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WO2003036737A8 - Stiffened surface micromachined structures and process for fabricating the same - Google Patents

Stiffened surface micromachined structures and process for fabricating the same Download PDF

Info

Publication number
WO2003036737A8
WO2003036737A8 PCT/US2002/033351 US0233351W WO03036737A8 WO 2003036737 A8 WO2003036737 A8 WO 2003036737A8 US 0233351 W US0233351 W US 0233351W WO 03036737 A8 WO03036737 A8 WO 03036737A8
Authority
WO
WIPO (PCT)
Prior art keywords
silicon nitride
silicon
devices
substrate
same
Prior art date
Application number
PCT/US2002/033351
Other languages
French (fr)
Other versions
WO2003036737A2 (en
WO2003036737A3 (en
Inventor
David L Dickensheets
Todd J Kaiser
Philip A Himmer
Jeffrey Lutzenberger
Robert A Friholm
Original Assignee
Univ Montana State
David L Dickensheets
Todd J Kaiser
Philip A Himmer
Jeffrey Lutzenberger
Robert A Friholm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Montana State, David L Dickensheets, Todd J Kaiser, Philip A Himmer, Jeffrey Lutzenberger, Robert A Friholm filed Critical Univ Montana State
Priority to EP02780484A priority Critical patent/EP1438256A2/en
Priority to AU2002343537A priority patent/AU2002343537A1/en
Priority to US10/493,140 priority patent/US20090065429A9/en
Priority to JP2003539116A priority patent/JP2005506909A/en
Publication of WO2003036737A2 publication Critical patent/WO2003036737A2/en
Publication of WO2003036737A3 publication Critical patent/WO2003036737A3/en
Publication of WO2003036737A8 publication Critical patent/WO2003036737A8/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067Mechanical properties
    • B81B3/007For controlling stiffness, e.g. ribs

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)

Abstract

Stiffened surface micromachined structures and a method to fabricate the same. A silicon substrate (10) is first etched to produce a mold containing a plurality of trenches or grooves (14) in a lattice configuration. Sacrificial oxide (15) is then grown on the silicon substrate (10) and then a stiffening member (16) (silicon nitride) is deposited over the surface of the substrate, thereby backfilling the grooves with silicon nitride. The silicon nitride is patterned to form mechanical members and metal (40) is then deposited and patterned to form the leads and capacitors for electrostatic actuation of mechanical members. The underlying silicon and sacrificial oxides are removed by etching the mold from underneath the fabricated micromachined devices, leaving free-standing silicon nitride devices with vertical ribs. The devices exhibit increased out-of-plan bending stiffness because of the presence of stiffening ribs. Silicon nitride biaxial pointing mirrors with stiffening ribs are also described.
PCT/US2002/033351 2001-10-22 2002-10-21 Stiffened surface micromachined structures and process for fabricating the same WO2003036737A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP02780484A EP1438256A2 (en) 2001-10-22 2002-10-21 Stiffened surface micromachined structures and process for fabricating the same
AU2002343537A AU2002343537A1 (en) 2001-10-22 2002-10-21 Stiffened surface micromachined structures and process for fabricating the same
US10/493,140 US20090065429A9 (en) 2001-10-22 2002-10-21 Stiffened surface micromachined structures and process for fabricating the same
JP2003539116A JP2005506909A (en) 2001-10-22 2002-10-21 Reinforced surface micromachined structure and manufacturing method thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US33043301P 2001-10-22 2001-10-22
US33043501P 2001-10-22 2001-10-22
US60/330,433 2001-10-22
US60/330,435 2001-10-22

Publications (3)

Publication Number Publication Date
WO2003036737A2 WO2003036737A2 (en) 2003-05-01
WO2003036737A3 WO2003036737A3 (en) 2003-11-20
WO2003036737A8 true WO2003036737A8 (en) 2008-12-31

Family

ID=23289754

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/033351 WO2003036737A2 (en) 2001-10-22 2002-10-21 Stiffened surface micromachined structures and process for fabricating the same

Country Status (4)

Country Link
EP (1) EP1438256A2 (en)
JP (1) JP2005506909A (en)
AU (1) AU2002343537A1 (en)
WO (1) WO2003036737A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6912082B1 (en) * 2004-03-11 2005-06-28 Palo Alto Research Center Incorporated Integrated driver electronics for MEMS device using high voltage thin film transistors
WO2008089786A1 (en) * 2007-01-23 2008-07-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Micromechanical component having increased stiffness, and method for the production of the same
WO2010005434A1 (en) 2008-07-09 2010-01-14 Hewlett-Packard Development Company, L.P. Print head slot ribs
DE102009026629B4 (en) * 2009-06-02 2017-09-21 Robert Bosch Gmbh Micromechanical system with a buried thin structured polysilicon layer and method for its production
WO2011080883A1 (en) * 2009-12-28 2011-07-07 株式会社ニコン Electro-mechanical converter, spatial optical modulator, exposure device, and methods for manufacturing them
JP5630015B2 (en) * 2009-12-28 2014-11-26 株式会社ニコン Spatial light modulator, exposure apparatus and manufacturing method thereof
KR102108022B1 (en) * 2011-07-29 2020-05-28 노반타 코포레이션 Systems and methods for providing mirrors with high stiffness and low inertia involving chemical etching
US9409763B2 (en) 2012-04-04 2016-08-09 Infineon Technologies Ag MEMS device and method of making a MEMS device
JP2013255975A (en) * 2012-06-14 2013-12-26 Fujitsu Ltd Electronic device
US9212045B1 (en) * 2014-07-31 2015-12-15 Infineon Technologies Ag Micro mechanical structure and method for fabricating the same
DE102019111634A1 (en) * 2019-05-06 2020-11-12 Lpkf Laser & Electronics Ag Process for the production of microstructures in a glass substrate
US11460688B2 (en) * 2019-08-23 2022-10-04 Tohoku University Mirror device, scanning laser device and scanning laser display including same mirror device, and method for manufacturing mirror device
CN115140703B (en) * 2022-07-08 2024-09-17 山东大学 Device and method for manufacturing prestrain-assisted fold-shaped micro-nano structure
DE102023132557A1 (en) * 2023-11-22 2025-05-22 Tdk Electronics Ag Microelectromechanical mirror, method for operating a microelectromechanical mirror, projection device and method for producing a micromechanical mirror

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5660680A (en) * 1994-03-07 1997-08-26 The Regents Of The University Of California Method for fabrication of high vertical aspect ratio thin film structures
US5628917A (en) * 1995-02-03 1997-05-13 Cornell Research Foundation, Inc. Masking process for fabricating ultra-high aspect ratio, wafer-free micro-opto-electromechanical structures
US6411754B1 (en) * 2000-08-25 2002-06-25 Corning Incorporated Micromechanical optical switch and method of manufacture

Also Published As

Publication number Publication date
WO2003036737A2 (en) 2003-05-01
WO2003036737A3 (en) 2003-11-20
AU2002343537A8 (en) 2009-01-29
JP2005506909A (en) 2005-03-10
AU2002343537A1 (en) 2003-05-06
EP1438256A2 (en) 2004-07-21

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