WO2003037576A1

WO2003037576A1 - Substrate transfer apparatus, and substrate transfer method

Info

Publication number: WO2003037576A1
Application number: PCT/JP2001/009604
Authority: WO
Inventors: Shinichi Ogimoto
Original assignee: Shibaura Mechatronics Corporation
Priority date: 2000-06-29
Filing date: 2001-11-01
Publication date: 2003-05-08
Also published as: JP4041267B2; JP2002012319A

Abstract

A substrate transfer apparatus for transferring a substrate on which electronic parts are mounted, inexpensively and reliably while preventing any of the electronic parts from coming off and the substrate from being damaged. The substrate transfer apparatus (10) is equipped with an arm body (11) which can move vertically and transversely. To the arm body (11), there are attached a plurality of glass substrate suction pads (12) for vacuum-chucking and supporting the upper face of a glass substrate (21), and a plurality of electronic part suction pads (13) arranged above the electronic parts (22) in positions corresponding to those of the electronic parts and adapted to vacuum-chuck and support the upper faces of the electronic parts (22). Each of the suction pads (12, 13) is connected to a vacuum source through a suction line. Each suction pad (12, 13) is equipped with an adjusting mechanism for adjusting its position relative to the arm body (11), so that its mount position on the arm body (11) can be adjusted in accordance with the size and position of the glass substrate (21) or the electronic parts (22). Each suction pad (13) is equipped with a spring (15) for absorbing an impact which is applied to the electronic part (22) when the suction pad (13) contacts with the electronic part (22).

Description

Description Board transfer device and board transfer method

The present invention relates to a component mounting apparatus for manufacturing a flat panel display represented by a liquid crystal panel and the like, and more particularly to a substrate transport apparatus and a substrate transport method for transferring a glass substrate or the like between processes. Background technology

Conventionally, as a component mounting device for manufacturing flat panel displays such as liquid crystal panels, electronic components (flexible printed circuit (FPC), chip on film), TCP (tape) There is known a component mounting apparatus for mounting a carrier package) on a glass substrate.

FIG. 6 is a diagram showing an example of a glass substrate on which electronic components are mounted by such a component mounting apparatus. As shown in FIG. 6, a glass substrate 21 is formed by laminating two types of substrates 21 a and 21 b having different sizes, and the front and rear surfaces on the outer periphery (the lower surface of the upper substrate 21 a and the lower substrate). A plurality of electronic components 22 are mounted on the upper surface of 21b).

Here, the glass substrate 21 on which the electronic component 22 is mounted in this way is transferred between processes by a substrate transfer device 30 as shown in FIGS. 7A and 7B. As shown in FIG. 7A and FIG. 7B, the substrate transfer device 30 sucks the upper surface of the glass substrate 21 provided on the lower surface of the arm body 31 and the arm body 31 movable vertically and horizontally. A plurality of suction pads 32 for supporting the glass substrate 21 (the glass substrate 21 on which the electronic components 22 are mounted) in a state where the glass substrate 21 is supported by the suction pads 3 2. Is transported between processes.

By the way, in recent years, glass substrates used in flat panel displays have become extremely large, and accordingly, electronic components mounted on glass substrates have also become large. In other words, as an electronic component mounted on a glass substrate, The use of electronic components that have a large size and are connected to a printed circuit board or a heat sink is also being used. For this reason, when the glass substrate on which such electronic components are mounted is transported by the substrate transport device 30 as shown in FIGS. 7A and 7B, the electronic components 22 hang down from the glass substrate 21 under their own weight. The electronic component 22 may drop during the transportation due to the interference with the unit or vibration applied during transportation (FIG. 7A). In addition, the electronic component 22 may collide with the glass substrate 21 due to the vibration applied during the transportation, and may damage the glass substrate 21 (FIG. 7B). Therefore, when a large glass substrate used in a flat panel display or the like is transported, as shown in FIG. In general, a method of transporting the entire tray 33 by a transport arm or a transport stage is used.

However, since the tray 33 for transporting large glass substrates is large and heavy, it is difficult to replace the tray 33 manually, and the handling mechanism for the tray 33 (the downstream process for the tray 33). It is necessary to provide a separate mechanism for returning to the upstream process. For this reason, there is a problem that the installation area and cost of the apparatus increase. In addition, since it is necessary to prepare a tray for each type of flat panel display (that is, the size of the glass substrate), there is a problem that a running cost increases. Disclosure of an invention

The present invention has been made in view of such a point, and it is possible to reliably and inexpensively transport a board on which electronic components are mounted by preventing the electronic components from dropping and damaging the board. It is an object to provide a substrate transfer device and a substrate transfer method. The present invention provides a board transfer device for transferring a board on which electronic components are mounted, an arm body, a first support mechanism attached to the arm body, and supporting a board to be transferred from above. And a second support mechanism attached to the arm body and supporting the electronic component mounted on the substrate from above.

In the present invention, the first support mechanism is arranged corresponding to the substrate. It is preferable to have a plurality of first support members. Further, it is preferable that the mounting position of the first support member is adjustable on the arm body. Further, it is preferable that an impact buffer mechanism is provided between the first support member and the arm main body to absorb an impact applied to the substrate when the arm comes into contact with the substrate. Note that, as the first support member, an adsorption member that adsorbs and holds the upper surface of the substrate can be used.

Further, in the present invention, it is preferable that the second support mechanism includes a plurality of second support members arranged corresponding to the electronic components. Further, it is preferable that the mounting position of the second support member be adjustable on the arm body. Further, it is preferable that an impact buffer mechanism is provided between the second support member and the arm body to absorb an impact applied to the electronic component at the time of contact with the electronic component. The second support member extends from the upper side of the electronic component and adsorbs and holds the upper surface of the electronic component. The second support member extends from the upper side of the electronic component and fixes the lower surface of the electronic component. A support arm that supports and supports can be used.

Further, in the present invention, it is preferable to further include an operation state control unit that selectively controls an operation state of each of the second support members.

Here, the operating state control means has a drive mechanism for raising and lowering each of the second support members, and moving each of the second support members from a support position for supporting each of the electronic components, or from each of the above electronic components. The operating state of each of the second support members can be selectively controlled by moving the second support member to any of the retracted retracted positions. In this case, it is preferable that the operating state control unit further includes a control device that controls the driving mechanism according to the type of the substrate to be transferred.

In the case where the second support member is a suction member that suctions and holds the upper surface of each of the electronic components, the operating state control unit may control the suction state to switch the suction state of each of the suction members. An operating state of each of the second support members can be selectively controlled by having a state switching mechanism and switching an attraction state of each of the second support members. In this case, the operation state control means may further include a control device that controls the suction state switching mechanism according to the type of the substrate to be transported. preferable.

The present invention also relates to a board transfer method for transferring a board on which electronic components are mounted from a first position to a second position, wherein the arm main body is positioned from the upper side toward the transfer target board positioned at the first position. And a first support mechanism attached to the arm main body and supporting the substrate from above, supporting the substrate and mounted on the substrate attached to the arm main body. A step of supporting the electronic component by a second support mechanism that supports the electronic component from above, and moving the arm body in the vertical and horizontal directions to mount the board on which the electronic component is mounted. A step of positioning the electronic component at the second position and releasing the support of the substrate by the first support mechanism and releasing the support of the electronic component by the second support mechanism. Providing a substrate transfer method, characterized in that.

According to the present invention, the first support mechanism for supporting the board from above and the second support mechanism for supporting the electronic components mounted on the board from above are provided on the arm body disposed above the board. Since the electronic component is provided, it is possible to prevent the electronic component from dropping from the substrate by its own weight when the substrate on which the electronic component is mounted is transported. It can be performed inexpensively and reliably without dropping or damaging the substrate.

Further, according to the present invention, the mounting position of each of the first support members and each of the second support members can be adjusted on the arm main body, so that the arm main body can be adjusted according to the size and position of the board or the electronic component. The mounting position can be adjusted above, and therefore, optimal transport can be realized for each type of flat panel display to be manufactured.

Further, according to the present invention, between each second support member and the arm main body, an impact absorbing mechanism for absorbing an impact applied to each electronic component when each second support member comes into contact with the electronic component is provided. Therefore, unnecessary impact and load can be prevented from being applied to each electronic component when each second support member comes into contact with the electronic component.

FIG. 1A is a front view showing an embodiment of the substrate transfer device according to the present invention, FIG. 1B is a plan view showing a glass substrate with electronic components transferred by the substrate transfer device shown in FIG. 1A;

FIG. 2 is a view showing a state in which a glass substrate is transferred between processes by the substrate transfer device shown in FIG. 1A.

FIG. 3 is a diagram showing a modification of the substrate transfer device shown in FIG. 1A,

FIG. 4 is a diagram showing another modification of the substrate transfer device shown in FIG. 1A.

FIG. 5 is a view showing still another modification of the substrate transfer device shown in FIG. 1A.

Figure 6 shows a glass substrate on which electronic components are mounted,

FIGS. 7A and 7B are diagrams showing an example of a conventional substrate transfer device.

FIG. 8 is a diagram showing another example of the conventional substrate transfer device. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

As shown in FIG. 1A and FIG. 1B, the substrate transfer apparatus 10 according to the present embodiment is for transferring a glass substrate 21 on which electronic components 22 are mounted between processes. The glass substrate 21 to be transported is composed of two types of substrates 2 la and 21 b of different sizes that are bonded to each other, on both front and back sides (the lower surface of the upper substrate 21 a and the lower substrate 2 la). Electronic components 22 are mounted on the upper surface of the lb).

As shown in FIGS. 1A and 1B, the substrate transfer device 10 includes an arm body 11 that is disposed above the glass substrate 21 and that can move up and down and left and right. The arm body 11 has a first support mechanism for supporting the glass substrate 21 from above, and is disposed above and corresponding to the glass substrate 21 to attract and support the upper surface of the glass substrate 21. A plurality of glass substrate suction pads (first support members) 12 are provided. The arm body 11 also has a second support mechanism for supporting a plurality of electronic components 22 mounted on the glass substrate 21 from above, corresponding to each of the electronic components 22 and disposed above the arm. In addition, an electronic component suction pad (second support member) 13 that adsorbs and supports the upper surface of the electronic component 22 is provided. The suction pad 12 for each glass substrate and the suction pad 13 for each electronic component are connected to a vacuum source (see reference numeral 18 in FIG. 4) via a suction system (see reference numerals 16a to 6d in FIG. 4). ) It is connected to the. Of these, each glass substrate suction pad 12 is provided with an adjusting mechanism (not shown) for adjusting the relative position with respect to the arm body 11, and the dimensions (length and width and thickness) of the glass substrate 21 are provided. The mounting position (vertical and horizontal position and height) can be adjusted on the arm body 11 according to the position and the position. Each of the electronic component suction pads 13 is provided with an adjustment mechanism (not shown) for adjusting a relative position with respect to the arm main body 11, and is provided with dimensions (width and width and thickness in the vertical and horizontal directions) of the electronic component 22. ) And its mounting position (vertical and horizontal position and height) can be adjusted according to the position. Further, each of the electronic component suction pads 13 includes a spring (impact buffering mechanism) that absorbs an impact applied to the electronic component 22 when the electronic component suction pad 13 comes into contact with the electronic component 22. 15 are provided.

Each electronic component suction pad 13 is provided with a sensor (not shown) for detecting the support status of electronic component 22 on each electronic component suction pad 13 (presence or absence of electronic component 22). In this case, it is possible to effectively detect a manufacturing defect due to a drop of the electronic component 22 or the like.

Next, referring to FIGS. 2 (a), (b), (c), (d) and (e), the operation of the present embodiment having such a configuration will be described. Here, an example is described in which the glass substrate 21 on which the electronic components 22 are mounted (hereinafter simply referred to as “glass substrate 21”) is transferred from the previous process to the next process by the substrate transfer device 10. Will be explained.

First, the substrate transfer device 10 is moved to the substrate receiving position by moving the arm body 11 to the left (FIG. 2 (a)). At this time, the substrate transport stage 41 in the previous process has moved to the substrate delivery position (first position) with the glass substrate 21 placed thereon.

In this state, by moving the arm body 11 downward, the substrate transfer device 10 is lowered, and all the suction pads 12 for glass substrates and the suction pads for electronic components attached to the arm body 11 are moved. The glass substrate 21 and the electronic components 22 are sucked and supported by setting the suction state (operating state) of 13 (Fig. 2 (b)).

Then, the substrate transfer device 10 is raised by moving the arm body 11 upward and rightward, and then moved to the substrate transfer position (second position) in the next process (FIG. 2 (c)). . At this time, the substrate transfer stage 42 in the next process is moved to the substrate receiving position. Is moving in.

Subsequently, the substrate transport device 10 is lowered by moving the arm body 11 downward, and the glass substrate 21 is placed on the substrate transport stage 42 in the next process (FIG. 2 (d)). .

After that, all the glass substrate suction pads 12 and electronic component suction pads 13 attached to the arm body 11 were put into a non-suction state (non-operation state), and the glass substrate 21 and the electronic components 22 were removed. Thereafter, the substrate transfer device 10 is raised by moving the arm body 11 upward (FIG. 2 (e)).

As described above, according to the present embodiment, the arm body 11 includes the glass substrate suction pad 12 that supports the glass substrate 21 to be transferred from the upper side, and the plurality of mounting pads mounted on the glass substrate 21. And a plurality of suction pads for electronic components 13 for supporting the electronic components 22 from above, so that when the glass substrate 21 on which the electronic components 22 are mounted is transported, the electronic components 22 This prevents the glass substrate 21 on which the electronic components 22 are mounted from being transported, which may cause the electronic components 22 to drop or damage the glass substrate 21. It can be performed cheaply and reliably without any inconvenience.

Further, according to the present embodiment, the mounting positions of the suction pads 12 for each glass substrate and the suction pads 13 for each electronic component can be adjusted on the arm body 11, so that the glass substrate The mounting position (vertical and horizontal position and height) can be adjusted on the arm body 11 according to the dimensions (vertical and horizontal width and thickness) and the position of the electronic component 22 or electronic component 22. In addition, it is possible to realize optimal transport for each type of flat panel display to be manufactured.

Further, according to the present embodiment, when each of the electronic component suction pads 13 comes into contact with the electronic component 22 between the electronic component suction pad 13 and the arm body 11, each electronic component is placed. Since a spring (impact buffering mechanism) 15 is provided to absorb the shock applied to 2 2, when the suction pad 13 for each electronic component comes into contact with the electronic component 22, it is applied to each electronic component 2 2. Unnecessary impact and load can be prevented from being applied.

In the above-described embodiment, the glass substrate on which the electronic component 22 is mounted is used. All the suction pads 13 for the electronic parts provided on the arm body 11 are operated when transporting 1, but it is not limited to this.Each electronic part is selected according to the type of flat panel display to be manufactured. The suction state (operating state) of the component suction pad 13 is selectively controlled, and the electronic component suction pad 13 corresponding to the position where the electronic component 22 does not exist or the position where support is not required is set to the non-suction state (non- (Operating state).

Specifically, for example, as shown in FIG. 3, each of a plurality of suction pads for electronic components 13 is provided with a drive mechanism 14 for raising and lowering the suction pads for electronic components, and the control device 35 controls The suction pad 13 for each electronic component is moved to either the support position for supporting the electronic component 22 or the retracted position where the electronic component 22 is evacuated, depending on the type (type) of the substrate to be formed. It is good to The driving mechanism 14 and the control device 35 constitute operating state control means.

Further, as shown in FIG. 4, a plurality of suction systems 16a to 16d are provided between the vacuum source 18 and the suction pads 13 for each electronic component, and the vacuum is controlled by the control device 36. The suction state of each electronic component suction pad 13 may be switched by switching the suction system by a suction system switching mechanism 17 such as a solenoid valve. In FIG. 4, one suction system is assigned to each side of the glass substrate 21. However, the present invention is not limited to this, and one system may be assigned to each of the suction pads 13 for each electronic component. It is possible. The selection information of each electronic component suction pad 13 is stored in the controller 36 together with the type information of the flat panel display to be manufactured, and the controller 36 controls the type of the board to be transported. The suction state of the suction pad 13 for electronic components may be automatically controlled according to (type). The adsorption state switching mechanism is composed of the adsorption systems 16a to 16d and the adsorption system switching mechanism 17, and is operated by the adsorption systems 16a to 16d, the adsorption system switching mechanism 17 and the controller 36. State control means is configured.

Further, in the above-described embodiment, the upper surface of each electronic component 22 is sucked and supported by the electronic component suction pad 13. However, the present invention is not limited to this, and as shown in FIG. The lower surface of each electronic component 22 may be supported and supported by the support arm 19.

Further, in the above-described embodiment, the electronic component suction pad 13 is provided with a spring 1. 5 is provided, but the invention is not limited to this, and a similar mechanism may be provided on the glass substrate suction pad 12.

In the above-described embodiment, a glass substrate used in a flat panel display has been described as an example. However, the present invention is not limited to this and can be applied to any substrate.

Claims

The scope of the claims

1. In a board transfer device for transferring a board on which electronic components are mounted, an arm body,

A second support attached to the arm body and supporting a substrate to be transferred from above;

1 support mechanism,

A second support mechanism attached to the arm body and supporting the electronic component mounted on the substrate from above, from the upper side.

2. The substrate transfer device according to claim 1, wherein the first support mechanism includes a plurality of first support members arranged corresponding to the substrate.

3. The substrate transfer device according to claim 2, wherein the mounting position of the first support member is adjustable on the arm main body.

4. An impact buffering mechanism is provided between the first support member and the arm main body to absorb an impact applied to the substrate at the time of contact with the substrate. Substrate transfer equipment.

5. The substrate transfer device according to claim 2, wherein the first support member is a suction member that suctions and holds an upper surface of the substrate.

6. The substrate transfer device according to claim 1, wherein the second support mechanism includes a plurality of second support members arranged corresponding to electronic components.

7. The substrate transfer device according to claim 6, wherein the mounting position of the second support member is adjustable on the arm main body.

8. An impact buffer mechanism is provided between the second support member and the arm main body for absorbing an impact applied to the electronic component at the time of contact with the electronic component. Item 7. The substrate transfer device according to Item 6.

9. The substrate transfer device according to claim 6, wherein the second support member is a suction member that extends from above the electronic component and suctions and holds an upper surface of the electronic component.

10. The second support member is a support arm extending from above the electronic component and supporting and supporting a lower surface of the electronic component. 6. The substrate transfer device according to 6.

11. The substrate transfer apparatus according to claim 6, further comprising operating state control means for selectively controlling an operating state of each of the second support members.

12. The operating state control means has a drive mechanism for raising and lowering each of the second support members, and moving each of the second support members from a support position for supporting each of the electronic components, or from each of the electronic components described above. The operation state of each of the second support members is selectively controlled by moving the second support member to any of the retracted retracted positions, according to claim 11, wherein

13. The method according to claim 12, wherein the operating state control unit further includes a control device that controls the driving mechanism according to a type of a substrate to be transferred.

14. The second support member is a suction member that suctions and holds the upper surface of each of the electronic components, and the operating state control unit includes a suction state switching mechanism for switching the suction state of each of the suction members. 21. The substrate transfer apparatus according to claim 11, wherein the operating state of each of the second support members is selectively controlled by switching a suction state of each of the second support members.

15. The substrate transfer device according to claim 14, wherein the operation state control means further includes a control device that controls the suction state switching mechanism according to a type of the substrate to be transferred.

16. In a board transfer method for transferring a board on which electronic components are mounted from a first position to a second position,

Lowering the arm body from above toward the substrate to be transported positioned at the first position;

A first support mechanism attached to the arm body for supporting the substrate from above, supports the substrate, and lifts the electronic component mounted on the board attached to the arm body. Supporting the electronic component by a second support mechanism that supports the electronic component from the side;

Positioning the substrate on which the electronic component is mounted at a second position by moving the arm body in the vertical and horizontal directions; Releasing the support of the substrate by the first support mechanism and releasing the support of the electronic component by the second support mechanism.