WO2006003133A1 - Electronic component with encapsulation - Google Patents
Electronic component with encapsulation Download PDFInfo
- Publication number
- WO2006003133A1 WO2006003133A1 PCT/EP2005/053009 EP2005053009W WO2006003133A1 WO 2006003133 A1 WO2006003133 A1 WO 2006003133A1 EP 2005053009 W EP2005053009 W EP 2005053009W WO 2006003133 A1 WO2006003133 A1 WO 2006003133A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- encapsulation
- electronic component
- metal
- substrate
- layer
- Prior art date
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 20
- 239000002346 layers by function Substances 0.000 claims description 14
- 239000004033 plastic Substances 0.000 claims description 10
- 229920003023 plastic Polymers 0.000 claims description 10
- 239000002905 metal composite material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000008393 encapsulating agent Substances 0.000 claims description 3
- 239000002923 metal particle Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 4
- 239000001301 oxygen Substances 0.000 abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 6
- 239000011888 foil Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910000743 fusible alloy Inorganic materials 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 210000004072 lung Anatomy 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the invention relates to an electronic component, in particular one with at least one organic functional layer and a novel encapsulation.
- Electronic components in particular those with at least one organic functional layer, are as a rule sensitive to environmental influences.
- components In order to protect them from damage, components, generally comprising at least one substrate, a lower electrode, at least one organic functional layer and an upper electrode, are completely encased or encapsulated.
- Many methods of encapsulation are known, both complete, inherently dimensionally stable caps are placed on the component as well as coatings of films applied over the component and sealingly connected to the substrate.
- the material of these encapsulations is usually a plastic or a glass, wherein barrier properties respek ⁇ tive tightness to moisture and / or air and mechanical stability are the essential requirements of the material.
- barrier properties respek ⁇ tive tightness to moisture and / or air and mechanical stability are the essential requirements of the material.
- barrier properties respek ⁇ tive tightness to moisture and / or air and mechanical stability are the essential requirements of the material.
- there are still no optimal solutions to this problem with regard to the material of the encapsulation because materials with increased impermeability generally have poor mechanical stability and vice versa. Be ⁇ but critical in terms of tightness on the one hand, the transition from the encapsulation to the substrate, this being
- the object of the invention is to provide an electronic component with an encapsulation which combines mechanical stability with impermeability and nevertheless can be produced easily and in mass production.
- the invention relates to an electronic component, an encapsulation, a substrate, a lower electrode, at least one functional layer and an upper electrode and the ent speaking contacts comprising, wherein the encapsulation comprises at least one layer of a metal composite material.
- the subject matter of the invention is a method for producing an electronic component, a encapsulation, a substrate, a lower electrode, at least one functional layer and an upper electrode and the corresponding contacts comprising at least the following method steps:
- the encapsulation with the substrate is either welded, glued and / or soldered.
- the encapsulation is sealed, for example, by cost-effective welding of the metal foil to the substrate.
- the plastic layer of the encapsulation can be connected to the substrate.
- the contact for the electrodes to a voltage and / or current source can be made via the contacting by the Verkapse ⁇ ment, either by welding or by using a low-temperature solder.
- a partial area of the foil will have an exposed metal area for contacting, so that a low contact resistance is guaranteed.
- At least one of the plated-through holes of the component is produced by the metal parts of the metal composite material.
- the good barrier properties, the high mechanical stability and the electrical conductivity of the metal are optimally utilized for the encapsulation.
- Metal composite is a plastic or a glass that contains metal in any form. It may be a polymer filled with metal fibers, metal platelets and / or other metal particles, but it may also be a layer structure with alternating metal and plastic or
- the metal may be in plastic or glass or a laminate layer or • in the form of fusible alloys, ie in the form of low-melting metal alloys.
- an electrically insulating member must be present within the metal composite forming the encapsulant to keep the two leads electrically separated.
- the term line is arbitrarily broad and not on a continuous metallic Limited line, because even with metal particles filled plastics can form the lines.
- photovoltaic elements photodetectors, electrochromic color elements, diodes, light-emitting diodes, in which the large-area light-emitting diodes can benefit from the invention
- transistors, capacitors are used as electronic component with at least one functional layer made of organic material. Rectifier and others.
- the encapsulations are preferably in the range of thin and thinnest films, ie, for example, with a thickness of 200 .mu.m, preferably of 75 .mu.m and particularly preferably of 30 .mu.m before.
- an encapsulation is produced by a layer structure, wherein plastic layers alternate with metal layers in a film composite and form a flexible encapsulation.
- plastic layers alternate with metal layers in a film composite and form a flexible encapsulation.
- Metal layers of the vias contribute to the tightness and mechanical stability of the encapsulation.
- the following layers are applied to one another: flexible film, which can also be used as a substrate, metal foil, flexible foil.
- This film composite has high barrier properties to oxygen and water vapor and it is possible to lay the contacts through the encapsulation in the metal layers of the encapsulation film composite.
- a partial region of the foil has an exposed metal region for contacting, so that a low contact resistance results.
- the encapsulation on an active functional layer of the component can be connected to the component.
- the encapsulation may be connected directly to the lower and / or the upper electrode instead of to the substrate.
- a substrate 1 which may be both a flexible film or a rigid carrier, such as a glass or quartz or the like. It is the bottom electrode 2, which is transparent at the photodetectors, the e- lektrochromen color elements and the light-emitting diodes, so that the radiation (s) through it to the active functional layer 1 (s) may take.
- At least one active organic functional layer 3 which, depending on the component, can be made of very different materials.
- the upper end forms the upper electrode 4.
- a so-called TopCoat be placed over the component, that is a
- the TopCoat can be made of organic (parylene), inorganic (silicon dioxide, aluminum oxide, silicon nitride (SiN x ), etc.) as well as of a film composite with a hybrid structure (organic / inorganic.
- the encapsulation 5 comprising a metal composite.
- the encapsulation leads via its Me ⁇ tallanteil the two contacts of the component to au ⁇ Shen.
- the encapsulation 5 comprises a plastic component 6, which in particular is also present at the point 8 at which the two current-carrying metal components 7, coming from opposite poles, overlap.
- the metal parts 7 lead the contacts of the two electrodes through the encapsulation to the outside.
- the encapsulating film and the element between ⁇ getter materials used are materials that react very strongly with water molecules and oxygen atoms and bind and / or chemically neutralize them when they penetrate the element.
- getter materials are zeolite and calcium oxide for water molecules and iron oxide for oxygen.
- getter materials are incorporated directly into the film.
- the invention discloses the packaging of organic solar cells with a cost-effective film composite which comprises a metal component.
- the packaging meets high standards, especially with regard to high barrier properties against oxygen and water vapor
- Encapsulation without or only with minimal adhesive joint, because the encapsulation can be welded / soldered to the substrate or the lower electrode, integrated feedthrough of electrical connections, also for glued, soldered and / or welded connections.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Beschreibungdescription
Elektronisches Bauteil mit VerkapselungElectronic component with encapsulation
Die Erfindung betrifft ein elektronischer Bauteil, insbeson¬ dere eines mit zumindest einer organischen Funktionsschicht und einer neuartigen Verkapselung.The invention relates to an electronic component, in particular one with at least one organic functional layer and a novel encapsulation.
Elektronische Bauteile, insbesondere solche mit zumindest ei- ner organischen Funktionsschicht, sind in der Regel empfind¬ lich gegen Umwelteinflüsse. Um sie vor Beschädigungen zu be¬ wahren, werden Bauteile, in der Regel zumindest ein Substrat, eine untere Elektrode, zumindest eine organische Funktions¬ schicht und eine obere Elektrode umfassend, komplett einge- hüllt oder verkapselt. Es sind viele Verfahren zur Verkapse¬ lung bekannt, dabei werden sowohl ganze, an sich formstabile Kappen dem Bauteil aufgesetzt als auch Überzüge aus Filmen über das Bauteil aufgebracht und abdichtend mit dem Substrat verbunden.Electronic components, in particular those with at least one organic functional layer, are as a rule sensitive to environmental influences. In order to protect them from damage, components, generally comprising at least one substrate, a lower electrode, at least one organic functional layer and an upper electrode, are completely encased or encapsulated. Many methods of encapsulation are known, both complete, inherently dimensionally stable caps are placed on the component as well as coatings of films applied over the component and sealingly connected to the substrate.
Das Material dieser Verkapselungen ist in der Regel ein Kunststoff oder ein Glas, wobei Barriereeigenschaften respek¬ tive Dichtigkeit gegenüber Feuchtigkeit und/oder Luft sowie mechanische Stabilität die wesentlichen Anforderungen an das Material sind. Leider gibt es noch keine optimalen Lösungen für dieses Problem im Bezug auf das Material der Verkapse¬ lung, weil Materialien mit erhöhter Dichtigkeit in der Regel mangelnde mechanische Stabilität aufweisen und umgekehrt. Be¬ sondern kritisch in Punkto Dichtigkeit ist zum einen der Übergang von der Verkapselung zum Substrat, wobei diesesThe material of these encapsulations is usually a plastic or a glass, wherein barrier properties respek¬ tive tightness to moisture and / or air and mechanical stability are the essential requirements of the material. Unfortunately, there are still no optimal solutions to this problem with regard to the material of the encapsulation, because materials with increased impermeability generally have poor mechanical stability and vice versa. Be¬ but critical in terms of tightness on the one hand, the transition from the encapsulation to the substrate, this being
Problem durch verschiedenste Klebetechniken und Verschrau- bungstechniken mittlerweile weitest gehend gelöst ist und zum anderen die Stelle in der Verkapselung, durch die die Kontak¬ tierungen gehen. Insbesondere ist die Verklebung zweier Glas- platten immer mit einer Klebefuge belastet, die zu Permeation von Gasen/Wasser führt. Aufgabe der Erfindung ist, ein elektronisches Bauteil mit ei¬ ner Verkapselung zur Verfügung zu stellen, die mechanische Stabilität mit Dichtigkeit vereint und trotzdem einfach und massenfertigungstauglich herstellbar ist.Problem by various bonding techniques and screwing techniques is now largely solved and on the other hand, the point in the encapsulation through which the Kontak¬ tations go. In particular, the bonding of two glass plates is always loaded with an adhesive joint, which leads to permeation of gases / water. The object of the invention is to provide an electronic component with an encapsulation which combines mechanical stability with impermeability and nevertheless can be produced easily and in mass production.
Diese Aufgabe wird durch den Gegenstand der unabhängigen An¬ sprüche sowie der dazugehörigen ünteransprüche im Zusammen¬ hang mit der Beschreibung sowie durch den Gegenstand der Fi¬ gur gelöst.This object is achieved by the subject matter of the independent claims and the associated subclaims in connection with the description and by the subject matter of the figure.
Gegenstand der Erfindung ist ein elektronisches Bauteil, eine Verkapselung, ein Substrat, eine untere Elektrode, zumindest eine Funktionsschicht und eine obere Elektrode sowie die ent¬ sprechenden Kontaktierungen umfassend, wobei die Verkapselung zumindest eine Schicht aus einem Metallverbundwerkstoff um- fasst. Außerdem ist Gegenstand der Erfindung ein Verfahren zur Herstellung eines elektronischen Bauteils, eine Verkapse¬ lung, ein Substrat, eine untere Elektrode, zumindest eine Funktionsschicht und eine obere Elektrode sowie die entspre— chenden Kontaktierungen umfassend, mit zumindest folgenden Verfahrensschritten:The invention relates to an electronic component, an encapsulation, a substrate, a lower electrode, at least one functional layer and an upper electrode and the ent speaking contacts comprising, wherein the encapsulation comprises at least one layer of a metal composite material. In addition, the subject matter of the invention is a method for producing an electronic component, a encapsulation, a substrate, a lower electrode, at least one functional layer and an upper electrode and the corresponding contacts comprising at least the following method steps:
- Aufbringen einer unteren Elektrode auf ein Substrat- Applying a lower electrode to a substrate
- Aufbringen zumindest einer Funktionsschicht auf die un¬ tere Elektrode - Aufbringen einer oberen Elektrode und- applying at least one functional layer to the lower electrode - applying an upper electrode and
- Verkapselung des gesamten Bauteils durch einen Metall¬ verbundwerkstoff und Verbindung der Verkapselung mit dem Substrat und/oder der untersten Schicht des Bauteils.- Encapsulation of the entire component by a Metall¬ composite material and connection of the encapsulation with the substrate and / or the bottom layer of the component.
Zwar wurde die Erfindung im Zusammenhang mit der Herstellung elektronischer Bauteile mit zumindest einer organischer Funk¬ tionsschicht entwickelt, jedoch kann sie genauso gut auf elektronische Bauteile der herkömmlichen, siliziumhaltigen Halbleitertechnologie angewendet werden.Although the invention was developed in connection with the production of electronic components having at least one organic functional layer, it can equally well be applied to electronic components of conventional silicon-containing semiconductor technology.
Nach einer Ausführungsform des Verfahrens wird die Verkapse¬ lung mit dem Substrat entweder verschweißt, geklebt und/oder verlötet. Dabei wird die Verkapselung beispielsweise durch ein kostengünstiges Verschweißen der Metallfolie mit dem Sub¬ strat abgedichtet. Ebenso kann die KunststoffSchicht der Ver¬ kapselung mit dem Substrat verbunden sein.According to one embodiment of the method, the encapsulation with the substrate is either welded, glued and / or soldered. In this case, the encapsulation is sealed, for example, by cost-effective welding of the metal foil to the substrate. Likewise, the plastic layer of the encapsulation can be connected to the substrate.
Der Kontakt für die Elektroden zu einer Spannungs- und/oder Stromquelle kann über die Kontaktierung durch die Verkapse¬ lung hergestellt werden, entweder durch Schweißen oder durch Verwendung eines Niedrigtemperatur-Lots. Je nach Ausführungs- form wird zur Kontaktierung ein Teilbereich der Folie einen offen gelegten Metallbereich haben, so dass ein niedriger Kontaktwiderstand garantiert wird.The contact for the electrodes to a voltage and / or current source can be made via the contacting by the Verkapse¬ ment, either by welding or by using a low-temperature solder. Depending on the embodiment, a partial area of the foil will have an exposed metal area for contacting, so that a low contact resistance is guaranteed.
Nach einer vorteilhaften Ausführungsform der Erfindung wird zumindest eine der Durchkontaktierungen des Bauteils durch die Metallanteile des Metallverbundwerkstoffs hergestellt. Dabei werden die guten Barriereeigenschaften, die hohe mecha¬ nische Stabilität sowie die elektrische Leitfähigkeit des Me¬ talls für die Verkapselung optimal genutzt.According to an advantageous embodiment of the invention, at least one of the plated-through holes of the component is produced by the metal parts of the metal composite material. In this case, the good barrier properties, the high mechanical stability and the electrical conductivity of the metal are optimally utilized for the encapsulation.
Metallverbundwerkstoff ist ein Kunststoff oder ein Glas, das Metall in irgendeiner Form enthält. Es kann sich um ein mit Metallfasern, Metallplättchen und/oder sonstigen Metall¬ partikeln gefülltes Polymer handeln, es kann aber auch ein Schichtaufbau mit abwechselnd Metall und Kunststoff- oderMetal composite is a plastic or a glass that contains metal in any form. It may be a polymer filled with metal fibers, metal platelets and / or other metal particles, but it may also be a layer structure with alternating metal and plastic or
Glasschichten, beispielsweise in Form dünnster Folien, vor¬ liegen. Das Metall kann auch im Kunststoff oder Glas oder als • Schicht oder Laminat in Form von fusible alloys, also in Form niedrig schmelzender Metalllegierungen vorliegen.Glass layers, for example in the form of thinnest films, vor¬ lie. The metal may be in plastic or glass or a laminate layer or • in the form of fusible alloys, ie in the form of low-melting metal alloys.
Für den Fall, dass beide Durchkontaktierungen, die der oberen und die der unteren Elektrode durch die Verkapselung gelegt wurden, wird ein elektrisch isolierender Teil innerhalb des Metallverbundstoffs, der die Verkapselung bildet, vorhanden sein müssen, um die beiden Leitungen elektrisch voneinander getrennt zu halten. Der Begriff Leitung ist dabei beliebig weit gefasst und nicht auf eine durchgehenden metallische Leitung beschränkt, weil auch mit Metallpartikel gefüllte Kunststoffe die Leitungen bilden können.In the event that both vias placed between the upper and lower electrodes through the encapsulant, an electrically insulating member must be present within the metal composite forming the encapsulant to keep the two leads electrically separated. The term line is arbitrarily broad and not on a continuous metallic Limited line, because even with metal particles filled plastics can form the lines.
Diese Aufgabe wird durch den Gegenstand der unabhängigen An- sprüche sowie der dazugehörigen Unteransprüche im Zusammen¬ hang mit der Beschreibung sowie durch den Gegenstand der Fi¬ gur gelöst.This object is achieved by the subject matter of the independent claims and the associated subclaims in connection with the description and by the subject matter of the figure.
Als elektronisches Bauteil mit zumindest einer Funktions- schicht aus organischem Material werden beispielsweise photo- voltaische Elemente, Photodetektoren, elektrochrome Farbele¬ mente, Dioden, Leuchtdioden, wobei unter den Leuchtdioden insbesondere die großflächigen Leuchtdioden durch die Erfin¬ dung profitieren können, Transistoren, Kondensatoren, Gleich- richter und weitere bezeichnet.For example, photovoltaic elements, photodetectors, electrochromic color elements, diodes, light-emitting diodes, in which the large-area light-emitting diodes can benefit from the invention, transistors, capacitors, are used as electronic component with at least one functional layer made of organic material. Rectifier and others.
Mit dem Metallverbundstoff gemäß der Erfindung können sowohl Bauteile mit starren als auch solche mit flexiblen Verkapse¬ lungen, wobei letztere unter Umständen auch als Versiegelun- gen bezeichnet werden können, hergestellt werden.With the metal composite according to the invention, both components with rigid and those with flexible Verkapse¬ lungs, the latter can be referred to under certain circumstances as seals, are produced.
Die Verkapselungen liegen bevorzugt im Bereich dünner und dünnster Folien, also beispielsweise mit einer Dicke von 200μm, bevorzugt von 75μm und insbesondere bevorzugt von 30μm vor.The encapsulations are preferably in the range of thin and thinnest films, ie, for example, with a thickness of 200 .mu.m, preferably of 75 .mu.m and particularly preferably of 30 .mu.m before.
Nach einer Ausführungsform wird eine Verkapselung durch einen Schichtaufbau hergestellt, wobei sich Kunststoffschichten mit Metallschichten in einem Folienverbund abwechseln und eine flexible Verkapselung bilden. Dabei wird insbesondere ermög¬ licht, dass die Durchkontaktierungen in der Verkapselung in¬ tegriert sind, weil die beiden Metallschichten der Durchkon- taktierungen durch elektrisch isolierende Kunststoff- Zwischenschichten effektvoll voneinander getrennt werden kön- nen, um Kurzschlüsse zu vermeiden. Gleichzeitig können dieAccording to one embodiment, an encapsulation is produced by a layer structure, wherein plastic layers alternate with metal layers in a film composite and form a flexible encapsulation. In this case, it is possible, in particular, that the plated-through holes in the encapsulation are integrated, because the two metal layers of the plated-through holes can be effectively separated from one another by electrically insulating plastic intermediate layers in order to avoid short circuits. At the same time, the
Metallschichten der Durchkontaktierungen zur Dichtigkeit und mechanischen Stabilität der Verkapselung beitragen. Beispielsweise werden folgende Schichten aufeinander aufge¬ bracht: flexible Folie wie sie auch als Substrat eingesetzt werden kann, Metallfolie, flexible Folie. Dieser Folienver- bund besitzt hohe Barriereeigenschaften gegenüber Sauerstoff und Wasserdampf und es ist möglich die Durchführung der Kon¬ takte durch die Verkapselung in die Metallschichten des Ver- kapselungs-Folienverbunds zu legen.Metal layers of the vias contribute to the tightness and mechanical stability of the encapsulation. For example, the following layers are applied to one another: flexible film, which can also be used as a substrate, metal foil, flexible foil. This film composite has high barrier properties to oxygen and water vapor and it is possible to lay the contacts through the encapsulation in the metal layers of the encapsulation film composite.
Je nach Ausführungsform hat zur Kontaktierung beispielsweise ein Teilbereich der Folie einen offen gelegten Metallbereich, so dass ein niedriger Kontaktwiderstand resultiert.Depending on the embodiment, for example, a partial region of the foil has an exposed metal region for contacting, so that a low contact resistance results.
Bei dem Verfahren zur Herstellung des Bauteils kann die Ver- kapselung auf einer aktiven Funktionsschicht des Bauteils mit dem Bauteil verbunden werden. Beispielsweise kann die Verkap¬ selung direkt mit der unteren und/oder der oberen Elektrode verbunden sein anstatt mit dem Substrat.In the method for producing the component, the encapsulation on an active functional layer of the component can be connected to the component. By way of example, the encapsulation may be connected directly to the lower and / or the upper electrode instead of to the substrate.
Im Folgenden wird die Erfindung noch anhand einer Figur, die eine Ausführungsform der Erfindung zeigt, näher_..erläutert.In the following, the invention will be explained in greater detail with reference to a figure which shows an embodiment of the invention.
Zu erkennen ist unten ein Substrat 1, das sowohl eine flexib¬ le Folie oder ein starrer Träger sein kann, wie beispielswei- se ein Glas oder Quarz oder ähnliches. Darauf befindet sich die untere Elektrode 2, die bei den Photodetektoren, den e- lektrochromen Farbelementen und den Leuchtdioden transparent ist, damit Strahlung durch sie auf die aktive (n)1 Funktions¬ schicht (en) treffen kann.Below is a substrate 1, which may be both a flexible film or a rigid carrier, such as a glass or quartz or the like. It is the bottom electrode 2, which is transparent at the photodetectors, the e- lektrochromen color elements and the light-emitting diodes, so that the radiation (s) through it to the active functional layer 1 (s) may take.
Darauf befindet sich zumindest eine aktive organische Funkti¬ onsschicht 3, die je nach Bauteil aus ganz verschiedenen Ma¬ terialien geschaffen sein kann. Den oberen Abschluss bildet die obere Elektrode 4. Beispielsweise kann über das Bauteil noch ein so genannter TopCoat gelegt sein, das heißt einOn top of this is at least one active organic functional layer 3 which, depending on the component, can be made of very different materials. The upper end forms the upper electrode 4. For example, a so-called TopCoat be placed over the component, that is a
Schutzfilm, durch den dem Bauteil erst einmal Schutz gegen¬ über nicht Reinstraum - Bedingungen gewährt wird, so dass die Verkapselung unter normalen Herstellungsbedingungen aufge¬ bracht werden kann.Protective film, by which the component is first granted protection against non-cleanroom conditions, so that the Encapsulation can be applied under normal production conditions.
Die TopCoat kann aus organischem (Parylene) , anorganischem (Siliziumdioxid, Aluminiumoxid, Siliziumnitrid (SiNx), etc.) als auch aus einem Folienverbund mit hybridem Aufbau (organi¬ sche/anorganische geschaffen sein.The TopCoat can be made of organic (parylene), inorganic (silicon dioxide, aluminum oxide, silicon nitride (SiN x ), etc.) as well as of a film composite with a hybrid structure (organic / inorganic.
Um das gesamte Bauteil herum und dicht mit dem Substrat 1 verbunden befindet sich die Verkapselung 5, einen Metallver¬ bundstoff umfassend. Die Verkapselung führt über ihren Me¬ tallanteil die beiden Kontaktierungen des Bauteils nach au¬ ßen. Die Verkapselung 5 umfasst einen Kunststoffanteil 6, der insbesondere auch an der Stelle 8 vorhanden ist, an der die beiden stromführenden Metallanteile 7, von gegensätzlichen Polen kommend, sich überlappen. Die Metallanteile 7 führen die Kontakte der beiden Elektroden durch die Verkapselung hindurch nach außen.Around the entire component and tightly connected to the substrate 1 is the encapsulation 5 comprising a metal composite. The encapsulation leads via its Me¬ tallanteil the two contacts of the component to au¬ Shen. The encapsulation 5 comprises a plastic component 6, which in particular is also present at the point 8 at which the two current-carrying metal components 7, coming from opposite poles, overlap. The metal parts 7 lead the contacts of the two electrodes through the encapsulation to the outside.
Nach einer Ausführungsform werden zwischen der Verkapselungs- folie und dem Element^Gettermaterialien eingesetzt (einge¬ legt) . Gettermaterialien sind Materialien die sehr stark mit Wassermolekülen und Sauerstoffatemen reagieren und diese bei einem Eindringen in das Element binden und/oder chemisch neutralisieren. Beispiele für Gettermaterialien sind Zeolith und Kalziumoxid für Wassermoleküle und Eisenoxid für Sauer¬ stoff.According to one embodiment, the encapsulating film and the element between ^ getter materials used (einge¬ inserted). Getter materials are materials that react very strongly with water molecules and oxygen atoms and bind and / or chemically neutralize them when they penetrate the element. Examples of getter materials are zeolite and calcium oxide for water molecules and iron oxide for oxygen.
Nach einer Ausführungsform werden Gettermaterialien direkt in die Folie eingearbeitet.In one embodiment, getter materials are incorporated directly into the film.
Die Erfindung offenbart erstmals die Verpackung organischer Solarzellen mit einem kostengünstigen Folienverbund, der ei¬ nen Metallanteil umfasst. Die Verpackung erfüllt hohe Ansprü- che, insbesondere in Bezug auf hohe Barriereeigenschaften gegen Sauerstoff und Wasser¬ dampfFor the first time, the invention discloses the packaging of organic solar cells with a cost-effective film composite which comprises a metal component. The packaging meets high standards, especially with regard to high barrier properties against oxygen and water vapor
Verkapselung ohne oder nur mit minimaler Klebefuge, weil die Verkapselung mit dem Substrat oder der unteren Elektrode verschweißt/verlötet werden kann, integrierte Durchführung von elektrischen Anschlüssen, auch für geklebte, verlötete und/oder verschweißte An¬ schlüsse. Encapsulation without or only with minimal adhesive joint, because the encapsulation can be welded / soldered to the substrate or the lower electrode, integrated feedthrough of electrical connections, also for glued, soldered and / or welded connections.
Claims
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05769610A EP1763895A1 (en) | 2004-07-02 | 2005-06-27 | Electronic component with encapsulation |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004032207 | 2004-07-02 | ||
| DE102004032207.4 | 2004-07-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006003133A1 true WO2006003133A1 (en) | 2006-01-12 |
Family
ID=34973056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2005/053009 WO2006003133A1 (en) | 2004-07-02 | 2005-06-27 | Electronic component with encapsulation |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP1763895A1 (en) |
| WO (1) | WO2006003133A1 (en) |
Cited By (5)
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| JP2006019285A (en) * | 2004-07-02 | 2006-01-19 | Konarka Technologies Inc | Organic photovoltaic component with encapsulant |
| DE102007046730A1 (en) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Organic electronic component for organic light emitting diodes, polymer elements, organic photovoltaic cell or electrochromic elements, has substrate and is provided on substrate |
| DE102008050332A1 (en) * | 2008-10-07 | 2010-04-22 | Leonhard Kurz Stiftung & Co. Kg | Photovoltaic cell comprises a photovoltaic conversion layer, a lower electrode layer applied on a lower surface of the photovoltaic conversion layer, and a multilayer foil applied on an upper surface of the photovoltaic conversion layer |
| WO2014076132A1 (en) * | 2012-11-14 | 2014-05-22 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
| US9607301B2 (en) | 2000-04-27 | 2017-03-28 | Merck Patent Gmbh | Photovoltaic sensor facilities in a home environment |
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| US9607301B2 (en) | 2000-04-27 | 2017-03-28 | Merck Patent Gmbh | Photovoltaic sensor facilities in a home environment |
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| WO2014076132A1 (en) * | 2012-11-14 | 2014-05-22 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
| CN104813501A (en) * | 2012-11-14 | 2015-07-29 | 欧司朗Oled有限责任公司 | Optoelectronic devices |
| US9502682B2 (en) | 2012-11-14 | 2016-11-22 | Osram Oled Gmbh | Optoelectronic device |
| DE102012220724B4 (en) | 2012-11-14 | 2022-05-25 | Pictiva Displays International Limited | optoelectronic component |
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| Publication number | Publication date |
|---|---|
| EP1763895A1 (en) | 2007-03-21 |
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