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WO2006004969A3 - Protection anticorrosion de circuit flexible amelioree - Google Patents

Protection anticorrosion de circuit flexible amelioree Download PDF

Info

Publication number
WO2006004969A3
WO2006004969A3 PCT/US2005/023401 US2005023401W WO2006004969A3 WO 2006004969 A3 WO2006004969 A3 WO 2006004969A3 US 2005023401 W US2005023401 W US 2005023401W WO 2006004969 A3 WO2006004969 A3 WO 2006004969A3
Authority
WO
WIPO (PCT)
Prior art keywords
flexible circuit
conductive layer
corrosion protection
improved flexible
support substrate
Prior art date
Application number
PCT/US2005/023401
Other languages
English (en)
Other versions
WO2006004969A2 (fr
Inventor
Craig M Bertelsen
Sean T Weaver
Original Assignee
Lexmark Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lexmark Int Inc filed Critical Lexmark Int Inc
Priority to GB0701178A priority Critical patent/GB2431054B/en
Publication of WO2006004969A2 publication Critical patent/WO2006004969A2/fr
Publication of WO2006004969A3 publication Critical patent/WO2006004969A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

L'invention concerne un circuit flexible possédant une résistance accrue à la corrosion, ainsi qu'un procédé associé. Ce circuit flexible comprend un substrat support polymère, une couche conductrice fournissant un tracé fixée à une première surface du substrat support, ainsi que des faisceaux de fils en communication électrique avec le tracé pour fixer le circuit flexible à une tête d'éjection microfluidique. Une couche polymérisée par plasma est déposée sur au moins une partie de la couche conductrice pour réduire la corrosion de ladite couche conductrice. Cette couche polymérisée par plasma peut également améliorer l'adhérence entre le circuit flexible et un adhésif utilisé pour fixer ledit circuit flexible à une structure.
PCT/US2005/023401 2004-06-30 2005-06-29 Protection anticorrosion de circuit flexible amelioree WO2006004969A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0701178A GB2431054B (en) 2004-06-30 2005-06-29 Improved flexible circuit corrosion protection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/882,728 2004-06-30
US10/882,728 US7673970B2 (en) 2004-06-30 2004-06-30 Flexible circuit corrosion protection

Publications (2)

Publication Number Publication Date
WO2006004969A2 WO2006004969A2 (fr) 2006-01-12
WO2006004969A3 true WO2006004969A3 (fr) 2007-03-01

Family

ID=35513395

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/023401 WO2006004969A2 (fr) 2004-06-30 2005-06-29 Protection anticorrosion de circuit flexible amelioree

Country Status (3)

Country Link
US (1) US7673970B2 (fr)
GB (1) GB2431054B (fr)
WO (1) WO2006004969A2 (fr)

Families Citing this family (22)

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Publication number Priority date Publication date Assignee Title
US6776660B1 (en) 2003-04-30 2004-08-17 Japan Aviation Electronics Industry, Limited Connector
JPWO2006082814A1 (ja) * 2005-02-01 2008-08-07 国立大学法人 名古屋工業大学 シロキサン変性多分岐ポリイミド
US7540788B2 (en) 2007-01-05 2009-06-02 Apple Inc. Backward compatible connector system
GB0703172D0 (en) * 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
US7784909B2 (en) * 2008-01-29 2010-08-31 Lexmark International, Inc. Ink jetting structure having protected connections
US9055700B2 (en) 2008-08-18 2015-06-09 Semblant Limited Apparatus with a multi-layer coating and method of forming the same
BE1019159A5 (nl) * 2010-01-22 2012-04-03 Europlasma Nv Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces.
GB201203927D0 (en) * 2012-03-06 2012-04-18 Semblant Ltd Coated electrical assembly
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
GB2485419B (en) * 2010-11-15 2015-02-25 Semblant Ltd Method for reducing creep corrosion
US8852693B2 (en) 2011-05-19 2014-10-07 Liquipel Ip Llc Coated electronic devices and associated methods
GB2489761B (en) * 2011-09-07 2015-03-04 Europlasma Nv Surface coatings
JP2013143563A (ja) 2012-01-10 2013-07-22 Hzo Inc 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム
US20130286567A1 (en) * 2012-01-10 2013-10-31 Hzo, Inc. Apparatuses, systems and methods for protecting electronic device assemblies
MY171574A (en) * 2012-03-06 2019-10-21 Semblant Ltd Coated electrical assembly
EP2828004B1 (fr) 2012-03-23 2019-11-20 hZo, Inc. Appareils, systèmes et procédés d'application de revêtements protecteurs à des assemblages de dispositifs électroniques
KR101889013B1 (ko) * 2012-05-17 2018-08-21 삼성디스플레이 주식회사 평판 표시 장치의 박막 봉지 및 그 제조방법
GB2510213A (en) * 2012-08-13 2014-07-30 Europlasma Nv Forming a protective polymer coating on a component
GB2521137A (en) * 2013-12-10 2015-06-17 Europlasma Nv Surface Coatings
BR112017015636A2 (pt) 2015-01-20 2018-03-13 Basf Coatings Gmbh processo para produção de laminados orgânico-inorgânicos flexíveis.
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
CN115509379A (zh) * 2021-06-07 2022-12-23 江苏菲沃泰纳米科技股份有限公司 一种柔性触控传感器、制备方法及触控显示屏

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US5442386A (en) * 1992-10-13 1995-08-15 Hewlett-Packard Company Structure and method for preventing ink shorting of conductors connected to printhead

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US4588641A (en) 1983-11-22 1986-05-13 Olin Corporation Three-step plasma treatment of copper foils to enhance their laminate adhesion
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JP2002355977A (ja) 2001-02-08 2002-12-10 Canon Inc 撥液部材、該撥液部材を用いたインクジェットヘッド、それらの製造方法及びインクの供給方法
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Publication number Priority date Publication date Assignee Title
US4683481A (en) * 1985-12-06 1987-07-28 Hewlett-Packard Company Thermal ink jet common-slotted ink feed printhead
US5442386A (en) * 1992-10-13 1995-08-15 Hewlett-Packard Company Structure and method for preventing ink shorting of conductors connected to printhead

Also Published As

Publication number Publication date
GB2431054B (en) 2008-02-06
US7673970B2 (en) 2010-03-09
US20060001700A1 (en) 2006-01-05
GB0701178D0 (en) 2007-02-28
WO2006004969A2 (fr) 2006-01-12
GB2431054A (en) 2007-04-11

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