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WO2006113708A3 - Appareil et procede de gestion du mouvement thermique d'un ensemble carte sonde - Google Patents

Appareil et procede de gestion du mouvement thermique d'un ensemble carte sonde Download PDF

Info

Publication number
WO2006113708A3
WO2006113708A3 PCT/US2006/014554 US2006014554W WO2006113708A3 WO 2006113708 A3 WO2006113708 A3 WO 2006113708A3 US 2006014554 W US2006014554 W US 2006014554W WO 2006113708 A3 WO2006113708 A3 WO 2006113708A3
Authority
WO
WIPO (PCT)
Prior art keywords
wiring substrate
stiffener plate
probe card
card assembly
thermally induced
Prior art date
Application number
PCT/US2006/014554
Other languages
English (en)
Other versions
WO2006113708A2 (fr
Inventor
Benjamin N Eldridge
Gary W Grube
Eric D Hobbs
Gaetan L Mathieu
Makarand S Shinde
A Nicholas Sporck
Thomas N Watson
Alexander N Slocum
Original Assignee
Formfactor Inc
Benjamin N Eldridge
Gary W Grube
Eric D Hobbs
Gaetan L Mathieu
Makarand S Shinde
A Nicholas Sporck
Thomas N Watson
Alexander N Slocum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, Benjamin N Eldridge, Gary W Grube, Eric D Hobbs, Gaetan L Mathieu, Makarand S Shinde, A Nicholas Sporck, Thomas N Watson, Alexander N Slocum filed Critical Formfactor Inc
Priority to JP2008507806A priority Critical patent/JP5592069B2/ja
Priority to EP06750561A priority patent/EP1877807A2/fr
Priority to KR1020077026728A priority patent/KR101282439B1/ko
Publication of WO2006113708A2 publication Critical patent/WO2006113708A2/fr
Publication of WO2006113708A3 publication Critical patent/WO2006113708A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention porte sur un ensemble comprenant un ensemble tête de sonde équipé de sondes à mettre en contact avec un dispositif électronique à tester. Cet ensemble tête de sonde peut être électriquement relié à un substrat de câblage et mécaniquement relié à une plaque de raidisseur. Ce substrat de câblage fournit des connexions électriques à un appareil de test, et la plaque de câblage fournit une structure permettant de relier l'ensemble caret sonde à l'appareil de test. La plaque de raidisseur peut présenter une résistance mécanique supérieure à celle du substrat de câblage et est moins sensible au mouvement thermique que le substrat de câblage. Ce substrat de câblage peut être fixé à la plaque de raidisseur au niveau du centre du substrat de câblage. Des espaces sont réservés à d'autres endroits où le substrat de câblage est fixé à la plaque de raidisseur si bien que le substrat de câblage peut se déployer et se contracter par rapport à la plaque de raidisseur.
PCT/US2006/014554 2005-04-19 2006-04-18 Appareil et procede de gestion du mouvement thermique d'un ensemble carte sonde WO2006113708A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008507806A JP5592069B2 (ja) 2005-04-19 2006-04-18 プローブカードアセンブリの熱により誘起される運動に対処するための装置
EP06750561A EP1877807A2 (fr) 2005-04-19 2006-04-18 Appareil et procede de gestion du mouvement thermique d'un ensemble carte sonde
KR1020077026728A KR101282439B1 (ko) 2005-04-19 2006-04-18 열에 의해 유발된 프로브 카드 조립체의 이동을 관리하는장치 및 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US59456205P 2005-04-19 2005-04-19
US60/594,562 2005-04-19
US11/306,515 US7285968B2 (en) 2005-04-19 2005-12-30 Apparatus and method for managing thermally induced motion of a probe card assembly
US11/306,515 2005-12-30

Publications (2)

Publication Number Publication Date
WO2006113708A2 WO2006113708A2 (fr) 2006-10-26
WO2006113708A3 true WO2006113708A3 (fr) 2009-05-07

Family

ID=37115860

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/014554 WO2006113708A2 (fr) 2005-04-19 2006-04-18 Appareil et procede de gestion du mouvement thermique d'un ensemble carte sonde

Country Status (6)

Country Link
US (3) US7285968B2 (fr)
EP (1) EP1877807A2 (fr)
JP (1) JP5592069B2 (fr)
KR (1) KR101282439B1 (fr)
TW (1) TWI398641B (fr)
WO (1) WO2006113708A2 (fr)

Cited By (7)

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US11280827B2 (en) 2016-02-29 2022-03-22 Teradyne, Inc. Thermal control of a probe card assembly
US11635459B2 (en) 2017-03-03 2023-04-25 Aehr Test Systems Electronics tester
US11860221B2 (en) 2005-04-27 2024-01-02 Aehr Test Systems Apparatus for testing electronic devices
US11977098B2 (en) 2009-03-25 2024-05-07 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
US12007451B2 (en) 2016-01-08 2024-06-11 Aehr Test Systems Method and system for thermal control of devices in an electronics tester
US12228609B2 (en) 2020-10-07 2025-02-18 Aehr Test Systems Electronics tester
US12326472B2 (en) 2007-12-19 2025-06-10 Aehr Test Systems System for testing an integrated circuit of a device and its method of use

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US20100000080A1 (en) 2010-01-07
US7592821B2 (en) 2009-09-22
US7285968B2 (en) 2007-10-23
JP5592069B2 (ja) 2014-09-17
US20080042668A1 (en) 2008-02-21
WO2006113708A2 (fr) 2006-10-26
JP2008539394A (ja) 2008-11-13
US20060255814A1 (en) 2006-11-16
TWI398641B (zh) 2013-06-11
EP1877807A2 (fr) 2008-01-16
TW200706888A (en) 2007-02-16
KR101282439B1 (ko) 2013-07-04

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