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WO2007034579A1 - Procédé de fabrication d’une pellicule de masquage comportant un motif de partition - Google Patents

Procédé de fabrication d’une pellicule de masquage comportant un motif de partition Download PDF

Info

Publication number
WO2007034579A1
WO2007034579A1 PCT/JP2006/301318 JP2006301318W WO2007034579A1 WO 2007034579 A1 WO2007034579 A1 WO 2007034579A1 JP 2006301318 W JP2006301318 W JP 2006301318W WO 2007034579 A1 WO2007034579 A1 WO 2007034579A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
masking
predetermined
release paper
panel
Prior art date
Application number
PCT/JP2006/301318
Other languages
English (en)
Japanese (ja)
Inventor
Masafumi Mogi
Masakazu Nakamura
Sho Katanahara
Original Assignee
Alps Engineering Co, .Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Engineering Co, .Ltd. filed Critical Alps Engineering Co, .Ltd.
Publication of WO2007034579A1 publication Critical patent/WO2007034579A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern

Definitions

  • the present invention is used when generating partition walls in various display panels.
  • the present invention relates to a method for forming a masking film having a predetermined partition wall pattern, and particularly in the case of misalignment when the partition wall is formed using a blast method or an etching method.
  • the present invention relates to a method for forming a masking film that can be used even if it is used.
  • Patent Document 1 Japanese Patent Laid-Open No. 11-283496
  • a method for forming a masking film having a partition wall pattern that can cope with such a state in which different performances (functions) are required, that is, blast processing, and etching treatment with hydrofluoric acid solution or the like. It is an object (problem) of the present invention to provide the most suitable method for the above.
  • the following measures are taken in the present invention. That is, in the first invention as claimed in claim 1, with respect to the method of forming a masking film having a predetermined partition pattern on the panel surface, the masking film has a predetermined thickness and a predetermined adhesion.
  • a step of crimping an application sheet having a low adhesion performance to the surface side of the masking sheet cut out to have a predetermined partition pattern in this way, and in this way, sandwiching the masking sheet between them on one side Has a three-layer sheet material force with an application sheet and a release paper on the other side, and a process for peeling the release paper and thus releasing the release paper.
  • the surface of the release paper that has been peeled off is placed facing the front side of the specified panel, and the masking sheet is sandwiched between the panel and the application sheet.
  • a process of crimping using a predetermined roll crimping means, a process of peeling the application sheet in a state where the masking sheet was crimped on the panel surface in this way, and a force were used.
  • the method for forming a masking film having a predetermined partition pattern on the panel surface has a predetermined thickness provided on the release paper.
  • Surface side of the masking sheet A process in which an application sheet having low adhesion performance is crimped onto the sheet, and in this way, a masking sheet is sandwiched between the application sheet on one side and a release paper on the other side.
  • the present invention relates to a method for forming a masking film having the predetermined partition wall pattern described in either claim 1 or claim 2.
  • a push-type cutting method in which a pinnacle-type push-type cutter is used is adopted.
  • the present invention relates to a method for forming a masking film having a predetermined partition wall pattern according to either claim 1 or claim 2.
  • the crimping step by the roll crimping means is performed at room temperature.
  • a common masking film that can be applied to both the blasting method and the hydrofluoric acid solution etching method can be obtained efficiently.
  • a PVC sheet or the like forming a masking film is pasted on the panel surface, it is compared with a conventional method or the like that is directly cut out using a cutting means such as a cutter.
  • the panel surface is no longer damaged by the cutting blade.
  • a common masking film that can be applied to both the blasting method and the etching method using a hydrofluoric acid solution can be efficiently obtained. It became possible to.
  • the attachment of the PVC sheet forming the masking film onto the panel surface is performed with an acrylic resin adhesive or butadiene rubber adhesive,
  • the masking coating (masking sheet) is securely adhered to the panel surface, and the masking coating (masking sheet) bonded in this way is smoothly removed (removed) after the partition formation process. It came to be performed.
  • the productivity of panels having partition walls can be improved.
  • the pinnacle-type pressing blade is used as the cutting means, blade spilling or the like does not occur in the cutting process, and the masking sheet cutting process can be performed smoothly and It has become possible to perform efficiently.
  • an acrylic resin adhesive is used, a roll crimping means is used, and the temperature during the crimping operation is further increased. Since the room temperature is about 20 ° C, there is no risk of bubbles on the bonding surface between the panel and the masking sheet, and the shape accuracy of the partition is reduced when forming the partition pattern on the panel surface. It became possible to improve.
  • An advantage of the present embodiment relates to a method for forming a masking film having a predetermined partition wall pattern on the panel surface.
  • the specific process is as follows.
  • the PVC sheet 1 having a predetermined thickness provided on the release paper 2 as shown in FIG. 1 is used, and the predetermined partition pattern forming portion 11 is formed with the release paper remaining on the back side.
  • Step (C) of applying the predetermined adhesive 5 to the masking sheet 1 in the state 2 is peeled off, and the masking sheet 1 and the application with the predetermined adhesive 5 applied in this way (C).
  • -A laminated sheet material consisting of a sheet 3 is placed with the surface coated with the adhesive 5 facing the surface of the predetermined panel 7 and the masking sheet 1 between the panel 7 and the application sheet 3
  • the basic principle is that power can be used.
  • a pinnacle type push as shown in FIG. A mold cutter was used as a cutting means for generating the partition wall pattern forming portion 11 of the masking sheet 1.
  • a pinnacle-type push-type cutter 9 is designed to form a double-edged blade with a partial force of the cutting edge 99 at its tip, for example, an inclination angle of about 40 ° as shown in FIG.
  • a pinacle-type cutting blade 9 By using such a pinacle-type cutting blade 9, a cut surface is formed at an end portion of the partition wall pattern forming portion 11 of the masking sheet 1 with an inclination angle of about 40 ° as shown in FIG. 2, for example.
  • the Rukoto is used as a cutting means for generating the partition wall pattern forming portion 11 of the masking sheet 1.
  • the cutting edge 99 of the cutting tool 9 comes into contact with the release paper 2 having a relatively soft surface, so that there is no spillage of the cutting edge 99, etc.
  • the cutting operation can be continuously performed. Then, in a state where such a cutting operation is performed, a predetermined partition wall pattern is formed by removing the remaining portion 19 that is not the partition wall pattern forming portion 11 as shown in FIG. Will be.
  • the application sheet 3 is provided on the surface side of the masking sheet 1 having the same strength as the PVC sheet on which the partition wall pattern is formed. (B in Fig. 1).
  • This application sheet 3 is a commercially available general sheet, which also serves as a sheet-like member having a predetermined low adhesive property. Note that the adhesive strength of the application sheet 3 needs to be slightly stronger (strong) than the adhesive strength between the release paper 2 and the masking sheet 1 made of PVC. In such a state where the application sheet 3 is placed on the masking sheet 1, the masking sheet 1 and the application sheet 3 are crimped using a predetermined crimping means (see (B) in FIG. 1).
  • a predetermined adhesive 5 on the surface of the sheet 1 (see (C) of FIG. 1).
  • the adhesive 5 in order to perform the removal operation smoothly and efficiently when the masking sheet 1 is removed after the partition walls have been formed by blasting or the like, this implementation is performed.
  • an acrylic resin adhesive or a butadiene rubber adhesive is used.
  • a masking sheet 1 with an adhesive that is provided in the state of a sheet material in advance on the back side of the masking sheet 1 made of the above PVC sheet may be used. In such a case, it is not necessary to apply V or adhesive in the process.
  • a state in which a predetermined adhesive 5 such as an acrylic resin adhesive is applied to one surface side of the masking sheet 1 in this manner is a panel 7 such as a glass panel.
  • the masking sheet 1 is pressure-bonded onto the surface of the panel 7 through the adhesive 5.
  • the crimping operation is performed by using, for example, a roll crimping means 6 as shown in FIG. That is, with the three-layered material consisting of the application sheet 3, masking sheet 1, and panel 7 as shown in FIG. Try to crimp continuously.
  • a panel 7 having a predetermined partition pattern forming portion 11 formed in this way on the surface will be described with reference to FIG.
  • This is a glass panel or other such panel 7 that has an acrylic resin adhesive or butadiene rubber adhesive on the surface side.
  • the partition wall pattern forming portion 11 forming the PVC masking sheet 1 is firmly bonded via the adhesive 5.
  • the end portion of the partition wall pattern forming portion 11 thus provided on the surface of the panel 7 has an inclination angle of about 40 ° as shown in FIG.
  • the tip portion 111 of the terminal portion is in a state of being strongly crimped in the crimping process ((D) in FIG. 1).
  • the tip end portion 111 of the end portion of the partition wall pattern forming portion 11 is turned up. There is nothing to say. Further, even when such a member (shown in FIG. 3) is etched in a hydrofluoric acid solution, the hydrofluoric acid solution or the like may permeate from the tip 111. Nah ...
  • the panel member having the masking film formed in the process based on the present embodiment on its surface side can be directly applied to the blasting process, and can be etched with a hydrofluoric acid solution or the like. It can be applied to ⁇ .
  • the present embodiment can be adopted in either the blasting method or the etching method, and the combination of the blasting method and the etching method. In the case where the construction method is adopted, excellent performance will be exhibited. As a result, productivity can be improved.
  • the step of pressing the masking sheet 1 onto the surface of the panel 7 is performed by the roll pressing means 6, and this step is also performed. Since the operation is performed at room temperature around room temperature or at room temperature, it is possible to remove bubbles that may be present in the crimping part, which is caused by the presence of the bubbles during the blasting process. It is possible to avoid the occurrence of cracks in the partition wall. As a result, it becomes possible to improve the yield rate of the partition forming operation, and to improve productivity. In addition, after the predetermined partition wall is formed in this way, the masking sheet 1 can be easily removed (removed) by an operator's manual work, and in this way. Since the masking sheet 1 is made of PVC sheet, it can be easily disposed of by incineration. Therefore, compared to conventional photoresist material processing, etc. Less impact on the environment.
  • FIG. 1 is a process explanatory view showing the overall configuration of the present invention.
  • FIG. 2 is an explanatory view showing a cutting process by a pinnacle-type cutting tool that forms the main part of the present invention.
  • FIG. 3 is a cross-sectional view showing the structure of a panel having a partition pattern on the surface produced according to the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Gas-Filled Discharge Tubes (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une pellicule de masquage applicable aussi bien au décapage qu'à l'écaillage. Ce procédé comprend : une étape (A) dans laquelle une feuille de PVC (1) disposée sur un intercalaire (2) est partiellement découpée de façon à laisser des éléments de tracé d'un motif de partition (11), l'intercalaire restant sur la face arrière ; une étape (B1) dans laquelle une feuille d’application à faible adhésion (3) est collée par compression sur la face avant de la feuille de masquage (1) qui a été découpée de façon à comporter les éléments de tracé du motif de partition (11) ; une étape (B2) dans laquelle l'intercalaire (2) est retiré du matériau en feuille triple couche comportant la feuille d'application (3) d'un côté ; une étape (C) dans laquelle un adhésif (5) est appliqué à la feuille de masquage (1), une étape (D) dans laquelle la feuille de masquage (1) recouverte de l’adhésif (5) est collée par pression sur une surface d’un panneau (7) au moyen de l’adhésif (5) ; et une étape (E) dans laquelle la feuille d’application (3) est retirée de la feuille de masquage (1) dans l’état de collage par pression à la surface du panneau(7).
PCT/JP2006/301318 2005-09-20 2006-01-27 Procédé de fabrication d’une pellicule de masquage comportant un motif de partition WO2007034579A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-271409 2005-09-20
JP2005271409A JP2007087615A (ja) 2005-09-20 2005-09-20 隔壁パターンを有するマスキング被膜の形成方法

Publications (1)

Publication Number Publication Date
WO2007034579A1 true WO2007034579A1 (fr) 2007-03-29

Family

ID=37888638

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/301318 WO2007034579A1 (fr) 2005-09-20 2006-01-27 Procédé de fabrication d’une pellicule de masquage comportant un motif de partition

Country Status (3)

Country Link
JP (1) JP2007087615A (fr)
TW (1) TW200712702A (fr)
WO (1) WO2007034579A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019088149A1 (fr) * 2017-11-01 2019-05-09 臼井国際産業株式会社 Étiquette adhésive, procédé de collage d'étiquette, procédé de fabrication d'un arbre de capteur de couple et installation pour sa fabrication

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4698532B2 (ja) * 2006-09-01 2011-06-08 株式会社アルプスエンジニアリング パネル表面上に隔壁パターンを有するマスキング被膜の形成方法及びそれに用いられる装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56134174A (en) * 1980-02-26 1981-10-20 Toppan Printing Co Ltd Masking of sand blasting treatment
JPS57121466A (en) * 1981-01-22 1982-07-28 Hiroshi Goto Protective transfer paper for sandblast
JPS61141553A (ja) * 1984-12-14 1986-06-28 Fuji Seisakusho:Kk サンドブラスト工法および転写材
JPS63312069A (ja) * 1987-03-03 1988-12-20 Sakae Ikeda 石材の図柄形成方法および該方法に使用される図柄形成素板
JPH0222217Y2 (fr) * 1982-07-08 1990-06-14
JP2001142401A (ja) * 1999-08-27 2001-05-25 Masanori Minato ポケット付きシール
JP2003204160A (ja) * 2001-09-26 2003-07-18 Fujikura Ltd 多層配線基板の層間接続構造及びフレキシブルプリント基板の製造方法並びにこの基板のランド部形成方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56134174A (en) * 1980-02-26 1981-10-20 Toppan Printing Co Ltd Masking of sand blasting treatment
JPS57121466A (en) * 1981-01-22 1982-07-28 Hiroshi Goto Protective transfer paper for sandblast
JPH0222217Y2 (fr) * 1982-07-08 1990-06-14
JPS61141553A (ja) * 1984-12-14 1986-06-28 Fuji Seisakusho:Kk サンドブラスト工法および転写材
JPS63312069A (ja) * 1987-03-03 1988-12-20 Sakae Ikeda 石材の図柄形成方法および該方法に使用される図柄形成素板
JP2001142401A (ja) * 1999-08-27 2001-05-25 Masanori Minato ポケット付きシール
JP2003204160A (ja) * 2001-09-26 2003-07-18 Fujikura Ltd 多層配線基板の層間接続構造及びフレキシブルプリント基板の製造方法並びにこの基板のランド部形成方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019088149A1 (fr) * 2017-11-01 2019-05-09 臼井国際産業株式会社 Étiquette adhésive, procédé de collage d'étiquette, procédé de fabrication d'un arbre de capteur de couple et installation pour sa fabrication
JP2019086554A (ja) * 2017-11-01 2019-06-06 臼井国際産業株式会社 貼付用ラベル、ラベル貼付方法、トルクセンサシャフトの製造方法および同シャフトの製造設備
JP7032106B2 (ja) 2017-11-01 2022-03-08 臼井国際産業株式会社 貼付用ラベル、ラベル貼付方法、トルクセンサシャフトの製造方法および同シャフトの製造設備

Also Published As

Publication number Publication date
JP2007087615A (ja) 2007-04-05
TW200712702A (en) 2007-04-01

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