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WO2007128998A3 - A method of making an electrical device - Google Patents

A method of making an electrical device Download PDF

Info

Publication number
WO2007128998A3
WO2007128998A3 PCT/GB2007/001337 GB2007001337W WO2007128998A3 WO 2007128998 A3 WO2007128998 A3 WO 2007128998A3 GB 2007001337 W GB2007001337 W GB 2007001337W WO 2007128998 A3 WO2007128998 A3 WO 2007128998A3
Authority
WO
WIPO (PCT)
Prior art keywords
resist
metal
onto
making
electrical device
Prior art date
Application number
PCT/GB2007/001337
Other languages
French (fr)
Other versions
WO2007128998A2 (en
Inventor
Nicholas Stone
Original Assignee
Nicholas Stone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nicholas Stone filed Critical Nicholas Stone
Priority to EP07732380A priority Critical patent/EP2011179A2/en
Priority to US12/296,772 priority patent/US8673681B2/en
Priority to CN2007800131788A priority patent/CN101536208B/en
Publication of WO2007128998A2 publication Critical patent/WO2007128998A2/en
Publication of WO2007128998A3 publication Critical patent/WO2007128998A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/464—Lateral top-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Conventionally, organic semiconductor devices are usually formed by either laser ablation, photolithography or by conductive inkjet printing. All these methods have short coming such as either being unsuitable for high volume production, slow, expensive or as is particularly the case in inject printing, the choice of metals used is restricted to those which can be formed as inks. The present invention employs flexography to print a resist pattern (7) onto a substrate (5) carrying a metal layer (8). Metal not protected by the resist can be etched away and then the resist (7) removed to leave exposed electrodes. Further materials (10,11) can be disposed onto the exposed metal, such as organic semiconductors, to form transistors or diodes.
PCT/GB2007/001337 2006-04-11 2007-04-11 A method of making an electrical device WO2007128998A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07732380A EP2011179A2 (en) 2006-04-11 2007-04-11 A method of making an electrical device
US12/296,772 US8673681B2 (en) 2006-04-11 2007-04-11 Electrical device fabrication
CN2007800131788A CN101536208B (en) 2006-04-11 2007-04-11 A method of making an electrical device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0607203.7 2006-04-11
GB0607203A GB2437112B (en) 2006-04-11 2006-04-11 A method of making an electrical device

Publications (2)

Publication Number Publication Date
WO2007128998A2 WO2007128998A2 (en) 2007-11-15
WO2007128998A3 true WO2007128998A3 (en) 2008-03-20

Family

ID=36539683

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2007/001337 WO2007128998A2 (en) 2006-04-11 2007-04-11 A method of making an electrical device

Country Status (5)

Country Link
US (1) US8673681B2 (en)
EP (1) EP2011179A2 (en)
CN (1) CN101536208B (en)
GB (1) GB2437112B (en)
WO (1) WO2007128998A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2437329B (en) * 2006-04-11 2011-03-09 Nicholas J Stone Conductive polymer electrodes
EP2244317A1 (en) * 2009-04-23 2010-10-27 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Optoelectric device and method for manufacturing the same
KR101156771B1 (en) * 2010-08-26 2012-06-18 삼성전기주식회사 Method of manufacturing conductive transparent substrate
US9650716B2 (en) * 2015-01-22 2017-05-16 Eastman Kodak Company Patterning continuous webs with protected electrically-conductive grids

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1383179A2 (en) * 2002-07-17 2004-01-21 Pioneer Corporation Organic semiconductor device
US20040127065A1 (en) * 2002-12-31 2004-07-01 Lg.Philips Lcd Co., Ltd. Pattern and its forming method of liquid crystal display device
WO2004066348A2 (en) * 2003-01-21 2004-08-05 Polyic Gmbh & Co. Kg Organic electronic component and method for producing organic electronic devices
JP2004268319A (en) * 2003-03-06 2004-09-30 Dainippon Printing Co Ltd Method for printing continuous fine lines by flexographic printing, and method for producing laminate or electromagnetic wave shielding material using the same
US20050186700A1 (en) * 2004-02-23 2005-08-25 Hagen Klauk Method for through-plating field effect transistors with a self-assembled monolayer of an organic compound as gate dielectric

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DE8909771U1 (en) * 1989-08-14 1990-12-13 Gerhard GmbH, 57586 Weitefeld Swap tank
US4869778A (en) * 1987-07-20 1989-09-26 Gardoc, Inc. Method of forming a patterned aluminum layer and article
DE3818194A1 (en) 1988-05-28 1989-12-07 Asea Brown Boveri SPINDLE WITH ELECTRIC MOTOR DRIVE FOR A SPINNING MACHINE
US6331356B1 (en) * 1989-05-26 2001-12-18 International Business Machines Corporation Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
KR100217006B1 (en) * 1995-10-17 1999-09-01 미따라이 하지메 Etching method, process for producing a semiconductor element using said etching method, and apparatus suitable for practicing said etching method
AU5871500A (en) * 1999-06-11 2001-01-02 Sydney Hyman Image making medium
EP1138091B1 (en) 1999-09-10 2007-01-17 Koninklijke Philips Electronics N.V. Conductive structure based on poly-3,4-alkenedioxythiophene (pedot) and polystyrenesulfonic acid (pss)
EP1209253A3 (en) * 2000-11-28 2004-02-25 Shipley Co. L.L.C. Process for treating adhesion promoted metal surfaces with epoxy resins
US6835412B2 (en) * 2001-05-04 2004-12-28 Micrometal Technologies, Inc. Metalized dielectric substrates for EAS tags
US6596183B2 (en) * 2001-05-11 2003-07-22 Teng-Kuei Chen Cutting-free method for making a hologram sticker and the structure of the sticker
JP4294489B2 (en) 2002-02-05 2009-07-15 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Photosensitive composition
US20030151028A1 (en) * 2002-02-14 2003-08-14 Lawrence Daniel P. Conductive flexographic and gravure ink
US6866799B2 (en) * 2002-05-09 2005-03-15 Anuvu, Inc. Water-soluble electrically conductive composition, modifications, and applications thereof
US7569153B2 (en) * 2002-05-23 2009-08-04 Lg Display Co., Ltd. Fabrication method of liquid crystal display device
US6661024B1 (en) * 2002-07-02 2003-12-09 Motorola, Inc. Integrated circuit including field effect transistor and method of manufacture
JP2004111784A (en) * 2002-09-20 2004-04-08 Dainippon Printing Co Ltd Light transmitting electromagnetic wave shielding sheet and method of manufacturing the same
KR100950133B1 (en) * 2002-12-27 2010-03-30 엘지디스플레이 주식회사 Pattern Forming Method by Printing Method
CN100392828C (en) * 2003-02-06 2008-06-04 株式会社半导体能源研究所 Manufacturing method of display device
CN100421279C (en) * 2003-11-17 2008-09-24 中国科学院长春应用化学研究所 Organic thin film transistor device containing modification layer and its processing method
DE102004031719A1 (en) 2004-06-30 2006-01-19 Infineon Technologies Ag Production process for an electrically functional layer structure for semiconductor technology forms and applies mask by gravure process and structures a material layer
EP1638155A1 (en) 2004-09-21 2006-03-22 Samsung SDI Germany GmbH Improvement of the conductivity of a polymer electrode by using an underlying grid of metal lines
US7524768B2 (en) * 2006-03-24 2009-04-28 Palo Alto Research Center Incorporated Method using monolayer etch masks in combination with printed masks
GB2437329B (en) * 2006-04-11 2011-03-09 Nicholas J Stone Conductive polymer electrodes
US7795769B2 (en) * 2006-10-13 2010-09-14 Thomas Cartwright Cover for the motor housing of a ceiling fan

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1383179A2 (en) * 2002-07-17 2004-01-21 Pioneer Corporation Organic semiconductor device
US20040127065A1 (en) * 2002-12-31 2004-07-01 Lg.Philips Lcd Co., Ltd. Pattern and its forming method of liquid crystal display device
WO2004066348A2 (en) * 2003-01-21 2004-08-05 Polyic Gmbh & Co. Kg Organic electronic component and method for producing organic electronic devices
JP2004268319A (en) * 2003-03-06 2004-09-30 Dainippon Printing Co Ltd Method for printing continuous fine lines by flexographic printing, and method for producing laminate or electromagnetic wave shielding material using the same
US20050186700A1 (en) * 2004-02-23 2005-08-25 Hagen Klauk Method for through-plating field effect transistors with a self-assembled monolayer of an organic compound as gate dielectric

Also Published As

Publication number Publication date
US20090275167A1 (en) 2009-11-05
GB2437112B (en) 2011-04-13
WO2007128998A2 (en) 2007-11-15
GB2437112A (en) 2007-10-17
US8673681B2 (en) 2014-03-18
CN101536208B (en) 2012-10-10
CN101536208A (en) 2009-09-16
EP2011179A2 (en) 2009-01-07
GB0607203D0 (en) 2006-05-17

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