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WO2008000529A1 - Dispositif support - Google Patents

Dispositif support Download PDF

Info

Publication number
WO2008000529A1
WO2008000529A1 PCT/EP2007/053539 EP2007053539W WO2008000529A1 WO 2008000529 A1 WO2008000529 A1 WO 2008000529A1 EP 2007053539 W EP2007053539 W EP 2007053539W WO 2008000529 A1 WO2008000529 A1 WO 2008000529A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
metal
support
coupling element
conductor
Prior art date
Application number
PCT/EP2007/053539
Other languages
German (de)
English (en)
Inventor
Jens Artmann
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2008000529A1 publication Critical patent/WO2008000529A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Definitions

  • the invention relates to a support device, the ⁇ example, as a transmission control device for controlling a gearbox of a vehicle can be used.
  • Such transmission control devices are used for controlling actuators, by means of which different transmission ratios of an automated transmission can be adjusted.
  • Such transmission control devices are preferably used locally close to the gearbox and thus also the ho ⁇ hen temperature fluctuations in the range of the transmission is excluded.
  • a high power requirement is often given for actuating the actuators, with the result that a large amount of heat is generated regularly by circuit breakers, which are included in the carrier device, which must be suitably dissipated.
  • Carrier devices often take environmentally ceramic circuit carrier, which should be elekt ⁇ driven conductively coupled particular for the realization of EMC protection to a reference potential.
  • the object of the invention is to provide a carrier device which is simple.
  • the invention is characterized by a carrier device having a metal carrier, a ceramic conductor carrier, which is arranged on the metal carrier, and a flex foil conductor carrier, which is electrically coupled by means of a bonding connection with the ceramic conductor carrier and by means of a electrically conductive coupling element with the metal carrier via positive engagement and / or adhesion electrically conductive ge ⁇ coupled.
  • the metal carrier is preferably designed to dissipate heat from the ceramic conductor carrier.
  • the metal carrier is plate-shaped.
  • the invention is characterized in that a particularly simple electrical coupling between metal carrier and ceramic conductor carrier can be produced without the material and / or surface condition of the metal carrier necessarily having to be suitable for a bond connection. This results in greater degrees of freedom in the design or manufacture of the metal carrier. This is because ⁇ achieved by particularly simple in that the bonding connection takes place through a coupling of the flex-film printed circuit carrier with the Ke Ramik-wire carrier while the metal support via
  • Positive locking and / or adhesion is electrically conductively coupled by means of the coupling element with the flex foil conductor carrier. So the often already for other purposes, such as. As a contacting of actuators or sensors existing flex foil conductor carrier can also be used for the purposes of Hers damagess the electrical coupling between the ceramic conductor carrier and the metal carrier. In addition, then only a slight requirement for a flatness or roughness of the metal carrier can be made and thus, for example, the metal carrier can be designed as a cast part, without a subsequent machining in the area of the bonding contact being necessary.
  • this has a housing cover, which is mechanically coupled by means of the coupling element with the metal support.
  • the coupling element has a double function, namely the production of the electrically conductive coupling between the flex foil conductor support and the metal support on the one hand and on the other hand of coupling of the housing cover with metal support.
  • the coupling element is a rivet. In this way, a positive connection between coupling element and metal carrier and also between coupling element and flex foil conductor carrier can be ensured in a particularly simple manner. In this way, the electrically conductive coupling between flex foil conductor carrier and metal carrier can then be ensured in a particularly simple manner.
  • the metal carrier comprises aluminum. This is a particularly preferred material for this purpose.
  • Figure 1 shows a first section of a support device
  • FIG. 2 shows a second detail of the carrier device according to FIG. 1.
  • a carrier device which is used for example as Getriebesteu ⁇ ervoriques, is shown in more detail with reference to Figures 1 and 2.
  • the carrier device can also be used for any other purposes, such as a Motorsteue ⁇ tion for an internal combustion engine or for other purposes outside the automotive sector.
  • the support device comprises a metal support 1, which is preferably plate-shaped and comprises a good heat lei ⁇ tendes material and is well electrically conductive.
  • the metal carrier thus also serves for EMC protection and is electrically conductively coupled to a reference potential.
  • the metal support comprises aluminum or consists essentially or even entirely of aluminum.
  • a ceramic conductor carrier 2 is arranged on the metal support 1, arranged. This is preferably adhered to the metal support 1 by means of thermal adhesive and in particular thermally coupled to the metal support 1 in such a way that over the Me ⁇ tallique 1 in the ceramic conductor support generated heat can be dissipated efficiently.
  • the ceramic circuit carrier comprises electrical conductors and with these contacted electrical or electronic Bauelemen ⁇ te, which also include integrated circuits.
  • the pre ⁇ part of ceramic conductor supports is that they can be made very compact and can be operated at very high temperatures.
  • the ceramic conductor carrier is designed as a so-called LTCC conductor carrier, wherein LTCC stands for Low Temperature Co-fired Ceramics.
  • Conductor carrier 4 is arranged.
  • Such flex foil conductor supports 4 comprise at least a base layer, a copper layer and a cover layer, wherein 4 different electrical conductors through the corresponding locally se ⁇ selective removal during manufacture of the flex foil conductor carrier
  • Copper layer can be formed.
  • the base layer and the cover layer are electrically insulating.
  • the flex foil conductor carrier 4 is also used for contacting actuators and / or sensors, which are associated with the carrier device, with the ceramic conductor carrier 2.
  • the flex foil conductor carrier 4 has a first bonding pad 6, which via a bonding wire 10 is electrically conductively coupled to a second bonding pad 8, which is formed on the ceramic conductor carrier 2.
  • the first and second bond pads 6, 8 in conjunction with the bonding wire 10, a bond connection is realized.
  • the flex foil conductor carrier 4 has a recess 16 in its cover foil, whereby a predetermined area of its copper layer is exposed, which forms part of a conductor which is electrically conductively coupled to the first bonding pad 8. Inside the recess 16 of the cover film, a recess 18 of the flex film is provided, which penetrates them.
  • the flex foil conductor carrier 4 is preferably arranged in alignment with its recess 18 with a recess 20 of the metal carrier 1.
  • a coupling element 12 penetrates both the flex foil conductor carrier 4 and the metal carrier 1 in the region of the corresponding recess 18, 20.
  • the coupling element 12 also has a stop shoulder 14, via which it can be mechanically clamped to the recess 16 of the cover foil of the flex foil.
  • Foil conductor carrier 4 is applied.
  • the coupling element 12 is formed from a material with good electrical conductivity. Thus, it is electrically coupled via the stop shoulder 14 in the region of the recess 16 of the cover foil to the copper layer of the flex foil conductor carrier 4.
  • the flex foil conductor carrier 4 is also positively coupled to the metal carrier 1 in this area.
  • the coupling element 12 is also positively coupled to the metal carrier 1. In the preferred embodiment, it is designed as a rivet. However, it can also be designed as another, known to those skilled in the art for this purpose coupling element 12, such as a screw, by means of ⁇ sen a positive and / or positive coupling can be made.
  • the coupling element 12 is preferably a beading member 22 by means of which it is dimensionally ⁇ positively fixed on the metal support 1 and thus an electri- cally conductive connection between one of the electrical
  • Head of the flex film conductor support 4 and the metal support 1 is guaranteed.
  • the bond connection can so a simple coupling of the metal carrier with a reference ⁇ potential (mass) can be ensured.
  • a housing cover 28 is preferably fixed to the metal carrier 1 by means of the coupling element 12.
  • the coupling element 12 preferably has a rivet head 24, by means of which also a positive connection in the region of a seat 26 of the housing cover 28 is realized.
  • the housing cover 28 may comprise plastic, for example, but preferably comprises metal, in particular aluminum. It can be produced, for example, as a punched-bent part or possibly by die-cast aluminum.
  • a sealing element 30 is preferably arranged, by means of which a sealing of an inner region of the carrier device can be ensured, in which the ceramic conductor carrier 2 is arranged.
  • the metal carrier 1 may preferably be formed as a punched-bent part or optionally as a diecasting element and is preferably made of aluminum.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Control Of Transmission Device (AREA)
  • Connection Of Plates (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un dispositif support comporte un support métallique (1), un support conducteur céramique (2) disposé sur le support métallique (1), et un support conducteur à pellicules flexibles (4) couplé de façon électriquement conductrice au support conducteur céramique (2) au moyen d'une connexion par métallisation, et couplé de façon électriquement conductrice au support métallique (1) par complémentarité de forme et/ou par assemblage à force, au moyen d'un élément de couplage électriquement conducteur (12).
PCT/EP2007/053539 2006-06-28 2007-04-12 Dispositif support WO2008000529A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006029711.3 2006-06-28
DE102006029711.3A DE102006029711B4 (de) 2006-06-28 2006-06-28 Trägervorrichtung

Publications (1)

Publication Number Publication Date
WO2008000529A1 true WO2008000529A1 (fr) 2008-01-03

Family

ID=38326257

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/053539 WO2008000529A1 (fr) 2006-06-28 2007-04-12 Dispositif support

Country Status (2)

Country Link
DE (1) DE102006029711B4 (fr)
WO (1) WO2008000529A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992011745A1 (fr) * 1990-12-21 1992-07-09 Siemens Aktiengesellschaft Boitier de protection contre les radiofrequences pour un circuit, par exemple pour la commande d'un 'airbag' d'un vehicule
US5506373A (en) * 1993-07-09 1996-04-09 Magnavox Electronic Systems Company Electronic module enclosure
US6501030B1 (en) * 1999-10-26 2002-12-31 Cisco Technology, Inc. Grounding plug for printed circuit board
DE102004021931A1 (de) * 2004-03-16 2005-10-06 Robert Bosch Gmbh Gehäuse für eine elektronische Schaltung
WO2006010652A1 (fr) * 2004-07-28 2006-02-02 Siemens Aktiengesellschaft Dispositif de commande, notamment appareil de commande mecatronique de transmission ou de moteur

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3814467B2 (ja) * 2000-06-28 2006-08-30 株式会社日立製作所 車両用電子制御装置
DE10110620A1 (de) * 2001-03-06 2002-09-26 Conti Temic Microelectronic Elekronische Baugruppe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992011745A1 (fr) * 1990-12-21 1992-07-09 Siemens Aktiengesellschaft Boitier de protection contre les radiofrequences pour un circuit, par exemple pour la commande d'un 'airbag' d'un vehicule
US5506373A (en) * 1993-07-09 1996-04-09 Magnavox Electronic Systems Company Electronic module enclosure
US6501030B1 (en) * 1999-10-26 2002-12-31 Cisco Technology, Inc. Grounding plug for printed circuit board
DE102004021931A1 (de) * 2004-03-16 2005-10-06 Robert Bosch Gmbh Gehäuse für eine elektronische Schaltung
WO2006010652A1 (fr) * 2004-07-28 2006-02-02 Siemens Aktiengesellschaft Dispositif de commande, notamment appareil de commande mecatronique de transmission ou de moteur

Also Published As

Publication number Publication date
DE102006029711A1 (de) 2008-01-31
DE102006029711B4 (de) 2018-10-18

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