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WO2008005325A3 - Wafer carrier docking station - Google Patents

Wafer carrier docking station Download PDF

Info

Publication number
WO2008005325A3
WO2008005325A3 PCT/US2007/015111 US2007015111W WO2008005325A3 WO 2008005325 A3 WO2008005325 A3 WO 2008005325A3 US 2007015111 W US2007015111 W US 2007015111W WO 2008005325 A3 WO2008005325 A3 WO 2008005325A3
Authority
WO
WIPO (PCT)
Prior art keywords
docking station
container
charging
couplings
wafer carrier
Prior art date
Application number
PCT/US2007/015111
Other languages
French (fr)
Other versions
WO2008005325A2 (en
Inventor
Barry Gregerson
James M Anderson
Original Assignee
Entegris Inc
Barry Gregerson
James M Anderson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc, Barry Gregerson, James M Anderson filed Critical Entegris Inc
Publication of WO2008005325A2 publication Critical patent/WO2008005325A2/en
Publication of WO2008005325A3 publication Critical patent/WO2008005325A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J5/00—Circuit arrangements for transfer of electric power between AC networks and DC networks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
    • H02J7/0044—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction specially adapted for holding portable devices containing batteries
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
    • H02J7/0045—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction concerning the insertion or the connection of the batteries
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/02—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from AC mains by converters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/40—Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
    • H02J50/402—Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices the two or more transmitting or the two or more receiving devices being integrated in the same unit, e.g. power mats with several coils or antennas with several sub-antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

An docking station for charging a rechargeable battery on a container such as a front opening unitary pod (FOUP) and/or coupling instrumentation on the container with a remote monitor. The docking station is configured to support and align a container having an instrumentation module that monitors the wafer carrier. The instrumentation module may be powered by a rechargeable battery through an interface with couplings such as inductive couplings or electrical contacts for engaging with the charging contacts on the docking station. A contact switch may enable power to be provided to the charging circuit only when the container is present on the docking station. The battery may be aligned with the contacts on the docking station using kinematic couplings on the container. Light sources such as light emitting diodes (LEDs) may indicate the status of the charging unit.
PCT/US2007/015111 2006-06-30 2007-06-28 Wafer carrier docking station WO2008005325A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81780006P 2006-06-30 2006-06-30
US60/817,800 2006-06-30

Publications (2)

Publication Number Publication Date
WO2008005325A2 WO2008005325A2 (en) 2008-01-10
WO2008005325A3 true WO2008005325A3 (en) 2008-07-31

Family

ID=38895129

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/015111 WO2008005325A2 (en) 2006-06-30 2007-06-28 Wafer carrier docking station

Country Status (2)

Country Link
TW (1) TW200807609A (en)
WO (1) WO2008005325A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9356822B2 (en) * 2012-10-30 2016-05-31 Kla-Tencor Corporation Automated interface apparatus and method for use in semiconductor wafer handling systems
WO2022044778A1 (en) * 2020-08-28 2022-03-03 イーグル工業株式会社 Electronic instrument

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605487A (en) * 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
US6397990B1 (en) * 1998-10-20 2002-06-04 Pri Automation, Inc. Materials transport system having inductive power transfer
US6917182B2 (en) * 2003-07-24 2005-07-12 Motorola, Inc. Method and system for providing induction charging having improved efficiency
US6937990B1 (en) * 1997-07-01 2005-08-30 Walker Digital, Llc System for syndication of insurance

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605487A (en) * 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
US6937990B1 (en) * 1997-07-01 2005-08-30 Walker Digital, Llc System for syndication of insurance
US6397990B1 (en) * 1998-10-20 2002-06-04 Pri Automation, Inc. Materials transport system having inductive power transfer
US6917182B2 (en) * 2003-07-24 2005-07-12 Motorola, Inc. Method and system for providing induction charging having improved efficiency

Also Published As

Publication number Publication date
TW200807609A (en) 2008-02-01
WO2008005325A2 (en) 2008-01-10

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