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WO2008146812A1 - 撮像装置の製造方法、撮像装置及び光学素子 - Google Patents

撮像装置の製造方法、撮像装置及び光学素子 Download PDF

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Publication number
WO2008146812A1
WO2008146812A1 PCT/JP2008/059719 JP2008059719W WO2008146812A1 WO 2008146812 A1 WO2008146812 A1 WO 2008146812A1 JP 2008059719 W JP2008059719 W JP 2008059719W WO 2008146812 A1 WO2008146812 A1 WO 2008146812A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging device
optical element
component
substrate
camera module
Prior art date
Application number
PCT/JP2008/059719
Other languages
English (en)
French (fr)
Inventor
Daisuke Watanabe
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Publication of WO2008146812A1 publication Critical patent/WO2008146812A1/ja

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Optics & Photonics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　本発明は、リフロー工程の処理に対応可能で光学性能に優れた撮像装置の製造方法、撮像装置及び光学素子を提供する。この撮像装置の製造方法は、ＳｉＨ基と反応性を有する炭素－炭素二重結合を１分子中に少なくとも２個含有する有機系骨格からなる有機化合物である（Ａ）成分と、１分子中に少なくとも２個のＳｉＨ基を含有するケイ素化合物である（Ｂ）成分と、ヒドロシリル化触媒である（Ｃ）成分とを必須成分として含有してなり、かつ、硬化性を有する樹脂組成物を硬化して光学素子を成形する工程、前記光学素子を備えたカメラモジュールを電子部品とともに基板上に載置する工程、及び、前記カメラモジュールと、前記電子部品と、前記基板とをリフロー処理に供し、前記カメラモジュールと前記電子部品とを前記基板に実装する工程を有することを特徴とする。
PCT/JP2008/059719 2007-05-29 2008-05-27 撮像装置の製造方法、撮像装置及び光学素子 WO2008146812A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-141758 2007-05-29
JP2007141758 2007-05-29

Publications (1)

Publication Number Publication Date
WO2008146812A1 true WO2008146812A1 (ja) 2008-12-04

Family

ID=40075052

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059719 WO2008146812A1 (ja) 2007-05-29 2008-05-27 撮像装置の製造方法、撮像装置及び光学素子

Country Status (1)

Country Link
WO (1) WO2008146812A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013175861A (ja) * 2012-02-24 2013-09-05 Fujifilm Corp 基板モジュールおよびその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185826A (ja) * 2000-12-15 2002-06-28 Matsushita Electric Ind Co Ltd 基板実装用カメラおよび基板実装用カメラの実装方法
JP2004294741A (ja) * 2003-03-27 2004-10-21 Kanegafuchi Chem Ind Co Ltd 光学レンズ及び光学レンズの製造方法
JP2005538503A (ja) * 2002-09-06 2005-12-15 ノキア コーポレイション コネクタ
JP2006100516A (ja) * 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd 成型基板及びこの製造方法、並びにこれを用いたカメラモジュール
JP2007043628A (ja) * 2005-08-05 2007-02-15 Hitachi Maxell Ltd カメラモジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185826A (ja) * 2000-12-15 2002-06-28 Matsushita Electric Ind Co Ltd 基板実装用カメラおよび基板実装用カメラの実装方法
JP2005538503A (ja) * 2002-09-06 2005-12-15 ノキア コーポレイション コネクタ
JP2004294741A (ja) * 2003-03-27 2004-10-21 Kanegafuchi Chem Ind Co Ltd 光学レンズ及び光学レンズの製造方法
JP2006100516A (ja) * 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd 成型基板及びこの製造方法、並びにこれを用いたカメラモジュール
JP2007043628A (ja) * 2005-08-05 2007-02-15 Hitachi Maxell Ltd カメラモジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013175861A (ja) * 2012-02-24 2013-09-05 Fujifilm Corp 基板モジュールおよびその製造方法

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