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WO2008139750A1 - 基材処理装置及びそれを用いた基材処理方法 - Google Patents

基材処理装置及びそれを用いた基材処理方法 Download PDF

Info

Publication number
WO2008139750A1
WO2008139750A1 PCT/JP2008/050894 JP2008050894W WO2008139750A1 WO 2008139750 A1 WO2008139750 A1 WO 2008139750A1 JP 2008050894 W JP2008050894 W JP 2008050894W WO 2008139750 A1 WO2008139750 A1 WO 2008139750A1
Authority
WO
WIPO (PCT)
Prior art keywords
base material
material processing
section
line
carrying
Prior art date
Application number
PCT/JP2008/050894
Other languages
English (en)
French (fr)
Inventor
Akitsugu Hatano
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Priority to CN2008800044036A priority Critical patent/CN101605710B/zh
Priority to US12/528,365 priority patent/US8317962B2/en
Publication of WO2008139750A1 publication Critical patent/WO2008139750A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/58—Article switches or diverters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00—Apparatus for splicing webs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1059—Splitting sheet lamina in plane intermediate of faces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1067—Continuous longitudinal slitting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y10T156/1085—One web only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y10T156/1087—Continuous longitudinal slitting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0448—With subsequent handling [i.e., of product]
    • Y10T83/0467—By separating products from each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/202—With product handling means
    • Y10T83/2074—Including means to divert one portion of product from another
    • Y10T83/2087—Diverging product movers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Replacement Of Web Rolls (AREA)
  • Manufacturing And Processing Devices For Dough (AREA)

Abstract

　基材処理装置は、処理対象の可撓性基材を第１ラインから受け取って搬送する第１基材搬送部と、第１基材搬送部によって搬送される可撓性基材を分割する基材分割部と、基材分割部によって分割されて生じた基材始端から可撓性基材を受け取り、その搬送経路を第２ラインへ切り替える経路切替部と、第２ラインの前段に設けられ、処理対象の可撓性基材を保持して第２ラインへ搬送する第２基材搬送部と、を備える。
PCT/JP2008/050894 2007-05-16 2008-01-23 基材処理装置及びそれを用いた基材処理方法 WO2008139750A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800044036A CN101605710B (zh) 2007-05-16 2008-01-23 基材处理装置和使用该基材处理装置的基材处理方法
US12/528,365 US8317962B2 (en) 2007-05-16 2008-01-23 Base material processing device and base material processing method using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-130228 2007-05-16
JP2007130228 2007-05-16

Publications (1)

Publication Number Publication Date
WO2008139750A1 true WO2008139750A1 (ja) 2008-11-20

Family

ID=40001974

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050894 WO2008139750A1 (ja) 2007-05-16 2008-01-23 基材処理装置及びそれを用いた基材処理方法

Country Status (3)

Country Link
US (1) US8317962B2 (ja)
CN (1) CN101605710B (ja)
WO (1) WO2008139750A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108040500B (zh) * 2015-09-29 2022-04-08 株式会社尼康 制造系统
CN110590139A (zh) * 2019-09-06 2019-12-20 中电九天智能科技有限公司 激光退火制程生产线优化方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11258699A (ja) * 1998-01-12 1999-09-24 Fuji Photo Film Co Ltd 画像記録装置
JP2003523908A (ja) * 2000-02-25 2003-08-12 メトソ ペーパ インコーポレイテッド 紙または板紙ウェブの製造方法および抄紙機または板紙抄紙機
JP2003327354A (ja) * 2002-05-10 2003-11-19 Zuiko Corp ウエブの継ぎ方法および継ぎ装置
JP2005178291A (ja) * 2003-12-22 2005-07-07 Fuji Photo Film Co Ltd 表面処理装置及び画像記録装置
JP2006027814A (ja) * 2004-07-15 2006-02-02 Metal Color:Kk ウエブの接合方法、除去接合方法およびジョインタ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6320643B1 (en) * 1998-01-12 2001-11-20 Fuji Photo Film Co., Ltd. Image recording apparatus
JP2002087665A (ja) 2000-09-12 2002-03-27 Dainippon Printing Co Ltd ウェブつなぎ装置
JP4423966B2 (ja) 2003-12-24 2010-03-03 凸版印刷株式会社 連続真空成膜装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11258699A (ja) * 1998-01-12 1999-09-24 Fuji Photo Film Co Ltd 画像記録装置
JP2003523908A (ja) * 2000-02-25 2003-08-12 メトソ ペーパ インコーポレイテッド 紙または板紙ウェブの製造方法および抄紙機または板紙抄紙機
JP2003327354A (ja) * 2002-05-10 2003-11-19 Zuiko Corp ウエブの継ぎ方法および継ぎ装置
JP2005178291A (ja) * 2003-12-22 2005-07-07 Fuji Photo Film Co Ltd 表面処理装置及び画像記録装置
JP2006027814A (ja) * 2004-07-15 2006-02-02 Metal Color:Kk ウエブの接合方法、除去接合方法およびジョインタ

Also Published As

Publication number Publication date
US20100095816A1 (en) 2010-04-22
CN101605710B (zh) 2011-08-10
CN101605710A (zh) 2009-12-16
US8317962B2 (en) 2012-11-27

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