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WO2009060539A1 - インライン型ウェハ搬送装置 - Google Patents

インライン型ウェハ搬送装置 Download PDF

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Publication number
WO2009060539A1
WO2009060539A1 PCT/JP2007/071815 JP2007071815W WO2009060539A1 WO 2009060539 A1 WO2009060539 A1 WO 2009060539A1 JP 2007071815 W JP2007071815 W JP 2007071815W WO 2009060539 A1 WO2009060539 A1 WO 2009060539A1
Authority
WO
WIPO (PCT)
Prior art keywords
inline
conveyance device
type wafer
conveyance
process module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/071815
Other languages
English (en)
French (fr)
Inventor
Naoki Watanabe
Einstein Noel Abarra
David Djulianto DJAYAPRAWIRA
Yasumi Kurematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Priority to CN200780101305A priority Critical patent/CN101842890A/zh
Priority to JP2009539923A priority patent/JP4494523B2/ja
Priority to PCT/JP2007/071815 priority patent/WO2009060539A1/ja
Publication of WO2009060539A1 publication Critical patent/WO2009060539A1/ja
Priority to US12/720,372 priority patent/US20100189532A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　ウェハを搬入及び搬出するためのロードロックチャンバ（５１）と、第１の搬送機構（５４ａ）を有する第１の搬送モジュール（５３ａ）と、第１のプロセスモジュール（５２ａ）と、第２の搬送機構（５４ｂ）を有する第２の搬送モジュール（５３ｂ）と、第２のプロセスモジュール（５２ｂ）とを順次直列的に接続した構成を有する。ウェハ（５５）は、第１の搬送機構により、ロードロックチャンバと第１のプロセスモジュールとの間で搬送され、第２の搬送機構により、第１のプロセスモジュールと第２のプロセスモジュールとの間で搬送される。
PCT/JP2007/071815 2007-11-09 2007-11-09 インライン型ウェハ搬送装置 Ceased WO2009060539A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200780101305A CN101842890A (zh) 2007-11-09 2007-11-09 在线型晶圆输送装置
JP2009539923A JP4494523B2 (ja) 2007-11-09 2007-11-09 インライン型ウェハ搬送装置および基板搬送方法
PCT/JP2007/071815 WO2009060539A1 (ja) 2007-11-09 2007-11-09 インライン型ウェハ搬送装置
US12/720,372 US20100189532A1 (en) 2007-11-09 2010-03-09 Inline-type wafer conveyance device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/071815 WO2009060539A1 (ja) 2007-11-09 2007-11-09 インライン型ウェハ搬送装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/720,372 Continuation US20100189532A1 (en) 2007-11-09 2010-03-09 Inline-type wafer conveyance device

Publications (1)

Publication Number Publication Date
WO2009060539A1 true WO2009060539A1 (ja) 2009-05-14

Family

ID=40625454

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/071815 Ceased WO2009060539A1 (ja) 2007-11-09 2007-11-09 インライン型ウェハ搬送装置

Country Status (4)

Country Link
US (1) US20100189532A1 (ja)
JP (1) JP4494523B2 (ja)
CN (1) CN101842890A (ja)
WO (1) WO2009060539A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101882565A (zh) * 2010-06-03 2010-11-10 北京北方微电子基地设备工艺研究中心有限责任公司 一种在线处理设备
JP2014036025A (ja) * 2012-08-07 2014-02-24 Hitachi High-Technologies Corp 真空処理装置または真空処理装置の運転方法
JP2015088694A (ja) * 2013-11-01 2015-05-07 株式会社日立ハイテクノロジーズ 真空処理装置
JP2019071480A (ja) * 2012-07-20 2019-05-09 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 磁気メモリを製造するための装置及び磁気接合を提供するための方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5785712B2 (ja) * 2010-12-28 2015-09-30 株式会社日立ハイテクノロジーズ 真空処理装置
US9406538B2 (en) 2012-10-09 2016-08-02 Applied Materials, Inc. Indexed inline substrate processing tool
KR101736855B1 (ko) 2015-05-29 2017-05-18 세메스 주식회사 기판 처리 설비
WO2021192001A1 (ja) 2020-03-24 2021-09-30 株式会社日立ハイテク 真空処理装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362944A (ja) * 1989-07-31 1991-03-19 Tokyo Electron Ltd 基板処理装置
JPH0799224A (ja) * 1993-09-28 1995-04-11 Hitachi Ltd 多チャンバ型半導体製造装置
JPH07106215A (ja) * 1993-10-08 1995-04-21 Kokusai Electric Co Ltd 半導体製造装置における障害処理方法
JPH1022358A (ja) * 1996-06-28 1998-01-23 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH10189687A (ja) * 1996-10-21 1998-07-21 Applied Materials Inc マルチチャンバ半導体ウェハ処理システム内の優先順位に基づくウェハ処理スケジューリング方法及びその装置
JPH11350132A (ja) * 1998-06-03 1999-12-21 Hitachi Ltd 成膜装置
JP2007005435A (ja) * 2005-06-22 2007-01-11 Rorze Corp 処理装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
KR100398877B1 (ko) * 2001-05-09 2003-09-19 삼성전자주식회사 현상기 소음 및 진동방지구조를 갖는 화상형성장치
US6918731B2 (en) * 2001-07-02 2005-07-19 Brooks Automation, Incorporated Fast swap dual substrate transport for load lock
US7226512B2 (en) * 2003-06-18 2007-06-05 Ekc Technology, Inc. Load lock system for supercritical fluid cleaning
US7210246B2 (en) * 2003-11-10 2007-05-01 Blueshift Technologies, Inc. Methods and systems for handling a workpiece in vacuum-based material handling system
US20060102078A1 (en) * 2004-11-18 2006-05-18 Intevac Inc. Wafer fab
US20070166134A1 (en) * 2005-12-20 2007-07-19 Motoko Suzuki Substrate transfer method, substrate transfer apparatus and exposure apparatus
CN101765677B (zh) * 2007-08-29 2012-01-25 佳能安内华股份有限公司 通过溅射的成膜方法及其溅射设备
WO2009057715A1 (ja) * 2007-10-31 2009-05-07 Canon Anelva Corporation マグネトロンユニット、マグネトロンスパッタリング装置及び電子デバイスの製造方法
JPWO2009066390A1 (ja) * 2007-11-22 2011-03-31 キヤノンアネルバ株式会社 スパッタ装置およびスパッタ方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362944A (ja) * 1989-07-31 1991-03-19 Tokyo Electron Ltd 基板処理装置
JPH0799224A (ja) * 1993-09-28 1995-04-11 Hitachi Ltd 多チャンバ型半導体製造装置
JPH07106215A (ja) * 1993-10-08 1995-04-21 Kokusai Electric Co Ltd 半導体製造装置における障害処理方法
JPH1022358A (ja) * 1996-06-28 1998-01-23 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH10189687A (ja) * 1996-10-21 1998-07-21 Applied Materials Inc マルチチャンバ半導体ウェハ処理システム内の優先順位に基づくウェハ処理スケジューリング方法及びその装置
JPH11350132A (ja) * 1998-06-03 1999-12-21 Hitachi Ltd 成膜装置
JP2007005435A (ja) * 2005-06-22 2007-01-11 Rorze Corp 処理装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101882565A (zh) * 2010-06-03 2010-11-10 北京北方微电子基地设备工艺研究中心有限责任公司 一种在线处理设备
CN101882565B (zh) * 2010-06-03 2012-04-11 北京北方微电子基地设备工艺研究中心有限责任公司 一种在线处理设备
JP2019071480A (ja) * 2012-07-20 2019-05-09 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 磁気メモリを製造するための装置及び磁気接合を提供するための方法
JP2014036025A (ja) * 2012-08-07 2014-02-24 Hitachi High-Technologies Corp 真空処理装置または真空処理装置の運転方法
JP2015088694A (ja) * 2013-11-01 2015-05-07 株式会社日立ハイテクノロジーズ 真空処理装置

Also Published As

Publication number Publication date
JPWO2009060539A1 (ja) 2011-03-17
JP4494523B2 (ja) 2010-06-30
US20100189532A1 (en) 2010-07-29
CN101842890A (zh) 2010-09-22

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