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WO2009011365A1 - プローブカード - Google Patents

プローブカード Download PDF

Info

Publication number
WO2009011365A1
WO2009011365A1 PCT/JP2008/062849 JP2008062849W WO2009011365A1 WO 2009011365 A1 WO2009011365 A1 WO 2009011365A1 JP 2008062849 W JP2008062849 W JP 2008062849W WO 2009011365 A1 WO2009011365 A1 WO 2009011365A1
Authority
WO
WIPO (PCT)
Prior art keywords
interposer
wiring board
probe head
wiring
probe
Prior art date
Application number
PCT/JP2008/062849
Other languages
English (en)
French (fr)
Inventor
Yoshio Yamada
Hiroshi Nakayama
Tsuyoshi Inuma
Takashi Akao
Original Assignee
Nhk Spring Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co., Ltd. filed Critical Nhk Spring Co., Ltd.
Priority to CN200880025240XA priority Critical patent/CN101755216B/zh
Priority to US12/452,716 priority patent/US8149008B2/en
Priority to JP2009523661A priority patent/JP5714817B2/ja
Publication of WO2009011365A1 publication Critical patent/WO2009011365A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

　回路構造間を電気的に接続するプローブを収容するプローブヘッドの所定の基準面に対する平行度の精度や平面度の精度を向上させることができるプローブカードを提供する。この目的のため、複数のプローブを保持するプローブヘッド１５と、回路構造に対応する配線パターンを有する平板状の配線基板１１と、配線基板１１に積層され、配線基板１１の配線を中継するインターポーザ１３と、インターポーザ１３とプローブヘッド１５との間に介在し、インターポーザ１３が中継する配線の間隔を変換し、この変換した配線をプローブヘッド１５と対向する表面に表出するスペーストランスフォーマ１４と、配線基板１１の板厚とインターポーザ１３の板厚との和よりも大きい高さを有する略柱状をなし、配線基板１１およびインターポーザ１３を板厚方向に貫通して埋め込まれ、一方の底面がスペーストランスフォーマ１４に当接する複数のポスト部材１８と、を備える。
PCT/JP2008/062849 2007-07-19 2008-07-16 プローブカード WO2009011365A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880025240XA CN101755216B (zh) 2007-07-19 2008-07-16 探针卡
US12/452,716 US8149008B2 (en) 2007-07-19 2008-07-16 Probe card electrically connectable with a semiconductor wafer
JP2009523661A JP5714817B2 (ja) 2007-07-19 2008-07-16 プローブカード

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-188546 2007-07-19
JP2007188546 2007-07-19

Publications (1)

Publication Number Publication Date
WO2009011365A1 true WO2009011365A1 (ja) 2009-01-22

Family

ID=40259697

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062849 WO2009011365A1 (ja) 2007-07-19 2008-07-16 プローブカード

Country Status (5)

Country Link
US (1) US8149008B2 (ja)
JP (1) JP5714817B2 (ja)
CN (1) CN101755216B (ja)
TW (1) TWI394953B (ja)
WO (1) WO2009011365A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI493195B (zh) * 2013-11-04 2015-07-21 Via Tech Inc 探針卡
EP2587267A4 (en) * 2010-06-25 2015-09-02 Nhk Spring Co Ltd CONTACT PROBE AND PROBE UNIT

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1959260B1 (en) * 2005-12-05 2019-05-29 NHK Spring Company Limited Probe card
JP5426365B2 (ja) * 2007-03-14 2014-02-26 日本発條株式会社 プローブカード
US8970242B2 (en) * 2008-09-30 2015-03-03 Rohm Co, Ltd. Method for manufacturing probe card, probe card, method for manufacturing semiconductor device, and method for forming probe
KR101270591B1 (ko) * 2011-06-02 2013-06-03 (주)기가레인 프로브 카드
JPWO2013018809A1 (ja) * 2011-08-02 2015-03-05 日本発條株式会社 プローブユニット
MY167999A (en) * 2011-10-07 2018-10-10 Nhk Spring Co Ltd Probe unit
KR101348204B1 (ko) * 2012-12-28 2014-01-10 주식회사 아이에스시 테스트 소켓 및 소켓본체
JP6209376B2 (ja) * 2013-07-08 2017-10-04 株式会社日本マイクロニクス 電気的接続装置
CN103399225A (zh) * 2013-07-26 2013-11-20 华进半导体封装先导技术研发中心有限公司 包含转接板的测试结构
KR102016427B1 (ko) 2013-09-10 2019-09-02 삼성전자주식회사 포고 핀 및 이를 포함하는 프로브 카드
KR101738621B1 (ko) * 2015-08-05 2017-06-09 주식회사 오킨스전자 보드 일체형 rf 인터포저 유닛 및 이의 설치방법
TWI632376B (zh) * 2016-05-31 2018-08-11 巨擘科技股份有限公司 探針卡裝置
US10120020B2 (en) 2016-06-16 2018-11-06 Formfactor Beaverton, Inc. Probe head assemblies and probe systems for testing integrated circuit devices
JP6855185B2 (ja) * 2016-07-27 2021-04-07 株式会社日本マイクロニクス 電気的接続装置
MY198385A (en) * 2017-03-30 2023-08-28 Nhk Spring Co Ltd Probe Holder and Probe Unit
IT201700051157A1 (it) * 2017-05-11 2018-11-11 Technoprobe Spa Metodo di fabbricazione di un multistrato di una scheda di misura per un’apparecchiatura di test di dispositivi elettronici
CN107389992A (zh) * 2017-09-12 2017-11-24 洛阳冰岩激光设备有限公司 一种多功能自清洁探针板
CN110531125B (zh) * 2018-05-23 2022-05-17 旺矽科技股份有限公司 空间转换器、探针卡及其制造方法
KR102228317B1 (ko) * 2020-10-26 2021-03-16 주식회사 프로이천 웨이퍼 테스트용 프로브 카드
CN112462108A (zh) * 2020-11-13 2021-03-09 上海华岭集成电路技术股份有限公司 一种新型探针卡装置
US11950378B2 (en) * 2021-08-13 2024-04-02 Harbor Electronics, Inc. Via bond attachment
US12327770B2 (en) * 2021-11-29 2025-06-10 International Business Machines Corporation Probe pad with built-in interconnect structure
CN115236492B (zh) * 2022-07-26 2025-04-04 江西兆驰半导体有限公司 一种led芯片探针检测方法及装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006126279A1 (ja) * 2005-05-23 2006-11-30 Kabushiki Kaisha Nihon Micronics プローブ組立体、その製造方法および電気的接続装置
JP2007003334A (ja) * 2005-06-23 2007-01-11 Micronics Japan Co Ltd プローブ組立体およびこれを用いた電気的接続装置
WO2007015314A1 (ja) * 2005-08-02 2007-02-08 Kabushiki Kaisha Nihon Micronics 電気的接続装置
WO2007046153A2 (ja) * 2005-10-24 2007-04-26 Nihon Micronics Kk 電気的接続装置の組み立て方法
WO2007066622A1 (ja) * 2005-12-05 2007-06-14 Nhk Spring Co., Ltd. プローブカード

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1251319C (zh) 1994-11-15 2006-04-12 佛姆法克特股份有限公司 微电子组件的插入物的制造方法
DE69635227T2 (de) 1995-05-26 2006-06-29 Formfactor, Inc., Livermore Kontakträger zum bestücken von substraten mit federkontakten
WO2001071779A2 (en) 2000-03-17 2001-09-27 Formfactor, Inc. Method and apparatus for planarizing a semiconductor contactor
WO2006017078A2 (en) * 2004-07-07 2006-02-16 Cascade Microtech, Inc. Probe head having a membrane suspended probe
US7307433B2 (en) * 2004-04-21 2007-12-11 Formfactor, Inc. Intelligent probe card architecture
TWI294523B (en) * 2004-07-28 2008-03-11 Microelectonics Technology Inc Integrated circuit probe card
JP4823667B2 (ja) * 2005-12-05 2011-11-24 日本発條株式会社 プローブカード

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006126279A1 (ja) * 2005-05-23 2006-11-30 Kabushiki Kaisha Nihon Micronics プローブ組立体、その製造方法および電気的接続装置
JP2007003334A (ja) * 2005-06-23 2007-01-11 Micronics Japan Co Ltd プローブ組立体およびこれを用いた電気的接続装置
WO2007015314A1 (ja) * 2005-08-02 2007-02-08 Kabushiki Kaisha Nihon Micronics 電気的接続装置
WO2007046153A2 (ja) * 2005-10-24 2007-04-26 Nihon Micronics Kk 電気的接続装置の組み立て方法
WO2007066622A1 (ja) * 2005-12-05 2007-06-14 Nhk Spring Co., Ltd. プローブカード

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2587267A4 (en) * 2010-06-25 2015-09-02 Nhk Spring Co Ltd CONTACT PROBE AND PROBE UNIT
US9404941B2 (en) 2010-06-25 2016-08-02 Nhk Spring Co., Ltd. Contact probe and probe unit
TWI493195B (zh) * 2013-11-04 2015-07-21 Via Tech Inc 探針卡

Also Published As

Publication number Publication date
US20100219852A1 (en) 2010-09-02
TW200912323A (en) 2009-03-16
JP5714817B2 (ja) 2015-05-07
CN101755216A (zh) 2010-06-23
TWI394953B (zh) 2013-05-01
JPWO2009011365A1 (ja) 2010-09-24
CN101755216B (zh) 2012-10-10
US8149008B2 (en) 2012-04-03

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