[go: up one dir, main page]

WO2009031849A3 - Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays - Google Patents

Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays Download PDF

Info

Publication number
WO2009031849A3
WO2009031849A3 PCT/KR2008/005252 KR2008005252W WO2009031849A3 WO 2009031849 A3 WO2009031849 A3 WO 2009031849A3 KR 2008005252 W KR2008005252 W KR 2008005252W WO 2009031849 A3 WO2009031849 A3 WO 2009031849A3
Authority
WO
WIPO (PCT)
Prior art keywords
nano
glass
conductive ink
glass frit
jet printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2008/005252
Other languages
French (fr)
Other versions
WO2009031849A2 (en
WO2009031849A4 (en
Inventor
Jooho Moon
Daehwan Jang
Dongjo Kim
Byungyoon Lee
Yoonhyun Kim
Sungsoo Kim
Kyuyong Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Industry Academic Cooperation Foundation of Yonsei University
Chang Sung Co
Original Assignee
Industry Academic Cooperation Foundation of Yonsei University
Chang Sung Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Industry Academic Cooperation Foundation of Yonsei University, Chang Sung Co filed Critical Industry Academic Cooperation Foundation of Yonsei University
Publication of WO2009031849A2 publication Critical patent/WO2009031849A2/en
Publication of WO2009031849A3 publication Critical patent/WO2009031849A3/en
Publication of WO2009031849A4 publication Critical patent/WO2009031849A4/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The present invention relates to a conductive ink composition for ink jet printing, which can form a conductive pattern by an ink jet printing method using a glass or ceramic substrate such as a flat panel display and a laminated manual component in producing components and elements that require a thermal process at a relatively high temperature of 400-800°C. It relates to a method for synthesizing silver nano sol having a uniform particle size, an excellent dispersion and an excellent sinterability, and to a conductive ink composition to which is added nano glass frit for improving adhesion between a conductive pattern, which is closely relates to a panel having long-term stability and reliability, and a glass substrate, the conductive ink composition being able to form patterns with excellent conductivity. According to the present invention, the conductive ink composition for ink jet printing comprising metal nano particles, a co-solvent and nano glass frit can form a conductive pattern using an ink jet printing method, and also enhance adhesion by fusing the nano glass frit, which is added during drying and heat treatment processes, with the substrate.
PCT/KR2008/005252 2007-09-07 2008-09-05 Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays Ceased WO2009031849A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0091068 2007-09-07
KR1020070091068A KR100905399B1 (en) 2007-09-07 2007-09-07 Conductive ink composition comprising metal nanoparticles and nanoglass frits for excellent conductivity and improved adhesion to glass and ceramic substrates

Publications (3)

Publication Number Publication Date
WO2009031849A2 WO2009031849A2 (en) 2009-03-12
WO2009031849A3 true WO2009031849A3 (en) 2009-07-02
WO2009031849A4 WO2009031849A4 (en) 2009-09-03

Family

ID=40429554

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/005252 Ceased WO2009031849A2 (en) 2007-09-07 2008-09-05 Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays

Country Status (2)

Country Link
KR (1) KR100905399B1 (en)
WO (1) WO2009031849A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101386085B1 (en) * 2011-06-14 2014-04-17 주식회사 아모그린텍 Conductive Metal Nano Particle Ink and Manufacturing Method thereof
KR20140040805A (en) * 2011-06-14 2014-04-03 바이엘 테크놀로지 서비시즈 게엠베하 Silver-containing aqueous ink formulation for producing electrically conductive structures, and ink jet printing method for producing such electrically conductive structures
KR101350706B1 (en) * 2011-11-24 2014-01-17 한국화학연구원 Method for solar cell metallization using conductive ink with nano sized glass frit by sol―gel process
KR101599103B1 (en) * 2013-06-20 2016-03-02 주식회사 엘지화학 Method for manufacturing metal particles with core-shell structure
KR102169003B1 (en) * 2013-06-20 2020-10-22 주식회사 잉크테크 Conductive ink composition, transparent conductive film comprising thereof and method for preparing transparent conductive film
KR101656452B1 (en) * 2013-09-06 2016-09-09 주식회사 잉크테크 Method for making conductive pattern and conductive pattern
WO2016110724A1 (en) 2015-01-07 2016-07-14 Fenzi Spa Glass frit composition and ceramic inkjet ink comprising the same
KR101900877B1 (en) * 2016-11-17 2018-09-20 (주)삼광기업 Manufacturing method of pad printing ink for ceramic coating layer and pad printing ink using the same
KR101960588B1 (en) * 2017-02-09 2019-03-21 창성나노텍 주식회사 Composition of thin film using Conductive Metal Ink and Method for preparing the same
KR102205001B1 (en) * 2019-01-28 2021-01-18 순천대학교 산학협력단 Method for providing temperature sensor tag using r2r gravure printing scheme
CN119468898A (en) * 2024-11-22 2025-02-18 西安交通大学 A temperature-strain dual-mode flexible sensor and its preparation method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970001404B1 (en) * 1990-04-12 1997-02-06 마쯔시다덴기산교 가부시기가이샤 Conductive ink
JP2007198933A (en) * 2006-01-27 2007-08-09 Keio Gijuku Method for producing substrate for surface enhanced Raman spectroscopy and substrate for surface enhanced Raman spectroscopy
KR20070085963A (en) * 2004-12-11 2007-08-27 이스트맨 코닥 캄파니 Conductive Silver Dispersions and Their Uses

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3211641B2 (en) 1995-09-22 2001-09-25 株式会社村田製作所 Conductive composition
KR100554207B1 (en) * 2003-10-28 2006-02-22 대주전자재료 주식회사 Manufacturing method of silver nanoparticles
JP4795674B2 (en) * 2004-11-17 2011-10-19 住友ゴム工業株式会社 Ink for surface printing of crystallized glass

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970001404B1 (en) * 1990-04-12 1997-02-06 마쯔시다덴기산교 가부시기가이샤 Conductive ink
KR20070085963A (en) * 2004-12-11 2007-08-27 이스트맨 코닥 캄파니 Conductive Silver Dispersions and Their Uses
JP2007198933A (en) * 2006-01-27 2007-08-09 Keio Gijuku Method for producing substrate for surface enhanced Raman spectroscopy and substrate for surface enhanced Raman spectroscopy

Also Published As

Publication number Publication date
KR20090025894A (en) 2009-03-11
WO2009031849A2 (en) 2009-03-12
KR100905399B1 (en) 2009-06-30
WO2009031849A4 (en) 2009-09-03

Similar Documents

Publication Publication Date Title
WO2009031849A3 (en) Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays
JP2021167425A (en) Metal nanowire ink for formation of transparent conductive film with fused network
CN103313886B (en) Vehicle window glass and manufacturing method thereof
KR102023374B1 (en) Copper paste composition for printing and the forming method for metal pattern using the same
CN103168503A (en) Plane heating element using ceramic glass
CN111344261A (en) Glass raw material for ion-exchanged glass
TW201108255A (en) Conductive composition for forming electrode
JP5000499B2 (en) Glass article on which conductive film is formed and method for producing the same
CN104927414B (en) A kind of insulating coating for being used to protect runner plate
JP2010126725A5 (en)
WO2016194389A1 (en) Method for manufacturing metal thin film, and electroconductive structure
CN107109095B (en) Conductive ink
CN104078098A (en) Low-silver-bearing printed circuit board silver paste and preparation method thereof
JP2008106145A (en) Sintering electroconductive paste
JP2015528044A (en) Tempered paint glass
JP5819751B2 (en) Conductive laminate, manufacturing method and precursor thereof
JP6408695B2 (en) Copper-containing conductive paste and electrode made from copper-containing conductive paste
CN105764168A (en) Car rear windshield heating wire silver paste and preparation method thereof
CN101602572A (en) A kind of aluminium enamel powdered frit and utilize this powdered frit to carry out the method for aluminium enamel spraying
WO2013146389A1 (en) Method for producing conductor film
KR20090094548A (en) Paste composition, and resistor film and electronic component comprising the same
CN105280267A (en) Functional membrane ceramic resistor slurry and preparation method therefor
CN103996433B (en) A kind of phosphorous copper alloy circuit board conductive silver paste and preparation method thereof
CN103366858B (en) A kind of LED aluminium oxide pedestal silver slurry and application thereof
KR102213925B1 (en) Ink composition for flash light sintering comprising silica particles

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08793715

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08793715

Country of ref document: EP

Kind code of ref document: A2