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WO2010099999A1 - Procédé d'enrobage d'un composant électrique - Google Patents

Procédé d'enrobage d'un composant électrique Download PDF

Info

Publication number
WO2010099999A1
WO2010099999A1 PCT/EP2010/050821 EP2010050821W WO2010099999A1 WO 2010099999 A1 WO2010099999 A1 WO 2010099999A1 EP 2010050821 W EP2010050821 W EP 2010050821W WO 2010099999 A1 WO2010099999 A1 WO 2010099999A1
Authority
WO
WIPO (PCT)
Prior art keywords
molding material
molding
mold
material volume
circuit module
Prior art date
Application number
PCT/EP2010/050821
Other languages
German (de)
English (en)
Inventor
Gerhard Grauf
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2010099999A1 publication Critical patent/WO2010099999A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components

Definitions

  • the invention relates to a method for embedding an electrical assembly in a molded body to be formed from molding material.
  • the invention further relates to such a type manufactured electrical circuit module.
  • Electrical assemblies in particular electronic circuits that are to be used under difficult environmental conditions, are housed in molded bodies, wherein the assembly is molded with a flowable molding compound, and, in particular in the transfer molding process, the shaped body is formed. Only connecting elements of the electrical subassembly for connecting the same project out of the molded body, whereas the electrical subassembly in the molded body is completely or partially surrounded by the molding compound.
  • manufacturing method for forming such a molded body around an electrical assembly around the very limited volume that can be imparted to the molding due to procedural requirements is disadvantageous.
  • Shaped bodies can be obtained in the prior art in two production processes, namely by compression molding on the one hand, wherein a housing without directly introduced electrical assembly is formed, in which the assembly must be subsequently housed, or by transfer molding on the other hand, the
  • Molding compound in a tool assembly already having the electrical assembly Mold cavity is introduced and solidifies in the tool around the electrical assembly around. Only the latter variant offers sufficient protection against environmental influences, since here the electrical assembly is hermetically enclosed by the injected molding compound.
  • the achievable volume and the Einbringa the electrical assembly are limited. In particular, it is not possible to achieve a structure of the shaped body which is separated according to regions, for example to provide certain functionalities.
  • Form mass volume is introduced into the closed mold, is provided, which is introduced into the open mold before closing also at least one molding material volume.
  • the molding material volume which is intended to form the shaped body two volumes can therefore be distinguished, namely one which is introduced into the mold before the mold is closed, and another which is known from the prior art injection molding process after closing the mold is pressed into this. Accordingly, the molding material volume to be introduced into the closed mold is to be regarded as a first molding material volume, and the molding material volume introduced into the still open mold as a second molding composition volume. The first and second molding material volumes together form the molding.
  • the molding material of the first molding material volume is the same and / or different from the molding material of the second molding material volume.
  • different molding material volumes can advantageously be combined in order to give the body-specific, desired properties.
  • the second molding material volume consists of such a molding material which, although less suitable as a coating, is for example very good heat transfer. has dissipative properties, so that there is a very good temperature balance within the molding in the electrical assembly and a good heat dissipation addition to an outside of the trainees molding, which can be avoided very advantageous thermally induced stresses within the molding.
  • the second molding material volume consists of various molding material materials.
  • the second molding material which is introduced into this before closing the mold, is therefore in turn a mixture or a layering or an arrangement of different molding material volumes, so that in certain areas, based on cross-section or layer structure of the molding, certain desired properties can be added.
  • By introducing the second molding material volume prior to closing the mold it is possible, for example, to introduce the molding compound materials from which it is assembled into the mold in a desired geometric arrangement and thus distribute or distribute the various molding compound volumes around the assembly to control specifically in the area of the assembly. In the prior art, this is not possible due to the given process technology of the transfer molding process.
  • the formation of different regions of different properties for example heat conductivity or mechanical strength, is very advantageous.
  • a shaped article carrier is understood to be a solid, in contrast to a shaped article material which essentially undergoes a transformation during the shaping of the shaped article in the mold.
  • the shaped-body carrier can in this case actually be designed as a carrier, in particular in such a manner that it holds the still-to-be-formed shaped body in an arrangement in which the shaped body is to be used.
  • the shaped-body carrier as a support element for the electrical subassembly to be introduced, ie in such a way that the electrical subassembly is held in a specific spatial position within the mold in which the shaped body is formed by introducing molding compound. It is preferably provided in a process training that at least one molding material volume is held on the not yet molded / molded molding carrier.
  • the incorporation of the molding material volume into the mold that is to say in particular of the second molding material volume introduced into the opened mold, can be carried out in a particularly preferred manner such that this molding material volume or a part thereof is held on the mold body, that is, for example, under or on top held the mold carrier.
  • the shaped body can be specifically assigned specific material properties in specific spatial areas.
  • the molded body carrier made of plastic, metal and / or glass fiber is selected. It is possible, already in the material selection the
  • the molded body carrier to assign a specific functionality.
  • a shielding of the electrical component can be achieved in a particularly simple and advantageous manner, whereas in the case of an embodiment made of plastic and preferably of glass fiber, a very good elasticity and resistance to distortion can be achieved.
  • the molded body carrier itself consists of a composite of different materials, that is, for example, a metal and additionally comprises glass fibers in, for example, different layers, so that even the shaped body carrier itself can perform different functions.
  • a fabric-like molded article carrier By fabric is here meant, on the one hand, that the molded article carrier is actually composed in the manner of a fabric of individual material bands or material threads, that is to say essentially has a woven or braided structure; However, it is also meant by this that the shaped body has a structure that only looks like an optical fabric, for example a hole structure, such that a plurality of apertures of the same or different size are introduced into the shaped body. In such an embodiment, it is possible, for example, to form the molded body carrier from metal and in this case both its properties an electromagnetic shielding as well as a mechanical distortion protection.
  • an electrical circuit module is proposed with an electrical assembly, which is embedded in a molded body formed from molding material. It is provided that the shaped body consists of at least one introduced in a transfer molding molding material volume and at least one introduced in the molding process molding material volume.
  • the molding material volume introduced in the molding process is introduced into the opened mold as described above, whereas the molding material volume introduced in the transfer molding process is pressed / injected into the closed mold.
  • the material of the molding compound volume introduced in the transfer molding process is the same or different from the material of the molding material volume introduced in the molding process, whereby it is particularly advantageous to integrate different material properties in a molding and thus in a circuit module.
  • At least one embedded molded article carrier is located in the shaped article.
  • the molded article carrier serves in one or injection molded form to hold the electrical circuit module in an arrangement in which this circuit module is inserted as intended, the holding during further processing steps or, for example, the stabilization of the circuit module in particular in mechanical terms.
  • the molded body carrier consists of plastic, metal and / or glass fiber. This makes it possible to assign him certain functional characteristics, as already described above.
  • the shaped-body carrier is particularly preferably a heat-dissipating element, thus it can serve as a heat sink for the electrical components embedded in the circuit module
  • the shaped-body carrier forms an electrical shield.
  • the shaped metal carrier made of metal, that is to say, for example, from a metal sheet in a continuous or perforated embodiment or in the form of a metal having tissue.
  • the molded article carrier projects out of the molded article or is partially encapsulated by it.
  • the shaped-body carrier can serve, for example, as a holder for subsequent processes or for holding the electrical circuit module in a predetermined arrangement, for example in a motor vehicle.
  • the molded body carrier in which the molded body carrier is designed as a shield, so in particular should have a ground potential, can thereby be particularly preferably form a ground connection, which in particular in automotive environments, a simple connection to the ground potential of a vehicle body can take place, such that the molded article carrier consists of metal and protrudes from the molding in the form of such an electrical ground connection, for example as an eyelet, pin or in any other suitable manner.
  • the shaped-body carrier serves as a means for distributing and / or reducing tensile stresses. Due to the formation of the shaped body in the manner described above about the electrical assembly around tensile stresses can occur in the molding material, in particular during its curing. Furthermore, by uneven thermal load during operation of the electrical assembly such tensile stresses may occur, which represent a mechanical stress on the molding and may have a life-limiting effect in unfavorable cases. Such tensile stresses can be caused by the shape of the body carrier, which is designed for this purpose in a suitable manner and consists of suitable material, for example, as described above made of glass fiber.
  • a fabric-like structure for example made of glass fiber
  • a shaped body carrier wherein the shaped mass material, when the shaped body is formed, bonds with this fabric-like structure, which absorbs and distributes the tensile stresses.
  • a metallic shaped-body carrier which has a grid structure or a structure of perforations or material elevations forming at least some of the force-applying elements.
  • the function of the molded article carrier as a means for distributing and / or reducing tensile stresses can be particularly advantageously combined with other functions, for example the electromagnetic shielding in the form of a metallic mold carrier body.
  • FIG. 1 shows an electrical circuit module with an electrical assembly in a molded body formed from molding compound
  • Figure 1 shows an electrical circuit module 1, with an electrical assembly 2, which is formed of individual electronic components 3, which in a suitable manner on a substrate 4, for example, a printed circuit board 5, respectively and are electrically connected together as appropriate.
  • the circuit module 1 contact pins 6, which with components 3 of the electrical assembly 2 and / or with the circuit board 5 (for example, based on Ke ramik) or on this arranged, not shown here interconnects, are electrically connected, for example via wire bonds 7.
  • the electrical assembly 2 is housed to form the circuit module 1 in a molded body 8, which is formed from molding compound 9.
  • the molding compound 9 is an electrically non-conductive plastic 10, wherein this plastic 10 consists of molding material 1 1.
  • In the molding material 1 1 is a
  • the molded body carrier 12 below the substrate 4 and a further molded body carrier 13 above the components 3 of the electrical assembly 2 in the molding material 1 1 introduced.
  • the molded body carrier 12 is in this case for example made of glass fiber 14 and serves as a means 29 for distribution and reduction of tensile stresses of the plastic 10 of the circuit module 1 in the region of its introduction.
  • the further molded body support 13 consists for example of a (continuous or hole-structured) metal 15 and serves in its attachment in the molding material 1 1 above the components 3 of the electrical assembly 2 as a heat sink 16 and as electrical shield 17 to improve the EMC compatibility, ie to avoid or reduction of the emission of electromagnetic radiation by the electrical assembly 2 and / or as protection against the absorption of electromagnetic radiation coming from the outside by the electrical assembly 2.
  • Particularly advantageous in a formation of the further molded article carrier 13 of metal 15 also one of individual electronic components 3 of the electrical assembly
  • Shaped body carrier 13 so that it protrudes from the shaped body 8, so this at least partially surmounted at its periphery.
  • the molded body carrier 12 or the other mold carrier body 13 for example, as a holder for subsequent processes, such as the insertion of the circuit module 1 in a larger electrical circuit or a circuit composite (not shown) or to hold the circuit module 1, for example by clamping or screws to use.
  • FIG. 2 shows a tool 18 for embedding the electrical assembly 2 (approximately as described in FIG. 1) in a shaped body 8 to be formed in the tool 18 (cf. FIG. 1), for which purpose the tool 18 has a shape 19 that negatively represents the shaped body 8.
  • the tool 18 and thus the mold 19 are shown here in the closed state.
  • molding material 1 1 was introduced into the mold 19, namely a second molding material volume 20, the second molding material volume 20 consisting of different molding material materials 1 1 having different properties.
  • the second molding material volume 20 is held by the shaped body carrier 12 to the electrical assembly 2 and thereby forms a molding material volume module 21, which can be mechanically connected to the electrical assembly 2 before introducing the electrical assembly 2 in the mold 19 of the tool 18 to the handling and to simplify and accelerate the execution of the molding process of the circuit module 1 (see FIG. 1).
  • a first molding material volume 22 is located after closure of the mold 19 in a pressing chamber 23, the volume of which can be rapidly reduced by a press die 24 in order to introduce the first molding composition volume 22 into the mold 19 through injection channels 25.
  • a known from the prior art transfer molding method is applied, wherein the first molding material volume 22 in the form 19 there are already existing components, namely the electrical assembly 2 with the second molding material volume 20 closes and connects and thereby forms the shaped body 8.
  • the mold 19 of the tool 18 is opened and the circuit module 1 thus formed is removed from the mold 19 by means of ejectors 28.
  • the second molding material volume 20 is already arranged in the region of the electrical assembly 2 prior to introduction of the first molding compound volume 22 and thus introduced into the mold 19. It must therefore be taken into account when introducing the first molding compound volume 22 by way of the transfer molding process in terms of gel and process time.
  • the second molding material volume 20, is formed from different molding materials 1 1 so that three or more different molding materials can be introduced into the molding body 8 selectively into regions 27, depending on the desired properties.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un procédé d'enrobage d'un composant électrique dans un corps moulé formé à partir d'une matière à mouler. Le composant est placé dans un moule ouvert, le moule est fermé et un volume de matière à mouler est envoyé dans le moule fermé, par un procédé de moulage par injection. Selon l'invention, au moins un volume de matière à mouler est également introduit dans le moule ouvert avant sa fermeture. L'invention concerne en outre un module de circuit électrique (1) fabriqué de cette manière.
PCT/EP2010/050821 2009-03-06 2010-01-26 Procédé d'enrobage d'un composant électrique WO2010099999A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009001373.3 2009-03-06
DE102009001373A DE102009001373A1 (de) 2009-03-06 2009-03-06 Verfahren zum Einbetten einer elektrischen Baugruppe

Publications (1)

Publication Number Publication Date
WO2010099999A1 true WO2010099999A1 (fr) 2010-09-10

Family

ID=42101681

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/050821 WO2010099999A1 (fr) 2009-03-06 2010-01-26 Procédé d'enrobage d'un composant électrique

Country Status (2)

Country Link
DE (1) DE102009001373A1 (fr)
WO (1) WO2010099999A1 (fr)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN103262226A (zh) * 2010-12-14 2013-08-21 罗伯特·博世有限公司 用于制造具有成型体的电子组件的方法

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JP5824765B2 (ja) * 2011-01-11 2015-12-02 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ
DE102011003870A1 (de) 2011-02-09 2012-08-09 Robert Bosch Gmbh Schaltungsmodul für ein Fahrzeug
GB2486032B (en) * 2011-03-22 2013-06-19 Enecsys Ltd Solar photovoltaic inverters
DE102012209033A1 (de) * 2012-05-30 2013-12-05 Robert Bosch Gmbh Elektronikmodul sowie Verfahren zur Herstellung eines solchen Elektronikmoduls, sowie elektronisches Steuergerät mit einem solchen Elektronikmodul
CN110198824B (zh) * 2017-01-19 2021-07-06 代傲阿扣基金两合公司 用于制造用于电子器件的电磁兼容性屏蔽壳体的方法
EP4350753A1 (fr) * 2022-10-04 2024-04-10 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Dispositif électronique avec corps de moule non plan tridimensionnel ayant une entité électrique à l'intérieur de celui-ci et avec une structure électroconductrice sur celui-ci

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JPH0381126A (ja) * 1990-07-17 1991-04-05 Mitsubishi Materials Corp 集積回路素子ケーシングの射出成形装置
JPH08142555A (ja) * 1994-11-14 1996-06-04 Mitsubishi Chem Corp 非接触型ｉｃカード及びその製造方法
JP2001009863A (ja) * 1999-06-30 2001-01-16 Rhythm Watch Co Ltd Ｉｃ及びｃｏｂの２色樹脂封止方法
JP2002134945A (ja) * 2000-10-24 2002-05-10 Tohoku Munekata Co Ltd 殻付電子部品の製法
US20060110850A1 (en) * 2001-06-12 2006-05-25 Bolken Todd O Method for two-stage transfer molding device to encapsulate MMC module
US20070205535A1 (en) * 2006-03-02 2007-09-06 Pardo Vitulli Method of injection molding an article of footwear with a flashing circuit capsule in the heel thereof
US7296345B1 (en) * 2004-11-16 2007-11-20 Super Talent Electronics, Inc. Method for manufacturing a memory device
US20080169552A1 (en) * 2006-01-17 2008-07-17 Koji Taya Semiconductor device and programming method
WO2008152575A1 (fr) * 2007-06-14 2008-12-18 Koninklijke Philips Electronics N.V. Boîtier électronique flexible et procédé pour fabriquer un tel boîtier

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0381126A (ja) * 1990-07-17 1991-04-05 Mitsubishi Materials Corp 集積回路素子ケーシングの射出成形装置
JPH08142555A (ja) * 1994-11-14 1996-06-04 Mitsubishi Chem Corp 非接触型ｉｃカード及びその製造方法
JP2001009863A (ja) * 1999-06-30 2001-01-16 Rhythm Watch Co Ltd Ｉｃ及びｃｏｂの２色樹脂封止方法
JP2002134945A (ja) * 2000-10-24 2002-05-10 Tohoku Munekata Co Ltd 殻付電子部品の製法
US20060110850A1 (en) * 2001-06-12 2006-05-25 Bolken Todd O Method for two-stage transfer molding device to encapsulate MMC module
US7296345B1 (en) * 2004-11-16 2007-11-20 Super Talent Electronics, Inc. Method for manufacturing a memory device
US20080169552A1 (en) * 2006-01-17 2008-07-17 Koji Taya Semiconductor device and programming method
US20070205535A1 (en) * 2006-03-02 2007-09-06 Pardo Vitulli Method of injection molding an article of footwear with a flashing circuit capsule in the heel thereof
WO2008152575A1 (fr) * 2007-06-14 2008-12-18 Koninklijke Philips Electronics N.V. Boîtier électronique flexible et procédé pour fabriquer un tel boîtier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103262226A (zh) * 2010-12-14 2013-08-21 罗伯特·博世有限公司 用于制造具有成型体的电子组件的方法
CN103262226B (zh) * 2010-12-14 2017-01-18 罗伯特·博世有限公司 用于制造具有成型体的电子组件的方法

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DE102009001373A1 (de) 2010-09-09

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