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WO2010005138A1 - Method for manufacturing led package - Google Patents

Method for manufacturing led package Download PDF

Info

Publication number
WO2010005138A1
WO2010005138A1 PCT/KR2008/004782 KR2008004782W WO2010005138A1 WO 2010005138 A1 WO2010005138 A1 WO 2010005138A1 KR 2008004782 W KR2008004782 W KR 2008004782W WO 2010005138 A1 WO2010005138 A1 WO 2010005138A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
transparent liquid
liquid resin
diode package
Prior art date
Application number
PCT/KR2008/004782
Other languages
French (fr)
Inventor
Hyun-Seok Cho
Dong-Hyun Lee
Original Assignee
Heesung Electronics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heesung Electronics Co., Ltd. filed Critical Heesung Electronics Co., Ltd.
Publication of WO2010005138A1 publication Critical patent/WO2010005138A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/04—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould
    • B29C41/042—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould by rotating a mould around its axis of symmetry
    • B29C41/045—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould by rotating a mould around its axis of symmetry the axis being placed vertically, e.g. spin casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
    • B29C39/006—Monomers or prepolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations

Definitions

  • the present invention relates to a method for manufacturing a light emitting diode
  • LED light-emitting diode
  • a transparent liquid resin is dispensed into the LED package, a uniform thickness is realized through a spin coating process, and a fine pattern is formed.
  • a light emitting diode is a device converting an electric energy into a light energy.
  • the LED is formed of a compound semiconductor that emits light having a specific wavelength depending on an energy band gap.
  • LED Since the LED cannot realize various colors and thus it is limited in use as compared with a liquid crystal display (LCD). However, LEDs having different colors have been recently developed and thus the LEDs have been used in a variety of fields such as the optical communication field and the display field.
  • the LEDs are provided in the form of a package in accordance with their use purpose and required conditions.
  • the LED package is designed such that LED chips are mounted on a substrate on which electrode patterns are formed or a lead frame, terminals of the LED chips are electrically connected to the electrode patterns, and epoxy, silicon, or the combination thereof is filled to cover the LED chips to function as a lens.
  • the transparent resin such as the epoxy and silicon filled in the LED package has a higher refractive index than the atmosphere and thus only the light, which has a lower angle than a total reflective threshold angle, among the light emitted from the LED chips is emitted to the external side. Therefore, an amount of the light that is substantially extracted is limited. A large amount of the light deviated from the threshold angle range is not emitted to the external light but totally reflected in the LED package. This causes the light loss.
  • the present invention is directed to a method for manufacturing an LED package that substantially obviates one or more problems due to limitations and disadvantages of the related art. It is an object of the present invention to provide a method for manufacturing an LED package, which can manufacture many LED packages at a time and form fine patterns on the manufactured LED packages, thereby simplifying the manufacturing process and reducing the manufacturing costs.
  • the present invention provides a method including:
  • the transparent liquid resin may be silicon resin to which phosphors and other relevant materials are added.
  • the fine pattern of the light emitting diode package may be a relief or intaglio pattern.
  • the fine pattern of the light emitting diode package may be one of a spherical shape, a pyramid shape, a cylindrical shape, a cone-shape shape, and a cube shape.
  • a height H of the transparent liquid resin 3a dispensed into the light emitting diode package from a top of an outer wall of the lead frame may be set to satisfy the following condition: 0.01 mm ⁇ H ⁇ 5 mm.
  • a high luminous LED package that has an enlarged advancing angle range and is improved in light efficiency by manufacturing a plurality of LED packages at a time and allowing fine patterns to be formed can be realized.
  • FIGS. 1 to 4 are sectional views illustrating a process for manufacturing lead frames and mounting LEDs in a method for manufacturing an LED package according to an embodiment of the present invention.
  • FIG. 5 shows perspective and enlarged sectional views illustrating a process for dispensing transparent liquid resin into an LED package using a dispenser in a method for manufacturing an LED package according to an embodiment of the present invention.
  • FIG. 6 shows perspective and enlarged sectional views illustrating a process for uniformly forming transparent liquid resin dispensed into an LED package set using a spin coater in a method for manufacturing an LED package according to an embodiment of the present invention.
  • FIG. 5 shows perspective and enlarged sectional views illustrating a process for dispensing transparent liquid resin into an LED package using a dispenser in a method for manufacturing an LED package according to an embodiment of the present invention.
  • FIG. 6 shows perspective and enlarged sectional views illustrating a process for uniformly forming transparent liquid resin dispensed into an LED package set using a spin coater in a method for manufacturing an LED package according to
  • FIG. 7 shows perspective and enlarged sectional views illustrating a process for forming fine patterns on uniformly formed transparent liquid resin using a stamp in a method for manufacturing an LED package according to an embodiment of the present invention.
  • FIGS. 8 to 11 are perspective views illustrating a variety of patterns of stamps in a method for manufacturing an LED package according to an embodiment of the present invention.
  • FIG. 12 is a sectional view illustrating a process for removing a stamp in a method for manufacturing an LED package according to an embodiment of the present invention.
  • FIG. 13 is a sectional view illustrating LED packages that are separated through a cutting process for an LED package set on which fine patterns are formed in a method for manufacturing an LED package according to an embodiment of the present invention.
  • LED package 110 Lead frame
  • FIGS. 1 to 4 are sectional views illustrating a process for manufacturing lead frames and mounting LEDs in a method for manufacturing an LED package according to an embodiment of the present invention.
  • lead frames are formed by molding through a silver-plating process on a copper plate and a portion except for a portion deposited through a photolithography process is removed through an etching process, after which the photolithography process is performed again. Next, an electrode is deposited and a polishing process is performed, after which a lead frame forming process is finished after performing a scribing or breaking process.
  • Each of the lead frames 110, 210, and 310 includes a lower substrate 110c having electrode patterns 110b and an upper plate 110a provided with a groove 110a- 1.
  • the lead frame 110 may be realized by connecting a plurality of the lead frames 110,
  • LED package set 1 may be independently manufactured to form the LED package set 1.
  • FIG. 2 shows a process for die -bonding the LED chip 120 in the lead frame 110.
  • LED chip 120 is mounted in the groove 110a- 1 of the lead frame 110. At this point, mounting precision of the LED chip 120 may be such that a maximum tack time is 1 sec/chip.
  • the LED package set 1 that has gone through the wire bonding process is arranged in a spin coater 2.
  • FIG. 5 shows perspective and enlarged sectional views illustrating a process for dispensing transparent liquid resin into an LED package using a dispenser in a method for manufacturing an LED package according to an embodiment of the present invention
  • FIG. 6 shows perspective and enlarged sectional views illustrating a process for uniformly forming transparent liquid resin dispensed into an LED package set using a spin coater in a method for manufacturing an LED package according to an embodiment of the present invention.
  • Transparent liquid resin 3a is dispensed in the LED package set 1 disposed in the spin coater 2.
  • the transparent liquid resin 3a may be silicon resin, epoxy resin, or a combination thereof.
  • the transparent liquid resin 3a may be silicon resin to which phosphors and other related materials are added.
  • the dispensing process is performed by a dispenser 3 that dispenses the transparent liquid resin into the LED package set 1.
  • the transparent liquid resin 3a may be dispensed into the LED package set 1 such that the transparent liquid resin 3a dispensed is higher than an outer wall 110a of the lead frame 110. This will be described later.
  • the transparent liquid resin 3a is not uniformly dispensed into the LED frames but unevenly dispensed with a various thickness.
  • a surface of the transparent liquid resin dispensed is curved and hardened due to the wetting property of the transparent liquid resin, it is difficult to extract the light.
  • the transparent liquid resin 3a formed on the LED package set 1 with the curved surface is forced outward by the centrifugal force generated by the rotation of the spin coater 2. After the spin coater 2 rotates for a predetermined time, the transparent liquid resin 3a in the LED packages 100, 200, 300, .., and NOO is formed with the uniform thickness.
  • the transparent liquid resin dispensed into the LED package set 1 with a non-uniform thickness is formed with the uniform thickness by the centrifugal force generated by the rotation of the spin coater. Therefore, the fraction defective of the Led packages 100, 200, .., and NOO is reduced and the mass- production becomes possible. Further, the precision of the dispenser 3 is not required and thus the cost for the manufacturing equipment can be reduced.
  • the transparent liquid resin 3a seals the LED package 100 to protect the bonding state of the LED chip 120 to the lead frame 110 and functions as a lens to refract the light emitted from the LED chip 120 when it is hardened.
  • FIG. 7 shows perspective and enlarged sectional views illustrating a process for forming fine patterns on uniformly formed transparent liquid resin using a stamp in a method for manufacturing an LED package according to an embodiment of the present invention
  • FIGS. 8 to 11 shows a variety of embodiments of a stamp.
  • a stamping process for forming a desired pattern on a surface of the transparent liquid resin 3a is performed by applying a stamp having a protrusion/groove pattern before the transparent liquid resin 3a is hardened.
  • a predetermined pressure and temperature are required.
  • the removal of the stamp 4 may be performed in a state where the transparent liquid resin is semi-hardened after a predetermined time has elapsed depending on the kind of the resin and protrusion/groove pattern of the stamp 4 so that the removal of the stamp can be easily realized.
  • the stamp 4 may be formed in an identical size to the LED package set 1 so that the stamp 4 can stamp the LED package set 1 one time.
  • the protrusion/groove pattern of the stamp 4 may be formed in a variety of shapes such as a spherical shape 4a, a pyramid shape 4b, a cylindrical shape 4c, a cone- shape shape 4d, a cube shape, and the like.
  • the pattern may be formed in a fine pattern less than 5 mm.
  • the pattern may be a relief or intaglio pattern.
  • the fine pattern is properly formed such that the total reflection of the LED package can be prevented and the advancing angle range increases, thereby improving the luminance.
  • the transparent liquid resin 3a dispensed into the LED package set 1 may be dispensed to be higher than a height of the lead frame 110a by 0.01-5 mm.
  • a process for drying the transparent liquid resin 3a is performed.
  • the drying process may be performed at a temperature of 150° for 1 hour, after which the transparent liquid resin 3a is hardened at a thermally controlled state by gradually reducing the temperature, thereby manufacturing the LED package set 1.
  • FIG. 12 is a sectional view illustrating a process for removing a stamp in a method for manufacturing an LED package according to an embodiment of the present invention.
  • FIG. 13 is a sectional view illustrating LED packages that are separated through a cutting process for an LED package set on which fine patterns are formed in a method for manufacturing an LED package according to an embodiment of the present invention.
  • a cutting process for separating the LED packages 100, 200, 300, .., and NOO from the LED package set 1 in which the transparent liquid resin is dispensed with the uniform thickness is performed.
  • a plurality of the LED packages can be more easily manufactured as compared with a process in which the LED packages are individually manufacture. Therefore, the manufacturing process can be simplified and the manufacturing cost can be reduced.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A method for manufacturing an LED package, in which a transparent liquid resin is dispensed into the LED package, a uniform thickness is realized through a spin coating process, and a fine pattern is formed, is provided. The method includes mounting light emitting diode chips on respective lead frames to form a light emitting diode package set, dispensing transparent liquid resin into the light emitting diode package set disposed in a spin coater, rotating the light emitting diode package set in which the transparent liquid resin is dispensed using the spin coater at a high speed to form the transparent liquid resin with a uniform thickness, forming a fine pattern on the transparent liquid resin formed on the light emitting diode package by applying a stamp before the transparent liquid resin is hardened, removing the stamp from the light emitting diode package set, and cutting the light emitting diode package set into individual light emitting diode packages. Accordingly, a high luminous LED package that has an enlarged advancing angle range and is improved in light efficiency by manufacturing a plurality of LED packages at a time and allowing fine patterns to be formed can be realized.

Description

Description
METHOD FOR MANUFACTURING LED PACKAGE
Technical Field
[1] The present invention relates to a method for manufacturing a light emitting diode
(LED) package, and more particularly, to a method for manufacturing an LED package, in which a transparent liquid resin is dispensed into the LED package, a uniform thickness is realized through a spin coating process, and a fine pattern is formed. Background Art
[2] A light emitting diode (LED) is a device converting an electric energy into a light energy. The LED is formed of a compound semiconductor that emits light having a specific wavelength depending on an energy band gap.
[3] Since the LED cannot realize various colors and thus it is limited in use as compared with a liquid crystal display (LCD). However, LEDs having different colors have been recently developed and thus the LEDs have been used in a variety of fields such as the optical communication field and the display field.
[4] The LEDs are provided in the form of a package in accordance with their use purpose and required conditions. Generally, the LED package is designed such that LED chips are mounted on a substrate on which electrode patterns are formed or a lead frame, terminals of the LED chips are electrically connected to the electrode patterns, and epoxy, silicon, or the combination thereof is filled to cover the LED chips to function as a lens.
[5] However, the transparent resin such as the epoxy and silicon filled in the LED package has a higher refractive index than the atmosphere and thus only the light, which has a lower angle than a total reflective threshold angle, among the light emitted from the LED chips is emitted to the external side. Therefore, an amount of the light that is substantially extracted is limited. A large amount of the light deviated from the threshold angle range is not emitted to the external light but totally reflected in the LED package. This causes the light loss.
[6] In addition, since a plurality of the LED packages are required for one optical communication device or one display, there is a need to mass-produce the LED packages. However, according to a related art method for manufacturing the LED package, since the transparent liquid resin must be dispensed into the LED package, a dispenser that requires high precision is necessary and thus it is difficult to mass-produce the LED packages. Disclosure of Invention Technical Problem
[7] Accordingly, the present invention is directed to a method for manufacturing an LED package that substantially obviates one or more problems due to limitations and disadvantages of the related art. It is an object of the present invention to provide a method for manufacturing an LED package, which can manufacture many LED packages at a time and form fine patterns on the manufactured LED packages, thereby simplifying the manufacturing process and reducing the manufacturing costs. Technical Solution
[8] To achieve the object, the present invention provides a method including:
[9] mounting light emitting diode chips on respective lead frames to form a light emitting diode package set;
[10] dispensing transparent liquid resin into the light emitting diode package set disposed in a spin coater;
[11] rotating the light emitting diode package set in which the transparent liquid resin is dispensed using the spin coater at a high speed to form the transparent liquid resin with a uniform thickness;
[12] forming a fine pattern on the transparent liquid resin formed on the light emitting diode package by applying a stamp before the transparent liquid resin is hardened;
[13] removing the stamp from the light emitting diode package set; and
[14] cutting the light emitting diode package set into individual light emitting diode packages.
[15] The transparent liquid resin may be silicon resin to which phosphors and other relevant materials are added.
[16] The fine pattern of the light emitting diode package may be a relief or intaglio pattern.
[17] The fine pattern of the light emitting diode package may be one of a spherical shape, a pyramid shape, a cylindrical shape, a cone-shape shape, and a cube shape.
[18] A height H of the transparent liquid resin 3a dispensed into the light emitting diode package from a top of an outer wall of the lead frame may be set to satisfy the following condition: 0.01 mm < H < 5 mm.
Advantageous Effects
[19] According to the present invention, a high luminous LED package that has an enlarged advancing angle range and is improved in light efficiency by manufacturing a plurality of LED packages at a time and allowing fine patterns to be formed can be realized.
[20] In addition, as the manufacturing process is simplified, the manufacturing cost can be reduced. Brief Description of the Drawings
[21] FIGS. 1 to 4 are sectional views illustrating a process for manufacturing lead frames and mounting LEDs in a method for manufacturing an LED package according to an embodiment of the present invention. [22] FIG. 5 shows perspective and enlarged sectional views illustrating a process for dispensing transparent liquid resin into an LED package using a dispenser in a method for manufacturing an LED package according to an embodiment of the present invention. [23] FIG. 6 shows perspective and enlarged sectional views illustrating a process for uniformly forming transparent liquid resin dispensed into an LED package set using a spin coater in a method for manufacturing an LED package according to an embodiment of the present invention. [24] FIG. 7 shows perspective and enlarged sectional views illustrating a process for forming fine patterns on uniformly formed transparent liquid resin using a stamp in a method for manufacturing an LED package according to an embodiment of the present invention. [25] FIGS. 8 to 11 are perspective views illustrating a variety of patterns of stamps in a method for manufacturing an LED package according to an embodiment of the present invention. [26] FIG. 12 is a sectional view illustrating a process for removing a stamp in a method for manufacturing an LED package according to an embodiment of the present invention. [27] FIG. 13 is a sectional view illustrating LED packages that are separated through a cutting process for an LED package set on which fine patterns are formed in a method for manufacturing an LED package according to an embodiment of the present invention. [28] DESCRIPTION OF THE SYMBOLS IN MAIN PORTIONS OF THE
DRAWINGS>
[29] 1: LED package set 2: Spin coater
[30] 3: Dispenser 3a: Transparent liquid resin
[31] 3b: Fine pattern 4: Stamp
[32] 100: LED package 110: Lead frame
[33] 120: LED chip 130: Wire
Best Mode for Carrying Out the Invention [34] Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. [35] FIGS. 1 to 4 are sectional views illustrating a process for manufacturing lead frames and mounting LEDs in a method for manufacturing an LED package according to an embodiment of the present invention.
[36] As shown in FIG. 1, lead frames are formed by molding through a silver-plating process on a copper plate and a portion except for a portion deposited through a photolithography process is removed through an etching process, after which the photolithography process is performed again. Next, an electrode is deposited and a polishing process is performed, after which a lead frame forming process is finished after performing a scribing or breaking process. Each of the lead frames 110, 210, and 310 includes a lower substrate 110c having electrode patterns 110b and an upper plate 110a provided with a groove 110a- 1.
[37] The lead frame 110 may be realized by connecting a plurality of the lead frames 110,
210, 310, .. and NlO to form an LED package set 1 or may be independently manufactured to form the LED package set 1.
[38] FIG. 2 shows a process for die -bonding the LED chip 120 in the lead frame 110. The
LED chip 120 is mounted in the groove 110a- 1 of the lead frame 110. At this point, mounting precision of the LED chip 120 may be such that a maximum tack time is 1 sec/chip.
[39] As shown in FIG. 3, the die-bonded LED chip 120 is connected to the lead frame 110 by wires 130. At this point, the wire 130 may be formed of gold and have a thickness of 1 mm.
[40] After the above, as shown in FIG. 4, the LED package set 1 that has gone through the wire bonding process is arranged in a spin coater 2.
[41] FIG. 5 shows perspective and enlarged sectional views illustrating a process for dispensing transparent liquid resin into an LED package using a dispenser in a method for manufacturing an LED package according to an embodiment of the present invention, and FIG. 6 shows perspective and enlarged sectional views illustrating a process for uniformly forming transparent liquid resin dispensed into an LED package set using a spin coater in a method for manufacturing an LED package according to an embodiment of the present invention.
[42] Transparent liquid resin 3a is dispensed in the LED package set 1 disposed in the spin coater 2. The transparent liquid resin 3a may be silicon resin, epoxy resin, or a combination thereof. For example, the transparent liquid resin 3a may be silicon resin to which phosphors and other related materials are added.
[43] The dispensing process is performed by a dispenser 3 that dispenses the transparent liquid resin into the LED package set 1. At this point, in order to form fine patterns on the LED package set 1 with a uniform thickness, the transparent liquid resin 3a may be dispensed into the LED package set 1 such that the transparent liquid resin 3a dispensed is higher than an outer wall 110a of the lead frame 110. This will be described later.
[44] The transparent liquid resin 3a is not uniformly dispensed into the LED frames but unevenly dispensed with a various thickness. In addition, when a surface of the transparent liquid resin dispensed is curved and hardened due to the wetting property of the transparent liquid resin, it is difficult to extract the light.
[45] Accordingly, when the transparent liquid resin is fully dispensed into the LED package set 1 by the dispenser 3, a process for rotating the spin coater 2 is performed.
[46] The transparent liquid resin 3a formed on the LED package set 1 with the curved surface is forced outward by the centrifugal force generated by the rotation of the spin coater 2. After the spin coater 2 rotates for a predetermined time, the transparent liquid resin 3a in the LED packages 100, 200, 300, .., and NOO is formed with the uniform thickness.
[47] Therefore, unlike the related art in which the transparent liquid resin is simply dispensed by the dispenser, the transparent liquid resin dispensed into the LED package set 1 with a non-uniform thickness is formed with the uniform thickness by the centrifugal force generated by the rotation of the spin coater. Therefore, the fraction defective of the Led packages 100, 200, .., and NOO is reduced and the mass- production becomes possible. Further, the precision of the dispenser 3 is not required and thus the cost for the manufacturing equipment can be reduced.
[48] The transparent liquid resin 3a seals the LED package 100 to protect the bonding state of the LED chip 120 to the lead frame 110 and functions as a lens to refract the light emitted from the LED chip 120 when it is hardened.
[49] FIG. 7 shows perspective and enlarged sectional views illustrating a process for forming fine patterns on uniformly formed transparent liquid resin using a stamp in a method for manufacturing an LED package according to an embodiment of the present invention, and FIGS. 8 to 11 shows a variety of embodiments of a stamp.
[50] Next, a stamping process for forming a desired pattern on a surface of the transparent liquid resin 3a is performed by applying a stamp having a protrusion/groove pattern before the transparent liquid resin 3a is hardened.
[51] In order to perform the stamping process, a predetermined pressure and temperature are required. The removal of the stamp 4 may be performed in a state where the transparent liquid resin is semi-hardened after a predetermined time has elapsed depending on the kind of the resin and protrusion/groove pattern of the stamp 4 so that the removal of the stamp can be easily realized.
[52] The stamp 4 may be formed in an identical size to the LED package set 1 so that the stamp 4 can stamp the LED package set 1 one time. The protrusion/groove pattern of the stamp 4 may be formed in a variety of shapes such as a spherical shape 4a, a pyramid shape 4b, a cylindrical shape 4c, a cone- shape shape 4d, a cube shape, and the like.
[53] The pattern may be formed in a fine pattern less than 5 mm. The pattern may be a relief or intaglio pattern. The fine pattern is properly formed such that the total reflection of the LED package can be prevented and the advancing angle range increases, thereby improving the luminance. In addition, in order to form the fine pattern, the transparent liquid resin 3a dispensed into the LED package set 1 may be dispensed to be higher than a height of the lead frame 110a by 0.01-5 mm.
[54] After the fine pattern 3b is formed as described above, a process for drying the transparent liquid resin 3a is performed. The drying process may be performed at a temperature of 150° for 1 hour, after which the transparent liquid resin 3a is hardened at a thermally controlled state by gradually reducing the temperature, thereby manufacturing the LED package set 1.
[55] FIG. 12 is a sectional view illustrating a process for removing a stamp in a method for manufacturing an LED package according to an embodiment of the present invention.
[56] The stamp is removed from the LED package set 1. At this point, as previously described, since the pattern is formed on the LED package set 1 by the same stamp, the LED package set 1 has the same pattern. Therefore, the LED packages are improved in light extraction efficiency by the uniform pattern.
[57] Additionally, a process for removing bubbles from the transparent liquid resin 3a that is hardened in a state where the stamp 4 is adhered thereto.
[58] FIG. 13 is a sectional view illustrating LED packages that are separated through a cutting process for an LED package set on which fine patterns are formed in a method for manufacturing an LED package according to an embodiment of the present invention.
[59] A cutting process for separating the LED packages 100, 200, 300, .., and NOO from the LED package set 1 in which the transparent liquid resin is dispensed with the uniform thickness is performed. By doing this, a plurality of the LED packages can be more easily manufactured as compared with a process in which the LED packages are individually manufacture. Therefore, the manufacturing process can be simplified and the manufacturing cost can be reduced.
[60] After the above, a process for testing electrical and optical properties of the LED packages under predetermined conditions and a process for packaging the LED package in a carrier tape at a predetermined distance are performed.
[61] It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention. Thus, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.

Claims

Claims
[1] A method for manufacturing a light emitting diode package, the method comprising: mounting light emitting diode chips 120, 220, 320, .., and N20 on respective lead frames 110, 210, 310, .., and NlO to form a light emitting diode package set 1; dispensing transparent liquid resin into the light emitting diode package set 1 disposed in a spin coater 2; rotating the light emitting diode package set 1 in which the transparent liquid resin 3a is dispensed using the spin coater 2 at a high speed to form the transparent liquid resin 3a with a uniform thickness; forming a fine pattern on the transparent liquid resin formed on the light emitting diode package 1 by applying a stamp 4 before the transparent liquid resin 3a is hardened; removing the stamp 4 from the light emitting diode package set 1 ; and cutting the light emitting diode package set 1 into individual light emitting diode packages 100, 200, 300, .., and N00. [2] The method of claim 1, wherein the transparent liquid resin 3a is silicon resin to which phosphors and other relevant materials are added. [3] The method of one of claims 1 and 2, wherein the fine pattern 3b of the light emitting diode package 100 is a relief or intaglio pattern. [4] The method of claim 2, wherein the fine pattern of the light emitting diode package 100 is one of a spherical shape, a pyramid shape, a cylindrical shape, a cone-shape shape, and a cube shape. [5] The method of one of claims 1 and 2, wherein a height H of the transparent liquid resin 3a dispensed into the light emitting diode package 100 from a top of an outer wall 110a of the lead frame 110 is set to satisfy the following condition:
0.01 mm < H < 5 mm.
PCT/KR2008/004782 2008-07-07 2008-08-18 Method for manufacturing led package WO2010005138A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8796665B2 (en) 2011-08-26 2014-08-05 Micron Technology, Inc. Solid state radiation transducers and methods of manufacturing
US11848303B2 (en) 2020-08-18 2023-12-19 Seoul National University R&Db Foundation Electronic device and method of transferring electronic element using stamping and magnetic field alignment

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101564319B1 (en) 2014-02-05 2015-10-30 천병태 Image sensor module and manufacturing method thereof
KR101694702B1 (en) * 2015-04-21 2017-01-11 우리이앤엘 주식회사 Led light source unit and backlight assembly using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050012372A (en) * 2003-07-25 2005-02-02 엘지이노텍 주식회사 Luminescent diode package and method for manufacturing led package
JP2005109059A (en) * 2003-09-30 2005-04-21 Sanyo Electric Co Ltd LIGHT EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
JP2007227919A (en) * 2006-02-22 2007-09-06 Samsung Electro Mech Co Ltd Manufacturing method of light emitting diode package
US20080142822A1 (en) * 2006-12-13 2008-06-19 Samsung Electro-Mechanics Co., Ltd. Light emitting diode package and method of manufacturing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100693462B1 (en) 2005-08-02 2007-03-12 한국광기술원 Wavelength Converting LED Package and Manufacturing Method Using Phosphors
KR100755619B1 (en) 2006-08-08 2007-09-06 삼성전기주식회사 Manufacturing method of LED package
KR100849807B1 (en) 2007-03-26 2008-07-31 삼성전기주식회사 Manufacturing method of light emitting diode package
KR20080087425A (en) * 2007-03-27 2008-10-01 삼성전기주식회사 Imprinting stamp for pattern formation and manufacturing method of LED package using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050012372A (en) * 2003-07-25 2005-02-02 엘지이노텍 주식회사 Luminescent diode package and method for manufacturing led package
JP2005109059A (en) * 2003-09-30 2005-04-21 Sanyo Electric Co Ltd LIGHT EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
JP2007227919A (en) * 2006-02-22 2007-09-06 Samsung Electro Mech Co Ltd Manufacturing method of light emitting diode package
US20080142822A1 (en) * 2006-12-13 2008-06-19 Samsung Electro-Mechanics Co., Ltd. Light emitting diode package and method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8796665B2 (en) 2011-08-26 2014-08-05 Micron Technology, Inc. Solid state radiation transducers and methods of manufacturing
US11848303B2 (en) 2020-08-18 2023-12-19 Seoul National University R&Db Foundation Electronic device and method of transferring electronic element using stamping and magnetic field alignment
US12009339B2 (en) 2020-08-18 2024-06-11 Seoul National University R&Db Foundation Electronic device and method of transferring electronic element using stamping and magnetic field alignment

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