[go: up one dir, main page]

WO2013014979A1 - Dispositif électroluminescent et procédé de fabrication d'un dispositif électroluminescent - Google Patents

Dispositif électroluminescent et procédé de fabrication d'un dispositif électroluminescent Download PDF

Info

Publication number
WO2013014979A1
WO2013014979A1 PCT/JP2012/058860 JP2012058860W WO2013014979A1 WO 2013014979 A1 WO2013014979 A1 WO 2013014979A1 JP 2012058860 W JP2012058860 W JP 2012058860W WO 2013014979 A1 WO2013014979 A1 WO 2013014979A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
sealing material
reflective layer
layer
Prior art date
Application number
PCT/JP2012/058860
Other languages
English (en)
Japanese (ja)
Inventor
雄也 大西
浩司 宮田
岩崎　良英
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2013014979A1 publication Critical patent/WO2013014979A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

Definitions

  • the present invention relates to a light-emitting device using a light-emitting element typified by a light-emitting diode (LED: Light Emitting Diode), and a manufacturing method thereof.
  • LED Light Emitting Diode
  • Light emitting devices using light emitting elements such as LEDs have advantages such as low power consumption, small size, high luminance, and long life, and thus have been used in various applications in recent years. For example, as an alternative to an incandescent lamp with high power consumption, it has come to be used in lighting devices.
  • FIG. 13 is a cross-sectional view illustrating a conventional method for sealing a light emitting element.
  • molds M ⁇ b> 1 and M ⁇ b> 2 are used to seal the light emitting element 203 provided on the reflective layer 202 formed on the substrate 201 with the sealing material 204.
  • the sealing material 204 is accommodated in the recess of the mold M1
  • the molds M1 and M2 are joined in a state where the substrate 201 is accommodated in the recess of the mold M2, and sealed by applying pressure, heat, or the like.
  • the light emitting element 203 is sealed by curing the agent 204.
  • the molds M1 and M2 are essential. For this reason, for example, when the structure of the light emitting device is to be changed, a mold corresponding to the new structure must be manufactured each time, which requires a lot of time and cost. Therefore, the structure of the light emitting device cannot be easily changed, which is a problem.
  • Patent Document 1 proposes a light emitting device in which a light emitting element is sealed with a sealing material without using a mold.
  • This light-emitting device will be described with reference to FIG.
  • FIG. 14 is a cross-sectional view and a plan view showing an example of the structure of a conventional light emitting device.
  • 14A is a cross-sectional view
  • FIG. 14B is a plan view
  • the cross-section shown in FIG. 14A shows the XX cross-section shown in FIG. 14B.
  • the light-emitting device 300 includes a substrate 301, a reflective layer 302 formed on the substrate 301, a light-emitting element 303 provided on the reflective layer 302, and a sealing material that seals the light-emitting element 303. 304 and a repellent layer 305 that is provided on the reflective layer 302 and has a repellent property with respect to the sealing material 304 in a fluid state.
  • the annular repellent layer 305 is formed to suppress the sealing material 304 from flowing out. Therefore, the light emitting element 303 can be sealed without using a mold.
  • the sealing material 304 In order to efficiently extract light from the light-emitting device, the sealing material for sealing the light-emitting element must be close to a hemispherical shape.
  • Patent Document 2 proposes a light-emitting device in which the shape of the sealing material is close to a hemispherical shape without using a mold.
  • This light-emitting device will be described with reference to FIG.
  • FIG. 15 is a cross-sectional view and a plan view showing another example of the structure of the conventional light emitting device.
  • 15A is a sectional view
  • FIG. 15B is a plan view
  • the section shown in FIG. 15A is a YY section shown in FIG. 15B.
  • the light-emitting device 400 illustrated in FIG. 15 includes a substrate 401, a reflective layer 402, a light-emitting element 403, and a sealing material 404.
  • a mark ink material 405 having repellency with respect to the sealing material 404 having fluidity is provided on the reflective layer 402 instead of the repellant layer 305 illustrated in FIG. 14.
  • the shape of the sealing material 404 is controlled.
  • JP 2008-258296 A Japanese Patent No. 4107349
  • the reflective layer 402 and the mark ink material 405 are problematic because the bonding strength is weakened due to the different materials, and problems such as peeling may occur.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a light-emitting device that can be easily manufactured with less difficulty such as peeling, and a manufacturing method thereof.
  • the present invention comprises a substrate, A reflective layer formed on the substrate and having a projecting portion projecting annularly; A light emitting element provided in an inner region surrounded by an inner peripheral wall surface of the protruding portion; A sealing material for sealing the light emitting element; A repellent layer that is formed on at least the top surface of the protruding portion and has a repellent property with respect to the sealing material in a fluid state, and at least a part of an outer edge of the sealing material has the repellent property
  • a light emitting device which is located on a layer.
  • the reflective layer can be formed of the same material as a whole including the protruding portion.
  • the surface of the repellent layer formed on the top surface of the protrusion is 20 ⁇ m or more than the surface of the reflection layer adjacent to the protrusion in the inner region. A higher value is preferable.
  • a sealing material can be easily hemispherical (or shape near this). It becomes possible to.
  • the inner peripheral wall surface of the protruding portion is perpendicular to the surface of the reflective layer adjacent to the protruding portion in the inner region.
  • a sealing material can be easily hemispherical (or shape near this). It becomes possible to. Note that “vertical” is not limited to a case where the angle is completely 90 degrees, and naturally includes a case where the angle is deviated from 90 degrees by a predetermined angle or less (substantially vertical) as long as the above effect is obtained.
  • the repellent layer is formed on at least the inner peripheral wall surface side of the top surface of the protruding portion.
  • the repellent layer is formed on the entire top surface of the protruding portion.
  • This configuration makes it possible to fasten the outer edge of the sealing material on the top surface of the protrusion.
  • the repellent layer is also formed on the outer peripheral wall surface of the protruding portion.
  • the reflective layer has a pedestal in the inner region, The thickness of the pedestal portion is greater than the thickness of the reflective layer adjacent to the pedestal portion in the inner region, It is preferable that the light emitting element is provided immediately above the pedestal.
  • the base portion having a large thickness efficiently reflects the light emitted from the light emitting element. Therefore, the light extraction efficiency of the light emitting device can be increased.
  • a reflection layer can be formed with the same material as a whole including a protrusion part.
  • the light-emitting device having the above-described characteristics is such that the reflective layer has at least one outer projecting portion projecting in an annular shape in an outer region outside the region surrounded by the outer peripheral wall surface of the projecting portion.
  • a reflection layer can be formed with the same material as a whole including an outside protrusion part.
  • the sealing material includes a phosphor.
  • the light-emitting device having the above characteristics further includes an inner sealing material that includes a phosphor and seals the light-emitting element, It is preferable that the sealing material seals the light emitting element together with the inner sealing material.
  • the light-emitting device having the above characteristics includes an annular inner repellent layer that is formed on the reflective layer in the inner region and has repellency to the inner sealing material in a fluid state.
  • an annular inner repellent layer that is formed on the reflective layer in the inner region and has repellency to the inner sealing material in a fluid state.
  • Structuring in this way makes it possible to suppress the expansion of the inner sealing material in the horizontal plane and to keep the inner sealing material in an arbitrary position.
  • the reflective layer has an inner protrusion that protrudes in an annular shape in the inner region, It is preferable that the inner sealing material is located in a region surrounded by an inner peripheral wall surface of the inner protrusion.
  • Structuring in this way makes it possible to suppress the expansion of the inner sealing material in the horizontal plane and to keep the inner sealing material in an arbitrary position. Furthermore, it can avoid that the sealing material and an inner side sealing material harden
  • a reflection layer can be formed with the same material as a whole including an inner side protrusion part.
  • the material forming the reflective layer is the same material as the white resin, metal, or the material forming the substrate.
  • the present invention provides a reflective layer forming step of forming a reflective layer having a projecting portion projecting annularly on a substrate, A repellent layer forming step of forming a repellent layer on at least the top surface of the protrusion; A light emitting element mounting step of providing a light emitting element in an inner region surrounded by an inner peripheral wall surface of the protruding portion; A sealing step of sealing at least the light emitting element by injecting a sealing material into the inner region, The repellency layer has repellency with respect to the sealing material in a state having fluidity in the sealing step, In the sealing step, there is provided a method for manufacturing a light emitting device, wherein the sealing material is injected so that at least a part of an outer edge of the sealing material is positioned on the repellent layer.
  • the manufacturing method of the light emitting device having the above characteristics includes the reflective layer forming step, On the substrate having a flat surface, the reflective layer having the protruding portion is formed by laminating a material constituting the reflective layer a plurality of times. Alternatively, it is preferable to form a reflective layer having the protruding portion by forming irregularities on the substrate.
  • the protrusion forming a part of the reflective layer having a repellent layer formed on the top surface in order to cure the sealing material in a hemispherical shape (or a shape close thereto) Department is used. Therefore, it is not necessary to separately provide a protrusion having a different material from that of the reflective layer on the reflective layer, and the light emitting device can be manufactured easily and at low cost. Furthermore, since the protruding portion is a part of the reflective layer and can be firmly bonded, it is possible to make it difficult to cause problems such as peeling.
  • Sectional drawing and top view which show the structure of the light-emitting device which concerns on the 1st example of 1st Embodiment of this invention.
  • Sectional drawing which shows an example of the manufacturing method of the light-emitting device shown in FIG.
  • Sectional drawing and the top view which show the structure of the light-emitting device which concerns on the 2nd example of 1st Embodiment of this invention.
  • Sectional drawing and the top view which show the structure of the light-emitting device which concerns on the 3rd example of 1st Embodiment of this invention.
  • Sectional drawing and top view which show the structure of the light-emitting device which concerns on the 1st example of 2nd Embodiment of this invention.
  • Sectional drawing which shows an example of the manufacturing method of the light-emitting device shown in FIG.
  • Sectional drawing and top view which show the structure of the light-emitting device which concerns on the 2nd example of 2nd Embodiment of this invention.
  • Sectional drawing and top view which show the structure of the light-emitting device which concerns on the 3rd example of 2nd Embodiment of this invention.
  • Sectional drawing and top view which show the structure of the light-emitting device which concerns on the 4th example of 2nd Embodiment of this invention.
  • Sectional drawing and the top view which show the structure of the light-emitting device which concerns on the 5th example of 2nd Embodiment of this invention.
  • Sectional drawing and top view which show the structure of the modification of the light-emitting device which concerns on embodiment of this invention.
  • Sectional drawing and top view which show the structure of the modification of the light-emitting device which concerns on embodiment of this invention.
  • Sectional drawing which shows the conventional sealing method of a light emitting element.
  • Sectional drawing and top view which show an example of the structure of the conventional light-emitting device.
  • Sectional drawing and top view which show another example of the structure of the conventional light-emitting device.
  • the present invention is applied to a light-emitting device including a light-emitting element composed of an LED and a sealing material including a phosphor that emits fluorescence when excited by light emitted from the light-emitting element.
  • a light-emitting device including a light-emitting element composed of an LED and a sealing material including a phosphor that emits fluorescence when excited by light emitted from the light-emitting element.
  • the light emitting device to which the present invention can be applied is not limited to the one having an LED as a light emitting element.
  • the present invention can be applied to a light emitting device including a light emitting element other than an LED such as a laser diode.
  • the present invention is also applicable to a light emitting device including a sealing material that does not include a phosphor.
  • FIG. 1 is a cross-sectional view and a plan view showing the structure of a light emitting device according to a first example of the first embodiment of the present invention.
  • 1A is a cross-sectional view
  • FIG. 1B is a plan view
  • the cross section shown in FIG. 1A is a cross section taken along the line AA shown in FIG. 1B.
  • the light emitting device 1Aa includes a substrate 10 having a flat surface, a reflective layer 11Aa formed on the substrate 10, a light emitting element 12 provided on the reflective layer 11Aa, and the light emitting element 12 sealed. And a repellent layer 14 having repellency against the sealing material 13 in a fluid state.
  • the substrate 10 includes electrodes (not shown) for supplying power to the light emitting element 12 (for example, two electrodes of an anode electrode and a cathode electrode) and the like, and the electrode and the light emitting element 12 are not shown. It is connected by a connecting member such as a case of mounting) or a bump (in the case of flip chip mounting).
  • substrate 10 may be a printed circuit board which uses a ceramic, glass epoxy, Al, etc. as a base material, for example, may be a lead frame, a tape carrier, etc.
  • the reflective layer 11Aa does not have to be partially formed in a portion where the connection member for connecting the light emitting element 12 and the electrode provided on the substrate 10 is provided or in the vicinity thereof.
  • the reflective layer 11Aa has a protruding portion 111 that protrudes in an annular shape (annular shape).
  • the light emitting element 12 is disposed in an inner region IN surrounded by an annular (annular) inner peripheral wall surface that is an inner peripheral surface of the protruding portion 111. Reflection in the outer surface OUT, which is outside the region surrounded by the top surface of the protruding portion 111, the surface of the reflective layer 11Aa in the inner region, and the outer peripheral wall surface of the protruding portion 111.
  • the surface of the layer 11Aa is flat.
  • the inner peripheral wall surface of the protrusion 111 is perpendicular to the surface of the reflective layer 11Aa adjacent to the protrusion 111 in the inner region IN.
  • the effect of suppressing the expansion of the sealing material 13 in the horizontal plane by the combination of the protruding portion 111 and the repellent layer can be suitably obtained.
  • “vertical” is not limited to a case where the angle is completely 90 degrees, and naturally includes a case where the angle is deviated from 90 degrees by a predetermined angle or less (substantially vertical) as long as the above effect is obtained.
  • the reflective layer 11Aa is made of, for example, a resin material (white resist) containing milky white titanium oxide, a metal material, a material constituting the substrate 10, or the like, and enters the reflective layer 11Aa (for example, the light emitting element 12 emits light). At least a part of light, light emitted from the phosphor contained in the sealing material 13, light refracted or reflected by the sealing material 13, and the like are reflected. Therefore, the intensity of the light emitted from the light emitting device 1Aa can be increased.
  • the reflective layer 11Aa is preferably formed over the entire surface of the substrate 10.
  • the light emitting element 12 is, for example, a chip-like LED, and has a size of, for example, a long side of 500 ⁇ m, a short side of 290 ⁇ m, and a height of about 100 ⁇ m.
  • the overall size of the light emitting device 1Aa is about 2.8 mm in width (vertical and horizontal) and about 1.3 mm in height.
  • the light emitting element 12 emits blue light (specifically, for example, the peak wavelength is 450 nm).
  • the light emitting element 12 may emit light other than blue light.
  • the light emitting element 12 may be an LED that emits ultraviolet light (specifically, for example, a peak wavelength of 390 nm to 420 nm).
  • the light emitting element 12 uses a fixing material such as die bond (in the case of wire bonding mounting) or underfill (in the case of flip chip mounting) as necessary, and has a main light emitting direction (light emitting surface). And fixed on the reflective layer 11Aa so as to be in the opposite direction to the substrate 10.
  • Sealing material 13 is a material that has fluidity during mounting and can be cured by applying heat or light thereafter.
  • it is made of an epoxy resin or a silicone resin.
  • the sealing material 13 seals the light emitting element 12 in a fluid state, and at least a part of the outer edge thereof is positioned on the repellent layer 14 (in other words, the sealing material 13 In the state where at least a part of the protrusions 111 and the repellent layer 14 are overcome).
  • the sealing material 13 can be cured in a hemispherical shape (or a shape close to this).
  • the sealing material 13 includes a phosphor that is excited by blue light emitted from the light emitting element 12 and emits, for example, yellow fluorescence.
  • the light emitted from the light emitting device 1Aa is white light in which blue light and yellow light are mixed.
  • the color of light emitted from the light emitting device 1Aa can be arbitrarily determined by appropriately selecting the type of light emitting element 12 or phosphor (color of emitted light).
  • the repellent layer 14 is formed at least on the top surface of the protruding portion 111.
  • the other surface for example, the reflection layer on the inner and outer wall surfaces of the projecting portion 111, the inner region IN and the outer region OUT). 11Aa surface, etc.).
  • the repellent layer 14 is formed not only on the top surface of the protruding portion 111 but also on the inner peripheral wall surface and the outer peripheral wall surface, Preferred (details will be described later).
  • the repellent layer 14 does not necessarily have to be formed on the entire top surface of the protruding portion 111, and has a width that can sufficiently prevent the sealing material 13 from spreading in the horizontal plane. You may form only in an inner peripheral wall side.
  • the repellent layer 14 is made of a material having repellent properties with respect to the sealing material 13 in a fluid state.
  • the repellent layer 14 is made of a fluorine-based polymer material.
  • the surface of the repellent layer 14 formed on the top surface of the protruding portion 111 is 20 ⁇ m or more higher than the surface of the reflective layer 11Aa adjacent to the protruding portion 111 in the inner region IN (that is, the inner region IN). Is preferably provided with a step of 20 ⁇ m or more at the boundary. If comprised in this way, since the effect which suppresses the expansion in the horizontal surface of the sealing material 13 by the combination of the protrusion part 111 and the repellent layer 14 is obtained suitably, a sealing material is easily hemispherical (or this) Close shape).
  • FIG. 2 is a cross-sectional view illustrating an example of a manufacturing method of the light-emitting device shown in FIG.
  • the cross-sectional view shown in FIG. 2 shows the same AA cross section as the cross-sectional view shown in FIG.
  • a substrate 10 is prepared.
  • a reflective layer 11 ⁇ / b> Aa is formed on the substrate 10.
  • a first layer made of a material constituting the reflective layer 11Aa is formed on the entire surface of the substrate 10 (excluding the portion where the connection member is provided), and a second layer made of the material is further attached to the first layer.
  • the reflective layer 11Aa can be formed by partially forming on one layer.
  • the reflective layer 11Aa is made of a positive photosensitive material (specifically, for example, the above-described white resist)
  • the protrusion 111 is formed after the second layer is formed on the entire surface of the first layer.
  • the reflective layer 11 ⁇ / b> Aa may be formed by exposing the photosensitive material except for the portion. If the reflective layer 11Aa is a negative photosensitive material, on the contrary, the portion where the protrusion 111 is to be provided may be exposed.
  • the reflective layer 11Aa may be formed by forming the first layer and the second layer by printing.
  • the reflective layer 11Aa includes the protruding portion 111 and is made of the same material as a whole. In addition, by manufacturing the reflective layer 11Aa in this way, it is possible to easily manufacture the reflective layer 11Aa that has the protruding portion 111 and is integrated as a whole.
  • the reflective layer 11Aa may be formed by laminating three or more times. However, from the viewpoint of facilitating the manufacturing method, it is preferable to form the reflective layer 11Aa by stacking twice as in the above example.
  • the repellent layer 14 is formed at least on the top surface of the protruding portion 111.
  • the repellent layer 14 can be formed so as to protrude from the top surface of the protrusion 111. Therefore, the repellent layer 14 does not require strict positioning during formation and can be easily formed.
  • the repellent layer 14 can be formed by vapor deposition, printing, transfer, or the like.
  • the light emitting element 12 is fixed in the inner region IN and on the reflective layer 11Aa.
  • a fixing material is used as necessary.
  • the sealing material 13 having fluidity is injected into the inner region IN until at least a part of the outer edge is located on the repellent layer 14. And cured by applying heat or light.
  • the sealing material 13 can be hardened in a hemispherical shape (or a shape close thereto).
  • the sealing material 13 can be injected by a dispenser, printing, or the like.
  • the position of the nozzle is set so that the tip of the nozzle that discharges the sealing material 13 does not contact a wire or the like. It is preferable that the height is higher than the height at which a wire or the like exists.
  • the light emitting device 1Aa of this example in order to harden the sealing material 13 in a hemispherical shape (or a shape close thereto), a part of the reflective layer 11Aa having the repellent layer 14 formed on the top surface. Is used. Therefore, it is not necessary to separately provide a protrusion having a different material from that of the reflective layer 11Aa on the reflective layer 11Aa, and the light emitting device 1Aa can be manufactured easily and at low cost. Furthermore, since the protruding portion 111 is a part of the reflective layer 11Aa and can be firmly joined, it is possible to make it difficult to cause problems such as peeling.
  • FIG. 3 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the second example of the first embodiment of the present invention.
  • 3A is a cross-sectional view
  • FIG. 3B is a plan view
  • the cross-section shown in FIG. 3A is a cross-section taken along the line BB shown in FIG. 3B.
  • the light emitting device 1Ab of this example shown in FIG. 3 shares most of the structure, effects, manufacturing method, and the like with the light emitting device 1Aa described so far. Therefore, in the light emitting device 1Ab of the present example, with respect to the parts common to the light emitting device 1Aa described so far, the description of the light emitting device 1Aa is referred to as appropriate, and the detailed description is omitted.
  • the light emitting device 1Ab of this example also includes the substrate 10, the reflective layer 11Ab, the light emitting element 12, the sealing material 13, and the repellent layer 14. .
  • the structure of the reflective layer 11Ab is different from the structure of the reflective layer 11Aa of the light emitting device 1Aa according to the first example of the first embodiment.
  • the reflective layer 11Ab of the light emitting device 1Ab of the present example has a protrusion 112 that is similar to the protrusion 111 described above, except that the outer peripheral wall surface extends to the end of the substrate 10.
  • FIG. 3 illustrates the case where the repellent layer 14 is partially formed not on the entire top surface of the projecting portion 112 but on the inner peripheral wall surface side. As described for the light emitting device 1Aa of the example, it may be formed on a surface other than the top surface, or may be formed on the entire top surface.
  • the reflective layer 11Ab of the light emitting device 1Ab of the present example has a pedestal portion 113 in which the light emitting element 12 is provided immediately above in the inner region IN.
  • the thickness of the pedestal portion 113 is larger than the thickness of the reflective layer 11Ab adjacent to the pedestal portion 113 in the inner region IN.
  • the projection 112 and the pedestal 113 having a large thickness efficiently reflect the light emitted from the light emitting element 12 and the sealing material 13. Therefore, the light extraction efficiency of the light emitting device 1Ab can be increased.
  • the protrusion 112 may be the protrusion 111 (see FIG. 1) included in the light emitting device 1Aa according to the first example of the first embodiment. Further, in the light emitting device 1Ab of this example, the pedestal portion 113 may not be formed. Further, the light emitting device 1Ab of this example can be manufactured by applying the manufacturing method (see FIG. 2) of the light emitting device 1Aa according to the first example of the first embodiment. In this case, in the method for manufacturing the light emitting device 1Aa according to the first example of the first embodiment, when the protrusion 111 is formed (see FIG. 2B), the protrusion 112 and the pedestal 113 are formed by the same method. What is necessary is just to form.
  • FIG. 4 is a sectional view and a plan view showing the structure of the light emitting device according to the third example of the first embodiment of the present invention.
  • 4A is a cross-sectional view
  • FIG. 4B is a plan view
  • the cross section shown in FIG. 4A is a CC cross section shown in FIG. 4B.
  • the light emitting device 1Ac of this example shown in FIG. 4 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa and 1Ab described above.
  • the description of the light emitting devices 1Aa and 1Ab will be referred to as appropriate, and the detailed description will be omitted.
  • the light emitting device 1Ac of this example also has a substrate 10, a reflective layer 11Ac, a light emitting element 12, and a sealing material 13. And a repellent layer 14.
  • the structure of the reflective layer 11Ab is different from the structures of the reflective layers 11Aa and 11Ab of the light emitting devices 1Aa and 1Ab according to the first and second examples of the first embodiment.
  • the reflection layer 11Ac of the light emitting device 1Ac of the present example includes the protrusion 111 and the pedestal 113 described above, and an outer protrusion 114 that protrudes in an annular shape in the outer region OUT.
  • 4 illustrates the case where the outer peripheral wall surface of the outer projecting portion 114 extends to the end of the substrate 10, but the outer peripheral wall surface of the outer projecting portion 114 is formed in an annular shape in the same manner as the outer peripheral wall surface of the projecting portion 111. Also good.
  • the protruding outer protrusion 114 efficiently reflects the light emitted from the light emitting element 12 and the sealing material 13. Therefore, the light extraction efficiency of the light emitting device 1Ac can be increased.
  • the pedestal portion 113 may not be formed.
  • the light emitting device 1Ac of this example can be manufactured by applying the method for manufacturing the light emitting device 1Aa according to the first example of the first embodiment (see FIG. 2).
  • the protruding portion 111 is formed in the method for manufacturing the light emitting device 1Aa according to the first example of the first embodiment (see FIG. 2B)
  • the protruding portion 111, the pedestal portion 113, and the outer side are formed by the same method.
  • the protrusion 114 may be formed.
  • FIG. 5 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the first example of the second embodiment of the present invention.
  • 5A is a sectional view
  • FIG. 5B is a plan view
  • the section shown in FIG. 5A is a DD section shown in FIG. 5B.
  • the light emitting device 1Ba of this example shown in FIG. 5 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa to 1Ac described above.
  • the description of the light emitting devices 1Aa to 1Ac is referred to as appropriate, and the detailed description is omitted.
  • the light emitting device 1Ba of this example also includes the substrate 10, the reflective layer 11Ba having the above-described protrusion 111 (see FIG. 1), and the light emitting element 12. And a sealing material 13 and a repellent layer 14.
  • the light emitting device 1Ba of this example includes an inner sealing material 131 that seals the light emitting element 12, and an inner sealing material 131 that is formed on the reflective layer 11Ba in the inner region IN and has fluidity.
  • an annular (annular) inner repellent layer 141 having repellent properties.
  • the light emitting element 12 is provided in a region surrounded by the inner periphery of the inner repellent layer 141 and on the reflective layer 11Ba.
  • the inner sealing material 131 is described as being included in the sealing material 13 in the light emitting device 1Aa according to the first example of the first embodiment, which is excited by the light emitted from the light emitting element 12 and emits fluorescence. As well as phosphor).
  • the sealing material 13 is transparent, for example, does not include a phosphor, and seals the light emitting element 12 together with the inner sealing material 131.
  • the inner sealing material 131 seals the light emitting element 12 in a fluid state and is cured while at least a part of the outer edge thereof is positioned on the inner repellent layer 141. Thereby, since the expansion in the horizontal surface of the inner side sealing material 131 is suppressed, it becomes possible to hold
  • FIG. 6 is a cross-sectional view illustrating an example of a method for manufacturing the light-emitting device shown in FIG. Note that the cross-sectional view shown in FIG. 6 shows the same DD cross section as the cross-sectional view shown in FIG.
  • a substrate 10 is prepared.
  • the reflective layer 11Ba is formed on the substrate 10.
  • the formation method of reflection layer 11Ba it is the same as that of light-emitting device 1Aa which concerns on the 1st example of 1st Embodiment mentioned above (refer FIG.2 (b)).
  • the repellent layer 14 is formed at least on the top surface of the protrusion 111, and the annular inner repellent layer 141 is formed in the inner region IN.
  • the repellent layer 14 and the inner repellent layer 141 can be formed sequentially or simultaneously by vapor deposition, printing, transfer, or the like.
  • the light emitting element 12 is fixed in a region surrounded by the inner periphery of the inner repellent layer 141 and on the reflective layer 11Ba.
  • the fixing method of the light emitting element 12 it is the same as that of light-emitting device 1Aa which concerns on the 1st example of 1st Embodiment mentioned above (refer FIG.2 (d)).
  • the light emitting element 12 is sealed with the inner side sealing material 131.
  • FIG. At this time, in the region surrounded by the inner periphery of the inner repellent layer 141, the inner sealing material 131 having fluidity is placed, and at least a part of the outer edge of the inner sealing material 131 is on the inner repellent layer 141. It is injected until it is in a state of being located, and is cured by applying heat or light. Thereby, the inner side sealing material 131 can be fixed and hardened in arbitrary positions.
  • the inner sealing material 131 can be injected by a dispenser, printing, or the like. However, when a dispenser is used, the position of the nozzle is set so that the tip of the nozzle that discharges the inner sealing material 131 does not contact the wire or the like. Is preferably at least as high as a wire or the like.
  • a sealing material 13 having fluidity is injected into the inner region IN.
  • pouring method of the sealing material 13 it is the same as that of light-emitting device 1Aa which concerns on the 1st example of 1st Embodiment mentioned above (refer FIG.2 (e)).
  • the double dome structure is formed by the inner sealing material 131 and the sealing material 13. Therefore, it is possible to extract light from the light emitting device 1Ba more efficiently by using the outer sealing material 13 as a lens.
  • FIG. 7 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the second example of the second embodiment of the present invention.
  • 7A is a sectional view
  • FIG. 7B is a plan view
  • the section shown in FIG. 7A is an EE section shown in FIG. 7B.
  • the light emitting device 1Bb of this example shown in FIG. 7 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa to 1Ac, 1Ba described so far.
  • the light emitting device 1Bb of this example also has the substrate 10, the reflective layer 11Bb, the light emitting element 12, the sealing material 13, and the inner sealing material 131. And a repellent layer 14 and an inner repellent layer 141.
  • the structure of the reflective layer 11Bb is different from the structure of the reflective layer 11Ba of the light emitting device 1Ba according to the first example of the second embodiment.
  • the reflective layer 11Bb of the light emitting device 1Bb of this example has the above-described protrusion 112 and pedestal 113 (see FIG. 3).
  • the inner repellent layer 141 is formed on the top surface of the pedestal portion 113, and the inner sealing material 131 is also formed on the pedestal portion 113.
  • 7 illustrates the case where the inner repellent layer 141 is formed on the outer peripheral wall surface side of the pedestal 113, the inner repellent layer 141 is larger than the inner sealing material 131 to be formed.
  • the base portion 113 may be formed at an arbitrary position on the top surface.
  • the light emitted from the light emitting element 12, the internal sealing material 131, and the sealing material 13 is efficiently reflected by the projecting portion 112 and the pedestal portion 113 having a large thickness. Therefore, the light extraction efficiency of the light emitting device 1Bb can be increased.
  • the protrusion 112 may be the protrusion 111 (see FIG. 5) included in the light emitting device 1Ba according to the first example of the second embodiment. Further, in the light emitting device 1Bb of this example, the pedestal portion 113 may not be formed. Further, the light emitting device 1Bb of this example can be manufactured by applying the method for manufacturing the light emitting device 1Ba according to the first example of the second embodiment (see FIG. 6). In this case, when the protrusion 111 is formed in the method for manufacturing the light emitting device 1Ba according to the first example of the second embodiment (see FIG. 6B), the protrusion 112 and the pedestal 113 are formed by the same method. do it.
  • FIG. 8 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the third example of the second embodiment of the present invention.
  • 8A is a cross-sectional view
  • FIG. 8B is a plan view
  • the cross-section shown in FIG. 8A is the FF cross-section shown in FIG. 8B.
  • the light emitting device 1Bc of this example shown in FIG. 8 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa to 1Ac, 1Ba, 1Bb described so far.
  • the description of the light emitting devices 1Aa to 1Ac, 1Ba, and 1Bb is appropriately referred to. Detailed description is omitted.
  • the light emitting device 1Bc of this example also has the substrate 10, the reflective layer 11Bc, the light emitting element 12, and the sealing material 13.
  • the inner sealing material 131, the repellent layer 14, and the inner repellent layer 141 are provided.
  • the structure of the reflective layer 11Bc is different from the structures of the reflective layers 11Ba and 11Bb of the light emitting devices 1Ba and 1Bb according to the first example and the second example of the second embodiment.
  • the reflective layer 11Bc of the light emitting device 1Bc of this example includes the above-described protrusion 111, pedestal 113, and outer protrusion 114 (see FIG. 4). 8 illustrates the case where the outer peripheral wall surface of the outer protrusion 114 extends to the end portion of the substrate 10, but it may be an annular shape similarly to the outer peripheral wall surface of the protrusion 111.
  • the protruding outer protrusion 114 efficiently reflects the light emitted from the light emitting element 12 and the sealing material 13. Therefore, the light extraction efficiency of the light emitting device 1Bc can be increased.
  • the pedestal portion 113 may not be formed.
  • the light emitting device 1Bc of this example can be manufactured by applying the method for manufacturing the light emitting device 1Ba according to the first example of the second embodiment (see FIG. 2).
  • the method for manufacturing the light emitting device 1Ba according to the first example of the second embodiment when the protrusion 111 is formed (see FIG. 6B), the protrusion 111, the pedestal 113, and the The outer protrusion 114 may be formed.
  • FIG. 9 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the fourth example of the second embodiment of the present invention.
  • 9A is a cross-sectional view
  • FIG. 9B is a plan view
  • the cross-section shown in FIG. 9A is a GG cross-section shown in FIG. 9B.
  • the light emitting device 1Bd of this example shown in FIG. 9 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa to 1Ac and 1Ba to 1Bc described so far.
  • the description of the light emitting devices 1Aa to 1Ac and 1Ba to 1Bc is appropriately referred to. Detailed description is omitted.
  • the light emitting device 1Bd of this example also includes the substrate 10, the reflective layer 11Bd, the light emitting element 12, the sealing material 13, and the like.
  • the inner sealing material 131 and the repellent layer 14 are provided.
  • the structure of the reflective layer 11Bd is different from the structure of the reflective layers 11Ba to 11Bc of the light emitting devices 1Ba to 1Bc according to the first to third examples of the second embodiment.
  • the light emitting device 1Bd of this example does not include the inner repellent layer 141.
  • the reflective layer 11Bd of the light emitting device 1Bd of the present example has the protrusion 112 (see FIG. 3) described above. Further, the reflective layer 11Bd of the light emitting device 1Bd of the present example includes an inner protrusion 115 that protrudes in an annular shape within the inner region IN. The light emitting element 12 is provided in a region surrounded by the inner peripheral wall surface of the inner protrusion 115 and on the reflective layer 11Bd.
  • the inner sealing material 131 seals the light emitting element 12 in a fluid state and is cured while being positioned in a region surrounded by the inner peripheral wall surface of the inner protruding portion 115. Thereby, since the expansion in the horizontal surface of the inner side sealing material 131 is suppressed, it becomes possible to hold
  • the inner projecting portion 115 is used to suppress the inner sealing material 131 from spreading in the horizontal plane. Therefore, the inner sealing material 131 can be made hemispherical (or a shape close to this). Furthermore, in the light emitting device 1 ⁇ / b> Bd of this example, it is possible to avoid the sealing material 13 and the inner sealing material 131 from being cured while including the inner repellent layer 141. Therefore, it is possible to suppress the occurrence of cracks in the sealing material 13 and the inner sealing material 131.
  • the above-described protrusion 111 may be employed instead of the protrusion 112.
  • the inner repellent layer 141 may be formed on at least the top surface of the inner protrusion 115 so that at least a part of the outer edge of the inner sealing material 131 is located on the inner repellent layer 141.
  • the light emitting device 1Bd of this example can be manufactured by applying the method of manufacturing the light emitting device 1Ba according to the first example of the second embodiment (see FIG. 6). In this case, in the method for manufacturing the light emitting device 1Ba according to the first example of the second embodiment, when the protrusion 111 is formed (see FIG. 6B), the protrusion 112 and the inner protrusion 115 are formed by the same method. May be formed.
  • FIG. 10 is a cross-sectional view and a plan view showing the structure of the light emitting device according to the fifth example of the second embodiment of the present invention.
  • 10A is a cross-sectional view
  • FIG. 10B is a plan view
  • the cross section shown in FIG. 10A shows the HH cross section shown in FIG. 10B.
  • the light emitting device 1Be of this example shown in FIG. 10 shares most of the structure, effects, manufacturing method, and the like with the light emitting devices 1Aa to 1Ac and 1Ba to 1Bd described so far.
  • the description of the light emitting devices 1Aa to 1Ac and 1Ba to 1Bd is referred to as appropriate. Detailed description is omitted.
  • the light emitting device 1Be of this example is similar to the light emitting devices 1Ba to 1Bd according to the first to fourth examples of the second embodiment, and the substrate 10, the reflective layer 11Be, the light emitting element 12, the sealing material 13, and the like.
  • the inner sealing material 131 and the repellent layer 14 are provided.
  • the structure of the reflective layer 11Bd is different from the structure of the reflective layers 11Ba to 11Bd of the light emitting devices 1Ba to 1Bd according to the first to fourth examples of the second embodiment.
  • the light emitting device 1Be of this example does not include the inner repellent layer 141.
  • the reflective layer 11Be of the light emitting device 1Be of the present example includes the above-described protrusion 111 and the outer protrusion 114 (see FIG. 4), and the above-described inner protrusion 115 (see FIG. 9).
  • 10 illustrates the case where the outer peripheral wall surface of the outer protrusion 114 extends to the end portion of the substrate 10, but it may be an annular shape like the outer peripheral wall surface of the protrusion 111.
  • the protruding outer protruding portion 114 efficiently reflects the light emitted from the light emitting element 12 and the sealing material 13. Therefore, the light extraction efficiency of the light emitting device 1Be can be increased.
  • FIG. 11 is a cross-sectional view and a plan view showing a structure of a modification of the light emitting device according to the embodiment of the present invention.
  • 11A is a cross-sectional view
  • FIG. 11B is a plan view
  • the cross section shown in FIG. 11A shows the II cross section shown in FIG. 11B.
  • the sealing material 13C included in the light emitting device 1C has a rectangular shape with rounded corners when viewed from above. Even if the sealing material 13C has such a shape, the light extraction efficiency can be increased as compared with the flat shape.
  • the sealing material 13C having such a shape can be easily manufactured by making the shape of the protrusion 111C in a top view into a rectangular shape having an annular shape and rounded four corners.
  • FIG. 12 is a cross-sectional view and a plan view showing the structure of a modification of the light emitting device according to the embodiment of the present invention. 12A is a cross-sectional view, FIG. 12B is a plan view, and the cross-section shown in FIG. 12A is a JJ cross-section shown in FIG. 12B.
  • the repellent layer 14D included in the light emitting device 1D is formed not only on the top surface of the protruding portion 111 but also on the outer peripheral wall surface of the protruding portion 111.
  • the repellent layer 14D may be formed not only on the outer peripheral wall surface of the protruding portion 111 but also on the inner peripheral wall surface.
  • the repellent layer 14D When the repellent layer 14D is formed in this way, even if at least a part of the outer edge of the sealing material 13D exceeds the repellent layer 14D formed on the top surface of the protrusion 111, it is formed on the outer peripheral wall surface. The repellency layer 14D thus stays. Therefore, the expansion of the sealing material 13D in the horizontal plane is effectively suppressed, and the sealing material 13D can be made hemispherical (or a shape close to this).
  • the reflective layers 11Aa to 11Ac, 11Ba to 11Be, 11C, and 11D are formed on the substrate 10 having a flat surface.
  • You may form the reflection layer which has an inner side protrusion part, a base part, etc.
  • the recess may be formed by performing etching, counterbore, or the like on the substrate except for a portion where the protruding portion, the outer protruding portion, the inner protruding portion, and the pedestal portion are to be formed.
  • the protrusion may be formed by providing a dam agent on a portion on the substrate where the protrusion, the outer protrusion, and the inner protrusion are to be formed.
  • one light emitting device 1Aa to 1Ac, 1Ba to 1Be, 1C, and 1D may include a plurality of light emitting elements.
  • the protrusions 111 and 112, the inner protrusion 115, the repellent layer 14, the inner repellent layer 141, and the like are formed as described above in accordance with the position where the sealant 13 and the inner sealant 131 are formed. do it.
  • the color (wavelength) of light emitted from the plurality of light emitting elements 12 may be the same or different.
  • one sealing material 13 and the inner sealing material 131 may have a structure for sealing one light emitting element, or may have a structure for sealing a plurality of light emitting elements together.
  • the sealing material 13 includes a phosphor
  • the sealing material 13 may not include the phosphor.
  • the case where the inner sealing material 131 has a phosphor is illustrated in the light emitting devices 1Ba to 1Be according to the respective examples of the second embodiment.
  • the sealing material 13 replaces the phosphor.
  • Both the sealing material 13 and the inner sealing material 131 may have phosphors (for example, phosphors having different colors (wavelengths) of emitted fluorescence).
  • a water-repellent material as the material constituting the repellent layer 14 or the inner repellent layer 141. If it is a water-repellent material, suitable repellency can be exhibited also with respect to resin materials, such as an epoxy and silicone which can comprise the sealing material 13 and the inner side sealing material 131. FIG.
  • the illustrated light emitting devices 1Aa to 1Ac, 1Ba to 1Be, 1C, and 1D can be implemented by combining a part or all of them as appropriate as long as there is no contradiction.
  • the light emitting devices 1Aa to 1Ac, 1Ba to 1Be, 1C, and 1D can be implemented with various modifications.
  • the light emitting device and the manufacturing method thereof according to the present invention can be suitably used for a light emitting device mounted on a lighting device or the like.
  • 1Aa to 1Ac, 1Ba to 1Be, 1C, 1D Light emitting device 10: Substrate 11Aa to 11Ac, 11Ba to 11Be, 11C, 11D: Reflective layer 111, 112: Protruding part 113: Base part 114: Outer projecting part 115: Inward projecting part Part 12: Light emitting element 13, 13C, 13D: Sealing material 131: Inner sealing material 14, 14C, 14D: Repellent layer 141: Inner repellent layer IN: Inner region OUT: Outer region

Landscapes

  • Led Device Packages (AREA)

Abstract

L'invention concerne un dispositif électroluminescent présentant un risque réduit de pelage et d'autres problèmes et pouvant facilement être produit. L'invention concerne en outre un procédé de fabrication du dispositif électroluminescent. Un dispositif électroluminescent (1Aa) comprend : un substrat (10) ; une couche réfléchissante (11Aa) formée sur le substrat (10) et présentant une saillie (111) de forme annulaire ; un élément électroluminescent (12) placé sur la couche réfléchissante (11Aa) dans une région intérieure (IN) entourée par la paroi périphérique intérieure de la saillie (111) ; un matériau de scellement (13) destiné à sceller l'élément électroluminescent (12) ; et une couche répulsive (14) offrant des propriétés de répulsion pour le matériau de scellement (13) lorsque celui-ci est dans un état fluide, la couche répulsive étant formée au moins sur la surface supérieure de la saillie (111). Au moins une partie du bord extérieur du matériau de scellement (13) est placée sur la couche répulsive (14).
PCT/JP2012/058860 2011-07-28 2012-04-02 Dispositif électroluminescent et procédé de fabrication d'un dispositif électroluminescent WO2013014979A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011164916A JP2013030572A (ja) 2011-07-28 2011-07-28 発光装置及び発光装置の製造方法
JP2011-164916 2011-07-28

Publications (1)

Publication Number Publication Date
WO2013014979A1 true WO2013014979A1 (fr) 2013-01-31

Family

ID=47600839

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/058860 WO2013014979A1 (fr) 2011-07-28 2012-04-02 Dispositif électroluminescent et procédé de fabrication d'un dispositif électroluminescent

Country Status (2)

Country Link
JP (1) JP2013030572A (fr)
WO (1) WO2013014979A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2800153A1 (fr) * 2013-04-30 2014-11-05 Tridonic Jennersdorf GmbH Module à DEL doté d'une surface fortement réfléchissante
WO2018134068A1 (fr) * 2017-01-17 2018-07-26 Osram Opto Semiconductors Gmbh Dispositif d'affichage

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150001268A (ko) * 2013-06-27 2015-01-06 엘지이노텍 주식회사 발광 소자 패키지
JP6402890B2 (ja) * 2014-03-06 2018-10-10 日亜化学工業株式会社 発光装置およびその製造方法
TWI667517B (zh) * 2014-09-30 2019-08-01 美商康寧公司 包含凸面色彩轉換元件的裝置
JP2016100385A (ja) * 2014-11-19 2016-05-30 パイオニア株式会社 光半導体デバイスおよび光半導体デバイスの製造方法
CN107690714B (zh) * 2015-08-24 2020-03-27 京瓷株式会社 发光元件搭载用基板、发光装置以及发光模块
JP2019087763A (ja) * 2019-03-01 2019-06-06 パイオニア株式会社 光半導体デバイスおよび光半導体デバイスの製造方法
JP7505395B2 (ja) * 2020-12-21 2024-06-25 豊田合成株式会社 発光装置とその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000315823A (ja) * 1999-04-30 2000-11-14 Runaraito Kk 発光ダイオードおよびその製造方法
JP2007243226A (ja) * 2007-06-20 2007-09-20 Sony Corp 光源装置、表示装置
JP2009503888A (ja) * 2005-08-04 2009-01-29 クリー インコーポレイテッド 調合された封止剤を用いた半導体発光デバイス用パッケージとそれをパッケージする方法
JP2010114218A (ja) * 2008-11-05 2010-05-20 Toshiba Corp 発光デバイス

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10144963A (ja) * 1996-11-05 1998-05-29 Sanyo Electric Co Ltd Ｌｅｄ光源及びその製造方法
JP2001196644A (ja) * 2000-01-11 2001-07-19 Nichia Chem Ind Ltd 光半導体装置及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000315823A (ja) * 1999-04-30 2000-11-14 Runaraito Kk 発光ダイオードおよびその製造方法
JP2009503888A (ja) * 2005-08-04 2009-01-29 クリー インコーポレイテッド 調合された封止剤を用いた半導体発光デバイス用パッケージとそれをパッケージする方法
JP2007243226A (ja) * 2007-06-20 2007-09-20 Sony Corp 光源装置、表示装置
JP2010114218A (ja) * 2008-11-05 2010-05-20 Toshiba Corp 発光デバイス

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2800153A1 (fr) * 2013-04-30 2014-11-05 Tridonic Jennersdorf GmbH Module à DEL doté d'une surface fortement réfléchissante
WO2018134068A1 (fr) * 2017-01-17 2018-07-26 Osram Opto Semiconductors Gmbh Dispositif d'affichage
US10770442B2 (en) 2017-01-17 2020-09-08 Osram Oled Gmbh Display device

Also Published As

Publication number Publication date
JP2013030572A (ja) 2013-02-07

Similar Documents

Publication Publication Date Title
WO2013014979A1 (fr) Dispositif électroluminescent et procédé de fabrication d'un dispositif électroluminescent
US10651350B2 (en) Method of manufacturing light emitting device with light-transmissive members
CN107039410B (zh) 发光装置的制造方法
CN111490146B (zh) 发光装置
JP5158472B2 (ja) 半導体発光装置
US9576941B2 (en) Light-emitting device and method of manufacturing the same
JP5736203B2 (ja) 発光装置
JP6217711B2 (ja) 発光装置の製造方法
JP5092866B2 (ja) ディスプレイユニット及びその製造方法
JP5084324B2 (ja) 発光装置および照明装置
EP2515353A2 (fr) Diode électroluminescente emballée et dispositif d'éclairage doté de celle-ci
JP2013110199A (ja) Ｌｅｄ発光装置
CN114188460A (zh) 发光装置
JP6005953B2 (ja) 発光装置
JP7235944B2 (ja) 発光装置及び発光装置の製造方法
KR20090002835A (ko) 질화물계 발광 소자 및 그 제조방법
CN102290500A (zh) 发光装置及其制造方法
JP2013191872A (ja) 発光素子パッケージ
JP5698808B2 (ja) 半導体発光装置
JP7492151B2 (ja) 発光モジュール
JP2008103480A (ja) 発光装置
JP2008130777A (ja) 半導体発光装置
JP2006261688A (ja) 発光装置
JP2015037170A (ja) Ｌｅｄ発光装置
JP2006202962A (ja) 発光装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12818127

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12818127

Country of ref document: EP

Kind code of ref document: A1