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WO2013108367A1 - Appareil de montage de composants électroniques et procédé de montage de composants électroniques - Google Patents

Appareil de montage de composants électroniques et procédé de montage de composants électroniques Download PDF

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Publication number
WO2013108367A1
WO2013108367A1 PCT/JP2012/050848 JP2012050848W WO2013108367A1 WO 2013108367 A1 WO2013108367 A1 WO 2013108367A1 JP 2012050848 W JP2012050848 W JP 2012050848W WO 2013108367 A1 WO2013108367 A1 WO 2013108367A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
mounting
rank
information
ratio
Prior art date
Application number
PCT/JP2012/050848
Other languages
English (en)
Japanese (ja)
Inventor
望月　学
義昭 坂田
寿治 清水
長谷川　弘和
貢司 渡部
誠寿郎 須永
一成 荘
浩之 小坂
昭一 藤森
浩義 廣田
Original Assignee
パイオニア株式会社
株式会社パイオニアＦａ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社, 株式会社パイオニアＦａ filed Critical パイオニア株式会社
Priority to CN201280041983.2A priority Critical patent/CN103766016B/zh
Priority to JP2013554118A priority patent/JP5789680B2/ja
Priority to PCT/JP2012/050848 priority patent/WO2013108367A1/fr
Publication of WO2013108367A1 publication Critical patent/WO2013108367A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Definitions

  • the present invention relates to an electronic component mounting apparatus and an electronic component mounting method for picking up an electronic component such as a chip and transferring and mounting the electronic component.
  • an electronic component transfer device a device that picks up electronic components divided by dicing and arranged in a wafer shape and arranges them at a transfer destination for each rank is known.
  • the electronic components are picked up from the upper side by the suction nozzle connected to the vacuum pump and picked up one by one by the operation of pushing up from the lower side and transferred.
  • the electronic component transfer device is arranged only in the same rank in a certain space so that it can be easily used for mounting on a substrate in a subsequent process.
  • Patent Document 1 discloses a configuration in which a plurality of suction nozzles arranged in a row are used to suck semiconductor products (electronic parts) in a row and transfer them to a transfer destination.
  • adsorbing a semiconductor product an appropriate rank of the semiconductor product is pushed up from the lower side by a push-up pin, thereby assisting pickup and ranking the semiconductor products to be picked up.
  • Patent Document 2 describes a configuration in which only chips belonging to the same rank are die-bonded based on chip characteristic data and position data when die-bonding a wafer-like chip (electronic component).
  • the conventional electronic component transfer device has a configuration in which the same rank is transferred and arranged so that die bonding can be easily performed in a subsequent mounting process. Further, although there is a configuration in which a wafer-like chip is directly die-bonded from the wafer, only a chip belonging to the same rank is die-bonded.
  • the present invention has been made in view of the above problems, and an example of the purpose thereof is to efficiently use the manufactured wafer-like electronic component and suppress variation while maintaining a certain quality required in the final product. It is an object to provide an electronic component mounting apparatus and an electronic component mounting method capable of performing the above.
  • an electronic component mounting apparatus includes an electronic component holding table that holds a wafer sheet in which a plurality of electronic components having different ranks are arranged in a wafer shape, and the electronic component holding table.
  • An electronic component information storage unit for storing electronic component information including position information of the electronic component on the wafer sheet and rank information of the electronic component, and one or a plurality of the electronic components are extracted from the wafer sheet and transferred to the substrate
  • An electronic component transfer mounting unit to be mounted a mounting substrate information storage unit for storing mounting substrate information including a mounting position and a required number on the substrate, and each electronic component on the wafer sheet based on the electronic component information While obtaining the electronic component rank ratio of the rank, based on the electronic component rank ratio and the mounting board information,
  • a mounting substrate ratio determining unit that determines a mounting ratio of each rank on the board, and the electronic component based on the mounting ratio and the electronic component information in a state where a plurality of ranks are mixed in a predetermined position on the substrate.
  • the electronic component mounting method of the present invention includes a wafer sheet holding step of holding a wafer sheet in which a plurality of electronic components having different ranks are arranged in a wafer shape on an electronic component holding table;
  • the electronic component rank ratio of each rank in the electronic component on the wafer sheet is determined based on the electronic component information, and the mounting ratio of each rank on the substrate is determined based on the electronic component rank ratio and the mounting substrate information.
  • Mounting board ratio determination process to determine; Based on the mounting ratio and the electronic component information, the electronic component on the wafer sheet is taken out one or more at a time, and is controlled to be transported and mounted to a predetermined position on the substrate in a state where a plurality of ranks are mixed. And a control process.
  • FIG. 1 is a block diagram illustrating a configuration of an electronic component mounting apparatus and an electronic component mounting method according to the present embodiment.
  • FIG. 1 A configuration of an electronic component mounting apparatus 1 which is an embodiment of the electronic component mounting apparatus of the present invention will be described with reference to FIG.
  • the left and right direction is the X direction
  • the direction from the near side to the back side is the Y direction
  • the up and down direction is the Z direction
  • the angle on the XY plane is ⁇ , Do.
  • the electronic component mounting apparatus 1 includes a pickup unit 10, a mounting unit 20, a transfer head 30 that is an electronic component transfer mounting unit, a control unit 40, an electronic component information storage unit 41, and mounting board information storage. A part 42, a mounting substrate ratio determining unit 43, and an area determining unit 44 are provided.
  • the pickup unit 10 and the mounting unit 20 are arranged to be separated from each other in the X direction.
  • the electronic component transfer mounting section is composed of a transfer head provided with a suction nozzle and a head actuator that operates the transfer head.
  • the pickup unit 10 is a unit that picks up the electronic component 100 from the wafer sheet 200 on which the electronic component 100 is arranged in the electronic component mounting apparatus 1.
  • the pickup unit 10 includes an electronic component holding table 11, an electronic component holding table actuator 12, a pickup hammer 13, an upper disk cam 14, a pickup motor 15, a push-up needle 16, a lower disk cam 17, a push-up motor 18 and a camera 19. Configured.
  • one pickup position Pu for picking up the electronic component 100 arranged on the wafer sheet 200 by the transfer head 30 is set.
  • the pickup position Pu indicates a predetermined position in the X direction and the Y direction in the pickup unit 10.
  • the electronic component holding table 11 is a member having a flat surface capable of holding the wafer sheet 200 on which the electronic component 100 is arranged.
  • the electronic component holding table 11 holds the peripheral portion of the wafer sheet 200 and extends the stretchable adhesive sheet, thereby separating the electronic components 100 arranged on the wafer sheet 200 from each other by a predetermined distance.
  • the electronic component holding table actuator 12 moves the electronic component holding table 11 in the plane where the electronic component 100 is arranged (in other words, in the XY plane), and rotates the electronic component holding table 11 in the ⁇ direction within this plane. It consists of an actuator to be The electronic component holding table actuator 12 moves the electronic component holding table 11 in accordance with a control signal supplied from the control unit 40, thereby moving the desired electronic component 100 arranged on the wafer sheet 200 to the pickup position Pu. Set.
  • the pickup hammer 13 has a bearing-like end portion disposed above the wafer sheet 200 at the pickup position Pu.
  • the bearing-like end of the pickup hammer 13 is connected to the upper disc cam 14 via an arm.
  • the upper disk cam 14 is a disk-shaped cam that can rotate according to the rotation of the pickup motor 15.
  • the pickup motor 15 rotates according to a control signal supplied from the control unit 40 and rotates the upper disk cam 14.
  • the pick-up hammer 13 reciprocates in the Z direction when the arm moves in accordance with the rotation of the upper disc cam 14 and the bearing-shaped end portion reciprocates in the Z direction.
  • the push-up needle 16 has a needle-like configuration disposed below the wafer sheet 200 at the pickup position Pu.
  • the push-up needle 16 is connected to the lower disk cam 17 via an arm, and moves in the Z direction as the lower disk cam 17 rotates.
  • the push-up needle 16 moves upward in the Z direction by the rotation of the lower disc cam 17, the upper end of the push-up needle 16 contacts the wafer sheet 200.
  • the push-up needle 16 penetrates the wafer sheet 200 at the upper end of the movement range, contacts the electronic component 100, and pushes up the electronic component 100.
  • the push-up needle 16 is arranged in such a manner that the needle-shaped upper end can push up the electronic component 100 arranged at the pickup position Pu.
  • the push-up motor 18 rotates the lower disk cam 17 in accordance with a control signal supplied from the control unit 40.
  • the camera 19 is configured and arranged so that the electronic component 100 arranged at the pickup position Pu on the wafer sheet 200 and the electronic component 100 arranged around the electronic component 100 can be accommodated in the imaging range. An image of the electronic component 100 captured by the camera 19 is transmitted to the control unit 40.
  • the mounting unit 20 is a unit that mounts the electronic component 100 sucked by the suction nozzle 31 on the mounting substrate 300 in the pickup unit 10.
  • the mounting unit 20 includes a mounting substrate holding table 21, a mounting substrate holding table actuator 22, a mounting hammer 23, and a circle.
  • a plate cam 24, a mounting motor 25, and a camera 26 are provided.
  • one mounting position Pl for mounting the electronic component 100 sucked by the suction nozzle 31 on the mounting substrate 300 is set.
  • the mounting position Pl indicates a predetermined position in the X direction and the Y direction in the mounting unit 20.
  • the mounting position Pl is set at a position that is separated from the pickup position Pu by a predetermined distance in the X direction.
  • the mounting board holding base 21 is a member having a flat surface capable of holding the mounting board 300 on which the electronic component 100 is mounted.
  • the mounting substrate 300 is a substrate such as a ceramic substrate, a glass substrate, or a printed substrate.
  • the mounting board holding table actuator 22 is an actuator having a movable axis that can move the mounting board holding table 21 in a surface direction (in other words, X direction, Y direction, and ⁇ direction) on which the electronic component 100 is mounted.
  • a plurality of electronic components 100 sucked by the suction nozzle 31 of the transfer head 30 are mounted on the mounting board 300 held on the mounting board holding table 21 with a predetermined margin.
  • a position where each electronic component 100 on the mounting substrate 300 is to be mounted will be referred to as an electronic component mounting position.
  • the electronic component mounting positions are set, for example, in a matrix shape having a plurality of columns and rows on the mounting substrate 300.
  • the mounting hammer 23 has a bearing-like end connected to an arm, and is connected to the disc cam 24 via the arm.
  • the disc cam 24 is configured to be rotatable according to the driving of the mounting motor 25.
  • the arm moves so that the bearing-like end of the mounting hammer 23 reciprocates in the Z direction.
  • the mounting motor 25 rotates the disc cam 24 according to a control signal supplied from the control unit 40.
  • the camera 26 is configured and disposed so that the electronic component 100 mounted at the mounting position Pl on the mounting substrate 300 and the periphery thereof can be accommodated in the imaging range. An image of the mounting substrate 300 captured by the camera 26 is transmitted to the control unit 40.
  • the transfer head 30 holds a plurality of cylindrical suction nozzles 31 and moves between the pickup unit 10 and the mounting unit 20 under the operation of the head actuator 32 to perform the pickup operation and the mounting operation of the electronic component 100. .
  • the transfer head 30 is disposed above the electronic component holding table 11 of the pickup unit 10 and the mounting board base 21 of the mounting unit 20 in the Z direction.
  • the suction nozzle 31 is connected to a decompression device (not shown) such as a vacuum pump via an intake passage (not shown) provided in the transfer head 30, and a control signal supplied from the control unit 40. Accordingly, the electronic component 100 in contact with the electronic component 100 is sucked and released.
  • a decompression device such as a vacuum pump
  • an intake passage not shown
  • a control signal supplied from the control unit 40 Accordingly, the electronic component 100 in contact with the electronic component 100 is sucked and released.
  • the head actuator 32 is a uniaxial actuator that can move the transfer head 30 in the X direction in accordance with a control signal supplied from the control unit 40.
  • the head actuator 32 moves the transfer head 30 between the pickup unit 10 and the mounting unit 20 along a straight line connecting the pickup position Pu and the mounting position Pl as indicated by an arrow in FIG.
  • the transfer head 30 is a spring that holds the lower end of the suction nozzle 31 so as to be separated from the upper end of the electronic component 100 by a predetermined distance in the Z direction, and further biases the suction nozzle 31 upward in the Z direction so that the suction nozzle 31 is stably fixed at the holding position. It has a mechanism.
  • a control unit 40 that sends control signals to the mounting substrate holding table actuator 22, the electronic component holding table actuator 12, and the head actuator 32 and controls them is connected to the electronic component information storage unit 41 and the mounting substrate information storage unit 42. .
  • the electronic component information storage unit 41 acquires and stores electronic component information including position information and rank information of the electronic component 100 on the wafer sheet 200 from a previous process or a probe inspection machine.
  • This electronic component information is acquired by a method such as via a server via a LAN or a method such as an electronic storage medium such as a CD or a memory.
  • the position information includes an index on the wafer sheet 200, and the rank information includes information such as a light amount, a wavelength, a resistance value, a processing speed, a high voltage resistance, and a current amplification factor.
  • the rank information may be divided into predetermined ranks based on information such as the light amount, wavelength, resistance value, processing speed, high voltage resistance, and current amplification factor.
  • the mounting board information storage unit 42 stores mounting board information of the electronic component 100 in the mounting board 300 arranged on the mounting board holding base 21.
  • the mounting board information includes at least information on the mounting position of each electronic component in the mounting board and the required number of electronic components mounted on the mounting board.
  • the control unit 40 obtains the electronic component rank ratio of each rank in the electronic component 100 on the wafer sheet 200 based on the electronic component information, and each rank in the mounting substrate 300 based on the electronic component rank ratio and the mounting substrate information.
  • the mounting board ratio determining unit 43 for determining the mounting ratio of the electronic component 100 and the area determining unit 44 for determining the area in which the electronic components 100 of each rank are mounted in the mounting board 300 are provided.
  • FIG. 2 is a diagram showing the positional relationship and operation direction of each part of the electronic component mounting apparatus.
  • FIG. 2 shows the arrangement and operation directions of the electronic component holding table 11 of the pickup unit 10, the mounting board holding table 21 of the mounting unit 20, and the transfer head 30 when the electronic component mounting apparatus 1 of FIG. 1 is viewed from above in the Z direction.
  • FIG. 2 shows the arrangement and operation directions of the electronic component holding table 11 of the pickup unit 10, the mounting board holding table 21 of the mounting unit 20, and the transfer head 30 when the electronic component mounting apparatus 1 of FIG. 1 is viewed from above in the Z direction.
  • the transfer head 30 has a plurality of suction nozzles 31 separated from each other by a predetermined margin on a straight line connecting the pickup position Pu of the pickup unit 10 and the mounting position Pl of the mounting unit 20. Hold in a row.
  • the transfer head 30 when the transfer head 30 is moved in the X direction by the operation of the head actuator 32, the suction nozzles 31 held by the transfer head 30 are transferred to the pickup position Pu one by one.
  • the transfer head 30 is moved in the X direction by the operation of the head actuator 32, so that the suction nozzles 31 held by the transfer head 30 are transferred to the mounting position Pl one by one. Is done.
  • the control unit 40 is a control CPU that controls the operation of each unit of the pickup unit 10, the mounting unit 20, and the transfer head 30.
  • the control unit 40 is connected to each related unit and controls the operation by supplying a control signal. Do.
  • the control unit 40 sets a position coordinate for each electronic component 100 by analyzing an image of the electronic component 100 on the wafer sheet 200 transmitted from the camera 19, for example.
  • the control unit 40 adjusts the position of the electronic component holding table 11 so that the electronic component 100 comes to the pickup position Pu by operating the electronic component holding table actuator 12 according to the position coordinates of the desired electronic component 100.
  • control unit 40 sets the position coordinates on the mounting board 300 and operates the mounting board holding base actuator 22 so that the mounting position of the electronic component comes to the mounting position Pl with the desired coordinates as the electronic component mounting position.
  • the position of the mounting board holder 21 is adjusted.
  • control unit 40 performs quality inspection, position information acquisition, and the like of the electronic component 100 arranged on the mounting substrate 300 based on the image analysis result transmitted from the camera 26.
  • control unit 40 refers to images captured by the camera 19 and the camera 26, and when the electronic component 100 is arranged shifted in the ⁇ direction on the XY plane, the electronic component holding table actuator 13 and the mounting substrate A control signal is transmitted to the holding table actuator 22, and the electronic component holding table 11 and the mounting board holding table 21 are each moved in the ⁇ direction to perform correction. Thereby, the pick-up and mounting of an electronic component are performed more reliably.
  • the control unit 40 controls the above operation according to the results determined by the mounting substrate ratio determining unit 43 and the area determining unit 44 according to the information from the electronic component information storing unit 41 and the mounting substrate information storing unit 42.
  • the mounting ratio is calculated by the in-mounting board ratio determining unit 43 from the rank information in the electronic component information storing unit 41 and the number necessary for the mounting board 300 in the mounting board information storing unit 42, and based on this mounting ratio.
  • the electronic component 100 having a specified rank on the wafer sheet 200 is mounted on a specified location (area) in the mounting substrate 300, whereby the electronic component 100 is efficiently mounted.
  • FIG. 3 is a diagram showing an aspect of picking up an electronic component by the electronic component mounting apparatus.
  • the electronic component holding table actuator 12 moves the electronic component holding table 11, and moves the desired electronic component 100 to the pickup position Pu (on the axis indicated by the one-dot broken line).
  • the head actuator 32 moves the transfer head 30 and moves the desired suction nozzle 31 to the pickup position Pu (state 1).
  • the positions in the Z direction of the pickup hammer 13, the push-up needle and the suction nozzle 31 in this state are the initial positions in the Z direction.
  • the pickup motor 15 rotates the upper disk cam 14 and moves the pickup hammer 13 downward.
  • the pickup hammer 13 contacts the upper end of the suction nozzle 31 and then pushes down the suction nozzle 31 against the biasing force of the spring mechanism that biases the suction nozzle 31 upward.
  • the suction nozzle 31 pushed down contacts the electronic component 100 at the position where the pickup hammer 13 reaches the lower end of the moving range, and the controller 40 operates the suction of the suction nozzle 31 in order to suck the electronic component 100 in advance.
  • the electronic component 100 is adsorbed.
  • the push-up motor 18 rotates the lower disk cam 17 and moves the push-up needle 16 toward the electronic component 100 (state 2).
  • the pickup motor 15 rotates the upper disk cam 14 and moves the pickup hammer 13 upward to release the suction nozzle 31 from being pushed down.
  • the suction nozzle 31 released from being pushed down moves upward while the electronic component 100 is sucked by the biasing force of the spring mechanism.
  • the upper end of the push-up needle 16 penetrates the wafer sheet 200 and pushes the electronic component 100 upward, and the lower end of the electronic component 100 is moved in the direction of peeling from the wafer sheet 200 (state 3).
  • the pick-up hammer 13 and the push-up needle 16 return to their initial positions, and the suction nozzle 31 that sucks the electronic component 100 to the lower end also returns to the initial position in the Z direction. Thereafter, the electronic component holding table actuator 12 moves the electronic component holding table 11 so that the next electronic component 100 comes to the next pickup position Pu. At the same time or before and after, the head actuator 32 moves the transfer head 30 and moves the next suction nozzle 31 to the pickup position Pu (state 4).
  • the electronic component 100 is sucked by the suction nozzle 31 of the transfer head 30 by the operation described above. By repeating the above-described operation a plurality of times, the electronic component 100 is attracted to each of the plurality of suction nozzles 31 held by the transfer head 30.
  • the mounting operation in the mounting unit 20 is performed in the same procedure. A specific procedure will be described below.
  • the mounting board holding base actuator 22 moves the mounting board holding base 21 to move a desired electronic component mounting position on the mounting board 300 to the mounting position Pl.
  • the head actuator 32 moves the transfer head 30 and moves the suction nozzle 31 that sucks the electronic component 100 to the mounting position Pl.
  • the mounting hammer 23 is in an initial position in the Z direction.
  • the mounting motor 25 rotates the disc cam 24 and moves the mounting hammer 23 downward.
  • the mounting hammer 23 contacts the upper end of the suction nozzle 31 and then pushes down the suction nozzle 31 against the biasing force of the spring mechanism that biases the suction nozzle 31 upward.
  • the electronic component 100 sucked by the sucked suction nozzle 31 comes into contact with the mounting board 300 at a position where the mounting hammer 23 reaches the lower end of the moving range.
  • the electronic component 100 is arranged at the electronic component mounting position on the mounting substrate 300 by the controller 40 releasing the suction of the suction nozzle 31 that sucks the electronic component 100. Since the mounting substrate 300 has adhesiveness, the electronic component 100 adheres to the mounting substrate 300 at the electronic component mounting position.
  • the mounting motor 25 rotates the disc cam 24 and moves the mounting hammer 23 upward to release the suction nozzle 31 from being pushed down.
  • the suction nozzle 31 released from being pushed down is moved upward in a state where the electronic component 100 is not sucked by the biasing force of the spring mechanism.
  • the mounting board holding base actuator 22 moves the mounting board holding base 21 and the mounting position Pl Move the next mounting position.
  • the head actuator 32 moves the transfer head 30 and moves the suction nozzle 31 that sucks the next electronic component 100 to the mounting position Pl.
  • the electronic component 100 transferred by the transfer head 30 is mounted on the mounting substrate 300 by the operation described above.
  • the electronic components 100 respectively sucked by the plurality of suction nozzles 31 provided in the transfer head 30 are mounted on the mounting substrate 300.
  • FIG. 4 is a flowchart showing an operation flow of the electronic component mounting apparatus and the electronic component mounting method of the present embodiment. Next, the operation of the electronic component mounting apparatus 1 will be described with reference to FIG. 4 which is a flowchart showing the overall operation flow including the pickup operation and the mounting operation by the electronic component mounting apparatus 1.
  • the wafer sheet 200 holding the electronic component 100 is placed on the electronic component holding table 11 of the pickup unit 10 at the start of a series of operations (step S1).
  • a plurality of electronic components 100 having different ranks are arranged in a wafer shape.
  • the mounting substrate 300 on which the electronic component 100 is mounted is placed on the mounting substrate holding base 21 of the mounting unit 20 (step S2).
  • control unit 40 generates and transmits a control signal for controlling each actuator (step S3).
  • the electronic component holding table actuator 12, the pickup motor 15, the mounting board holding base actuator 22, the head actuator 32, and the like are controlled to control the pickup and mounting of the electronic component 100. Control signal generation / transmission will be described later.
  • control unit 40 moves the transfer head 30 to the pickup unit 10 (step S4) and executes a pickup operation (step S5).
  • the electronic component 100 arranged on the wafer sheet 200 is sucked by each of the plurality of suction nozzles 31 of the transfer head 30 by such a pickup operation.
  • the pickup operation will be described later.
  • control unit 40 moves the transfer head 30 to the mounting unit 20 (step S6), and executes a mounting operation (step S7).
  • the electronic component 100 sucked by each of the plurality of suction nozzles 31 in the transfer head 30 is mounted on the mounting substrate 300.
  • the mounting operation will be described later.
  • the controller 40 repeats a series of operations from step S4 to step S7 until all the electronic components 100 to be moved on the wafer sheet 200 are mounted on the mounting substrate 300 (step S8: Yes), End the operation.
  • FIG. 5 is a flowchart showing a flow of control signal generation / transmission in the control unit 40.
  • a flow of control signal generation / transmission (step 3 in FIG. 4) by the control unit 40 of the electronic component mounting apparatus 1 will be described with reference to the flowchart in FIG.
  • the control unit 40 acquires electronic component information (including rank information and position information) from the electronic component information storage unit 41. At the same time or before and after, the control unit 40 acquires images of all the electronic components 100 arranged on the wafer sheet 200 taken by the camera 19 of the pickup unit 10. Based on the acquired image information, the control unit 40 collates the index on the wafer sheet 200 with the index included in the electronic component information (including rank information and position information) acquired from the electronic component information storage unit 41. .
  • the control unit 40 sets the coordinates for each electronic component 100 based on the position information of the electronic component information (including rank information and position information) with matching, and the image information captured by the camera 19, and is generated. Link with location information. Thereby, the control unit 40 can recognize the position and rank of the electronic component 100 arranged on the wafer sheet 200.
  • the electronic component information storage unit 41 acquires and stores electronic component information from the storage unit of the probe inspection apparatus in the previous process or the storage unit on the server (step S10).
  • control unit 40 calculates the electronic component rank ratio of the electronic component 100 on the wafer sheet 200 from the acquired electronic component information (step S11).
  • control unit 40 acquires the mounting board information including the required number of electronic components on the mounting board and the mounting position from the mounting board information storage unit 42.
  • the mounting board information storage unit 42 stores mounting board information including the number of necessary electronic components on the mounting board and the mounting position (step S12).
  • the mounting board ratio determination unit 43 of the control unit 40 calculates the mounting ratio from the electronic component rank ratio and the mounting board information (step S13).
  • the mounting ratio is a ratio of ranks of electronic components mounted on the mounting board.
  • the area determination unit 44 of the control unit 40 determines the area where the electronic component 100 of each rank is mounted from the mounting ratio and the mounting board information (step S14).
  • the control unit 40 generates and transmits a control signal according to the mounting ratio and the area (step S15).
  • An area is an area where electronic components are mounted on a mounting board.
  • a wafer sheet holding step of holding a wafer sheet on which a plurality of electronic components having different ranks are arranged in a wafer shape on the electronic component holding table corresponds to step S1.
  • the electronic component information storage step of storing electronic component information including electronic component position information and electronic component rank information on the wafer sheet in the electronic component holding table in the electronic component information storage unit corresponds to step S10.
  • the mounting board information storing step of storing the mounting board information including the mounting position on the board and the required number in the mounting board information storage unit corresponds to step S12.
  • the electronic component rank ratio of each rank in the electronic component on the wafer sheet is determined based on the electronic component information
  • the mounting ratio of each rank in the substrate is determined based on the electronic component rank ratio and the mounting substrate information.
  • the ratio determination process corresponds to steps S11 and S13.
  • step S4-7 Based on the mounting ratio and the electronic component information, one or more of the electronic components on the wafer sheet are taken out, and the control process is controlled to transfer and mount to a predetermined position on the substrate in a state where a plurality of ranks are mixed. This corresponds to step S4-7.
  • FIG. 6 is a flowchart showing the flow of the pickup operation of the present embodiment. Next, the pickup operation (step 5 in FIG. 4) of the electronic component 100 by the pickup unit 10 of the electronic component mounting apparatus 1 will be described with reference to the flowchart in FIG.
  • control unit 40 sets the electronic component 100 to be picked up first as a reference electronic component.
  • the camera 19 captures an image of the reference electronic component and transmits image information to the control unit 40. Based on the transmitted image information, the control unit 40 sets coordinates again for the reference electronic component, and generates position information (step S101).
  • the control unit 40 first compares the position information of all the electronic components 100 acquired from the image captured by the camera 19 (FIG. 5, step S10) with the position information of the reference electronic component newly acquired, and determines the reference It detects how much the position of the electronic component is deviated from the initial position (that is, detected in step S10), and calculates a position correction amount for correcting the deviation (step S102).
  • the control unit 40 applies the position information of the reference electronic component acquired again and updates the position information of the stored reference electronic component (step S103).
  • control unit 40 operates the electronic component holding table actuator 12 based on the updated position information of the reference electronic component, and moves the electronic component holding table 11 so that the reference electronic component is moved to the pickup position Pu. (Step S104).
  • control unit 40 operates the head actuator 32 to move the transfer head 30 so that the suction nozzle 31 that is not sucking the electronic component 100 is moved to the pickup position Pu (step). S105).
  • control unit 40 causes the suction nozzle 31 to suck the reference electronic component and picks up the electronic component 100 (step S106).
  • control unit 40 drives the pickup motor 15 to cause the pickup hammer 13 to push down the suction nozzle 31.
  • the control unit 40 drives the push-up motor 18 to push the electronic component 100 up by the push-up needle 16.
  • the electronic component 100 is adsorbed by contact with the suction nozzle 31 pushed down by the pickup hammer 13, and further, the suction nozzle 31 moves upward and is pushed up by the push-up needle 16, so that the electronic component 100 is peeled off from the wafer sheet 200. Picked up.
  • step S107: Yes when there is an electronic component 100 that can be picked up (step S107: Yes) and there is a suction nozzle 31 that can suck the electronic component 100 (step S108: Yes), the next electronic component 100 pickups are made.
  • the control unit 40 reads the position information stored for the next electronic component 100, and compares the coordinates of the electronic component 100 with the coordinates of the reference electronic component before update (that is, the coordinates detected in step S10). Then, it is determined whether or not the position of the electronic component 100 is within the correction amount application area.
  • the correction amount application area indicates a predetermined range starting from the position coordinates of the reference electronic component. In such a correction amount application area, for each electronic component 100, from the detection of the first electronic component 100 position (ie, step S10 in FIG. 5) to the re-detection of the position of the reference electronic component (ie, step S101 in FIG. 6). It can be considered that the positional deviation generated between and is the same.
  • the displacement of the position of the electronic component 100 is largely caused by the expansion and contraction of the wafer sheet 200 to be stretched, and it is considered that the displacement of the position is the same for the electronic component 100 within a certain range.
  • the position shift of the electronic component is considered to be the same as the position shift of the reference electronic component. It is done. For this reason, by detecting the coordinates of the electronic component and acquiring the position information again, the position information after the deviation of the electronic component to be picked up can be obtained by applying the correction amount of the reference electronic component. It can be calculated.
  • the predetermined range centering on the reference electronic component that defines the correction amount application area may be changed as appropriate, for example, depending on the stretchability of the wafer sheet 200 that causes the positional shift of the electronic component 100. May be changed as appropriate.
  • control unit 40 uses the position correction amount of the reference electronic component to use the electronic component 100. Is corrected (step S110).
  • the corrected position information is obtained by applying the position correction amount of the reference electronic component to the stored position information of the electronic component 100.
  • the control unit 40 operates the electronic component holding table actuator 12 based on the corrected position information of the next electronic component 100 and moves the electronic component holding table 11 so that the electronic component 100 is moved to the pickup position Pu. Move (step S111).
  • next suction nozzle 31 that is not sucking the electronic component 100 is moved to the pickup position Pu (step S105), and the next electronic component 100 is picked up.
  • step S109 when the position of the next electronic component 100 is outside the correction amount application area based on the reference electronic component (step S109: No), the control unit 40 sets the electronic component 100 as a new reference electronic component. .
  • control unit 40 acquires position information by capturing an image (step S101), calculates a position correction amount (step S102), and updates the position information (step S103). Execute pickup operation.
  • a pickup position Pu which is a position where the electronic component 100 is taken out is determined, and the suction nozzle 31 and the electronic component 100 are transferred to the pickup position Pu one by one in order. For this reason, positioning can be performed in a relatively short time, and the tact time can be shortened.
  • the tact time can be further shortened by transferring the electronic component 100 and the suction nozzle 31 in parallel.
  • the electronic components 100 can be sorted by appropriately selecting the electronic components 100 to be sucked according to the state, shape, and rank of the electronic components 100.
  • FIG. 7 is a flowchart showing the flow of the mounting operation of this embodiment.
  • the mounting operation step 7 in FIG. 4 of the electronic component 100 by the mounting unit 20 of the electronic component mounting apparatus 1 will be described with reference to the flowchart in FIG.
  • the control unit 40 transmits a control signal for operating the mounting board holding base actuator 22 and moves the mounting board holding base 21 so that a desired electronic component mounting position on the mounting board 300 is moved to the mounting position Pl ( Step S201).
  • control unit 40 operates the head actuator 32 to move the transfer head 30 so that the suction nozzle 31 that sucks the electronic component 100 is moved to the mounting position Pl (step). S202).
  • control unit 40 releases the suction so that the electronic component 100 sucked by the suction nozzle 31 is mounted at the electronic component mounting position on the mounting substrate 300 (step S203).
  • control unit 40 drives the mounting motor 25 to cause the mounting hammer 23 to push down the suction nozzle 31. After the electronic component 100 attracted by the pushed-down suction nozzle 31 comes into contact with the mounting substrate 300, the control unit 40 releases the suction of the suction nozzle 31 and places the electronic component 100 on the mounting substrate 300. To implement.
  • control unit 40 repeats a series of operations from step S201 to step S203 until there is no electronic component sucked by the suction nozzle 31 provided in the transfer head 30 (step S204: Yes). Make it.
  • Whether or not an electronic component is present in the suction nozzle 31 is determined by the control unit 40 when the number to be transferred matches the number transferred on the image captured by the camera 26. It can be assumed that no electronic component is present in the nozzle 31.
  • step S204 After all the electronic components 100 to be sucked by the suction nozzle 31 are mounted on the mounting substrate 300 (step S204: Yes), the control unit 40 takes an image of the electronic component 100 mounted on the mounting substrate 300 by the camera 26. And receiving image information. Based on the input image information, whether or not the electronic component 100 is mounted is inspected for the accuracy of the arrangement of the electronic component 100 and the appearance of the electronic component 100 (step S205). After the electronic component 100 inspection, the control unit 40 ends the mounting operation.
  • FIG. 8 shows an example of a light emitting diode element on a wafer sheet and a light emitting diode module mounted on a substrate.
  • the electronic component 100 is a light emitting diode element
  • the mounting substrate 300 is a substrate on which a light emitting diode element can be mounted as a substrate of a light emitting diode module, such as a ceramic substrate or a glass substrate.
  • the light emitting diode elements on the wafer sheet 200 are received in a state in which the quality varies depending on the manufacturing conditions in the manufacturing process of the light emitting diode elements in the previous process.
  • This variation in quality is an unavoidable variation in manufacturing caused by the atmosphere in the chamber at the time of manufacturing the light emitting diode element, the cleaning of the light emitting diode element, the variation in the film thickness of the light emitting diode element, and the like. If a product or a module is manufactured without taking this variation into consideration, variations will occur in the finished product, and the yield will eventually deteriorate.
  • each light emitting diode element is inspected by probe inspection or the like, and ranking is performed according to the inspection result.
  • the wafer sheet of FIG. 8 schematically shows the inspection results, where ⁇ indicates A rank, ⁇ indicates B rank, and X indicates C rank. Actually, there are several tens of ranks, but in the description of the present embodiment, description will be made with three ranks. Even if the rank becomes several tens of ranks, the present invention can be applied.
  • This inspection result and rank classification information are linked to the position information, and stored in the storage unit of the inspection apparatus on the server or in the previous process together with the index number or code of the wafer sheet attached to each sheet. . Or you may make it store directly in the electronic component information storage part 41.
  • the electronic component information storage unit 41 acquires electronic component information from the inspection device in the previous process or the storage unit.
  • mounting board information which is information regarding the required number and positions of light emitting diode elements to be mounted on the board, is input.
  • the rank ratio of the light emitting diode elements on the wafer sheet 200 is calculated by the in-mounting board ratio determining unit 43.
  • the rank ratio of the light emitting diode elements on the wafer sheet 200 in FIG. 8 is A rank: B rank: C rank is 80: 16: 4.
  • the mounting substrate ratio determining unit 43 further determines the rank ratio of the mounting substrate 300 based on the calculated rank ratio on the wafer sheet 200.
  • the light emitting diode module composed of 25 light emitting diode elements, 20 A ranks, 4 B ranks, and 1 C rank are used. This is also referred to as a mounting ratio as a rank ratio in the mounting substrate 300.
  • the mounting area of each rank on the mounting board 300 is determined by the area determination unit 44 based on the mounting ratio and mounting board information. In FIG. 8, it is determined that the A rank light emitting diode element having a higher rank is mounted in the peripheral area, and the C rank light emitting diode element having a lower rank is determined to be mounted in the central area.
  • the light emitting diode elements of each rank are mounted on the mounting substrate 300 using the rank ratio of the light emitting diode elements on the wafer sheet 200 as a mounting ratio.
  • the rank information and position information in the light emitting diode module will be specifically described. A description will be given with reference to a state 3 in which a light emitting diode module is completed through the mounting process of each rank on the substrate in FIG.
  • light emitting diode elements of ranks other than the highest rank are mounted on the light emitting diode module.
  • the end portion may be required to have a relatively high rank due to the contrast, and the center portion may have a low rank.
  • the A rank which is the highest rank is used at the end, and the lower rank is adopted as it goes to the center.
  • the C rank is mounted around the lower rank
  • the B rank is surrounded by the rank
  • the A rank is surrounded by the rank so that the luminous intensity and the light quantity of the entire module are secured.
  • a plurality of patterns are prepared from the idea that light emitting diode elements having a necessary rank are mounted at appropriate positions according to specifications required for the final product. Therefore, for example, when a plurality of substrates are held on the mounting substrate holding base 21 of the mounting unit 20, they can be mounted on the plurality of substrates with the same arrangement pattern or with different patterns. It becomes possible.
  • the control unit 40 refers to the electronic component information according to the mounting ratio, calculates which position on the wafer sheet 200 and which rank of the light emitting diode element is picked up and mounted on the substrate, and holds the electronic component Control signals are transmitted to the table actuator 12, the mounting substrate holder actuator 22, and the transfer head 30.
  • the light emitting diode element is picked up from the wafer sheet 200 by the suction nozzle 31 of the transfer head 30 and mounted on the substrate.
  • the light emitting diode element of rank A which is the most light emitting diode device among the light emitting diode devices to be mounted, is first applied to the substrate.
  • the B rank light emitting diode element is picked up from the wafer sheet 200 (state 2) and mounted, and finally the C rank light emitting diode element is picked up from the wafer sheet 200 and mounted (state 3).
  • the mounted electronic components may be inspected after mounting the light emitting diode elements of each rank at the time of mounting.
  • the tact time can be shortened, and when inspection is performed from many light emitting diode elements on the wafer sheet 200 such as A rank, inspection after mounting A rank
  • B rank or C rank light emitting diode elements which are fewer electronic components.
  • the inspection may be performed for each board after completion of mounting on the board.
  • the inspection is performed based on an image captured by the camera 26 of the mounting unit 20.
  • each light emitting diode element is present at a position where it should be, or is mounted at a certain distance from another light emitting diode element at a position where it should be, or obliquely or horizontally. Check whether it is not mounted.
  • the mounting is performed from the light emitting diode element of rank A that is mounted most on the substrate, but the mounting order is not limited to this, and the rank that is mounted the least on the substrate.
  • the light emitting diode elements may be mounted from the light emitting diode elements having the highest rank on the wafer sheet 200 or the light emitting diode elements having the smallest rank.
  • the peripheral part and the central part are determined according to the rank, but the area may be determined according to the rank ratio. Further, the area may be determined by referring not only to the rank ratio but also to the rank position. By doing in this way, the light emitting diode element on the wafer sheet 200 is efficiently mounted in a board
  • FIG. 9 shows an example of a light emitting diode element on the wafer sheet 200 and a light emitting diode module mounted on the substrate.
  • the rank ratio of the light emitting diode elements on the wafer sheet 200 is A rank: B rank: C rank is 64:24:12.
  • a light emitting diode module composed of 25 light emitting diode elements is configured by using 16 A ranks, 6 B ranks, and 3 C ranks.
  • the mounting area of each rank is determined by the area determination unit based on the mounting ratio and mounting board information.
  • the A rank light emitting diode elements having higher ranks are mounted in the peripheral area, and the lower rank B rank and C rank light emitting diode elements are mounted side by side in the central area. Has been decided to be.
  • the present invention can be similarly applied to cases where there are several tens of ranks. It is also possible not to use the worst-ranked electronic components, set not to use the electronic components with the lower rank, and determine the defective electronic components so that they are not used. It is. For example, when there are 20 ranks, it is possible to set so that the electronic component with the worst rank is not used.
  • the electronic component mounting apparatus includes an electronic component holding table that holds a wafer sheet in which a plurality of light emitting diode elements having different ranks are arranged in a wafer shape, and light emitting diode elements on the wafer sheet in the electronic component holding table.
  • An electronic component information storage unit for storing electronic component information including position information and rank information of the light emitting diode elements; an electronic component transfer mounting unit for extracting one or a plurality of light emitting diode elements from the wafer sheet and transferring and mounting them on a substrate;
  • a mounting board information storage unit for storing mounting board information consisting of a mounting position and a required number on the board, and an electronic component rank ratio of each rank in the light emitting diode element on the wafer sheet based on the electronic component information, Based on the component rank ratio and mounting board information, An electronic component that mounts a light emitting diode element at a predetermined position on the substrate in a mixed state with a plurality of ranks based on the mounting ratio and the electronic component information And a control unit that controls the transfer mounting unit.
  • the light emitting diode elements on the wafer sheet can be efficiently mounted, and waste can be reduced.
  • the light emitting diode elements finally remaining on the wafer sheet side can be reduced.
  • an area determining unit that determines an area in which the light emitting diode elements of each rank are mounted is provided.
  • light emitting diode elements of the same rank can be arranged in a certain area on the substrate.
  • the electronic component mounting method in the present embodiment includes a wafer sheet holding step for holding a wafer sheet in which a plurality of electronic components having different ranks are arranged in a wafer shape on an electronic component holding table, and the wafer sheet on the electronic component holding table.
  • Electronic component information storage step for storing electronic component information including electronic component position information and electronic component rank information in the electronic component information storage unit, and mounting substrate information including mounting position and necessary number on the substrate.
  • the electronic component rank ratio of each rank in the electronic component on the wafer sheet is obtained based on the electronic component information and the mounting substrate information storing step to be stored in the part, and each electronic component rank ratio in the substrate is determined based on the electronic component rank ratio and the mounting substrate information.
  • the light emitting diode elements on the wafer sheet can be efficiently mounted, and waste can be reduced.
  • a light emitting diode element is used as an example of an electronic component.
  • a semiconductor element, a resistance element, a transistor, or the like may be used, and any electronic component that can be divided into a plurality of ranks depending on its property. Any electronic component may be used.
  • the substrate is, for example, a substrate such as a ceramic substrate, a glass substrate, or a printed substrate, and may be a substrate on which electronic components can be mounted.
  • the electronic component information is, for example, position information of each light emitting diode element including an index on a wafer sheet, and rank information including information such as a light amount and a wavelength.
  • the rank information may be rank information that is divided into predetermined ranks based on information such as light quantity and wavelength.
  • the electronic component information storage unit is connected to a storage device external to the electronic component mounting apparatus, for example, a storage unit of the probe inspection apparatus in the previous process, or the probe inspection apparatus, in addition to the storage unit of the electronic component mounting apparatus. It is a storage medium such as a server, CD, or memory, and any storage medium can be used as long as it can be stored.
  • the mounting board information is mounting position information of each light emitting diode element in the board, the number of mounting on the board, and the shape of the board.
  • a storage device external to the electronic component mounting apparatus for example, a storage medium such as a computer, server, CD, or memory connected to the electronic component mounting apparatus As long as it can be memorized, it may be anything.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention porte sur un appareil de montage de composants électroniques qui utilise efficacement des composants électroniques en forme de feuille à gaufrettes et qui supprime les variations pendant qu'il maintient une qualité constante exigée pour le produit fini. Cet appareil de montage de composants électroniques (1) est muni de : table de retenue de composants électroniques (11) qui dispose d'une feuille à gaufrettes (200) sur laquelle sont arrangés sous forme de feuille à gaufrettes plusieurs composants électroniques de rangs différents ; unité de mise en mémoire de l'information des composants électroniques (41) qui contient l'information sur les composants électroniques comprenant l'information de position des composants électroniques (100) sur la feuille à gaufrettes (200) sur la table de retenue de composants électroniques (11) et l'information sur le classement desdits composants électroniques (100) ; tête de transfert (30) qui peut extraire un ou plusieurs composants électroniques (100) de la feuille à gaufrettes (200) à la fois et les transférer vers une unité de montage (300) ; unité de mise en mémoire de tableau de montage (42) qui contient l'information relative au tableau de montage comprenant le nombre nécessaire et la position de montage des composants électroniques (100) sur le tableau de montage (300) ; unité de détermination de coefficient de tableau de montage qui calcule le coefficient de classement des composants électroniques dans chaque classe de composants électroniques (100) sur la feuille à gaufrettes (200), sur la base de l'information sur les composants électroniques, et détermine le coefficient de montage de chaque classe du tableau de montage (300) sur la base du coefficient de classement de composants électroniques et de l'information relative au tableau de montage ; unité de commande qui, sur la base du coefficient de montage et de l'information sur les composants électroniques, contrôle la tête de transfert (30) afin de monter les composants électroniques sur des positions prescrites sur le tableau de montage (300) dans un état dans lequel les classes sont mélangées.
PCT/JP2012/050848 2012-01-17 2012-01-17 Appareil de montage de composants électroniques et procédé de montage de composants électroniques WO2013108367A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201280041983.2A CN103766016B (zh) 2012-01-17 2012-01-17 电子元件安装装置及电子元件安装方法
JP2013554118A JP5789680B2 (ja) 2012-01-17 2012-01-17 電子部品実装装置および電子部品実装方法
PCT/JP2012/050848 WO2013108367A1 (fr) 2012-01-17 2012-01-17 Appareil de montage de composants électroniques et procédé de montage de composants électroniques

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PCT/JP2012/050848 WO2013108367A1 (fr) 2012-01-17 2012-01-17 Appareil de montage de composants électroniques et procédé de montage de composants électroniques

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KR102782924B1 (ko) 2018-07-23 2025-03-19 삼성전자주식회사 Led 전송 장치를 포함하는 전자 장치 및 그 제어 방법
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JPWO2013108367A1 (ja) 2015-05-11
CN103766016A (zh) 2014-04-30
CN103766016B (zh) 2017-02-15

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