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WO2014086844A2 - Métallisation de filtres à cavité polymères - Google Patents

Métallisation de filtres à cavité polymères Download PDF

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Publication number
WO2014086844A2
WO2014086844A2 PCT/EP2013/075512 EP2013075512W WO2014086844A2 WO 2014086844 A2 WO2014086844 A2 WO 2014086844A2 EP 2013075512 W EP2013075512 W EP 2013075512W WO 2014086844 A2 WO2014086844 A2 WO 2014086844A2
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WO
WIPO (PCT)
Prior art keywords
cavity filter
metal
polymeric
manufacturing
filter according
Prior art date
Application number
PCT/EP2013/075512
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English (en)
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WO2014086844A3 (fr
Inventor
Sven Göthe
Björn ATTHOFF
Original Assignee
Cuptronic Technology Ltd.
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Publication date
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Publication of WO2014086844A2 publication Critical patent/WO2014086844A2/fr
Publication of WO2014086844A3 publication Critical patent/WO2014086844A3/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/204—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/008—Manufacturing resonators
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Definitions

  • the present invention relates generally to a method of
  • a metal on a polymeric substrate surface of a cavity filter air cavity filter
  • a polymeric cavity filter coated with a metal is also encompassed.
  • Metallization of objects including polymeric objects are known from for instance WO 98/34446, WO 2007/116056, WO 2007/116057, and WO 2012/066018.
  • Cavity filters use air as dielectric and are sharply tuned resonant circuits that allow only certain frequencies to pass. Cavity structures can be used to realize band pass or band stop filters and multiplexers where they can be used
  • filter of this kind are known as notch filters.
  • Physically a cavity filter is a resonator inside a conducting "box" with coupling loops at the input and output.
  • Cavity filters are capable of high selectivity even under power loads of at least a megawatt. Higher quality factor as well as increased performance stability at closely spaced frequencies can be achieved by increasing the internal volume of the filter cavities.
  • Cavity filters are critical with regard to their geometry and their dimensions. Cavity filters made of polymeric materials are for instance lighter compared to a corresponding cavity filter made of metal such as aluminum. Cavity filters made of polymeric materials may experience problems with thermal expansion. A cavity filter has to function over a wide
  • dimensions of the cavity may depend on the temperature for some materials, it is desired to add materials to a polymeric cavity filter in order to reduce the thermal expansion.
  • the plastic material utilized in cavity filters typically expands less than aluminum with thermal variations.
  • Materials utilized for cavity filters include but are not limited to PSI (Polysulphonimide) , PEI (Polyetherimide,
  • polystyrene polystyrene, Xarec
  • PEEK polyether ether ketone
  • LCP Liquid Crystalline Polymers, Vectra
  • the polymer materials may be filled with glass fiber and/or ceramic materials as well as other materials.
  • One problem for cavity filters made of polymer material is the adhesion between the polymeric material and the metal.
  • adhesion of metal to the polymer material is a problem when using additives in order to further reduce the thermal expansion coefficient of the polymeric cavity filter base.
  • To metalize a polymer cavity filter is a problem from surface adhesion perspective.
  • Another problem for polymeric cavity filters coated with metal is that the surface roughness of the finished metal surface is too rough for the filter to become efficient.
  • a method for manufacturing a polymeric cavity filter with an inner surface coated with a metal layer comprising the steps: a)providing a cavity filter base, said cavity filter base comprising at least one polymer, wherein at least the inner surface of said cavity filter base comprises at least one selected from the group consisting of an abstractable hydrogen atom and an unsaturation, wherein the thermal expansion coefficient of the cavity filter base is 1*10 ⁇ 4 K -1 or less, b) contacting at least the inner surface of said cavity filter base with at least one polymerizable unit, at least one initiator, and optionally at least one solvent, wherein said at least one polymerizable unit is able to undergo a chemical reaction to form a polymer comprising at least one charged group, c) inducing a polymerization reaction by exposure to at least one selected from the group consisting of heat and actinic radiation adapted to said at least one initiator to form polymers on at least the inner surface of said cavity filter base, said polymers comprising at
  • Advantages of the invention include that cavity filter bases made of polymeric materials and with additives giving a low thermal expansion coefficient can still be metalized.
  • a low thermal expansion coefficient of the filter base is necessary for a cavity filter due to the small geometric tolerances for the cavity of the filter.
  • the cavity filter becomes useful over a wide temperature range.
  • Another advantage is that the method gives a smooth metal surface inside the filter cavity. A smooth surface for the inside of the cavity filter is necessary for a good cavity filter. Small irregularities in the surface structure would lead to impaired filter properties and heating of the filter which is not desired. Energy losses in the filter are reduced due to the smooth metal surface.
  • a further advantage is that the performance of the filter is improved compared to an ordinary metallic cavity filter.
  • the Q-value (quality factor) of the present filter is improved compared to a corresponding conventional filter made entirely of metal .
  • the polymeric cavity filter has a lower weight than
  • Example of an application area is in wireless communications, Radio Frequency Systems (RFS) as an air cavity filter.
  • RFS Radio Frequency Systems
  • a cavity filter is in a base station for mobile phones.
  • the lower weight of the polymeric cavity filter allows the cavity filter to be placed close to the antenna at a higher position. The placement close to the antenna gives a further improved signal .
  • “Abstractable hydrogen” as used herein denotes a hydrogen atom which can be removed in a chemical reaction so that a covalent bond is formed.
  • “Cavity filter base” as used herein denotes the usually polymeric base that is coated with a layer of metal to obtain a finished cavity filter.
  • “Polymerizable unit” as used herein denotes a chemical compound which is able to participate in a chemical reaction which yields a polymer.
  • a method for manufacturing a polymeric cavity filter with an inner surface coated with a metal layer comprising the steps: a) providing a cavity filter base, said cavity filter base comprising at least one polymer, wherein at least the inner surface of said cavity filter base comprises at least one selected from the group consisting of an abstractable hydrogen atom and an unsaturation, wherein the thermal expansion coefficient of the cavity filter base is 1*10 ⁇ 4 K -1 or less, b) contacting at least the inner surface of said cavity filter base with at least one polymerizable unit, at least one initiator, and optionally at least one solvent, wherein said at least one polymerizable unit is able to undergo a chemical reaction to form a polymer comprising at least one charged group, c) inducing a polymerization reaction by exposure to at least one selected from the group consisting of heat and actinic radiation adapted to said at least one initiator to form polymers on at least the inner surface of said cavity filter base, said polymers comprising at least one
  • the polymers formed on the surface have at least one charged group each, typically many charged groups.
  • a first metal is adsorbed. This is made either by adsorption of oppositely charged metal ions or by adsorption of small metal particles (1-1000 nm) .
  • charged compounds can be adsorbed to the polymers so that metal ions can be adsorbed to the oppositely charged compounds adsorbed to the polymers.
  • ions they are reduced to metal.
  • the addition of the first metal takes place before step b) , between steps b) and c) or between steps c) and d) .
  • the addition of the first metal takes place at several of these points. Both ions and metal particles can be added during the same process, either simultaneously or at different points.
  • the second metal is applied on the surface.
  • the application of the second metal is facilitated by the existing first metal.
  • a third metal is applied on the second metal.
  • one or more layers of metal are applied on top of the third metal.
  • the metal particles which may be added as alternative ii) in claim 1 have a diameter in the range 2-500 nm, alternatively 5-500 nm. Particles with an irregular shape are also encompassed. A particle with an irregular shape may not have a well-defined diameter like a spherical particle. In case of a particle where the diameter is not directly and unambiguously possible to determine the diameter is defined as the largest dimension of the particle in any direction.
  • a further metal is applied to the existing metal on the surface of the polymer cavity filter, said further metal can be the same as the mentioned second metal or a third metal.
  • a third metal can thus be deposited on the second metal.
  • palladium ions a deposited and reduced as the first metal, copper is deposited on the reduced palladium ions and silver is deposited on the copper.
  • the cavity filter base comprises at least one selected from the group consisting of glass fibers, carbon fibers, aramid fibers, and wood fibers. These additives, in particular glass fibers, carbon fibers, and aramid fibers reduce the thermal expansion coefficient of the cavity filter base.
  • the cavity filter base comprises at least one natural fiber.
  • the cavity filter base comprises at least one organic particle.
  • the solvent is optional.
  • the optional solvent is selected from the group consisting of methanol, ethanol, acetone, and ethyl acetate.
  • the optional solvent is selected from the group consisting of methanol, and ethanol.
  • the at least one initiator forms one phase together with the at least one polymerizable unit and the optional at least one solvent.
  • the polymerizable unit is a monomer. In an alternative embodiment the polymerizable unit is an oligomer.
  • the polymerizable unit can undergo a chemical reaction and form a polymer. If the polymerizable unit is a monomer it can undergo a polymerization reaction to form a polymer.
  • Oligomers are compounds formed by a polymerization reaction of a few monomers. The oligomers can in turn undergo a reaction to form a polymer.
  • the at least one polymerizable unit is at least one selected from a polymerizable monomer and a polymerizable oligomer.
  • the polymerizable unit is at least one selected from the group consisting of methacrylic acid, acrylic acid, and maleic acid.
  • the polymerizable unit is at least one selected from the group consisting of methacrylic acid, and acrylic acid.
  • the polymerization reaction is induced by irradiation with a source of actinic radiation.
  • the polymerization reaction is induced by heat. In one embodiment the polymerization reaction is induced by both actinic radiation and heat.
  • the initiator is at least one photoinitator selected from the group consisting of antraquinone,
  • thioxanthone isopropyl thioxanthone, xanthone, benzophenone, and fluorenone.
  • the initiator is selected from thioxanthone and benzophenone.
  • initiators affected by both actinic radiation and heat are utilized in one embodiment.
  • examples of such initiators include but are not limited to alpha-hydroxyketone,
  • the cavity filter base is treated with at least one selected from plasma, corona, and flame treatment before step b) . This treatment can improve the wettability of the surface.
  • the cavity filter base is washed before step d) .
  • the second metal is at least one selected from the group consisting of copper, silver, and gold.
  • the first metal is selected from nickel and
  • step b) the at least one solvent is present in step b) and the at least one solvent is at least partially evaporated between step b) and c) .
  • the polymerization reaction in step c) can be carried out when the mixture on the surface is dried or if a part of the solvent has evaporated. This has the advantage that the viscosity increases so that the mixture more easily stays on the surface during activation of the initiator .
  • the Ra value is lOym or less, in an
  • the Ra value is 5ym or less. In one embodiment the Ra value is 2ym or less. In yet another
  • the Ra value is lym or less.
  • the Ra value is 0.5ym or less. In yet another embodiment the Ra value is 0. lym or less.
  • the Ra value is measured defined in DIN EN ISO 4287.
  • the Ra (or roughness average) value is a measure of the surface roughness.
  • the Ra value is calculated from the roughness profile of the surface.
  • the Ra value is the arithmetical mean deviation of the
  • a low Ra value has the advantage that the losses in the filter are minimized and that the induction of heat in the filter is minimized.
  • the invention provides a method to obtain a metal coating with a very low Ra value.
  • the polymeric cavity filter base has a smooth surface, the surface of the metal will also be very smooth.
  • the metal coating method does not add any or only extremely little to the surface roughness Ra .
  • the thermal expansion coefficient of the cavity filter base is 0.6*10 "4 K "1 or less . In yet another embodiment the thermal expansion coefficient of the cavity filter base is 0.2*10 ⁇ 4 K -1 or less. In one embodiment the thermal expansion coefficient of the cavity filter base is 2*10 ⁇ 4 K "1 or less.
  • said cavity filter comprising a polymeric material, wherein at least the inside of said cavity filter is coated with a layer of a metal, wherein said cavity filter has a thermal expansion coefficient of 1*10 ⁇ 4 K "1 or less, wherein the inside of said cavity filter has a Ra value of 20ym or less defined according to DIN EN ISO 4287.
  • the cavity filter is manufactured according to the above method.
  • the different embodiments of the above method are also applicable to the cavity filter.
  • the new technology is an improved method for giving superior properties of the cavity filter.
  • the process with a grafting step initiated with irradiation of for instance UV/Visable light creates a covalent bond between the grafting polymer and the polymeric substrate surface.
  • the metal is applied and it forms strong secondary bonds (hydrogen bonds, dipolar bonds or ion bonds) with the grafted polymer.
  • the grafting mixture is applied wet but function both in wet or dry state. There is today no known grafting process
  • the impact of oxygen in the process can be minimized through optimizing the thickness of the layer or use of protective gases .
  • the wavelength of the UV source, laser or light used for irradiation should match the absorption of spectra of the initiator, if such an initiator is used. It is also possible to use heat activated initiators. A preferred embodiment is initiators activated by both actinic radiation and heat. In one embodiment the polymerization reaction is induced by irradiation with a UV light source that matches the wavelength sensitivity of the photo initiator.
  • the polymerizable unit is in one embodiment selected from various polymerizable units having a carboxyl functional group. Thus the polymerizable unit will become a carboxyl group as a charged group.
  • the grafting process step has been verified with energies down to 50 mJ/cm 2 to activate the initiator.
  • the second metal is at least one selected from the group consisting of copper, silver, and gold.
  • the first metal is selected from nickel and
  • Example of application areas for the cavity filter include but are not limited to in wireless communications, and Radio
  • Frequency Systems as a filter.
  • a cavity filter is in a base station for mobile phones.
  • the lower weight of the polymeric cavity filter allows the cavity filter to be placed close to the antenna at a higher position, for instance in an antenna tower.
  • the placement closer to the antenna gives a further improved signal, due to the shorter distance between the filter and the antenna. It would even be possible to place the cavity filter next to the antenna due to the lower weight of the cavity filter.
  • a method for application of a metal on a cavity filter substrate surface comprising the steps: a) providing a cavity filter base, said cavity filter base comprising at least one polymer, wherein the surface of said cavity filter base comprises at least one selected from the group consisting of an abstractable hydrogen atom and an unsaturation , b) providing a mixture comprising at least one solvent, at least one monomer, and at least one initiator, wherein said at least one initiator forms one phase together with said at least one monomer and said at least one solvent, and wherein said at least one monomer is able to polymerize to form a polymer comprising at least one charged group, c) contacting at least a part of said cavity filter base with said mixture, d) inducing a polymerization reaction by exposure to at least one selected from heat and actinic radiation adapted to said at least one initiator to form polymers on at least the inner surface of said cavity filter base, said polymers comprising at least one charged group, and said polymers
  • said cavity filter is made of PSI (Polysulfon imide) .
  • said cavity filter comprises at least one selected from ceramics and glass fiber. In one embodiment of the alternative aspect said
  • polymerization reaction is induced by irradiation with a UV light source.
  • the solvent is selected from the group consisting of methanol, ethanol, acetone, and ethyl acetate.
  • the solvent is selected from the group consisting of methanol, and ethanol.
  • the monomer is at least one selected from the group consisting of methacrylic acid, acrylic acid, and maleic acid.
  • the monomer is at least one selected from the group consisting of methacrylic acid, and acrylic acid.
  • the initiator is selected from thioxanthone and benzophenone.
  • the cavity filter base is treated with plasma before step c) . In one embodiment of the alternative aspect the cavity filter base is washed before step e) .
  • the second metal is at least one selected from the group consisting of copper, silver, and gold.
  • the first metal is selected from nickel and palladium.
  • a grafting solution consisting of acrylic acid (1.0 wt %) , thioxanthone (0.01 wt %) and ethanol was prepared.
  • the solution was sprayed by an air spray gun to a cavity filter of PEEK (Polyether ether ketone)
  • the panels were irradiated with a 200 W mercury fusion system lamp .
  • the samples were irradiated with an energy of 600 mJ/cm 2 .
  • the samples washed in deionized water (DIW) .
  • DIW deionized water
  • the samples activated in a commercial solution comprising palladium (II) ions.
  • the palladium ions were reduced to palladium metal by dipping the panel in a commercial reducing media.
  • the panels were then washed in DIW before placing them in a commercial chemical copper bath for copper plating.
  • Example 2 A full coverage of copper was obtained and the filter box showed excellent performance in testing.
  • Example 2 A full coverage of copper was obtained and the filter box showed excellent performance in testing.
  • a grafting solution consisting of methacrylic acid (1 wt %) , chlorothioxanthone (0.01 wt %) and methanol/ethanol (1:1) was prepared .
  • the solution was sprayed by an air spray gun to a cavity filter of LCP (Liquid Crystalline Polymers, Vectra)
  • the panels were irradiated with a 200 W mecury Fusion system lamp .
  • the samples were irradiated with an energy of 600 mJ/cm 2 .
  • the samples washed in deionized water (DIW) .
  • DIW deionized water
  • the samples activated in a commercial solution comprising palladium ( I I ) ions.
  • the palladium ions were reduced to palladium metal by dipping the panel in a commercial reducing media.
  • the panels were then washed in DIW before placing them in a commercial chemical copper bath for copper plating.
  • a grafting solution consisting of acrylic acid (10.0 wt %) , isopropyl thioxanthone (0.1 wt %) and ethanol was prepared.
  • the solution was sprayed by an airless spray gun to a cavity filter of PEI (Polyetherimide)
  • PEI Polyetherimide
  • the panels were irradiated with a 200 W mercury fusion system lamp .
  • the samples were irradiated with an energy of 450 mJ/cm 2 .
  • Aluminium cavity Q 2810 @ 939,97 MHz
  • Plastic cavity has approx. 5% higher Q value than the aluminum cavity which lower loss.
  • a grafting solution consisting of acrylic acid (50.0 wt %) , fluorenone (1.2 wt %) and ethyl acetate/ethanol (20/80) was prepared .
  • the solution was sprayed by an air spray gun to a cavity filter of PEI (Polyetherimide)
  • the panels were irradiated with a 200 W mercury fusion system lamp .
  • the samples were irradiated with an energy of 650 mJ/cm 2 . After irradiation were the samples washed in deionized water (DIW) . In the next step were the samples activated in a commercial solution comprising palladium (II) ions. The palladium ions were reduced to palladium metal by dipping the panel in a commercial reducing media. The panels were then washed in DIW before placing them in a commercial chemical copper bath for copper plating.
  • DIW deionized water
  • Example 5 This means that the test panel has not been affected by the temperature cycle which is an important criterion.
  • a grafting solution consisting of acrylic acid (50.0 wt %) , fluorenone (0.2 wt %) , Irgacure 184 (1.1 wt %) and methanol was prepared.
  • the solution was sprayed by an air spray gun to a cavity filter of polysulphone imide.
  • the panels were irradiated with a 200 W mercury fusion system lamp .
  • the samples were irradiated with an energy of 450 mJ/cm 2 . After irradiation were the samples washed in deionized water (DIW) . In the next step were the samples activated in a commercial solution comprising palladium (II) ions. The palladium ions were reduced to palladium metal by dipping the panel in a commercial reducing media. The panels were then washed in DIW before placing them in a commercial chemical copper bath for copper plating.
  • DIW deionized water
  • a grafting solution consisting of acrylic acid (10.0 wt %) , isopropyl thioxanthone (0.1 wt %) and ethanol was prepared.
  • the solution was sprayed by an airless spray gun to a cavity filter of PEI (Polyetherimide)
  • the panels were irradiated with a 200 W mercury fusion system lamp .
  • the samples were irradiated with an energy of 500 mJ/cm 2 .
  • the samples washed in deionized water (DIW) .
  • DIW deionized water
  • the samples activated in a commercial solution comprising palladium (II) ions.
  • the palladium ions were reduced to palladium metal by dipping the panel in a commercial reducing media.
  • the panels were then washed in DIW before placing them in a commercial chemical copper bath for copper plating.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Filtering Materials (AREA)

Abstract

L'invention porte sur un procédé pour l'application d'un métal sur un filtre à cavité, comprenant la mise en contact d'au moins une partie de ladite base de filtre à cavité avec un mélange; l'amorce d'une réaction de polymérisation par exposition à de la chaleur et/ou un rayonnement actinique adapté audit ou auxdits initiateurs pour former des polymères sur au moins la surface interne de ladite base de filtre à cavité, lesdits polymères comprenant au moins un groupe chargé et lesdits polymères formant des liaisons covalentes après réaction avec un atome d'hydrogène pouvant être extrait et/ou une insaturation sur ladite base de filtre à cavité; et par la suite l'application de métal supplémentaire. Les avantages de l'invention comprennent la possibilité de métalliser des filtres à cavité avec une adhérence supérieure et l'obtention d'un accroissement de performance du filtre à cavité par comparaison avec des filtres à cavité en alumine existants.
PCT/EP2013/075512 2012-12-05 2013-12-04 Métallisation de filtres à cavité polymères WO2014086844A2 (fr)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015165874A1 (fr) * 2014-04-28 2015-11-05 Cuptronic Technology Ltd. Métallisation de surfaces
WO2022018136A1 (fr) 2020-07-21 2022-01-27 Ncapt Ab Procédé de traitement de surface avant revêtement et encollage
WO2022018278A1 (fr) 2020-07-24 2022-01-27 Cuptronic Technology Ltd. Procédé de traitement de surface avant métallisation
WO2025114356A1 (fr) 2023-11-28 2025-06-05 Cuptronic Technology Ltd. Métallisation de surfaces

Citations (4)

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Publication number Priority date Publication date Assignee Title
WO1998034446A1 (fr) 1997-01-31 1998-08-06 Cuptronic Ab Nouveau procede de modification de surfaces
WO2007116057A2 (fr) 2006-04-10 2007-10-18 Linea Tergi Ltd. Procédé d'application d'un métal sur un substrat
WO2007116056A2 (fr) 2006-04-10 2007-10-18 Linea Tergi Ltd. Procédé d'application d'un métal sur du papier
WO2012066018A2 (fr) 2010-11-16 2012-05-24 Cuptronic Technology Ltd. Métallisation d'objets par polymérisation plasma

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1746681A1 (fr) * 2005-07-20 2007-01-24 Matsushita Electric Industrial Co., Ltd. Filtre en plastique en forme de peigne avec un poteau métallique pour augmenter la dissipation thermique
JP2008308762A (ja) * 2007-05-17 2008-12-25 Kimoto & Co Ltd 無電解メッキ形成材料、および無電解メッキされた非導電性基材の製造方法
EP2323214A1 (fr) * 2009-11-16 2011-05-18 Alcatel Lucent Dispositif pour filtrer les signaux de fréquence radio, filtre à cavité d'air coaxial et procédé de fabrication correspondant

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998034446A1 (fr) 1997-01-31 1998-08-06 Cuptronic Ab Nouveau procede de modification de surfaces
WO2007116057A2 (fr) 2006-04-10 2007-10-18 Linea Tergi Ltd. Procédé d'application d'un métal sur un substrat
WO2007116056A2 (fr) 2006-04-10 2007-10-18 Linea Tergi Ltd. Procédé d'application d'un métal sur du papier
WO2012066018A2 (fr) 2010-11-16 2012-05-24 Cuptronic Technology Ltd. Métallisation d'objets par polymérisation plasma

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015165874A1 (fr) * 2014-04-28 2015-11-05 Cuptronic Technology Ltd. Métallisation de surfaces
US10774424B2 (en) 2014-04-28 2020-09-15 Cuptronic Technology Ltd. Metalization of surfaces
WO2022018136A1 (fr) 2020-07-21 2022-01-27 Ncapt Ab Procédé de traitement de surface avant revêtement et encollage
WO2022018278A1 (fr) 2020-07-24 2022-01-27 Cuptronic Technology Ltd. Procédé de traitement de surface avant métallisation
US12378671B2 (en) 2020-07-24 2025-08-05 Cuptronic Technology Ltd. Method for surface treatment prior to metallization
WO2025114356A1 (fr) 2023-11-28 2025-06-05 Cuptronic Technology Ltd. Métallisation de surfaces

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