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WO2016116921A1 - Jet de levage incliné - Google Patents

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Info

Publication number
WO2016116921A1
WO2016116921A1 PCT/IL2016/050007 IL2016050007W WO2016116921A1 WO 2016116921 A1 WO2016116921 A1 WO 2016116921A1 IL 2016050007 W IL2016050007 W IL 2016050007W WO 2016116921 A1 WO2016116921 A1 WO 2016116921A1
Authority
WO
WIPO (PCT)
Prior art keywords
donor
substrate
facets
acceptor
droplets
Prior art date
Application number
PCT/IL2016/050007
Other languages
English (en)
Inventor
Zvi Kotler
Michael Zenou
Original Assignee
Orbotech Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd. filed Critical Orbotech Ltd.
Priority to EP16739876.7A priority Critical patent/EP3247529A4/fr
Priority to KR1020177022327A priority patent/KR20170102984A/ko
Priority to CN201680006659.5A priority patent/CN107206548B/zh
Publication of WO2016116921A1 publication Critical patent/WO2016116921A1/fr
Priority to IL253169A priority patent/IL253169A0/en
Priority to US15/644,857 priority patent/US20170306495A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B23K26/342—Build-up welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225—Oblique incidence of vaporised material on substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

Definitions

  • Fig. 2 is a schematic side view showing details of the system of Fig. 1, in accordance with an embodiment of the present invention
  • Figs. 3 - 6 are schematic, sectional views showing details of non-planar Laser-Induced Forward Transfer (LIFT) donors, in accordance with embodiments of the present invention.
  • LIFT Laser-Induced Forward Transfer
  • Apparatus 10 comprises an optical assembly 16, containing a laser and optics for Laser-Induced Forward Transfer (LIFT) .
  • Optical assembly 16 and its operations are described with reference to Fig. 2 below.
  • direct printing applications such as are performed by apparatus 10, for example as patterning or layer deposition on a PCB or FPD or any other applicable device, may comprise other diagnostics capabilities that may be in-situ (i.e., monitoring and inspecting during the printing process), integrated (i.e., monitoring and inspecting selected devices immediately after completion of the LIFT process), or offline, by a stand-alone diagnostics system.
  • laser beam 28 provides pulsed radiation on donor 22A.
  • the radiation passes through surface 23A and impinges on the donor film of a selected facet 26. Since the selected facet is not parallel to an acceptor surface 33A of substrate 24, herein assumed to be parallel to a base surface 35A of the substrate, ejection of droplets 30 of molten material from the donor film occurs at an angle 29 to acceptor surface 33A of substrate 24.
  • Acceptor surface 33A of substrate 24 is also referred to herein as top surface 33A of the substrate.
  • the ejection of droplets 30 is orthogonal to facet 26, and is indicated by an arrow 31.
  • structure 25A has surfaces, such as the sidewall, which are not parallel to acceptor surface 33A, i.e., to base surface 35A.
  • other structures 25B, 25C, 25D, 25E are mounted on substrate 24.
  • the other structures have the same property as structure 25A described here, i.e., they have surfaces which are not parallel to the base surface of substrate 24.
  • the lower surface of donor 22A comprises a periodic structure (as shown in Fig. 3) .
  • the structure of the lower surface of donor 22A may have a non-periodic structure with different slopes of facets along the lower surface of donor 22A. I.e., the structure may be different from the center of donor 22A to the edge of the donor. For example the slope angle of facets at the edge of donor 22A may be steeper than the angle of the facets at the center.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • General Chemical & Material Sciences (AREA)

Abstract

L'invention concerne un appareil de dépôt de matériau sur une surface acceptrice comprenant un substrat donneur transparent présentant des première et seconde surfaces opposées de sorte qu'au moins une partie de la seconde surface ne soit pas parallèle à la surface acceptrice, et comprenant un film donneur sur la seconde surface. L'appareil comprend en outre un ensemble optique, qui est configuré pour diriger un faisceau de rayonnement de manière à traverser la première surface du substrat donneur et toucher le film donneur au niveau d'un emplacement sur la partie de la seconde surface qui n'est pas parallèle à la surface acceptrice, de manière à provoquer l'éjection de gouttelettes de matériau fondu depuis le film donneur sur la surface acceptrice.
PCT/IL2016/050007 2015-01-21 2016-01-05 Jet de levage incliné WO2016116921A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP16739876.7A EP3247529A4 (fr) 2015-01-21 2016-01-05 Jet de levage incliné
KR1020177022327A KR20170102984A (ko) 2015-01-21 2016-01-05 경사진 lift 제팅
CN201680006659.5A CN107206548B (zh) 2015-01-21 2016-01-05 倾斜的激光诱导前向转换喷射
IL253169A IL253169A0 (en) 2015-01-21 2017-06-25 Spraying metal drops at an angle using the laser transfer method (lift)
US15/644,857 US20170306495A1 (en) 2015-01-21 2017-07-10 Angled lift jetting

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562105761P 2015-01-21 2015-01-21
US62/105,761 2015-01-21

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/644,857 Continuation-In-Part US20170306495A1 (en) 2015-01-21 2017-07-10 Angled lift jetting

Publications (1)

Publication Number Publication Date
WO2016116921A1 true WO2016116921A1 (fr) 2016-07-28

Family

ID=56416516

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2016/050007 WO2016116921A1 (fr) 2015-01-21 2016-01-05 Jet de levage incliné

Country Status (7)

Country Link
US (1) US20170306495A1 (fr)
EP (1) EP3247529A4 (fr)
KR (1) KR20170102984A (fr)
CN (1) CN107206548B (fr)
IL (1) IL253169A0 (fr)
TW (1) TW201639654A (fr)
WO (1) WO2016116921A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9925797B2 (en) 2014-08-07 2018-03-27 Orbotech Ltd. Lift printing system
US10193004B2 (en) 2014-10-19 2019-01-29 Orbotech Ltd. LIFT printing of conductive traces onto a semiconductor substrate
US10471538B2 (en) 2015-07-09 2019-11-12 Orbotech Ltd. Control of lift ejection angle
CN110637354A (zh) * 2017-05-24 2019-12-31 奥宝科技股份有限公司 于未事先图样化的基板上电器互连的电路元件
US10633758B2 (en) 2015-01-19 2020-04-28 Orbotech Ltd. Printing of three-dimensional metal structures with a sacrificial support
US10688692B2 (en) 2015-11-22 2020-06-23 Orbotech Ltd. Control of surface properties of printed three-dimensional structures
US12162294B2 (en) 2019-05-07 2024-12-10 Orbotech Ltd. Lift printing using thin donor foils

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3521483A1 (fr) * 2018-02-06 2019-08-07 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Appareil et procédé de dépôt par lift
JP7424093B2 (ja) * 2019-03-08 2024-01-30 株式会社リコー 立体造形物を造形する装置、立体造形物を造形する方法
WO2020222090A1 (fr) 2019-05-01 2020-11-05 Io Tech Group Ltd. Procédé pour connecter électriquement une puce avec des connecteurs supérieurs à l'aide d'une impression 3d
US11446750B2 (en) 2020-02-03 2022-09-20 Io Tech Group Ltd. Systems for printing solder paste and other viscous materials at high resolution
US11622451B2 (en) 2020-02-26 2023-04-04 Io Tech Group Ltd. Systems and methods for solder paste printing on components
EP3893611A1 (fr) * 2020-04-07 2021-10-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Dépôt contrôlé d'un matériau donneur sur une surface cible
US11497124B2 (en) 2020-06-09 2022-11-08 Io Tech Group Ltd. Methods for printing conformal materials on component edges at high resolution
US11691332B2 (en) 2020-08-05 2023-07-04 Io Tech Group Ltd. Systems and methods for 3D printing with vacuum assisted laser printing machine

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US6792326B1 (en) 1999-05-24 2004-09-14 Potomac Photonics, Inc. Material delivery system for miniature structure fabrication
US6805918B2 (en) 1999-01-27 2004-10-19 The United States Of America As Represented By The Secretary Of The Navy Laser forward transfer of rheological systems
US20050095367A1 (en) 2003-10-31 2005-05-05 Babiarz Alec J. Method of noncontact dispensing of viscous material
US7277770B2 (en) 2003-07-15 2007-10-02 Huang Wen C Direct write process and apparatus
WO2009153792A2 (fr) 2008-06-19 2009-12-23 Utilight Ltd. Formation de motifs induite par la lumière
EP2660352A1 (fr) 2012-05-02 2013-11-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Feuille donneuse et procédé de fabrication de transfert avant induit par la lumière

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EP1938970A1 (fr) * 2005-09-30 2008-07-02 Think Laboratory Co., Ltd. Rouleau a graver pour photogravure et procede de production de celui-ci
US20080084611A1 (en) * 2006-10-05 2008-04-10 Bright View Technologies, Inc. Methods and Apparatus for Creating Apertures Through Microlens Arrays Using Curved Cradles, and Products Produced Thereby
US20110089412A1 (en) * 2008-06-16 2011-04-21 Shigeo Fujimori Patterning method, production method of device using the patterning method, and device
JP5003826B2 (ja) * 2009-12-03 2012-08-15 東レ株式会社 ドナー基板、パターニング方法およびデバイスの製造方法
KR20120138472A (ko) * 2011-06-15 2012-12-26 삼성디스플레이 주식회사 레이저 열전사 장치, 레이저 열전사 방법, 및 그를 이용한 유기 발광 표시장치의 제조 방법
WO2013124114A1 (fr) * 2012-02-23 2013-08-29 Asml Netherlands B.V. Dispositif, appareil lithographique, procédé de guidage d'un rayonnement et procédé de fabrication de dispositif
WO2013126927A2 (fr) * 2012-02-26 2013-08-29 Solexel, Inc. Systèmes et procédés pour une division par laser et un transfert de couche de dispositif
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US6805918B2 (en) 1999-01-27 2004-10-19 The United States Of America As Represented By The Secretary Of The Navy Laser forward transfer of rheological systems
US6792326B1 (en) 1999-05-24 2004-09-14 Potomac Photonics, Inc. Material delivery system for miniature structure fabrication
US7277770B2 (en) 2003-07-15 2007-10-02 Huang Wen C Direct write process and apparatus
US20050095367A1 (en) 2003-10-31 2005-05-05 Babiarz Alec J. Method of noncontact dispensing of viscous material
WO2009153792A2 (fr) 2008-06-19 2009-12-23 Utilight Ltd. Formation de motifs induite par la lumière
EP2660352A1 (fr) 2012-05-02 2013-11-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Feuille donneuse et procédé de fabrication de transfert avant induit par la lumière
WO2013165241A1 (fr) * 2012-05-02 2013-11-07 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Feuille donneuse et procédé pour la fabrication par transfert direct induit par la lumière

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Title
See also references of EP3247529A4

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9925797B2 (en) 2014-08-07 2018-03-27 Orbotech Ltd. Lift printing system
US10193004B2 (en) 2014-10-19 2019-01-29 Orbotech Ltd. LIFT printing of conductive traces onto a semiconductor substrate
US10633758B2 (en) 2015-01-19 2020-04-28 Orbotech Ltd. Printing of three-dimensional metal structures with a sacrificial support
US10471538B2 (en) 2015-07-09 2019-11-12 Orbotech Ltd. Control of lift ejection angle
US10688692B2 (en) 2015-11-22 2020-06-23 Orbotech Ltd. Control of surface properties of printed three-dimensional structures
CN110637354A (zh) * 2017-05-24 2019-12-31 奥宝科技股份有限公司 于未事先图样化的基板上电器互连的电路元件
US20210028141A1 (en) * 2017-05-24 2021-01-28 Orbotech Ltd. Electrical Interconnection Of Circuit Elements On A Substrate Without Prior Patterning
US11881466B2 (en) 2017-05-24 2024-01-23 Orbotech Ltd. Electrical interconnection of circuit elements on a substrate without prior patterning
CN110637354B (zh) * 2017-05-24 2024-03-08 奥宝科技有限公司 于未事先图样化的基板上电器互连的电路元件
US12162294B2 (en) 2019-05-07 2024-12-10 Orbotech Ltd. Lift printing using thin donor foils

Also Published As

Publication number Publication date
EP3247529A4 (fr) 2019-01-16
KR20170102984A (ko) 2017-09-12
IL253169A0 (en) 2017-08-31
TW201639654A (zh) 2016-11-16
CN107206548B (zh) 2019-08-13
US20170306495A1 (en) 2017-10-26
CN107206548A (zh) 2017-09-26
EP3247529A1 (fr) 2017-11-29

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