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WO2017018991A1 - Modification de canal de bus - Google Patents

Modification de canal de bus Download PDF

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Publication number
WO2017018991A1
WO2017018991A1 PCT/US2015/042004 US2015042004W WO2017018991A1 WO 2017018991 A1 WO2017018991 A1 WO 2017018991A1 US 2015042004 W US2015042004 W US 2015042004W WO 2017018991 A1 WO2017018991 A1 WO 2017018991A1
Authority
WO
WIPO (PCT)
Prior art keywords
memory
bus
switch
signals
slot
Prior art date
Application number
PCT/US2015/042004
Other languages
English (en)
Inventor
Melvin K. Benedict
Edward G. BENSON
Karl J. Bois
Original Assignee
Hewlett Packard Enterprise Development Lp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Enterprise Development Lp filed Critical Hewlett Packard Enterprise Development Lp
Priority to PCT/US2015/042004 priority Critical patent/WO2017018991A1/fr
Publication of WO2017018991A1 publication Critical patent/WO2017018991A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/16—Handling requests for interconnection or transfer for access to memory bus

Definitions

  • Electronic components such as processors, memory modules, controllers, and input/output (I/O) devices, can be electrically connected to a communications bus in a computing system.
  • the speed of the communications bus refers to the amount of data that can move between the electronic components within a given amount of time. The more data the communications bus can transmit at one particular time, the faster the transmission of data between the components. Thus, computing resources may benefit from communication buses that provide optimal performance speed.
  • FIG. 1 A is a block diagram of a system including a mounted switch and populated memory slots;
  • Fig. 1 B is a block diagram of the system including the mounted switch and unpopulated memory slots;
  • FIG. 2A is a block diagram of a topology for a motherboard that includes mounted switches
  • Fig. 2B is a block diagram of another topology for the motherboard that includes the mounted switches and a stub connection;
  • FIG. 3 is a block diagram of a topology for a motherboard that includes mounted switches and multiple stub connections;
  • Fig. 4 is an example of a PIN diode used as a switching mechanism
  • Fig. 5 is a block diagram of a topology for a motherboard that includes switch logic used to configure a PIN diode used as a switching mechanism
  • Fig. 6 is a process flow diagram of a method for manufacturing a system board.
  • Fig. 7 is a block diagram showing a non-transitory, computer-readable medium that stores code configured to reduce the number of loads on a memory bus of a system board.
  • a bit is a unit of data that can be transferred internally within the circuitry of a computing system and along multiple communication channels.
  • the computing system may include a memory communications bus to transfer data between a central processing unit (CPU) and a memory module, among other components.
  • the number of memory slots and the number of memory modules populated in the memory slots may affect the performance of the bus by increasing capacitive loading.
  • the speed at which the memory communications bus transfers data between the components may decrease, thus reducing the memory bandwidth and degrading the signal integrity of the memory communications bus.
  • speed and bandwidth are two of the primary factors indicative of the performance level of the memory communications bus.
  • Examples described herein provide a system to maintain or improve memory bus performance.
  • the system can include components mounted on a motherboard, including a processor, a memory controller, memory slots, memory modules, a memory bus, and one or more switches, among others.
  • the memory modules may populate the memory slots that may be electrically connected to the memory bus.
  • the switches may be mounted adjacent to the memory modules and connected to the memory bus. The placement of the switches may reconfigure the memory bus by disconnecting at least one memory slot from the memory bus to electrically isolate a memory module populated in the at least one memory slot.
  • Fig. 1 A is a block diagram of a system 100A including a mounted switch 102 and populated memory slots.
  • the system 100A may be a server, personal computer, mobile computing device, and the like.
  • a motherboard 104 may provide a foundation for the system 100A on which various electronic components are mounted and electrically connected to one another. As shown in Fig. 1 A, the motherboard 104 may enable communication between electronic components including a CPU 106 with a memory controller 108, a RAM device 1 10 including DIMMs 1 12-1 to 1 12-4, and the switch 102.
  • the motherboard board 104 may include additional components to perform various system functionalities. However, for simplicity, components related to the memory function of the system 100A are illustrated in Fig. 1 A.
  • the CPU 106 includes circuitry used to execute stored instructions, for example, memory data stored in the RAM device 1 10.
  • the CPU 106 can be a single core processor, a multi-core processor, a computing cluster, or any number of other configurations.
  • the memory controller 108 may be integrated into the CPU 106 to control the RAM device 1 10, as shown in Fig. 1 A. In other examples, the memory controller 108 may be a separate circuit chip or integrated into the RAM device 1 10, among other configurations.
  • the memory controller 108 may manage the flow of data between the RAM device 1 10 and the CPU 106.
  • the DIMMs 1 12-1 to 1 12-4 may be composed of several RAM integrated circuits mounted on small-scale circuit boards. Each DIMM 1 12-1 to 1 12-4 can be inserted into a memory slot 1 14 mounted on the motherboard 104.
  • the DIMMs 1 12-1 to 1 12-4 may incorporate volatile memory, for example, dynamic random access memory (DRAM) or synchronous DRAM (SDRAM).
  • DRAM dynamic random access memory
  • SDRAM synchronous DRAM
  • the DIMMs 1 12-1 to 1 12-4 may act as the main memory of the system 100A to store and transfer data including programs, applications, and other data to be executed by the CPU 106.
  • the RAM device 1 10 may be configured with other types of memory modules, such as double data rate fourth generation (DDR4) RAM or Single In-Line Memory Modules (SIMMs), among others.
  • DDR4 double data rate fourth generation
  • SIMMs Single In-Line Memory Modules
  • a memory bus 1 16 may enable the communications between the DIMMs 1 12- 1 to 1 12-4 and the CPU 106 using parallel wires, herein referred to as channels 1 18-1 to 1 18-3. As shown in Fig. 1 A, the channels 1 18-1 to 1 18-3 may physically connect the memory controller 108 to the memory slots 1 14 to transmit bus signals, e.g., memory data, to and from the DIMMs 1 12-1 to 1 12-4. The channels 1 18-1 to 1 18-3 may perform other functions such as determining the amount of data and the speed of the data transferred between the DIMMs 1 12-1 to 1 12-4 and the CPU 106.
  • the performance of the memory bus 1 16 may be directly related to the number of DIMMs 1 12-1 to 1 12-4 on each channel 1 18-1 to 1 18-3. For example, increasing the number of memory modules, or even the existing memory modules, on the memory bus 1 16 may slow the electrical transitions, such as voltage, frequencies, and so forth, on the bus 1 16. The delay may increase the capacitive load on the memory bus 1 16. Consequently, reductions in the bandwidths, the signal integrity and the transmission speeds of the memory bus 1 16 may decrease performance factors. If the reduction continues, the performance of the system 100A may also decrease.
  • the capacitive load may include the sum of the input capacitance of all of the DIMMs 1 12-1 to 1 12-4 on the channels 1 18-1 to 1 18-3.
  • the switch 102 may be configured in a default-closed configuration so that signals can flow through it. However, when configured to an open position, the switch 102 may create a gap in the circuitry of the system 100A by inhibiting transmission of the signals. In other words, the switch 102 in an open position may act as a termination end-point to discontinue the routing of bus signals along the memory bus 1 16 with minimum bouncing, noise, and other signal interferences.
  • the memory bus 1 16 may electrically connect the switch 102 to the DIMMs 1 12-1 to 1 12-4, the CPU 106, and other components on the motherboard 104.
  • the switch 102 may be mounted on the channels 1 18-1 to 1 18-3 along with the DIMMs 1 12- 1 to 1 12-4, however, the number and the location of the switch 102 may vary based on manufacturer specifications.
  • the switch 102 when configured to an open position, may reconfigure the memory bus 1 16 by reducing the number of DIMMs, memory slots, or both, electrically connected to the bus 1 16.
  • an end-user may use the switch 102 to remove the DIMMs 1 12-3 and 1 12-4 electrically from the channel 1 18-3.
  • the switch may receive bus signals routed on the memory bus 1 16 before the DIMMs 1 12-3 and 1 12-4 receive the bus signals. Due to the open position of the switch 102, the bus signals may be prevented from continuing along the memory bus 1 16. In this manner, the DIMMs 1 12-3 and 1 12-4 may be disconnected so as to not receive the routed bus signals from the memory bus 1 16.
  • DIMMs 1 12-3 and 1 12-4 may be electrically removed to reduce the capacitive load on the channel 1 18-3 and thus, on the memory bus 1 16.
  • 1 12-2 may operate at an increased bandwidth to maintain or improve the electrical characteristics and performance of the memory bus 1 16, the system 100A, or both.
  • the switch 102 may have a low capacitance, it may be positioned on the motherboard 104 to directly receive signals for the memory controller 108 to improve the electrical characteristics of the circuity in the system 100A.
  • Fig. 1 B is a block diagram of the system 100B including the mounted switch
  • the system 100B may operate at less than optimal memory capacity, for example, when only the memory slots 1 14-1 and 1 14-2 are populated. However, the unpopulated memory slots 1 14-3 and 1 14-4 that continue to receive routed bus signals create an additional capacitive load on the memory bus
  • the additional capacitive load may delay the electrical characteristics of the memory bus 1 16. Consequently, transmission speeds and the speed at which the CPU
  • the switch 102 may be mounted on the memory bus 1 16 to isolate the unpopulated memory slots 1 14-3 and 1 14-4 electrically from the routed bus signals. Specifically, the switch 102 may receive signals routed on the memory bus 1 16 before the signals reach the unpopulated memory slots 1 14-3 and
  • bus signals may terminate at the switch 102 when configured to an open position to prevent the flow of current further along the memory bus 1 16.
  • the slots 1 14-3 and 1 14-4 may be electrically disconnected from the memory bus 1 16.
  • the electrical isolation of the slots 1 14-3 and 1 14-4 may reduce the capacitive load and improve the electrical characteristics of the memory bus 1 16.
  • the switch 102 can be controlled by firmware, such as basic input/output system (BIOS) firmware 120, located in a ROM device 122 electrically connected to the CPU 106.
  • the firmware 120 may control the switch 102 to operate in an opened position to prevent the flow of current through the switch 102.
  • an end-user may desire to mount DIMMs in the unpopulated memory slots 1 14- 3 and 1 14-4 to increase memory capacity of the system 100B.
  • the BIOS firmware 120 may configure the switch 102 to a closed position to allow routed bus signals to pass through the switch 102 in order to electrically connect the memory slots 1 14-3 and 1 14-4 with the memory bus 1 16.
  • the switch 102 may support the bandwidth frequencies and additional electrical characteristics of the memory bus 1 16.
  • the switch 102 may provide the appropriate bandwidth frequencies to allow the routed bus signals to pass from one component to another on the motherboard 104 while maintaining or increasing the performance of the memory bus 1 16.
  • the switch 102 may include a device to enable switching between applications, an analog cross circuit switch, a PIN diode, a FET-based switching technology, or other components that can behave as an isolation feature to inhibit the flow of electricity in the circuitry of the system 100B.
  • Fig. 2A is a block diagram of a topology 200A for a motherboard 202 that includes mounted switches.
  • the electrical components may include several DIMMs 204-1 to 204-4, 206-1 to 206-4 mounted on opposite sides of a CPU
  • the DIMMs 204-1 to 204-4, 206-1 to 206-4 may store volatile memory data for the system 200A.
  • a memory bus 210 may enable the transfer of the data between the DIMMs 204-1 to 204-4, 206-1 to 206-4, the CPU 208, and other electrical components on the motherboard 202.
  • the memory bus 210 may be made of parallel wires, such as channels 212-1 to 212-3, that can electrically transmit data between the DIMMs 204-1 to 204-4, 206-1 to 206-4 and the CPU 208.
  • Switches 214 may be mounted on both sides of the CPU 208 and adjacent to the DIMMs 204-1 to 204-4, 206-1 to 206-4.
  • the configuration of the electrical components mounted each side of the CPU 208 may be identical, as illustrated in Fig. 2A. In other examples, the configuration of the electrical components on each side of the CPU 208 may vary based on the specifications of a manufacturer, an end-user, or both.
  • additional DIMMs connected to the memory bus 210 may decrease transmission speeds.
  • the transmission speeds may also decrease due to the number of existing DIMMs 204-1 to 204-4, 206-1 to 206-4 on the memory bus 210.
  • the mounting of the switches 214 on the motherboard 202 may reduce the capacitive load on the memory bus 210 by electrically removing one or more DIMMs.
  • the switches 214 configured in an open position may electrically isolate and prevent the transmission of routed bus signals to the DIMMs 204-4 and 204- 6. In this manner, the electrically disconnected DIMMs 204-4 and 206-4 may not receive the routed bus signals transmitted on the memory bus 210.
  • the electrical isolation of the DIMMs 204-4 and 206-4 may reduce the capacitive load and improve the electrical characteristics of the memory bus 1 16. Consequently, the performance of the memory bus 210 may be improved or maintained since a lower number of DIMMs, i.e., DIMMs 204-1 to 204-3, 206-1 to 206-3, may be electrically connected within the system 200A.
  • Fig. 2B is a block diagram of another topology 200B for the motherboard 202 that includes the mounted switches 214 and stub connections. Like numbers are as described with respect to Fig. 2A.
  • the DIMMs 204-3 and 206-3 may form stub connections 216-1 and 218-1 on the channel 212-3.
  • 218-1 may include an interconnection that branches off the memory bus 210.
  • the addition of the stub connections 216-1 and 218-1 may also increase the capacitive load on the memory bus 210 to produce an impedance mismatch.
  • the mismatch may produce electrical reflections that may degrade bus signals and thus, inhibit the performance of the memory bus 210.
  • the switches 214 configured in an opened position may electrically disconnect the stub connections 216-1 and 218-1 so that the routed bus signals fail to reach the DIMMs 204-3 and 206-3. In this way, the electrical isolation of the DIMMs 204-3 and 206-3 may reduce or alleviate the mismatch to reduce the capacitive load created by the stub connections 216-1 and 218-1 .
  • the bandwidth efficiency of the memory bus 210 may increase to provide optimal performance of the system 200B.
  • Fig. 3 is a block diagram a topology 300 for a motherboard 302 that includes mounted switches 304 and multiple stub connections 306-1 to 306-3 and 308-1 to 308-
  • the length of the stubs connections 306-1 to 306-3 and 308-1 to 308-3 may increase the capacitive load on the memory bus 310 that may cause slower transmission speeds.
  • the DIMMs 310-1 , 310-3, 310-5 and 312-1 , 312-3, 312-5 may be electrically disconnected from the memory bus 310. Since routed bus signals
  • transmitted on the memory bus 310 may terminate at the switches 304, the DIMM 310-
  • Fig. 4 is an example of a PIN diode 402 used as a switching mechanism.
  • PIN diode 402 is a semiconductor device that operates as a variable resister at radio frequencies (RF) and microwave frequencies. Generally, the resistance of the PIN diode 402 may vary depending on the amount of current that may flow through it, for example, from less than 1 ohm ( ⁇ ) (forward biased or "ON") to more than 10 kilo-ohm (k
  • the PIN diode 402 may implement logic to switch its control current between ON and OFF modes.
  • the PIN diode 402 as a switch may be designed to have the least possible loss, e.g., reduced isolation, of an input bus signal.
  • the PIN diode 402 In the OFF mode, the PIN diode
  • the PIN diode 402 as a switch may exhibit a high loss, e.g., isolation, to an input bus signal.
  • the selection of the PIN diode 402 as a switching mechanism may be due to its high-switching speeds, low capacitance, and low frequency limit, among others.
  • the PIN diode 402 may be electrically connected to a controller 406 embedded in a CPU 408 and memory modules 410 and 412, such as DIMMs, as will be further described with respect to Fig. 5.
  • Fig. 5 is a block diagram of a topology 500 for a motherboard 502 that includes switch logic 504 used to configure the PIN diode 402 of Fig. 4 as a switching mechanism. Like numbered items are as described with respect to Fig. 4.
  • the switch logic 504 shown in Fig. 5 may indicate the location of a mounted PIN diode, such as the PIN diode 402 of Fig. 4.
  • DIMMs 506-2, 506-3, 506-5, 506-6, 508-2, 508-3, 508-5, and 508-6 may be electrically connected to CPU 510 and the switch logic 504 via memory bus 512.
  • DIMMs 506-2, 506-3, 506-5, 506-6, 508-2, 508-3, 508-5, and 508-6 may form various stub connections 514-1 to 514-4 and 516-1 to 516-4, as shown in Fig. 5.
  • the DIMMs 506-2, 506-3, 506-5, 506-6, 508-2, 508-3, 508-5, and 508-6 may be electrically disconnected from the memory bus 512.
  • the switch logic 504 mounted on the motherboard 502 may control the flow of bus signals transmitted by the memory bus 512.
  • the switch logic 504 may switch the PIN diodes to an OFF mode to terminate routed bus signals. Accordingly, the bus signals may not flow pass the PIN diodes 402 but terminate at the switch logic 504.
  • the memory bus 512 and the DIMMs 506-2, 506-3, 506-5, 506-6, 508-2, 508-3, 508-5 may not be electrically connected, the signal frequencies and the capacitive loading of the memory bus 512 may be reduced.
  • the remaining electrically connected DIMMs 506-1 , 506-4, 508-1 , and 508-4 may operate at an increased bandwidth to improve the electrical characteristics and performance of the memory bus 510.
  • Fig. 6 is a block diagram of a method 600 of manufacturing a system board.
  • the method 600 may include positioning at least one memory modules in memory slots located on the system board.
  • the memory slots may receive bus signals from a memory controller on a memory bus.
  • the system board may be located in a computing device such as a server, computer, mobile devices, and the like.
  • the memory modules may include DIMMs, SIMMs, DDR4 RAM devices, and so forth.
  • the method 600 may position at least one switch on the system board.
  • the switch may be coupled, via the memory bus, to at least one memory slot that can be populated with a memory module.
  • the method may include using the switch to isolate the at least one memory slot from the bus signals.
  • the use of the switch may control system capacitance and bandwidth to maintain or improve performance of the memory bus, the system board, or both.
  • Fig. 7 is a block diagram of a system 700 that includes a non-transitory, computer-readable medium 702 that stores code configured to reduce the number of loads on a memory bus of a system board.
  • a non-transitory, computer-readable medium 702 that stores code configured to reduce the number of loads on a memory bus of a system board.
  • an increased capacitive load on the memory bus may reduce the transmission speeds, the signal integrity, and the bandwidth of the memory bus.
  • the mounting of switches on the system board may reduce the capacitive load to provide improved memory bus performance.
  • the computer-readable medium 702 can include RAM, such as DRAM or SRAM.
  • a processor 704 may access the computer-readable medium 702 over a memory bus 706.
  • the processor 704 may include code configured to perform methods described herein.
  • Various software components discussed herein may be stored on the computer-readable medium 702.
  • the software components may include various modules to disconnect and electrically remove memory slots from the memory bus.
  • An identify module 708 may identify at least one memory slot coupled on a memory bus that is to be disconnected and electrically removed from the memory bus.
  • An isolation module 710 may isolate the at least one identified memory slot by routing bus signals to a switch coupled on the memory bus. The bus signals may terminate at the switch when positioned in an open position so that the at least one memory slot fails to receive the bus signals.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

L'invention concerne un système et des procédés se rapportant à la modification d'un canal de bus. Le système peut comprendre un processeur et un contrôleur mémoire connecté électriquement au processeur. Le système peut comprendre un bus mémoire et des bancs de mémoire connectés électriquement à au contrôleur mémoire par l'intermédiaire du bus mémoire. Chaque banc de mémoire peut comprendre un connecteur pour recevoir un module de mémoire et pour coupler le module de mémoire au bus mémoire. Le système peut comprendre au moins un commutateur connecté électriquement au contrôleur mémoire par l'intermédiaire du bus mémoire, le commutateur servant à isoler au moins un banc de mémoire du bus de mémoire.
PCT/US2015/042004 2015-07-24 2015-07-24 Modification de canal de bus WO2017018991A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2015/042004 WO2017018991A1 (fr) 2015-07-24 2015-07-24 Modification de canal de bus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/042004 WO2017018991A1 (fr) 2015-07-24 2015-07-24 Modification de canal de bus

Publications (1)

Publication Number Publication Date
WO2017018991A1 true WO2017018991A1 (fr) 2017-02-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/042004 WO2017018991A1 (fr) 2015-07-24 2015-07-24 Modification de canal de bus

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WO (1) WO2017018991A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090204736A1 (en) * 2005-05-27 2009-08-13 Ati Technologies Ulc Computing device with flexibly configurable expansion slots, and method of operation
US20090248969A1 (en) * 2008-03-31 2009-10-01 Larry Wu Registered dimm memory system
WO2010144624A1 (fr) * 2009-06-09 2010-12-16 Google Inc. Programmation de valeurs de résistance de terminaison dimm
US20120110229A1 (en) * 2008-05-28 2012-05-03 Rambus Inc. Selective switching of a memory bus
US20130341790A1 (en) * 2004-03-02 2013-12-26 Michael W. Leddige Interchangeable connection arrays for double-sided dimm placement

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130341790A1 (en) * 2004-03-02 2013-12-26 Michael W. Leddige Interchangeable connection arrays for double-sided dimm placement
US20090204736A1 (en) * 2005-05-27 2009-08-13 Ati Technologies Ulc Computing device with flexibly configurable expansion slots, and method of operation
US20090248969A1 (en) * 2008-03-31 2009-10-01 Larry Wu Registered dimm memory system
US20120110229A1 (en) * 2008-05-28 2012-05-03 Rambus Inc. Selective switching of a memory bus
WO2010144624A1 (fr) * 2009-06-09 2010-12-16 Google Inc. Programmation de valeurs de résistance de terminaison dimm

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