WO2017018999A1 - Thermal radiation heat dissipation structure - Google Patents
Thermal radiation heat dissipation structure Download PDFInfo
- Publication number
- WO2017018999A1 WO2017018999A1 PCT/US2015/042069 US2015042069W WO2017018999A1 WO 2017018999 A1 WO2017018999 A1 WO 2017018999A1 US 2015042069 W US2015042069 W US 2015042069W WO 2017018999 A1 WO2017018999 A1 WO 2017018999A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermal radiation
- electronic device
- heat dissipation
- powder coating
- dissipation structure
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 71
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 23
- 239000000843 powder Substances 0.000 claims abstract description 35
- 238000000576 coating method Methods 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 10
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- -1 polyethylene terephthalate Polymers 0.000 claims description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 9
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 9
- 229910021389 graphene Inorganic materials 0.000 claims description 8
- 229910021538 borax Inorganic materials 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 235000010339 sodium tetraborate Nutrition 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004328 sodium tetraborate Substances 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052744 lithium Inorganic materials 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 description 5
- 239000008199 coating composition Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000012855 volatile organic compound Substances 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 description 1
- AJFXNBUVIBKWBT-UHFFFAOYSA-N disodium;boric acid;hydrogen borate Chemical compound [Na+].[Na+].OB(O)O.OB(O)O.OB(O)O.OB([O-])[O-] AJFXNBUVIBKWBT-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
Definitions
- Fig. 1 depicts an example sectional view illustrating thermal radiation heat dissipation structure for an electronic device in accordance with one example of the present application.
- Fig. 2 depicts another example sectional view illustrating thermal radiation heat dissipation structure for an electronic device in accordance with one example of the present application.
- the present specification describes a structure including a thermal radiation derived powder coating formulation disposed on metal substrates of electronic devices for dissipating heat from the electronic devices.
- the present specification further describes another structure including a putty layer disposed between the metal substrate and the thermal radiation derived powder coating for dissipating heat from the electronic devices.
- thermal radiation derived powder coating refers to the powder including both graphene and carbon nanotubes that provides a significantly better heat transfer via z-direction, i.e., in a substantially perpendicular direction to the coated surface/metal substrate.
- carbon nanotube refers to "cylindrical structure made up of carbon atoms”.
- the present specification describes the thermal radiation derived powder coating that provides good surface porosity coverage for metal substrates, and more specifically for die casting metal substrates. Furthermore, the thermal radiation derived powder coating offers a significantly high cost/performance value as the thermal releasing technology. In addition, the thermal radiation derived powder coating provides an effective anti-corrosion coating solution for metal substrates. Also, the structure including the thermal radiation derived powder coating may enhance product lifetime for various components included in electronic devices, such as liquid crystal display (LCD) panels, light emitting diodes (LEDs), central processing units (CPUs), batteries and the like. May further reduce the risk of any battery explosion due to overheating and further may alleviate overheating of LCD panels by reducing the LCD panel temperature to below skin temperature of about 40° C or lower. Moreover, the metal substrate structure of electronic devices including the thermal radiation derived powder coating may improve information loading speed and power efficiency.
- LCD liquid crystal display
- LEDs light emitting diodes
- CPUs central processing units
- the present specification describes the thermal radiation derived powder coating having no volatile organic compounds (VOCs).
- VOCs volatile organic compounds
- graphene in the thermal radiation derived powder coating composition provides a very high aspect ratio of about 50 - 5,000, which can provide a good coverage on high porosity substrate surface by powder coating process.
- the process of application of the thermal radiation derived powder coating onto the high porosity metal substrate may not result in trapping chemical, which may result in serious corrosion problem in magnesium alloy substrates.
- Fig. 1 depicts an example sectional view 100 of a thermal radiation heat dissipation structure for an electronic device in accordance with techniques of the present application.
- a thermal radiation derived powder coating 120 is disposed to dissipate heat from the electronic device via thermal radiation 130.
- the thermal radiation derived powder coating 120 is applied on to the metal substrate 1 10.
- Example technique includes establishing an electrostatic charge on thermal radiation powder using an applicator such that the maximum voltage is achieved at the tip of the electrode for applying the thermal radiation derived powder coating 120 onto the metal substrate 1 10.
- the thermal radiation derived coating includes a resin and thermal radiation materials.
- FIG. 2 depicts another example sectional view 200 of a thermal radiation heat dissipation structure for an electronic device in accordance with techniques of the present application.
- Example resin materials are polycarbonate (PC), polyethylene terephthalate (PET), polyethylene terephthalate - glycol (PET-G), poly vinyl chloride (PVC), polyacrylic, polyphenylene sulphide (PPS), thermoplastic polymers, thermoset polymers and the like.
- Example thermal radiation materials are graphene, carbon nanotube, and the like.
- the thermal radiation derived powder coating includes about or less than 30% by weight of additives, such as aluminum, copper, silver, silicon, gold, diamond, silicon carbide, boron nitride, graphite and/or synthetic thermal conductive materials.
- the thermal radiation derived powder coating comprises, by weight about 40% of grapheme, less than or about 3% of carbon nanotube, about 2% of diamond, and about 10% of graphite.
- the thickness of the thermal radiation derived powder coating is in the range of about 5- 60 micrometers ( ⁇ ).
- Example metal substrate of electronic devices are aluminum, magnesium, lithium, zinc, titanium, niobium, stainless, copper, metal alloy, and the like.
- the formulation of thermal radiation derived powder coating including graphene and carbon nanotube provides a significantly better heat transfer in the z-axis direction as shown in Fig. 1 .
- the thermal radiation heat dissipation structure shown in Fig. 2 is similar to the thermal radiation heat dissipation structure shown in Fig. 1 , except a putty layer 210 is disposed between the metal substrate 1 10 and the thermal radiation derived powder coating 120 to enhance heat dissipation via thermal radiation 130.
- Example putty layer materials include epoxy, silicone, and borax. Further, exemplary borax materials are sodium borate, sodium tetraborate, disodium tetraborate, a salt of boric acid and the like.
- the metal substrate is an outside cover of the electronic device and/or a semiconductor element of the electronic device.
- Exemplary electronic device is a computing device, a laptop, a tablet, a smart phone, a notebook, and the like.
- Exemplary semiconductor elements housed in the electronic device is a central processing unit (CPU), LCD panel, LED, battery or any other such heat generating component/device.
- CPU central processing unit
- LCD panel LCD panel
- LED battery or any other such heat generating component/device.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
In one example, a thermal radiation heat dissipation structure for dissipating heat from an electronic device is described. The thermal radiation heat dissipation structure includes a metal substrate of the electronic device. Further, the thermal radiation heat dissipation structure includes a thermal radiation derived powder coating that is disposed on the metal substrate of the electronic device for dissipating heat from the electronic device via thermal radiation, wherein the thermal radiation derived powder coating comprises a resin and thermal radiation materials and wherein the thermal radiation materials include grapheme, and carbon nanotube.
Description
THERMAL RADIATION HEAT DISSIPATION STRUCTURE
BACKGROUND
[0001] The cooling of the electronic devices, such as computing devices and mobile devices and the removal of the heat generated by the semiconductor elements in the electronic devices plays a significant role in electronic industry. For using the heat dissipating means in the high integrate products and multi function applications, various heat dissipating structures with high heat dissipating efficiency have developed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0002] Examples are described in the following detailed description and in reference to the drawings, in which:
[0003] Fig. 1 depicts an example sectional view illustrating thermal radiation heat dissipation structure for an electronic device in accordance with one example of the present application; and
[0004] Fig. 2 depicts another example sectional view illustrating thermal radiation heat dissipation structure for an electronic device in accordance with one example of the present application.
DETAILED DESCRIPTION
[0005] The present specification describes a structure including a thermal radiation derived powder coating formulation disposed on metal substrates of electronic devices for dissipating heat from the electronic devices. The present specification further describes another structure including a putty layer disposed between the metal substrate and the thermal radiation derived powder coating for dissipating heat from the electronic devices. The term "thermal radiation derived powder coating" refers to the powder including both graphene and carbon nanotubes that provides a significantly better heat transfer via z-direction, i.e., in a substantially perpendicular direction to the coated surface/metal substrate. The term carbon nanotube refers to "cylindrical structure made up of carbon atoms".
[0006] Further, the present specification describes the thermal radiation derived powder coating that provides good surface porosity coverage for metal substrates, and more specifically for die casting metal substrates. Furthermore, the thermal radiation derived powder coating offers a significantly high cost/performance value as the thermal releasing technology. In addition, the thermal radiation derived powder coating provides
an effective anti-corrosion coating solution for metal substrates. Also, the structure including the thermal radiation derived powder coating may enhance product lifetime for various components included in electronic devices, such as liquid crystal display (LCD) panels, light emitting diodes (LEDs), central processing units (CPUs), batteries and the like. May further reduce the risk of any battery explosion due to overheating and further may alleviate overheating of LCD panels by reducing the LCD panel temperature to below skin temperature of about 40° C or lower. Moreover, the metal substrate structure of electronic devices including the thermal radiation derived powder coating may improve information loading speed and power efficiency.
[0007] In addition, the present specification describes the thermal radiation derived powder coating having no volatile organic compounds (VOCs). Further, graphene in the thermal radiation derived powder coating composition provides a very high aspect ratio of about 50 - 5,000, which can provide a good coverage on high porosity substrate surface by powder coating process. Furthermore, the process of application of the thermal radiation derived powder coating onto the high porosity metal substrate may not result in trapping chemical, which may result in serious corrosion problem in magnesium alloy substrates.
[0008] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present techniques. It will be apparent, however, to one skilled in the art that the present apparatus, devices and systems may be practiced without these specific details. Reference in the specification to "an example" or similar language means that a particular feature, structure, or characteristic described is included in at least that one example, but not necessarily in other examples.
[0009] Turning now to the figures, Fig. 1 depicts an example sectional view 100 of a thermal radiation heat dissipation structure for an electronic device in accordance with techniques of the present application. As shown in Fig. 1 , over a metal substrate 1 10 of an electronic device, such as a computing device, a laptop, a tablet, a smart phone, or a notebook, a thermal radiation derived powder coating 120 is disposed to dissipate heat from the electronic device via thermal radiation 130. The thermal radiation derived powder coating 120 is applied on to the metal substrate 1 10. Example technique includes establishing an electrostatic charge on thermal radiation powder using an applicator such that the maximum voltage is achieved at the tip of the electrode for applying the thermal radiation derived powder coating 120 onto the metal substrate 1 10.
ln one example, the thermal radiation derived coating includes a resin and thermal radiation materials.
[00010] Fig. 2 depicts another example sectional view 200 of a thermal radiation heat dissipation structure for an electronic device in accordance with techniques of the present application.
[00011] Example resin materials are polycarbonate (PC), polyethylene terephthalate (PET), polyethylene terephthalate - glycol (PET-G), poly vinyl chloride (PVC), polyacrylic, polyphenylene sulphide (PPS), thermoplastic polymers, thermoset polymers and the like. Example thermal radiation materials are graphene, carbon nanotube, and the like. In some examples, the thermal radiation derived powder coating includes about or less than 30% by weight of additives, such as aluminum, copper, silver, silicon, gold, diamond, silicon carbide, boron nitride, graphite and/or synthetic thermal conductive materials. Further in some examples, the thermal radiation derived powder coating comprises, by weight about 40% of grapheme, less than or about 3% of carbon nanotube, about 2% of diamond, and about 10% of graphite. In some examples, the thickness of the thermal radiation derived powder coating is in the range of about 5- 60 micrometers (μιη).
[00012] Example metal substrate of electronic devices are aluminum, magnesium, lithium, zinc, titanium, niobium, stainless, copper, metal alloy, and the like. The formulation of thermal radiation derived powder coating including graphene and carbon nanotube provides a significantly better heat transfer in the z-axis direction as shown in Fig. 1 .
[00013] The thermal radiation heat dissipation structure shown in Fig. 2 is similar to the thermal radiation heat dissipation structure shown in Fig. 1 , except a putty layer 210 is disposed between the metal substrate 1 10 and the thermal radiation derived powder coating 120 to enhance heat dissipation via thermal radiation 130.
[00014] Example putty layer materials include epoxy, silicone, and borax. Further, exemplary borax materials are sodium borate, sodium tetraborate, disodium tetraborate, a salt of boric acid and the like. In some examples, the metal substrate is an outside cover of the electronic device and/or a semiconductor element of the electronic device. Exemplary electronic device is a computing device, a laptop, a tablet, a smart phone, a notebook, and the like. Exemplary semiconductor elements housed in the electronic device is a central processing unit (CPU), LCD panel, LED, battery or any other such heat generating component/device.
[00015] In this manner, the present application discloses structures for dissipating heat generated from electronic components housed in electronic devices.
[00016] The foregoing describes novel structures for dissipating heat from electronic devices. While the above application has been shown and described with reference to the foregoing examples, it should be understood that other forms, details, and implementations may be made without departing from the spirit and scope of this application.
Claims
1. A thermal radiation heat dissipation structure for an electronic device, comprising: a metal substrate of the electronic device; and
a thermal radiation derived powder coating disposed on the metal substrate of the electronic device for dissipating heat from the electronic device via thermal radiation, wherein the thermal radiation derived powder coating comprises a resin and thermal radiation materials.
2. The thermal radiation heat dissipation structure of claim 1 , wherein the resin comprises materials selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polyethylene terephthalate - glycol (PET-G), poly vinyl chloride (PVC), polyacrylic, polyphenylene sulphide (PPS), thermoset polymers and thermoplastic polymers.
3. The thermal radiation heat dissipation structure of claim 1 , wherein the thermal radiation materials comprise materials selected from the group consisting of graphene, and carbon nanotube.
4. The thermal radiation heat dissipation structure of claim 3, wherein the thermal radiation derived powder coating comprises about 30% or less by weight of additives selected from the group consisting of aluminum, copper, silver, silicon, gold, diamond, silicon carbide, boron nitride, graphite and synthetic thermally conductive materials.
5. The thermal radiation heat dissipation structure of claim 3, wherein the thermal radiation derived powder coating comprises, by weight less than or about 40% of graphene, less than or about 3% of carbon nanotube, about 2% of diamond and about 10% of graphite.
6. The thermal radiation heat dissipation structure of claim 1 , wherein the thermal radiation derived powder coating having a thickness of about 5-60 micrometers (μιη).
7. The thermal radiation heat dissipation structure of claim 1 , wherein the metal substrate of the electronic device comprises materials selected from the group consisting
of aluminum, magnesium, lithium, zinc, titanium, niobium, stainless, copper, and metal alloy.
8. The thermal radiation heat dissipation structure of claim 1 , wherein the metal substrate is an outside cover of the electronic device and/or a semiconductor element of the electronic device.
9. A thermal radiation heat dissipation structure for an electronic device, comprising: a metal substrate of the electronic device;
a putty layer disposed on the metal substrate of the electronic device; and a thermal radiation derived powder coating disposed on the putty layer for dissipating heat from the electronic device via the putty layer and thermal radiation, wherein the thermal radiation derived powder coating comprises a resin and thermal radiation materials.
10. The thermal radiation heat dissipation structure of claim 9, wherein the putty layer comprises materials selected from the group consisting of epoxy, silicone, and borax.
1 1. The thermal radiation heat dissipation structure of claim 9, wherein the electronic device is a computing device, a laptop, a tablet, a smart phone, or a notebook.
12. An electronic device, comprising:
a metal substrate; and
a thermal radiation derived powder coating disposed on the metal substrate for dissipating heat from the electronic device via thermal radiation, wherein the thermal radiation derived powder coating comprises a resin and thermal radiation materials, and wherein the thermal radiation derived powder coating comprises, by weight less than or about 40% of graphene, less than or about 3% of carbon nanotube, about 2% of diamond and about 10% of graphite.
13. The electronic device of claim 12, wherein the resin comprises materials selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET),
polyethylene terephthalate - glycol (PET-G), poly vinyl chloride (PVC), thermoset polymers, polyacrylic, polyphenylene sulphide (PPS) and thermoplastic polymers.
14. The electronic device of claim 12, wherein the thermal radiation materials comprise materials selected from the group consisting of graphene, and carbon nanotube.
15. The electronic device of claim 14, wherein the thermal radiation derived powder coating comprise about 30% or less by weight of additives selected from the group consisting of aluminum, copper, silver, silicon, gold, diamond, silicon carbide, boron nitride, graphite and synthetic thermal conductive materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2015/042069 WO2017018999A1 (en) | 2015-07-24 | 2015-07-24 | Thermal radiation heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2015/042069 WO2017018999A1 (en) | 2015-07-24 | 2015-07-24 | Thermal radiation heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2017018999A1 true WO2017018999A1 (en) | 2017-02-02 |
Family
ID=57884971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2015/042069 WO2017018999A1 (en) | 2015-07-24 | 2015-07-24 | Thermal radiation heat dissipation structure |
Country Status (1)
| Country | Link |
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| WO (1) | WO2017018999A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019013793A1 (en) * | 2017-07-13 | 2019-01-17 | Hewlett-Packard Development Company, L.P. | Coating composition(s) |
| WO2020251549A1 (en) * | 2019-06-11 | 2020-12-17 | Hewlett-Packard Development Company, L.P. | Coated metal alloy substrates and process of production thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019013793A1 (en) * | 2017-07-13 | 2019-01-17 | Hewlett-Packard Development Company, L.P. | Coating composition(s) |
| CN110832050A (en) * | 2017-07-13 | 2020-02-21 | 惠普发展公司，有限责任合伙企业 | One or more coating compositions |
| JP2020523233A (en) * | 2017-07-13 | 2020-08-06 | ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． | Coating composition |
| EP3622034A4 (en) * | 2017-07-13 | 2020-11-25 | Hewlett-Packard Development Company, L.P. | COATING COMPOSITION (S) |
| US11309229B2 (en) | 2017-07-13 | 2022-04-19 | Hewlett-Packard Development Company, L.P. | Coating composition(s) |
| WO2020251549A1 (en) * | 2019-06-11 | 2020-12-17 | Hewlett-Packard Development Company, L.P. | Coated metal alloy substrates and process of production thereof |
| US20220112609A1 (en) * | 2019-06-11 | 2022-04-14 | Hewlett-Packard Development Company, L.P. | Coated metal alloy substrates and process of production thereof |
| US11952665B2 (en) | 2019-06-11 | 2024-04-09 | Hewlett-Packard Development Company, L.P. | Coated metal alloy substrates and process of production thereof |
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