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WO2018003950A1 - Bobine pour machine électrique rotative, procédé de production de bobine pour machine électrique rotative, bande de mica, procédé de production de bande de mica, produit durci de bande de mica, et article isolant - Google Patents

Bobine pour machine électrique rotative, procédé de production de bobine pour machine électrique rotative, bande de mica, procédé de production de bande de mica, produit durci de bande de mica, et article isolant Download PDF

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Publication number
WO2018003950A1
WO2018003950A1 PCT/JP2017/024056 JP2017024056W WO2018003950A1 WO 2018003950 A1 WO2018003950 A1 WO 2018003950A1 JP 2017024056 W JP2017024056 W JP 2017024056W WO 2018003950 A1 WO2018003950 A1 WO 2018003950A1
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WO
WIPO (PCT)
Prior art keywords
mica
mica tape
particle size
size distribution
boron nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/024056
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English (en)
Japanese (ja)
Inventor
みゆき 室町
貴耶 山本
士輝 宋
敬二 福島
竹澤　由高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2018525280A priority Critical patent/JPWO2018003950A1/ja
Publication of WO2018003950A1 publication Critical patent/WO2018003950A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/60—Composite insulating bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/06—Insulation of windings
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K3/00—Details of windings
    • H02K3/30—Windings characterised by the insulating material

Definitions

  • the present invention relates to a coil for a rotating electrical machine, a method for manufacturing a coil for a rotating electrical machine, a mica tape, a method for manufacturing a mica tape, a cured product of an mica tape, and an insulator.
  • a coil (hereinafter also simply referred to as a coil) used in a rotating electrical machine such as a generator or an electric motor generally has a coil conductor and an insulating layer disposed on the outer periphery of the coil conductor to insulate the coil conductor from the external environment. is doing.
  • a material for forming an insulating layer for insulating a member (insulator) such as a coil from an external environment an insulating material using mica called a mica tape is known.
  • the mica tape is generally mainly composed of a backing layer containing a backing material and a mica layer containing mica, and an insulating layer is formed by curing a resin impregnated in the mica tape.
  • Patent Document 1 discloses a mica tape in which alumina having a high thermal conductivity is filled as an inorganic filler in a mica layer. By using this mica tape, 0.32 W / (m ⁇ K) is disclosed. An insulating layer having a thermal conductivity of ⁇ 0.36 W / (m ⁇ K) is obtained.
  • Patent Document 2 discloses a mica tape in which a thermal conductive layer containing an inorganic filler having a high thermal conductivity is disposed on one surface, and 0.35 W / (m ⁇ K) to 0.48 W / ( An insulating layer having a thermal conductivity of m ⁇ K) is obtained.
  • Patent Document 3 discloses a method in which HTC (high thermal conductivity) particles are infiltrated into a backing layer of a mica tape, and the composite tape is impregnated into the composite tape through the backing layer.
  • the mica tape containing the inorganic filler may drop off from the mica tape.
  • the inorganic filler may flow out of the mica tape into the resin varnish and the amount of the inorganic filler remaining in the insulating layer may be reduced. Therefore, in order to obtain a high thermal conductivity, a large amount of the inorganic filler may be blended.
  • the quality of the resin varnish changes due to the outflow of the inorganic filler from the mica tape into the resin varnish.
  • an object of the present invention is to provide a coil for rotating electricity having an insulating layer containing a mica tape that can suppress the dropping of the inorganic filler from the mica tape, and a method for manufacturing the same. It is an object of the present invention to provide a mica tape capable of suppressing the falling off of the inorganic filler from the mica tape, a method for producing the mica tape, a cured product of the mica tape, and an insulator using the mica tape.
  • a coil conductor and an insulating layer disposed on an outer periphery of the coil conductor wherein the insulating layer includes a mica tape, and the mica tape includes a mica layer including mica, a backing material, and an inorganic filler.
  • the inorganic filler comprises boron nitride having a first particle size distribution peak existing in a range of 5 ⁇ m or less and a second particle size distribution peak existing in a range of 6 ⁇ m or more.
  • the first particle size distribution peak of the boron nitride exists in a range of 2 ⁇ m to 5 ⁇ m, and the second particle size distribution peak exists in a range of 6 ⁇ m to 10 ⁇ m.
  • Coil for rotating electrical machines ⁇ 3>
  • the content of the inorganic filler in the mica tape is 20% by volume to 50% by volume of the total volume of non-volatile components excluding the mica and the backing material, according to ⁇ 1> or ⁇ 2> Coil for rotating electrical machines.
  • ⁇ 4> The step of winding the mica tape around the outer periphery of the coil conductor, and the step of forming the insulating layer including the mica tape wound around the outer periphery of the coil conductor.
  • ⁇ 7> The mica tape according to ⁇ 5> or ⁇ 6>, wherein the content of the inorganic filler is 20% by volume to 50% by volume of the total volume of nonvolatile components excluding the mica and the backing material.
  • ⁇ 8> A step of arranging a backing material on mica to prepare a laminate, a first particle size distribution peak existing in a range of 5 ⁇ m or less, and a second particle size distribution peak existing in a range of 6 ⁇ m or more And a step of applying a composition containing an inorganic filler containing boron nitride and a resin component to the backing material side of the laminate.
  • ⁇ 9> The method for producing a mica tape according to claim 8, wherein the content of the inorganic filler in the composition is 20% by volume to 50% by volume of the entire nonvolatile content of the composition.
  • ⁇ 11> The cured product of mica tape according to any one of ⁇ 5> to ⁇ 7>, comprising a resin component and obtained by curing the resin component.
  • An insulator having an insulator and an insulating layer that is a cured product of the mica tape according to ⁇ 11>, which is disposed on at least a part of the surface of the insulator.
  • a coil for rotating electricity having an insulating layer containing a mica tape that can prevent the inorganic filler from dropping off from the mica tape, and a method for manufacturing the same.
  • the mica tape which can suppress the drop-off
  • the term “process” includes a process that is independent of other processes and includes the process if the purpose of the process is achieved even if it cannot be clearly distinguished from the other processes. It is.
  • numerical values indicated by using “to” include numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range. Good. Further, in the numerical ranges described in this specification, the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples.
  • the content rate or content of each component in the composition is such that when there are a plurality of substances corresponding to each component in the composition, the plurality of kinds present in the composition unless otherwise specified. It means the total content or content of substances.
  • the particle diameter of each component in the composition is a mixture of the plurality of types of particles present in the composition unless there is a specific indication when there are a plurality of types of particles corresponding to each component in the composition. Means the value of.
  • the term “layer” refers to the case where the layer is formed only in a part of the region in addition to the case where the layer is formed over the entire region. Is also included.
  • the term “lamination” indicates that layers are stacked, and two or more layers may be combined, or two or more layers may be detachable.
  • the coil for a rotating electrical machine of the present embodiment has a coil conductor and an insulating layer disposed on the outer periphery of the coil conductor, and the insulating layer includes mica tape,
  • the mica tape has a mica layer containing mica, and a backing layer containing a backing material and an inorganic filler, and the inorganic filler has a first particle size distribution peak existing in a range of 5 ⁇ m or less, and 6 ⁇ m or more. Boron nitride having a second particle size distribution peak present in the range.
  • the coil for a rotating electrical machine of the present embodiment includes a first particle size distribution peak in which the mica tape forming the insulating layer exists as an inorganic filler in a range of 5 ⁇ m or less, and a second particle size distribution peak in a range of 6 ⁇ m or more.
  • the dispersibility of boron nitride in the composition (varnish) used for producing the mica tape is improved and the viscosity is lowered. It can be suppressed. Furthermore, it is considered that in the backing layer formed using a composition in which boron nitride is well dispersed, boron nitride is easily trapped by the backing material, and the inorganic filler does not easily fall off.
  • the mica tape used for forming the insulating layer of the coil of the present embodiment are the same as those of the mica tape of the present embodiment described later. Further, the material, shape, size, and the like of the coil conductor used in the coil of the present embodiment are not particularly limited, and can be selected according to the use of the coil.
  • the method for manufacturing a coil for a rotating electrical machine of the present embodiment includes a step of winding a mica tape around the outer periphery of a coil conductor, a step of forming the insulating layer including the mica tape wound around the outer periphery of the coil conductor, Have
  • the method of winding the mica tape around the outer periphery of the coil conductor is not particularly limited, and a usual method can be adopted.
  • the method for forming the insulating layer including the mica tape wound around the outer periphery of the coil conductor is not particularly limited.
  • the mica tape is heated while being pressed (heat press), and the resin component contained in the mica tape is caused to flow out of the mica tape in advance to fill the space between the overlapping mica tapes.
  • the resin component is then formed by a method of curing this to form an insulating layer (in the case of prepreg mica tape), and after winding the mica tape around the coil conductor, a vacuum pressure impregnation method (Vacuum Pressure Impression, VPI).
  • VPI vacuum pressure impregnation method
  • Examples include a method of impregnating mica tape and curing it to form an insulating layer (in the case of dry mica tape).
  • the mica tape of the present embodiment has a mica layer containing mica, a backing layer containing a backing material and an inorganic filler, and the inorganic filler has a first particle size distribution peak existing in a range of 5 ⁇ m or less, And boron nitride having a second particle size distribution peak existing in a range of 6 ⁇ m or more. Boron nitride may have a particle size distribution peak other than the first particle size distribution peak and the second particle size distribution peak. Further, two or more first particle size distribution peaks may be present, and two or more second particle size distribution peaks may be present.
  • the mica tape of the present embodiment can form an insulating layer excellent in thermal conductivity while suppressing the amount of inorganic filler.
  • the present inventors consider as follows. First, it is mentioned that boron nitride contained as an inorganic filler exhibits high thermal conductivity. Furthermore, the boron nitride has a first particle size distribution peak that exists in a range of 5 ⁇ m or less and a second particle size distribution peak that exists in a range of 6 ⁇ m or more, so that small boron nitride is present between large boron nitride particles.
  • the dispersion of boron nitride in the composition (varnish) used for the preparation of the mica tape is improved and the viscosity is lowered, so that uneven distribution of boron nitride after coating is suppressed. It is done. Further, it is considered that boron nitride is easily trapped by the backing material in a backing layer formed using a composition in which boron nitride is well dispersed, and boron nitride is not easily dropped off.
  • FIG. 2 shows the state of boron nitride when both boron nitride corresponding to the first particle size distribution peak and boron nitride corresponding to the second particle size distribution peak exist, and nitridation corresponding to the second particle size distribution peak.
  • FIG. 2A shows the state of boron nitride when only boron exists.
  • the boron nitride is a surface. Orientation in a certain direction is suppressed, and the anisotropy of thermal conductivity tends to be reduced.
  • the thermal conductivity tends to be higher than that of boron nitride of the same filling amount.
  • the boron nitride is oriented in a certain direction in the plane, and the difference in thermal conductivity between the in-plane direction and the thickness direction tends to be large and anisotropy tends to occur.
  • the thermal conductivity anisotropy is suppressed, but the thermal conductivity is compared with boron nitride of the same filling amount. The rate tends to be low.
  • the first particle size distribution peak of boron nitride exists in the range of 1 ⁇ m to 4 ⁇ m and the second particle size distribution peak exists in the range of 8 ⁇ m to 11 ⁇ m. More preferably, the first particle size distribution peak is in the range of 2 ⁇ m to 3 ⁇ m, and the second particle size distribution peak is in the range of 9 ⁇ m to 10 ⁇ m.
  • the particle size distribution peak when the particle size distribution peak is present in a certain range, the case where all of the peaks including the particle size distribution peak exist within the range, and the case where a part of the mountain exists outside the range. Both are included. Furthermore, in the volume-based particle size distribution curve, the first particle size distribution peak existing in the range of 5 ⁇ m or less is smaller than the second particle size distribution peak existing in the range of 6 ⁇ m or more (peak height is low). Is preferred.
  • the second particle size distribution peak is preferably in the range of 6 ⁇ m to 100 ⁇ m.
  • Boron nitride preferably has a frequency at the first particle size distribution peak of 0.1% to 5%, more preferably 1% to 4%.
  • the frequency at the second particle size distribution peak is preferably 1% to 6%, and more preferably 2% to 5%.
  • Boron nitride preferably has a frequency at the first particle size distribution peak / frequency value at the second particle size distribution peak of less than 1, preferably 0.9 or less, and 0.8 or less. More preferred.
  • the frequency value at the first particle size distribution peak / the frequency value at the second particle size distribution peak is preferably 0.1 or more, and more preferably 0.2 or more.
  • Boron nitride preferably has a particle diameter (D10) of 0.1 ⁇ m to 3 ⁇ m when the accumulation from the small diameter side of the volume-based particle size distribution curve is 10%, and preferably has a particle diameter (D50) of 50%. ) Is preferably 3 ⁇ m to 8 ⁇ m, and the particle diameter (D90) at 90% is preferably 8 ⁇ m to 100 ⁇ m.
  • the value of D10 / D90 is preferably 0.001 to 0.333, and the value of D90-D10 is preferably 6 ⁇ m to 99 ⁇ m.
  • the particle size distribution peak of boron nitride can be measured by a laser diffraction method.
  • boron nitride is introduced into pure water and dispersed with an ultrasonic disperser, and a laser diffraction / scattering particle size distribution measuring device (for example, Nikkiso Co., Ltd., “Microtrack MT3000II” is obtained from the obtained dispersion. )).
  • a laser diffraction / scattering particle size distribution measuring device for example, Nikkiso Co., Ltd., “Microtrack MT3000II” is obtained from the obtained dispersion.
  • the filler component is extracted from the backing layer using an organic solvent and sufficiently dispersed with an ultrasonic disperser or the like. By measuring the particle size distribution of this dispersion, the particle size distribution of the filler can be measured.
  • FIG. 1 is a schematic cross-sectional view showing an example of the structure of the mica tape of this embodiment.
  • the mica tape may have a mica layer 6 containing mica 4 and a backing layer 5 containing a backing material 2 and an inorganic filler 1. Further, the mica layer 6 and the backing layer 5 may each contain the resin component 3.
  • the resin component 3 may be included in both the mica layer 6 and the backing layer 5 or only in one.
  • the resin component 3 may be included in the entire mica layer 6 (or the backing layer 5) or may be partially included.
  • the mica tape of this embodiment is a mica tape (prepreg mica tape) used in a method for forming an insulating layer by curing a resin component contained in a mica tape in advance after the mica tape is wound around an object to be insulated.
  • it may be a mica tape (dry mica tape) used in a method of forming an insulating layer by curing a resin component impregnated after being wound around an insulator.
  • the kind of mica is not particularly limited. Examples include unfired hard mica, fired hard mica, unfired soft mica, fired soft mica, synthetic mica, and flake mica. Among these, unfired hard mica is preferable from the viewpoint of adhesion between mica and the resin component.
  • the particle size of mica is not particularly limited.
  • the proportion of mica pieces having a particle diameter of 2.8 mm or more is preferably less than 45% by mass of the whole mica pieces, It is more preferably 30% by mass or less, and further preferably 20% by mass or less, based on the entire mica piece.
  • the proportion of mica pieces having a particle diameter of 0.5 mm or more when sieved using a JIS standard sieve is 40% by mass or more of the entire mica pieces. Is preferable, and it is more preferable that it is 60 mass% or more.
  • JIS-Z-8801-1: 2006 The JIS standard sieve conforms to JIS-Z-8801-1: 2006 and corresponds to ISO3310-1: 2000.
  • ISO3310-1: 2000 it is preferable to apply the one having a square mesh shape as in JIS-Z-8801-1: 2006.
  • Mica may be used alone or in combination of two or more.
  • two or more mica are used in combination, for example, when two or more mica having the same component and different particle sizes are used, when two or more mica having the same particle size and different components are used, and the average particle size and component The case where 2 or more types of mica having different types is used is mentioned.
  • the amount of mica in the mica layer is not particularly limited. For example, a range of 80 g / m 2 to 230 g / m 2 is preferable, and a range of 100 g / m 2 to 200 g / m 2 is more preferable. If the amount of mica in the mica layer is 80 g / m 2 or more, a decrease in insulation tends to be suppressed. If the amount of mica in the mica layer is 230 g / m 2 or less, the thickness of the mica tape can be reduced, and the decrease in thermal conductivity tends to be suppressed.
  • the type of the backing material is not particularly limited.
  • a glass cloth is mentioned.
  • the inorganic filler is taken in between the fibers constituting the glass cloth, and the falling of the inorganic filler tends to be suppressed.
  • the resin component penetrated between the fibers tends to be well integrated with the adjacent mica layer, and the thermal conductivity tends to be improved. Furthermore, there is a tendency that cuts, cracks and the like are less likely to occur when wound around an insulator.
  • a part of the fiber may be an organic material.
  • the fiber comprised in particular with an organic material is not restrict
  • a part of the glass cloth is a fiber composed of an organic material
  • the warp, the weft, or both may be a fiber composed of an organic material.
  • the average thickness of the backing material is not particularly limited.
  • the thickness is preferably 30 ⁇ m to 60 ⁇ m, and more preferably 45 ⁇ m to 50 ⁇ m.
  • the average thickness of the backing material is 30 ⁇ m or more, it is suppressed that the backing layer becomes too thin following the thickness of the backing material when the mica tape is pressed, and a decrease in thermal conductivity is suppressed. There is a tendency. If the thickness of the backing material is 60 ⁇ m or less, the thickness of the mica tape can be suppressed, and the occurrence of breakage, cracks, and the like of the mica tape during the process of winding the mica tape around the insulator tends to be suppressed.
  • the average thickness of the backing material is the arithmetic average value of the measured values obtained by measuring the thickness of the backing material at a total of 10 locations using a micrometer (MDC-SB, Mitutoyo Corporation). .
  • the backing material may be surface-treated if necessary.
  • Examples of the surface treatment method for the backing material include treatment with a silane coupling agent.
  • the inorganic filler includes boron nitride having a first particle size distribution peak that exists in a range of 5 ⁇ m or less and a second particle size distribution peak that exists in a range of 6 ⁇ m or more. Since boron nitride exhibits higher thermal conductivity than other inorganic fillers (for example, alumina), the thermal conductivity of the insulating layer formed from the mica tape tends to be further improved.
  • the inorganic filler may include inorganic fillers other than boron nitride such as silica and alumina.
  • the proportion of boron nitride in the inorganic filler is preferably 50% by mass or more, more preferably 70% by mass or more, and 90% by mass. More preferably, it is the above.
  • the type of boron nitride is not particularly limited, and examples include hexagonal boron nitride (h-BN), cubic boron nitride (c-BN), and wurtzite boron nitride. Among these, hexagonal boron nitride (h-BN) is preferable.
  • the boron nitride may be primary particles of boron nitride formed in a scale shape or secondary particles formed by agglomeration of primary particles.
  • the average particle size of the inorganic filler is not particularly limited as long as it contains boron nitride having a first particle size distribution peak existing in the range of 5 ⁇ m or less and a second particle size distribution peak existing in the range of 6 ⁇ m or more. .
  • it is preferably in the range of 3 ⁇ m to 8 ⁇ m, and more preferably in the range of 5 ⁇ m to 7 ⁇ m.
  • the average particle size of the inorganic filler can be measured by using, for example, a laser diffraction / scattering particle size distribution measuring apparatus (Nikkiso Co., Ltd., “Microtrack MT3000II”). Specifically, an inorganic filler is introduced into pure water and then dispersed with an ultrasonic disperser. By measuring the particle size distribution of the dispersion, the particle size distribution of the inorganic filler is measured. Based on this particle size distribution, the particle size (D50) corresponding to 50% volume accumulation from the small diameter side is determined as the average particle size.
  • a laser diffraction / scattering particle size distribution measuring apparatus Nikkiso Co., Ltd., “Microtrack MT3000II”.
  • the inorganic filler preferably has an aspect ratio in the range of 1 to 10, and more preferably in the range of 1 to 9. Further, the boron nitride contained in the inorganic filler preferably has an aspect ratio in the range of 1 to 10, more preferably in the range of 1 to 9.
  • the aspect ratio of the inorganic filler or boron nitride is in the range of 1 to 10
  • the surface area where the inorganic filler or boron nitride is in contact with the resin increases, and the inorganic filler or boron nitride is more closely attached to the backing material through the resin, and the coil
  • the scattering of the inorganic filler is more suppressed when the mica tape is wound around.
  • the ratio of the length of the major axis to the minor axis is measured for each of 20 representative particles, and the arithmetic average value of the obtained measured values is used.
  • the method for measuring the aspect ratio of the inorganic filler or boron nitride is not particularly limited.
  • a cured product of mica tape is cut in the thickness direction, and the cut surface is smoothed by ion milling, and then the cut surface obtained by depositing platinum is scanned with an electron microscope (SEM) (magnification: 3000 times). And can be measured using a micrometer.
  • SEM electron microscope
  • the inorganic filler may be used alone or in combination of two or more.
  • two or more inorganic fillers are used in combination, for example, when two or more inorganic fillers having the same component and different average particle sizes are used, two or more inorganic fillers having the same average particle size and different components are used, and A case where two or more inorganic fillers having different average particle diameters and types are used.
  • the inorganic filler may be surface-treated by a coupling agent, heat treatment or light treatment.
  • a coupling agent for example, in the case of heat treatment, impurities on the surface of the inorganic filler are removed by heating the inorganic filler at an appropriate high temperature (for example, 250 ° C. to 800 ° C.) for 1 hour to 3 hours. Therefore, the affinity when the inorganic filler is mixed with the resin component is improved, and the viscosity of the composition containing the inorganic filler and the resin component is lowered and tends to be easily applied. Further, the coated surface of the composition has few smears and irregularities and tends to improve smoothness.
  • the mica tape may contain a resin component.
  • the kind of resin used as the resin component is not particularly limited. From the viewpoint of curing the mica tape to form the insulating layer, a curable resin is preferable, and a thermosetting resin is more preferable.
  • the curable resin include an epoxy resin, a phenol resin, an unsaturated polyester resin, and a silicone resin. From the viewpoint of adhesion between the mica layer and the backing layer and electrical insulation, an epoxy resin is preferable.
  • Epoxy resins in the case of using an epoxy resin as a resin component include bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolak type epoxy resin, naphthalene type epoxy resin, cycloaliphatic epoxy resin, etc. Is mentioned. Among these, from the viewpoint of heat resistance, phenol novolac type epoxy resins, bisphenol A type epoxy resins and bisphenol F type epoxy resins are preferable.
  • the epoxy equivalent of the epoxy resin is not particularly limited. For example, it is preferably 130 g / eq to 500 g / eq, more preferably 135 g / eq to 400 g / eq, and even more preferably 140 g / eq to 300 g / eq.
  • the epoxy equivalent is measured by dissolving a precisely weighed epoxy resin in a solvent such as methyl ethyl ketone, adding acetic acid and a tetraethylammonium bromide acetic acid solution, and then performing potentiometric titration with a perchloric acid acetic acid standard solution. An indicator may be used for potentiometric titration.
  • the number average molecular weight of the resin used as the resin component is not particularly limited. For example, from the viewpoint of fluidity, it is preferably 100 to 100,000, more preferably 200 to 50,000, and still more preferably 300 to 10,000.
  • the number average molecular weight of the resin is a value measured under the following conditions using a gel permeation chromatography method (GPC) according to a conventional method.
  • a curing agent may be included as a resin component.
  • the curing agent is not particularly limited and can be appropriately selected depending on the type of the curable resin.
  • curing agent may be used individually by 1 type, or may use 2 or more types together.
  • the curing agent can be appropriately selected from curing agents usually used as a curing agent for epoxy resins. Specific examples include amine curing agents such as dicyandiamide and aromatic diamine; phenol resin curing agents such as phenol novolac and cresol novolac; acid anhydride curing agents such as alicyclic acid anhydrides and the like.
  • the ratio of the curing agent to the epoxy resin should be 0.8 to 1.2 in terms of equivalent ratio (curing agent / epoxy resin) from the viewpoint of curability and electrical characteristics of the cured product To preferred.
  • a curing catalyst may be included for the purpose of accelerating the curing reaction of the curable resin.
  • the curing catalyst is not particularly limited, and can be selected according to the type of the curable resin and the curing agent used as necessary.
  • Specific examples of the curing catalyst include tertiary amine compounds such as trimethylamine, imidazole compounds such as 2-methylimidazole and 2-methyl-4-ethylimidazole, organometallic salts such as tin, zinc and cobalt, boron trifluoride.
  • examples include amine complexes of Lewis acids such as monoethylamine, and organic phosphorus compounds such as organic phosphine compounds.
  • a hardening accelerator may be used individually by 1 type, or may use 2 or more types together.
  • the content is not particularly limited.
  • the content of the curing catalyst is generally in the range of 0.01% by mass to 5% by mass with respect to the total amount of the epoxy resin and the curing agent included as necessary. is there.
  • the mica tape may contain other components other than the components described above as necessary.
  • examples of other components include coupling agents, antioxidants, anti-aging agents, stabilizers, flame retardants, and thickeners.
  • the content is not particularly limited.
  • the mica tape of this embodiment has a mica layer containing mica and a backing layer containing a backing material and boron nitride, and may have other layers as necessary.
  • the other layer include a protective layer (protective film) provided on the outermost surface of the mica tape.
  • the average thickness of the mica tape (the total thickness of the mica layer and the backing layer) is not particularly limited.
  • the average thickness of the mica tape may be 400 ⁇ m or less, preferably 350 ⁇ m or less, and more preferably 300 ⁇ m or less.
  • the average thickness of the mica tape is preferably 300 ⁇ m or less and more preferably 290 ⁇ m or less from the viewpoint of easy winding of the mica tape. From the viewpoint of electrical insulation, the average thickness of the mica tape is preferably 120 ⁇ m or more, more preferably 150 ⁇ m or more, and further preferably 160 ⁇ m or more.
  • the average thickness of the mica tape is preferably 220 ⁇ m or less and more preferably 190 ⁇ m or less from the viewpoint of ease of winding the mica tape. From the viewpoint of electrical insulation, the average thickness of the mica tape is preferably 120 ⁇ m or more, more preferably 150 ⁇ m or more, and further preferably 180 ⁇ m or more.
  • the average thickness of the mica layer is not particularly limited. From the viewpoint of ease of winding the mica tape, the average thickness of the mica layer is preferably 180 ⁇ m or less, and more preferably 170 ⁇ m or less. From the viewpoint of electrical insulation, the average thickness of the mica layer is preferably 80 ⁇ m or more, and more preferably 90 ⁇ m or more.
  • the average thickness of the backing layer is not particularly limited. From the viewpoint of ease of winding the mica tape, the average thickness of the backing layer is preferably 60 ⁇ m or less, and more preferably 50 ⁇ m or less. From the viewpoint of the strength of the mica tape, the average thickness of the backing layer is preferably 10 ⁇ m or more, and more preferably 20 ⁇ m or more.
  • the average thickness of the mica tape (the total thickness of the mica layer and the backing layer) was measured at a total of 10 locations using a micrometer (MDC-SB, Mitutoyo Corporation). The arithmetic average value of the measured values obtained is used.
  • the thickness of the mica layer and the backing layer in the mica tape is determined by measuring the thickness of the mica layer and the backing layer in the cross section of the mica tape with a micrometer of a stereomicroscope (for example, Olympus Corporation “BX51”). Observe 3 points and use the arithmetic average.
  • a stereomicroscope for example, Olympus Corporation “BX51”.
  • the content of the inorganic filler in the nonvolatile content excluding mica and the backing material of the mica tape is not particularly limited. For example, it is preferably 20% by volume to 50% by volume and more preferably 25% by volume to 35% by volume of the total volume of non-volatile components excluding mica and the backing material.
  • the content of the inorganic filler is 20% by volume or more of the total volume of nonvolatile components excluding mica and the backing material, the thermal conductivity of the insulating layer formed from the mica tape tends to be further improved.
  • the content of the inorganic filler is 50% by volume or less of the total volume of non-volatile components excluding mica and the backing material, filling of the inorganic filler into the resin component tends to be facilitated.
  • the content of non-volatile components excluding mica and the backing material in the total mass of the mica layer and the backing layer of the mica tape is not particularly limited. For example, it is preferably 5% by mass to 45% by mass of the total mass of the mica layer and the backing layer, more preferably 10% by mass to 30% by mass, and further preferably 15% by mass to 20% by mass. preferable.
  • the content of nonvolatile components excluding mica and the backing material is 5% by mass or more of the total mass of the mica layer and the backing layer, the thermal conductivity tends to be more effectively improved.
  • the non-volatile content excluding mica and the backing material is 45% by mass or less of the total mass of the mica layer and the backing layer, an increase in the thickness of the mica tape tends to be suppressed. In addition, varnish impregnation tends to proceed during the production of mica tape.
  • the content of the resin component in the nonvolatile content excluding mica and the backing material of the mica tape is not particularly limited. For example, it is preferably 35% by mass to 70% by mass, more preferably 50% by mass to 65% by mass, and more preferably 55% by mass to 60% by mass with respect to the total mass of the nonvolatile content excluding mica and the backing material. More preferably.
  • the content of the resin component is 35% by mass or more of the total mass of nonvolatile components excluding mica and the backing material, the adhesion between the backing layer and the mica layer tends to be improved.
  • the content of the resin component is 70% by mass or less of the total nonvolatile content excluding mica and the backing material, the thermal conductivity tends to be improved.
  • the content of the resin component in the mica tape is not particularly limited and can be selected according to the use of the mica tape.
  • the content of the resin component may be 40% by mass or less of the total mass of the mica layer and the backing layer, and is preferably 5% by mass to 33% by mass.
  • the content of the resin component is preferably 25% by mass to 33% by mass of the total mass of the mica layer and the backing layer, for example, 25% by mass to 30% by mass. It is more preferable that When the content of the resin component is 25% by mass or more of the total mass of the mica layer and the backing layer, the mica from the mica tape and, if necessary, the falling off (powder off) of the inorganic filler are suppressed, and the insulator As a result of the occurrence of cracks, cuts, wrinkles, and the like of the mica tape when the mica tape is wound around, the insulation reliability and the thermal conductivity tend to be suppressed.
  • the content of the resin component is 33% by mass or less of the total mass of the mica layer and the backing layer, an increase in the thickness of the mica tape is suppressed and good winding properties tend to be maintained. Furthermore, the resin component tends to be prevented from dropping beyond the volume necessary to fill the gap between the overlapping mica tapes with the mica tape wound around the insulator. As a result, generation of voids is reduced, and a decrease in insulation reliability tends to be suppressed.
  • the content of the resin component in the mica tape is preferably 5% by mass to 15% by mass of the total mass of the mica layer and the backing layer, for example, 5% by mass. More preferably, it is ⁇ 12% by mass, and further preferably 8% by mass to 10% by mass.
  • the content of the resin component is 5% by mass or more of the total mass of the mica layer and the backing layer, the adhesion between the backing layer and the mica layer tends to be sufficiently secured.
  • the content of the resin component is 15% by mass or less of the total mass of the mica layer and the backing layer, high thermal conductivity tends to be achieved.
  • the content rate of the resin component in the mica tape is calculated by the following method, for example.
  • the mica tape cut to a size of 30 mm in width and 50 mm in length is heated in an electric furnace at 600 ° C. for 2 hours, and the mass reduction rate (%) before and after heating is obtained by the following formula.
  • the above process is performed three times, and an arithmetic average value of the obtained values is obtained.
  • Content of resin component ⁇ (mass before heating ⁇ mass after heating) / mass before heating ⁇ ⁇ 100
  • the content of the resin component in the mica layer is preferably 15% by mass or less of the total mass of the mica layer, and more preferably 10% by mass or less. More preferably, it is 5 mass% or less, and it is especially preferable that it is 0 mass%.
  • the mica layer preferably contains substantially no inorganic filler other than mica.
  • the content of the inorganic filler other than mica in the mica layer is preferably 3% by mass or less, more preferably 2% by mass or less, and more preferably 1% by mass or less of the total mass of the mica layer. More preferably, it is particularly preferably 0% by mass.
  • the mica layer does not substantially contain fibrites.
  • the content of fibrils in the mica layer is preferably 1% by mass or less of the total mass of the mica layer, more preferably 0.5% by mass or less, and 0.1% by mass. The following is more preferable, and 0% by mass is particularly preferable.
  • the fibrit is a fibrous substance mixed so that the mica layer can stand on its own, and examples thereof include organic fibers such as polyamide and polyimide, and inorganic fibers such as glass fibers.
  • the mica tape of this embodiment may be manufactured through any process, and conventionally known manufacturing methods can be applied.
  • the details and preferred embodiments of the mica, backing material, inorganic filler and resin component used in the above method, and the produced mica tape are as described above.
  • the mica paper is a sheet-like object formed by collecting mica pieces.
  • the composition may contain a solvent.
  • the solvent By including the solvent, the viscosity of the composition is lowered, and the inorganic filler tends to be easily mixed.
  • the type of the solvent is not particularly limited, and can be selected from commonly used organic solvents. Specific examples include methyl ethyl ketone, toluene, methanol, cyclohexanone and the like.
  • a solvent may be used individually by 1 type, or may use 2 or more types together.
  • the content of the inorganic filler in the composition is not particularly limited. For example, it is preferably 20% by volume to 90% by volume, and more preferably 25% by volume to 35% by volume of the total nonvolatile content (components excluding the solvent) of the composition.
  • the content of the inorganic filler is 20% by volume or more of the entire nonvolatile content of the composition, the thermal conductivity of the insulating layer formed using mica tape tends to be further improved.
  • the content of the inorganic filler is 90% by volume or less of the entire nonvolatile content of the composition, the mixing property of the inorganic filler and the resin component tends to be improved.
  • the viscosity at the time of application of the composition is not particularly limited. For example, it is preferably 500 mPa ⁇ s to 3000 mPa ⁇ s.
  • the viscosity at the time of application of the composition is a temperature of the composition when the composition is applied to the backing material, and is a value measured using an E-type viscometer under a condition of 50 revolutions / minute (rpm).
  • the application of the composition can be performed, for example, by applying the composition to the backing material using a roll coater or the like.
  • the composition applied to the backing material oozes out to the other surface side of the backing material and penetrates all or part of the mica paper.
  • the mica paper can easily become independent and is not easily collapsed.
  • the thermal conductivity tends to be improved.
  • the mica tape of this embodiment can be used, for example, for forming an insulating layer provided on the outer periphery of an insulator such as a coil conductor used for a rotating electrical machine coil or the like.
  • the cured product of the mica tape of this embodiment is obtained by curing the mica tape described above. More specifically, it is obtained by curing a resin component contained in a mica tape.
  • the curing method is not particularly limited, and can be selected from ordinary methods.
  • the insulator of this embodiment includes an insulator and an insulating layer that is a cured product of the mica tape of this embodiment that is disposed on at least a part of the surface of the insulator.
  • the method for forming the insulating layer using the mica tape of the present embodiment is not particularly limited, and conventionally known production methods can be applied. For example, after winding mica tape around an insulator, heat it while applying pressure to the mica tape (heat press), and let the resin component contained in the mica tape flow out of the mica tape in advance and overlap between the overlapping mica tapes.
  • a resin component is formed by filling and curing an insulating layer (in the case of a prepreg mica tape), winding a mica tape around an insulator, and then applying a vacuum pressure impregnation (VPI).
  • a vacuum pressure impregnation A method of impregnating a mica tape and curing the same to form an insulating layer (in the case of dry mica tape).
  • the resin component impregnated into the mica tape is not particularly limited.
  • epoxy resins such as a bisphenol A type epoxy resin
  • curing agents such as an alicyclic acid anhydride
  • the impregnation method of the resin component in the vacuum pressure impregnation method the curing conditions after the impregnation, the ratio of the epoxy resin and the curing agent, etc., conventionally known methods, known conditions and the like can be referred to.
  • the kind of insulator to be insulated is not particularly limited, and examples thereof include metal materials (copper, etc.) having shapes such as coils, rods, and plates.
  • Specific examples of the insulator include a coil conductor of a coil for a rotating electrical machine.
  • an insulating layer exhibiting high thermal conductivity can be formed. Therefore, when the insulator of this embodiment is a coil, when cooling the coil, a hydrogen cooling method or an air cooling method should be adopted even for a coil of a scale that conventionally employs a direct water cooling method. As a result, the coil structure can be simplified.
  • Example 1 (1) Production of mica paper Unfired hard mica was dispersed in water to form mica particles, and the mica was made with a paper machine to produce mica paper having a mica amount of 140 g / m 2 .
  • boron nitride (Electrochemical Industry Co., Ltd.) having a particle size distribution peak in the range of 2 ⁇ m to 3 ⁇ m and in the range of 7 ⁇ m to 9 ⁇ m is added and stirred, and boron nitride containing boron nitride as an inorganic filler A containing varnish was prepared.
  • the particle size distribution of the boron nitride used is shown in FIG.
  • the particle size distribution of boron nitride was measured by a laser diffraction method using Nikkiso Co., Ltd. “Microtrack MT3000II”). Specifically, 10 mg of boron nitride was added to 50 mg of pure water and dispersed by shaking for 10 minutes. 20 ml was injected into the cell and measured at 25 ° C. The refractive index of water was 1.333, and the refractive index of boron nitride was 2.17. The ratio by mass of the epoxy resin and the curing catalyst in the boron nitride-containing varnish (epoxy resin: curing catalyst) was 97: 3.
  • Example 2 Production of mica paper Unfired hard mica was dispersed in water to form mica particles, and the paper was made with a paper machine to produce mica paper having a mica amount of 180 g / m 2 .
  • Epoxy novolak resin (Dow Chemical Japan Co., Ltd., trade name “D.N.438” (“D.N.” is a registered trademark)) 36 as a resin component 0.7% by mass, 1.1% by mass of boron trifluoride monoethylamine (Wako Pure Chemical Industries, Ltd.) as a curing accelerator, and 31.1% by mass of methyl ethyl ketone (Wako Pure Chemical Industries, Ltd.) as a solvent did.
  • boron nitride (Electrochemical Co., Ltd.) having a particle size distribution peak in the range of 2 ⁇ m to 3 ⁇ m and in the range of 7 ⁇ m to 9 ⁇ m was added and further mixed to prepare a boron nitride-containing varnish.
  • Example 2 A mica tape was prepared in the same manner as in Example 2 except that boron nitride (electrochemical industry) having a particle size distribution peak of only 6 ⁇ m was used as the boron nitride used for the preparation of the boron nitride-containing varnish. And evaluated. The results are shown in Table 1. Further, when the mica tape was produced, uneven coating and resin loss occurred, resulting in a non-uniform tape. When a 16-layer laminated cured product of mica tape was produced, the presence or absence of outflow of boron nitride was visually confirmed. As a result, the varnish extruded by the press became cloudy and outflow of boron nitride occurred.
  • boron nitride electrochemical industry
  • Example 3 Mica tape and lamination hardening were carried out in the same manner as in Example 1 except that boron nitride (Electrochemical Industry Co., Ltd.) having a particle size distribution peak of only 2 ⁇ m was used as boron nitride used for the preparation of the boron nitride-containing varnish. A product was prepared and evaluated. The results are shown in Table 1. Moreover, when the presence or absence of outflow of boron nitride into the impregnating varnish during vacuum impregnation was visually confirmed, the impregnating varnish became cloudy and outflow of boron nitride occurred.
  • boron nitride Electrochemical Industry Co., Ltd.
  • a mica tape was prepared in the same manner as in Example 2 except that boron nitride (electrochemical industry) having a particle size distribution peak of only 6 ⁇ m was used as the boron nitride used for the preparation of the boron nitride-containing varnish. And evaluated. The results are shown in Table 1. Further, when the mica tape was produced, uneven coating and resin loss occurred, resulting in a non-uniform tape. When a 16-layer laminated cured product of mica tape was produced, the presence or absence of outflow of boron nitride was visually confirmed. As a result, the varnish extruded by the press became cloudy and outflow of boron nitride occurred.
  • boron nitride electrochemical industry
  • Example 1 using boron nitride having a first particle size distribution peak existing in a range of 5 ⁇ m or less and a second particle size distribution peak present in a range of 7 ⁇ m or more is a particle size distribution.
  • Good thermal conductivity was achieved even with a small amount of boron nitride as compared with Comparative Example 1 using boron nitride having a peak only at 6 ⁇ m.
  • Example 2 using boron nitride having a first particle size distribution peak existing in a range of 5 ⁇ m or less and a second particle size distribution peak present in a range of 6 ⁇ m or more has a particle size distribution peak of 6 ⁇ m. Thermal conductivity was significantly improved with the same amount of boron nitride as in Comparative Example 2 using only boron nitride.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Insulating Bodies (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)

Abstract

La présente invention concerne une bobine pour une machine électrique rotative comprenant un conducteur de bobine et une couche isolante disposée sur la périphérie extérieure du conducteur de bobine. La couche isolante comprend une bande de mica. La bande de mica comprend : une couche de mica comprenant du mica ; et une couche de support comprenant un matériau de support et un agent de remplissage inorganique. L'agent de remplissage inorganique comprend du nitrure de bore ayant un premier pic de distribution de taille de particule qui est présent dans une plage inférieure ou égale à 5 µm et un second pic de distribution de taille de particule qui est présent dans une plage supérieure ou égale à 6 µm.
PCT/JP2017/024056 2016-06-29 2017-06-29 Bobine pour machine électrique rotative, procédé de production de bobine pour machine électrique rotative, bande de mica, procédé de production de bande de mica, produit durci de bande de mica, et article isolant Ceased WO2018003950A1 (fr)

Priority Applications (1)

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JP2018525280A JPWO2018003950A1 (ja) 2016-06-29 2017-06-29 回転電機用コイル、回転電機用コイルの製造方法、マイカテープ、マイカテープの製造方法、マイカテープの硬化物及び絶縁物

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JPPCT/JP2016/069361 2016-06-29
PCT/JP2016/069361 WO2018003043A1 (fr) 2016-06-29 2016-06-29 Bobine pour machine électrique tournante, procédé de fabrication de bobine pour machine électrique tournante, bande de mica, procédé de fabrication de bande de mica, produit durci de bande de mica et matériau isolant

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PCT/JP2017/024056 Ceased WO2018003950A1 (fr) 2016-06-29 2017-06-29 Bobine pour machine électrique rotative, procédé de production de bobine pour machine électrique rotative, bande de mica, procédé de production de bande de mica, produit durci de bande de mica, et article isolant

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JP2020115732A (ja) * 2019-01-18 2020-07-30 西芝電機株式会社 回転子コイルの製造方法

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US11196142B2 (en) 2018-08-31 2021-12-07 Micron Technology, Inc. Millimeter wave antenna and EMI shielding integrated with fan-out package
WO2020075269A1 (fr) * 2018-10-11 2020-04-16 三菱電機株式会社 Bobine de stator, son procédé de fabrication, et machine électrique tournante

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JPH0945133A (ja) * 1995-08-01 1997-02-14 Japan Mica Ind Co Ltd マイカ基材シート状体及び絶縁コイル
JPH11206056A (ja) * 1998-01-12 1999-07-30 Hitachi Ltd 絶縁コイルおよびこれを用いた回転電機
JP2014141626A (ja) * 2012-12-28 2014-08-07 Konica Minolta Inc 塗布液、反射膜、反射シート、太陽電池モジュール、ｌｅｄ照明装置および実装用基板
WO2015053374A1 (fr) * 2013-10-09 2015-04-16 日立化成株式会社 Bande de mica préimprégnée et bobine la comprenant

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JPH0945133A (ja) * 1995-08-01 1997-02-14 Japan Mica Ind Co Ltd マイカ基材シート状体及び絶縁コイル
JPH11206056A (ja) * 1998-01-12 1999-07-30 Hitachi Ltd 絶縁コイルおよびこれを用いた回転電機
JP2014141626A (ja) * 2012-12-28 2014-08-07 Konica Minolta Inc 塗布液、反射膜、反射シート、太陽電池モジュール、ｌｅｄ照明装置および実装用基板
WO2015053374A1 (fr) * 2013-10-09 2015-04-16 日立化成株式会社 Bande de mica préimprégnée et bobine la comprenant

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020115732A (ja) * 2019-01-18 2020-07-30 西芝電機株式会社 回転子コイルの製造方法

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