[go: up one dir, main page]

WO2018145085A1 - Gestion de la chaleur de dispositifs électroniques - Google Patents

Gestion de la chaleur de dispositifs électroniques Download PDF

Info

Publication number
WO2018145085A1
WO2018145085A1 PCT/US2018/017059 US2018017059W WO2018145085A1 WO 2018145085 A1 WO2018145085 A1 WO 2018145085A1 US 2018017059 W US2018017059 W US 2018017059W WO 2018145085 A1 WO2018145085 A1 WO 2018145085A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
case
frame
temple
conduction pathway
Prior art date
Application number
PCT/US2018/017059
Other languages
English (en)
Inventor
Andrea ASHWOOD
Ashutosh Y. Shukla
Stephen Andrew Steger
Original Assignee
Snap, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/425,774 external-priority patent/US10042187B2/en
Application filed by Snap, Inc. filed Critical Snap, Inc.
Publication of WO2018145085A1 publication Critical patent/WO2018145085A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C5/00—Constructions of non-optical parts
    • G02C5/14—Side-members
    • G02C5/18—Side-members reinforced
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
    • A45C11/04—Spectacle cases; Pince-nez cases
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C5/00—Rigid or semi-rigid luggage
    • A45C5/02—Materials therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C11/00—Non-optical adjuncts; Attachment thereof
    • G02C11/10—Electronic devices other than hearing aids
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C5/00—Constructions of non-optical parts
    • G02C5/22—Hinges
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • G02B27/017—Head mounted
    • G02B2027/0178—Eyeglass type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation

Definitions

  • TECHNICAL FIELD [0002] The subject matter disclosed herein generally relates to conducting heat from electronic devices. More specifically, the present disclosure discloses apparatuses, systems and techniques used to conduct heat from electronics housed within a wearable device.
  • FIG. 1 is a plan view of eyewear comprising a wearable electronic device including temples, a frame, onboard electronic components housed in the frame according to one embodiment.
  • FIG. 2 is a perspective view of the eyewear disposed in a case and a heat conduction pathway from the eyewear into the case according to one embodiment.
  • FIG. 3 is a perspective view of the case with the eyewear removed showing ledges, a docking port, and a portion of the heat conduction pathway according to one embodiment.
  • FIG. 4 is a perspective view of a second embodiment of the case with portions of the case removed to illustrate a second embodiment of the heat conduction pathway.
  • FIG. 5A is a first plan view of the ledge and heat conduction pathway of the case and a portion of the frame housing the electronics and further illustrating heat being conducted from the frame to the heat conduction pathway according to one embodiment.
  • FIG. 5B is perspective view of a rear portion of the frame, the ledge and heat conduction pathway of the case and further illustrating heat being conducted from the frame to the heat conduction pathway the according to one embodiment.
  • FIG. 6 is a perspective view of the onboard electronic components, a thermal coupling, and a hinge assembly with portions of the frame and temples removed according to one embodiment.
  • One aspect of this disclosure relates to small form electronic devices, such as an eyewear article with onboard electronic components such as a camera, a processor, WiFi module, and various other modules as is shown in FIGS. 1, 2 and 5A-6.
  • eyewear articles are referred to herein as smart glasses.
  • the onboard electronic components are carried by the smart glasses, being located as in the frame (as illustrated in FIGS. 1, 5 A and 6) and/ or in the temple(s).
  • the onboard electronic components can generate large amounts of heat relative to the form factor during electrically powered operation of the smart glasses.
  • the smart glasses are disposable in two major configurations. In a stowed position, one or both of the temples are folded by the frame to a non- wearable position for the user. In a wearable position, both of the temples are extended so as to be received around a user's face.
  • the onboard electronic components of the smart glasses can run software to perform tasks in the stowed position or the wearable position. For example, the tasks include transferring data, capturing sensor data, managing power usage, and so on. Performance of the tasks in such stowed position can improve the glasses' efficiency and user experience by allowing the tasks to be performed even when the smart glasses are not fully put to use being worn by the user.
  • a heat conduction pathway internal to the smart glasses for transferring heat away from the onboard electronic components toward the back of the frame or to the temple(s) along a core wire.
  • such an internal heat transfer pathway can include a thermal coupling between the temple and the frame to conduct heat across the articulated joint both when the temple(s) is in the wearable position and when the temple is in the stowed position.
  • an external heat conduction pathway is in some example embodiments provided to conduct heat externally to the smart glasses.
  • the external heat conduction pathway is in some embodiments provided by a case or carrier (e.g., FIGS. 2-5B) that can be used to house the smart glasses in the stowed position.
  • the external heat conduction pathway in such embodiments conducts heat away from the onboard electronic components and smart glasses and into designated portions of the case.
  • the case can have a port (e.g., FIGS. 4A and 4B) for data and/or power transfer to a mating port on the smart glasses.
  • the case can be used for recharging of a battery of the smart glasses in addition to providing a heat transfer pathway, for example.
  • the disclosed thermal coupling transfers heat generated by the onboard electronic components away therefrom and away from the smart glasses to the case. This reduces the likelihood of localized heating adjacent the onboard electronic components.
  • the smart glasses and the case that can provide for the thermal coupling between the smart glasses and the case. More particularly, the thermal coupling can extend internally within the frame, from a backside of the temples adjacent a hinge assembly between the temple and the frame and along the case to facilitate a more desirable heat transfer path of the heat away from the onboard electronic components to the case as shown in FIGS. 2-5B.
  • the thermal coupling can include a cap hinge. The cap hinge is part of the thermal coupling as well as the housing of the frame and the hinge assembly (e.g., FIGS.
  • the cap hinge abuts one or more internal surfaces disposed within the frame to form a conductive heat exchange relationship.
  • the cap hinge abuts one or more heat sinks internal to the frame.
  • These internal heat sinks carry the onboard electronics components thereon.
  • a conductive heat conduction pathway is formed from the internal heat sinks to the cap hinge and from the cap hinge to the second heat transfer pathway in the case as shown in FIGS. 2-5B.
  • either the frame (on one or both sides), both the frame and the temple(s), or at least one of the temples carries the onboard electronic components.
  • the second heat conduction pathway can be part of both sides of the case as shown in FIGS. 2 and 3 or one side of the case as shown in FIG. 4.
  • the onboard electronic components and heat conduction pathways can be disposed on both the left and right side portions of the frame and each respective left and right side of the case according to some embodiments.
  • Embodiments described herein relate to apparatuses, systems and techniques that provide for heat management in smart glasses by conducting heat away from onboard electronic components to off-board and/or off-device heat sink(s). This can include conducting the heat into a holding case for the smart glasses. These arrangements can make the smart glasses as more reliable and wearable for the user. For example, conducting heat into the case and away from the onboard electronic components in the smart glasses can allow for increased data transfer rates from the smart glasses (e.g. data transferred via WiFi or other communication modalities).
  • Smart glasses include onboard electronic components such as a power source, power and communication related circuitry, communication devices (e.g., a camera, a microphone, or sensors), display devices, a computer, a memory, modules, and/or the like.
  • the smart glasses comprise an eyewear body configured for wearing by a user to hold one or more optical elements mounted on the eyewear body within a field of view of the user.
  • optical elements can include not just lenses, but may in some embodiments comprise any object that can be held close to the eye and through which or from which light is passed to the eye not only lenses (which may be corrective or non- correct, colored or non-colored, but also includes various other optical elements.
  • Such optical elements therefore can include displays, virtual reality displays, near-eye display surfaces such as those of a smartphone or tablet, and at least partially transmissive lenses or the like.
  • the smart glasses include the frame and a pair of the temples coupled thereto on opposite ends of the frame at articulated joints.
  • the temple is in the wearable configuration or position when at least one of both temples are substantially fully unfolded for reception along a side of the user's head.
  • the temple(s) is in the collapsed
  • the smart glasses can be in both the wearable configuration and the collapsed configuration at the same time (e.g., one temple unfolded the other temple folded towards the frame) and the onboard electronics components can be electrically powered so as to be operable in either condition as previously discussed.
  • FIG. 1 shows a plan view of a front of a pair of smart glasses 12.
  • the smart glasses 12 can comprise an eyewear body 13.
  • the eyewear body 13 can include one or more temples 14A and 14B and a frame 16.
  • the smart glasses 12 can additionally include articulated joints 18A and 18B, onboard electronic components 20A and 20B, and core wires 22A, 22B and 24.
  • the eyewear body 13 are configured for wearing by a user to hold one or more optical elements mounted on the eyewear body 13 within a field of view of a user. More particularly, the frame 16 holds the one or more optical elements, while the temples 14A and 14B connect to the frame 16 at the respective articulated joints 18A and 18B.
  • the temples 14A and 14B comprise elongate members having core wires 22A and 22B extending therein.
  • the temple 14A is illustrated in the wearable position while the temple 14B is illustrated in the stowed position.
  • the temple 14A connects to a right end portion 26 A of the frame 16 via the articulated joint 18 A.
  • the temple 14B connects to a left end portion 26B of the frame 16 via the articulated joint 18B.
  • the right end portion 26A of the frame 16 can carry the onboard electronic components 20 A by housing the onboard electronic components 20A therein
  • the left end portion 26B can carry the onboard electronic components 20B by housing the onboard electronic components 20B therein.
  • the core wire 22A comprises a portion of the temple 14A (e.g., is embedded within a plastics material or other material that comprises an outer cap of the temple 14 A) and extends longitudinally from adjacent the articulated joint 18A toward a second longitudinal end of the temple 14A.
  • the core wire 22B comprises a portion of the temple 14B (e.g., is embedded within a plastics material or other material that comprises an outer cap of the temple 14B) and extends longitudinally from adjacent the articulated joint 18B toward a second longitudinal end of the temple 14B.
  • the core wire 24 extends from the right end portion (terminating adjacent the onboard electronic components 20 A) to the left end portion 26B (terminating adjacent the onboard electronic components 20B).
  • the eyewear body 13 carries the onboard electronic components 20A and 20B (e.g., either or both of the temple(s) 14A, 14B and/or the frame 16 carry electronics).
  • the onboard electronic components 20A and 20B comprise a heat source that generates heat during electrically powered operation.
  • the onboard electronic components 20A and 20B can comprise a power source, power and communication related circuitry, communication devices (e.g., a camera, a microphone, sensors, etc.), display devices, a computer, a memory, modules, and/or the like.
  • the power source e.g., a battery
  • the communication devices such as the camera, etc. can be housed within the right end portion 26 A of the frame 16 in some embodiments.
  • the temples 14 A, 14B and the frame 16 can be constructed of a plastics material, cellulosic plastic (e.g., cellulosic acetate), an eco-plastic material, a thermoplastic material, or the like in addition to the core wires 22A, 22B and 24.
  • the core wires 22A, 22B and 24 act to provide structural integrity to the eyewear body 13 (i.e. the temple(s) 14A, 14B and/or the frame 16).
  • the core wires 22A, 22B and/or 24 act as a heat sink to transfer the heat generated by the onboard electronic components 20 A and 20B away thereform so as to reduce the likelihood of localized heating adjacent the onboard electronic components 20 A and 20B.
  • the core wires 22 A, 22B and/or 24 are thermally coupled to the heat source to provide a heat sink for the heat source.
  • the core wires 22A, 22B and/or 24 are constructed of a relatively flexible conductive metal or metal alloy material such as one or more of an aluminum, an alloy of aluminum, alloys of nickel-silver, and a stainless steel, according to some embodiments.
  • the temple 14A and core wire 22A extend generally longitudinally rearward from a rear facing surface of the right end portion 26A of the frame 16.
  • the articulated joint 18A (shown in dashed) comprises a hinge assembly 28 that includes hinge projections configured to mate with one another as illustrated and discussed subsequently.
  • the articulated joint 18A can comprise a linkage assembly, a ball joint assembly, a male/female assembly, or another type of mechanical connection that allows for movement of the temple 14A relative to the frame 16.
  • the articulated joint 18 A can also be formed as part of the frame 16 and the temple 14A. Indeed, the articulated joint 18A can provide for movement of the temple 14A relative to the frame 16. Thus, the articulated joint 18A allows for movement of the temple 14A such that it is disposable between the stowed position and the wearable position as illustrated in FIG. 1.
  • FIG. 2 shows the smart glasses 12 previously described can be used as part of a system such as system 100 to conduct heat generated by the onboard electronic components of the smart glasses 12 into a case 102.
  • the system 100 includes the case 102 and the smart glasses 12 as illustrated in FIG. 2.
  • a cable (not shown) can also be utilized with the system 100.
  • the smart glasses 12 can generally include the frame 16, one or more temples 14A and 14B, and on board electronic components (as illustrated and discussed in previous embodiments); the details of each will not be discussed in great detail as aspects of these items have been previously described.
  • the case 102 comprises a body 103 such as a container or holder for the smart glasses 12.
  • a portion of the case 102 is removed to illustrate the smart glasses 12 and other internal parts of the case 102 and the body 103.
  • the body 103 can include a first sidewall 104, a second sidewall 106, a backside wall 108, a cavity 110, a first ledge 112, a second ledge 114, and a first heat conduction pathway 116.
  • the 114 comprise one or more supports 115 for the smart glasses 12 according to the embodiment of FIGS. 2-4. It should be recognized that the one or more supports
  • 115 can comprise other mounting structures such as projections, shaped receptacles, or the like in other embodiments.
  • the first sidewall 104 is arranged opposing the second sidewall 106. Both the first sidewall 104 and the second sidewall 106 can connect to the backside wall 108 in a spaced apparat relationship. Together the first sidewall 104, the second sidewall 106, the backside wall 108 and other walls of the case 102 define a portion of the cavity 110.
  • the cavity 110 is sized and shaped to receive the smart glasses 12 therein.
  • the first ledge 112 is disposed within the body 103 and formed from a portion of the first sidewall 104.
  • the second ledge 114 is positioned across the cavity 1 10 from the first ledge 112.
  • the second ledge 114 is disposed within the body 103 and formed from a portion of the second sidewall 106.
  • the first and second ledges 112 and 114 are each configured to receive a portion of the smart glasses 12 with the smart glasses 12 in the stowed position as shown in FIG. 2.
  • This portion of the smart glasses 12 can comprise backside of each of the right end portion 26 A and the left end portion 26B adjacent the articulating joints 18A and 18B.
  • the case 102 can include electronic connectors 118.
  • One such of the electronic connector 118 can comprise a base or internal connector (also referred to as a port) on the case 102 such as at one of the first ledge 112 and the second ledge 114.
  • the electronic connector 118 mates or otherwise electronically connects with a complimentary corresponding connector (not shown) on the smart glasses 12.
  • the electronic connectors 118 are complemented by magnets or other mechanisms for retaining the smart glasses 12 on the second ledge 114 for charging and/or data transfer.
  • FIGS. 2 and 3 show the first heat conduction pathway 116 (shown as arrows in FIG. 2), which can be connected both physically and thermally to one or both of first and second ledges 112 and 114.
  • the embodiment of FIGS. 2 and 3 show the first heat conduction pathway 116 connected to both the first and second ledges 112 and 1 14.
  • the embodiment of FIG. 4 shows a first heat conduction pathway 216 connected to only the first ledge 112.
  • the first heat conduction pathway 116 can terminate at one or more heat sinks 116 A, 116B. These one or more heat sinks 116 A, 116B can be located at or closely adjacent to one or both of the first and second ledges 112 and 114 as shown in FIG. 3. According to some embodiments the one or more heat sinks 116A, 116B integrated with the one or more supports 115 (e.g.
  • Each of the one or more heat sinks 116 A, 116B are configured for thermally conductive coupling with a corresponding heat sink of the smart glasses 12 with the heat sink of the eyewear connected in a heat transfer relationship with the heat source of the eyewear device as discussed further subsequently.
  • the one or more heat sinks 116 A, 1 16B are part of the first heat conduction pathway 116.
  • the one or more heat sinks 116 A, 116B are separate components from the first heat conduction pathway 116. In either case, the first heat conduction pathway 116 is thermally connected to the one or more heat sinks 116 A, 116B.
  • the second temple 14B is connected to the frame 16 at a second articulated joint 18B.
  • a portion (the left end portion 26B) of the frame 16 adjacent the second articulate joint 18B abuts the second ledge 114.
  • the smart glasses 12 can have second onboard electronic components carried by the frame 14 such as in the left end portion 26B. These onboard electronic components comprise a second heat source that generates heat during electrically powered operation.
  • the first heat conduction pathway 116 extends into the case 102 and can extend internally within the first sidewall 104 and the second sidewall 106 to the backside wall 108. As shown in FIG.
  • the first heat conduction pathway 116 is thermally coupled to the heat source (shown as arrow A) with the smart glasses 12 disposed on the first and the second ledges 112, 114 to provide a heat sink for the heat source to direct heat into the case 102 and away from the smart glasses 12.
  • the smart glasses 12 can be placed in the case 102 as shown in FIG. 2.
  • the smart glasses 12 can be operable (i.e. are electrically powered) even in the stowed position within the case 102.
  • the onboard electronic components can run software and perform other tasks that can improve the glasses' efficiency and performance thereby improving the user experience.
  • the first heat conduction pathway 116 into the case 102 can allow some tasks such as data transfer to be performed more rapidly than could otherwise be performed in the wearable position. This is because a thermal coupling (further discussed in reference to FIGS.
  • first heat conduction pathway 116 that includes the first heat conduction pathway 116 allows for heat conduction between the frame 16 and the case 102, and in some cases, between the frame 16 and one or more of the temples 14A, 14B. This conduction occurs when the temples 14A and 14B are in the stowed position such as shown in FIG. 2 as well as the wearable position partially shown in FIG. 1.
  • the smart glasses 12 and the case 102 can interact together in various ways and for various purposes.
  • the case 102 can transport and protect the smart glasses 12, can charge or provide power to the electronics incorporated in the smart glasses 12, and/or to communicate with the electronics of the smart glasses 12.
  • the case 102 can house a supplemental battery to those of the smart glasses 12. Heat can result from the charging of the battery or from powered operation of the onboard electronic components when the temples 14 A, 14B are in the stowed position within the case 102.
  • the first heat conduction pathway 116 conducts this heat into the case 102 away from the glasses 12.
  • the internal connector 118 (FIG. 3) of the case 102 couples to a corresponding electronic connector of the glasses 12 in a manner previously described in Applicant's previously cited co-pending U.S. Patent Applications when the temples 14A and 14B are in the stowed position and docked in the case 102.
  • the interior of the case 102 is shaped to receive the smart glasses 12 only when the temples 14A and 14B are in the stowed position.
  • the shape of the interior also can be such that the electronic connectors 118 of those of the case 102 and of the glasses 12 interface together and are docked with little slippage or movement occurring between the case 102 and the glasses 12.
  • the connectors can be of virtually any type known in the art for power and/or data
  • FIG. 4 shows a second case 202 of similar construction to that of the case 102 of FIGS. 2 and 3. As such, the details of the features and applications of the case 202 will not be discussed in great detail.
  • the case 202 differs from case 102 in that the first heat conduction pathway 216 has a different construction from that of the first heat conduction pathway 116 of FIGS. 2 and 3. More particularly, the first conduction pathway 216 connects only to the first ledge 112 (shown in phantom). This first ledge 112 interfaces with a portion of the frame that houses the camera and other communication devices (e.g., a microphone, sensors, etc.) that can generate a substantial portion of the total heat generated by the onboard electronic components.
  • the first ledge 112 interfaces with a portion of the frame that houses the camera and other communication devices (e.g., a microphone, sensors, etc.) that can generate a substantial portion of the total heat generated by the onboard electronic components.
  • the first heat conduction pathway 216 includes a heat spreader 220 disposed internally within the backside wall 108 of the case 202.
  • the heat spreader 220 comprises one or more of a copper heat sink, an aluminum heat sink, a graphite heat sink, and a heat pipe.
  • the relatively larger surface area of the heat spreader 220 allows for increased rate of heat transfer into the case 202.
  • the heat pipe if used, can have a hollow central cavity surrounded by an exterior housing.
  • the hollow cavity contains a working fluid (e.g., deionized water).
  • the working fluid is evaporated to a vapor at the first end portion adjacent the heat source.
  • the vapor travels the length of the heat pipe from a first end portion to second end portion.
  • the vapor condenses back to fluid and the heat is released to the heat sink.
  • the fluid is absorbed back into a wick that extends substantially the length of the heat pipe.
  • the working fluid travels the length of the wick back from the second end portion to the first end portion to repeat the cycle described above. Further details regarding the construction of the heat pipe can be found the Applicant's co-pending U.S. Application No. 15/084,683, entitled
  • the first heat conduction pathway 216 includes a metal strip 222 imbedded in the first sidewall 104 of the case 202.
  • the metal strip 222 couples to the first ledge 112 and interfaces with a portion of the smart glasses. This interface can occur in a part of an articulate joint between a temple and a frame as will be further described in reference to FIGS. 5 A and 5B.
  • the metal strip 222 extends internally along the backside wall 108 and connects to the heat spreader 220.
  • FIGS. 5A and 5B show a portion of the frame 16 of the smart glasses 12 along with a portion of the core wire 22 A and temple 14A from various perspectives.
  • FIGS. 5A and 5B also highly schematically illustrate a first heat conductive pathway 316 and a first ledge 112, the construction of which has been previously discussed in reference to FIGS. 2-4.
  • the first heat conductive pathway 316 can terminate at one or more heat sinks 316 A.
  • the thermal coupling 302 can include the first heat conductive pathway 316, a second heat conductive pathway 318 and various components of the smart glasses 12.
  • FIG. 5 A shows an enlarged view of the right end portion 26A of the frame 16, the articulated joint 18 A, the onboard electronic components 20 A, the temple 14A and the core wire 22A.
  • FIG. 5A also illustrates components of the hinge assembly 28 including a cap hinge 30 and a temple hinge 32.
  • the onboard electronic components 20A are located within the frame 16.
  • the heat source is located within the frame 16.
  • the onboard electronic components 20A are housed within a cavity in the right end portion 26A of the frame 16.
  • this cavity can encompass a small volume (e.g., the cavity can be is -17 mm long).
  • the thermal coupling 302 can be used to direct heat away from the onboard electronic components 20 A and a housing 33 that forms and encases the cavity and the onboard electronic components 20A.
  • the thermal coupling 302 can direct heat to the core wire 22 A (a heat sink) and/or the first heat conductive pathway 316 as previously discussed.
  • components of the hinge assembly 28 form the second heat conductive pathway 318 (a part of the thermal coupling 302 in addition to the first heat conductive pathway 316).
  • the second heat conductive pathway 318 comprises at least a second heat sink (after the core wire 22A) for the heat source.
  • the second heat conductive pathway 318 extends between the heat source and the core wire 22 A across the articulated joint 16A between the temple 14A and the frame 16.
  • the thermal coupling 302 can be comprised of components of the hinge assembly 28 as well as the case 102 or 202, the thermal coupling 302 can be configured to conduct heat across the articulated joint 18A both when the temple 14A is in the wearable position (via the second heat conductive pathway 318) and when the temple is in the stowed position (via one or both of the first heat conductive pathway 316 and/or the second heat conductive pathway 318).
  • the core wire 22A is thermally coupled to the heat source by the second heat conduction pathway 318 to provide a heat sink for the heat source.
  • the first heat conduction pathway 316 and the second heat conduction pathway 318 are part of the thermal coupling 302 to conduct heat to adj acent and across the articulated j oint 18 A when the temple 14A is in the stowed position, and indeed, when the temple 14A and the frame 16 are received in the case 102 or 202.
  • the cap hinge 30 can form a portion of the second heat conductive pathway 318 and can additionally form a portion of the frame 16 and the hinge assembly 28. More particularly, the cap hinge 30 can have a first portion 37 integrally formed with the housing 33 of the frame 16 and has a second portion 40 comprising a projection extending from the frame 16 and the first portion 37. As is illustrated in FIGS. 5A and 6, one or more heat sinks internal to the frame 16 abut the cap hinge 30 along one or more internal surfaces disposed within the frame 16. The first ledge 112 and the first heat conduction pathway 316 can abut the one or more external surfaces 36 of the cap hinge 30.
  • the temple hinge 32 forms a portion of the second heat conductive pathway 318 and additionally forms a portion of the temple 14A and the hinge assembly 28.
  • the temple hinge 32 can comprise a fourth heat sink (in addition to at least the core wire 22 A, the cap hinge 30 and the first heat conductive pathway 316).
  • the temple hinge 32 couples to the core wire 22 A in a conductive heat exchange relationship.
  • the first heat conductive pathway 316 abuts the temple hinge 32 in a conductive heat exchange relationship.
  • the core wire 22A can be soldered or otherwise connected to the temple hinge 32 in a solid heat conductive manner.
  • the temple hinge 30 can be connected to the cap hinge 32 via a metal screw or fastener (shown in FIG. 5B).
  • FIG. 5 A illustrates a heat flow via conduction along the second heat conduction pathway 318 and the first heat conduction pathway 316 (illustrated by arrows) where heat generated by electrical powered operation of the onboard electronic components 20A is conducted away therefrom via one or more heat sinks internal to the frame 16.
  • the heat is conducted to the cap hinge 30, to the first heat conductive pathway 316 in the case 102, 202, through the screw (see FIG. 5B), and the temple hinge 32 to the core wire 22A within the temple 14A.
  • the thermal coupling 302 can be configured such that the heat from the onboard electronic components 20A can be conducted to the cap hinge 30, to the case 102, 202 via the first heat conductive pathway 316, through the screw and temple hinge 32 to the core wire 22A within the temple 14A according to some embodiments. According to other embodiments only one of the first heat conductive pathway 316 and the second heat conductive pathway 318 can be utilized rather than both being utilized as described in the embodiment of FIG. 5A.
  • FIG. 5B shows an enlarged view of the right end portion 26A of the frame 16, the articulated joint 18 A, the onboard electronic components 20 A, the temple 14 A, the core wire 22 A, the hinge assembly 28, the first ledge 112, the first heat conductive pathway 316, the second heat conductive pathway 318 and the thermal coupling 302 from a rear position.
  • the temple 14A is shown in phantom in FIG. 5B to better illustrate the cap hinge 30, the screw 31, the temple hinge 32 and the core wire 22A. Portions of the housing 33 are removed to better illustrate the cap hinge 30.
  • FIG. 5B shows the cap hinge 30 in further detail.
  • the first portion 37 including the external surfaces 36 can have a relatively large surface area comprised of opposing relatively flat surfaces that can take up most of the rear-facing portion of the right end portion 26A of the frame 16. Such relatively large surface area provides a sufficient area for heat transfer purposes.
  • the first portion 37 can include apertures therein. These apertures can be used for convection heating of the onboard electronic components 20A in some embodiments. In other cases, the apertures can be used to facilitate electrical communication via wire or can simply be used to reduce the weight of the cap hinge 30.
  • the second portion 40 of the cap hinge 30 comprising projections are received in corresponding projections 48 of the temple hinge 32. The second portion 40 and the projections 48 can be configured to receive the screw 31 therein.
  • FIG. 5B illustrates the conduction of heat along the first heat conduction pathway 316 and the second heat conduction pathway 318 as previously discussed and illustrated in reference to FIG. 5A.
  • the heat generated by electrical powered operation of the onboard electronic components 20A is conducted away therefrom via one or more heat sinks internal to the frame 16.
  • the heat is conducted (indicated by arrows) to the cap hinge 30, the first heat conductive pathway 316, through the screw 31, and the temple hinge 32 to the core wire 22A within the temple 14A.
  • the thermal coupling 302 can be configured such that the heat from the onboard electronic components 20 A can be conducted to away thereform and indeed from the smart glasses 12 to the case 102 or 202 as previously discussed.
  • FIG. 6 shows portions of the frame 16 with the housing 33 (FIG. 5 A) and components of the temple 14 (FIG. 5 A) removed.
  • FIG. 6 shows the onboard electronic components 20A, a first internal heat sink 50, a second internal heat sink 52, and the cap hinge 30 arranged together.
  • the first internal heat sink 50 and the second internal heat sink 52 abut the cap hinge 30 can be abutted along one or more internal surfaces 54 disposed within the frame 16. This forms a conductive heat exchange relationship.
  • the first internal heat sink 50 and the second internal heat sink 52 can be entirely internal to the frame 16 (i.e. can be disposed within the housing 33 of FIG. 5A).
  • the onboard electronic components 20A can be disposed entirely within the frame 16 (i.e. can be disposed within the housing 33 of FIG. 5 A) and can carried by the first internal heat sink 50 and the second internal heat sink 52.
  • the first internal heat sink 50 can be spaced from the second internal heat sink 52.
  • the first internal heat sink 50 can extend generally longitudinally and can extend generally parallel with the second internal heat sink 52.
  • the first internal heat sink 50 can hold and wrap around various boards and/or modules that comprise some of the onboard electronic components 20A.
  • the second internal heat sink 52 can hold and sandwich various boards and/or modules that comprise some of the onboard electronic components 20 A.
  • the second internal heat sink 52 can extend longitudinally from the cap hinge 30 to abut an image sensor 56 of a camera 58.
  • the first internal heat sink 50 and the second internal heat sink 52 can act to conduct heat away from the onboard electronic components 20 A to the cap hinge 30 and onward to the core wire 22A (FIGS. 1, 5A and 5B).
  • the one or more internal surfaces 54 of the cap hinge 30 can have a thermal interface material (TEVI) disposed on them.
  • the TEVI can help to provide good thermal contact between the cap hinge 30 and the first internal heat sink 50 and the second internal heat sink 52.
  • the first internal heat sink 50 and the second internal heat sink 52 can additionally utilize TEVIs to provide for good thermal contact between the first internal heat sink 50 and the second internal heat sink 52 and the onboard electronic components 20A (e.g., the processor, the WiFi module, the memory, and the image sensor 56). All of these contacts via TEVIs allow for heat to be moved rearward through the first internal heat sink 50 and the second internal heat sink 52 to the cap hinge 30 and on to the core wire 22 A (FIGS. 1, 5 A and 5B).
  • a case for a wearable device can include one or more supports disposed within the case and configured to receive a portion of the wearable device thereon.
  • the wearable device can include an eyewear body carrying onboard electronic components that comprise a heat source that generates heat during electrically powered operation.
  • the case can further include a first heat conduction pathway connected to the one or more supports and extending into the case. The first heat conduction pathway can be thermally coupled to the heat source with the eyewear body disposed on the one or more supports to provide a heat sink for the heat source to direct heat into the case and away from the eyewear body.

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Ophthalmology & Optometry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Acoustics & Sound (AREA)
  • General Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Eyeglasses (AREA)

Abstract

La présente invention concerne des appareils et des systèmes pouvant comprendre un boîtier pour lunettes ayant un corps de lunettes portant des composants électroniques embarqués comprenant une source de chaleur qui génère de la chaleur pendant un fonctionnement alimenté électriquement. Le boîtier peut maintenir les lunettes lorsque les lunettes sont en position rangée. Le boîtier peut en outre comprendre un ou plusieurs supports pour soutenir les lunettes en position rangée à l'intérieur de l'espace de maintien. Un ou plusieurs dissipateurs thermiques sont intégrés avec le ou les supports. Chacun du ou des dissipateurs thermiques est thermiquement conducteur et couplé à un dissipateur thermique correspondant des lunettes. Un premier trajet de conduction de chaleur est relié thermiquement au ou aux dissipateurs de chaleur et peut s'étendre dans le corps de boîtier afin de conduire la chaleur de la source de chaleur dans le boîtier avec les lunettes soutenues en position rangée.
PCT/US2018/017059 2017-02-06 2018-02-06 Gestion de la chaleur de dispositifs électroniques WO2018145085A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/425,774 2017-02-06
US15/425,774 US10042187B2 (en) 2016-02-29 2017-02-06 Heat management for electronic devices

Publications (1)

Publication Number Publication Date
WO2018145085A1 true WO2018145085A1 (fr) 2018-08-09

Family

ID=61274341

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2018/017059 WO2018145085A1 (fr) 2017-02-06 2018-02-06 Gestion de la chaleur de dispositifs électroniques

Country Status (1)

Country Link
WO (1) WO2018145085A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10317700B1 (en) 2016-02-29 2019-06-11 Snap Inc. Wearable device with heat transfer pathway
WO2020172138A1 (fr) * 2019-02-22 2020-08-27 Snap Inc. Branche de lunettes modulaire
US10928658B1 (en) 2016-02-29 2021-02-23 Snap Inc. Heat management for electronic devices
CN113165235A (zh) * 2018-11-30 2021-07-23 美国斯耐普公司 低压模塑制品及其制造方法
CN115113404A (zh) * 2022-07-05 2022-09-27 歌尔股份有限公司 Ar眼镜
EP4152079A4 (fr) * 2020-05-11 2023-11-15 Vivo Mobile Communication Co., Ltd. Lunettes intelligentes, boîtier de lunettes et ensemble lunettes
JP2024503083A (ja) * 2021-01-20 2024-01-24 メタ プラットフォームズ テクノロジーズ， リミテッド ライアビリティ カンパニー 人工現実ディスプレイを充電するための装置、システム、及び方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5455637A (en) * 1993-09-10 1995-10-03 Comdisco, Inc. Electrochromic eyewear system, rechargeable eyewear and external charger therefor
WO2011149364A1 (fr) * 2010-05-26 2011-12-01 Francis William Austin Lunettes modulaires
CN203369502U (zh) * 2013-07-26 2014-01-01 许振宇 一种可以充电的多媒体眼镜镜盒
US9470909B2 (en) * 2011-08-17 2016-10-18 Mitsui Chemicals, Inc. Moisture-resistant electronic spectacle frames
US9482883B1 (en) * 2015-04-15 2016-11-01 Snapchat, Inc. Eyewear having linkage assembly between a temple and a frame

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5455637A (en) * 1993-09-10 1995-10-03 Comdisco, Inc. Electrochromic eyewear system, rechargeable eyewear and external charger therefor
WO2011149364A1 (fr) * 2010-05-26 2011-12-01 Francis William Austin Lunettes modulaires
US9470909B2 (en) * 2011-08-17 2016-10-18 Mitsui Chemicals, Inc. Moisture-resistant electronic spectacle frames
CN203369502U (zh) * 2013-07-26 2014-01-01 许振宇 一种可以充电的多媒体眼镜镜盒
US9482883B1 (en) * 2015-04-15 2016-11-01 Snapchat, Inc. Eyewear having linkage assembly between a temple and a frame

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10317700B1 (en) 2016-02-29 2019-06-11 Snap Inc. Wearable device with heat transfer pathway
US11809021B2 (en) 2016-02-29 2023-11-07 Snap Inc. Wearable device with heat transfer pathway
US11921357B2 (en) 2016-02-29 2024-03-05 Snap Inc. Wearable electronic device with articulated joint
US10928649B2 (en) 2016-02-29 2021-02-23 Snap Inc. Wearable electronic device with articulated joint
US10928658B1 (en) 2016-02-29 2021-02-23 Snap Inc. Heat management for electronic devices
US12222584B2 (en) 2016-02-29 2025-02-11 Snap Inc. Wearable device with heat transfer pathway
US10379377B2 (en) 2016-02-29 2019-08-13 Snap Inc. Heat sink configuration for wearable electronic device
US11086140B1 (en) 2016-02-29 2021-08-10 Snap Inc. Wearable device with heat transfer pathway
US12422685B2 (en) 2018-11-30 2025-09-23 Snap Inc. Low pressure molded article and method for making same
CN113165235B (zh) * 2018-11-30 2022-11-25 美国斯耐普公司 低压模塑制品及其制造方法
CN113165235A (zh) * 2018-11-30 2021-07-23 美国斯耐普公司 低压模塑制品及其制造方法
US11927760B2 (en) 2018-11-30 2024-03-12 Snap Inc. Low pressure molded article and method for making same
CN113454521A (zh) * 2019-02-22 2021-09-28 美国斯耐普公司 模块化眼戴设备腿
WO2020172138A1 (fr) * 2019-02-22 2020-08-27 Snap Inc. Branche de lunettes modulaire
US12181732B2 (en) 2019-02-22 2024-12-31 Snap Inc. Modular eyewear temple
EP4152079A4 (fr) * 2020-05-11 2023-11-15 Vivo Mobile Communication Co., Ltd. Lunettes intelligentes, boîtier de lunettes et ensemble lunettes
JP2024503083A (ja) * 2021-01-20 2024-01-24 メタ プラットフォームズ テクノロジーズ， リミテッド ライアビリティ カンパニー 人工現実ディスプレイを充電するための装置、システム、及び方法
CN115113404A (zh) * 2022-07-05 2022-09-27 歌尔股份有限公司 Ar眼镜

Similar Documents

Publication Publication Date Title
US10928658B1 (en) Heat management for electronic devices
US11921357B2 (en) Wearable electronic device with articulated joint
WO2018145085A1 (fr) Gestion de la chaleur de dispositifs électroniques
US11973292B2 (en) Eyewear having selectively exposable feature
US11188123B1 (en) Eyewear with conductive temple joint
US10317706B1 (en) Battery assembly for a wearable electronic device
EP4632467A2 (fr) Dispositif électronique portable avec joint articulé

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18707181

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18707181

Country of ref document: EP

Kind code of ref document: A1