WO2018149252A1

WO2018149252A1 - Fingerprint identification component and terminal

Info

Publication number: WO2018149252A1
Application number: PCT/CN2018/071726
Authority: WO
Inventors: 张文真
Original assignee: 广东欧珀移动通信有限公司
Priority date: 2017-02-16
Filing date: 2018-01-08
Publication date: 2018-08-23
Also published as: CN106897684A

Abstract

A fingerprint identification component (100) and a terminal (200). The fingerprint identification component (100) comprises a flexible circuit board (10) and a fingerprint identification module (20). The flexible circuit board (10) comprises an installation portion (12) and a protruding portion (14) attached thereto. The fingerprint identification module (20) is arranged above the installation portion (12). The protruding portion (14) protrudes from the installation portion (12) and out of the fingerprint identification module (20). The protruding portion (14) comprises a surface (142) arranged opposite to the fingerprint identification module (20). A glue layer (30) is arranged on the surface (142). The glue layer (30) is arranged near the installation portion (12) or in contact with the installation portion (12).

Description

Fingerprint identification component and terminal

Priority information

The present application claims priority to and the benefit of the patent application Serial No. JP-A-------

Technical field

The present invention relates to the field of terminals, and in particular, to a fingerprint identification component and a terminal.

Background technique

In the related art, the fingerprint recognition component includes a flexible circuit board and a fingerprint identification module, and the flexible circuit board includes a mounting portion, and the fingerprint recognition module is disposed on the mounting portion and electrically connected to the flexible circuit board, in order to prevent water from flowing into the mounting portion and fingerprint recognition The gap between the modules causes a short circuit of the flexible circuit board, and a sealant is applied on the periphery of the mounting portion to seal the gap between the mounting portion and the fingerprint recognition module. However, the sealant may flow from the mounting portion to other parts of the flexible circuit board and adhere to the flexible circuit board to cause the flexible circuit board to harden, which is disadvantageous to the deformation of the flexible circuit board and affects the normal use of the flexible circuit board.

Summary of the invention

Embodiments of the present invention provide a fingerprint identification component and a terminal.

A fingerprint identification component of an embodiment of the present invention includes a flexible circuit board including a mounting portion and a protruding portion connecting the mounting portion, and a fingerprint recognition module, wherein the fingerprint recognition module is disposed on the mounting portion The protruding portion protrudes from the mounting portion toward an outer side of the fingerprint recognition module, the protruding portion includes a surface opposite to the fingerprint recognition module, and the surface is provided with a glue layer, the sparse layer The glue layer is disposed adjacent to or in contact with the mounting portion.

The terminal of the embodiment of the present invention includes the fingerprint recognition component described above.

In the fingerprint recognition component and the terminal of the embodiment of the invention, the glue-repellent layer can prevent the sealant on the periphery of the mounting portion from adhering to other parts of the flexible circuit board, thereby preventing the flexible circuit board from becoming hard and facilitating the deformation of the flexible circuit board. Normal use.

The additional aspects and advantages of the invention will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a perspective view of a fingerprint recognition component according to an embodiment of the present invention;

2 is an exploded perspective view of a fingerprint identification component according to an embodiment of the present invention;

3 is a schematic cross-sectional view of a fingerprint recognition assembly according to an embodiment of the present invention;

4 is a schematic plan view of a terminal according to an embodiment of the present invention.

The main component symbol description:

Fingerprint identification component 100;

a flexible circuit board 10, a mounting portion 12, a protruding portion 14, a surface 142, an extension portion 144, a connecting portion 146;

Fingerprint identification module 20, fingerprint identification chip 22, package body 24, mounting surface 26, first pad 28;

The glue layer 30;

Sealant 40;

Reinforcement sheet 50;

Cover plate 60;

Terminal 200.

detailed description

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientations of "post", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the present invention and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. Therefore, it should not be construed as limiting the invention. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

In the present invention, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.

Referring to FIG. 1 to FIG. 3 together, the fingerprint identification component 100 of the embodiment of the present invention includes a flexible circuit board 10 and a fingerprint identification module 20.

The flexible circuit board 10 includes a mounting portion 12 and a protruding portion 14 that connects the mounting portion 12. The fingerprint recognition module 20 is disposed on the mounting portion 12. The extension 14 projects from the mounting portion 12 to the outside of the fingerprint recognition module 20. The protrusion 14 includes a surface 142 opposite to the fingerprint recognition module 20, and the surface 142 is provided with a glue layer 30 disposed adjacent to or in contact with the mounting portion 12.

In the fingerprint recognition component 100 of the embodiment of the present invention, the glue release layer 30 can prevent the sealant on the periphery of the mounting portion 12 from adhering to other portions of the flexible circuit board 10, thereby preventing the flexible circuit board 10 from becoming hard and facilitating the flexible circuit. The board 10 is deformed and used normally.

Specifically, a circuit is formed on the flexible circuit board 10, and the flexible circuit board 10 can be connected to an external device through a connector to enable the external device to have a fingerprint recognition function.

In the embodiment, the fingerprint recognition module 20 is substantially oblong. Of course, in other embodiments, the fingerprint recognition module 20 can be designed into other shapes such as a cylindrical shape, a rectangular parallelepiped shape, and an elliptical shape according to actual conditions.

In certain embodiments, the glue release layer 30 includes a silk screen ink layer and/or a fluoride layer.

Thus, the glue releasing effect of the glue layer 30 is good, so that the sealant can be prevented from adhering to the surface 142. Further, since the screen printing ink layer and the fluoride are less adhesive, the protruding portion 14 is less likely to be strongly bonded to the fingerprint recognition module 20, so that the protruding portion 14 can be easily deformed and easily connected to an external device. It is understood that the fluoride is an organic or inorganic compound containing a negative fluorine.

In certain embodiments, the fingerprint recognition assembly 100 includes a sealant 40. The sealant 40 seals the gap between the mounting portion 12 and the fingerprint recognition module 20, and the glue layer 30 is disposed adjacent to or in contact with the sealant 40.

As such, the sealant 40 can prevent water from entering the gap between the mounting portion 12 and the fingerprint recognition module 20 and affecting the electrical connection function between the mounting portion 12 and the fingerprint recognition module 20.

Additionally, the glue release layer 30 can prevent the sealant 40 from flowing along the extension 14 to other locations of the flexible circuit board 10.

In one example, when the fingerprint recognition component 100 is assembled, the fingerprint recognition module 20 may be first mounted on the mounting portion 12, and then the glue layer 30 is applied to the portion of the surface 142 near the mounting portion 12, and then at the mounting portion 12. A sealant 40 is applied to the fingerprint recognition module 20 to seal the gap between the mounting portion 12 and the fingerprint recognition module 20.

When the sealant 40 is applied, the sealant 40 is liquid and has high fluidity. However, since the sealant 40 is not bonded to the glue release layer 30, it is possible to prevent the sealant from adhering to other positions of the flexible circuit board 10. 40, thereby preventing the sealant 40 from flowing to other locations of the flexible circuit board 10.

In some embodiments, the fingerprint identification module 20 includes a fingerprint identification chip 22 and a package 24 encasing the fingerprint identification chip 22 . The mounting portion 12 is electrically connected to the fingerprint recognition chip 22 .

As such, the fingerprint recognition module 20 can implement the function of fingerprint recognition through the fingerprint recognition chip 22. Specifically, the fingerprint identification chip 22 is provided with a sensing pixel array facing the surface of the user's finger. When the user performs the fingerprint recognition operation, the finger can be placed at a position corresponding to the fingerprint identification chip 22, and the sensing pixel array can collect the user's fingerprint. The pattern is followed by matching the fingerprint pattern of the user with the pre-stored fingerprint pattern. If the matching is successful, the fingerprint recognition is successful.

In addition, the encapsulation of the fingerprint recognition chip 22 by the package body 24 can reduce the influence of the interference signal on the fingerprint array when the fingerprint array is collected, so as to improve the accuracy of the fingerprint recognition module 20 in recognizing the fingerprint.

It can be understood that the fingerprint identification module 20 includes a mounting surface 26 opposite the mounting portion 12, the mounting surface 26 is formed with a first pad 28, and the first pad 28 can be connected to the fingerprint identification chip 22 by a gold wire. The surface of the mounting portion 12 opposite to the fingerprint recognition module 20 is formed with a second pad (not shown), the second pad corresponds to the first pad 28, and the second pad is soldered together with the first pad 28 to achieve mounting. The portion 12 is electrically connected to the fingerprint recognition chip 22.

In certain embodiments, the protrusion 14 includes an extension 144 and a connection 146. The extension 144 extends outwardly from the edge of the fingerprint recognition module 20. The connecting portion 146 is connected to the extending portion 144 and the mounting portion 12 . The connecting portion 146 is opposite to the fingerprint recognition module 20 , and the surface of the connecting portion 146 opposite to the fingerprint recognition module 20 is provided with a glue releasing layer 30 .

As such, the adhesive layer 30 is disposed on the surface of the connecting portion 146 opposite to the fingerprint recognition module 20, and the area of the glue layer 30 can be disposed on the smaller flexible circuit board 10, thereby saving the glue layer 30 to reduce the cost of the fingerprint recognition assembly 100.

In some embodiments, the mounting portion 12 is substantially rectangular, the connecting portion 146 is connected to the long edge of the mounting portion 12, and the dimension L1 of the connecting portion 146 to the mounting portion 12 is smaller than the length L2 of the mounting portion 12, that is, L1 < L2.

As such, the connecting portion 146 is small in size and easily deformed, so that the fingerprint recognition assembly 100 is easily connected to an external device.

In some embodiments, the sealant 40 is annular and located at the periphery of the mounting portion 12, and the adhesive layer 30 extends from the mounting portion 12 in the extending direction of the protruding portion 14. The absorbent layer 30 has an extension W1 larger than the ring. The width of the sealant 40 is W2, that is, W1>W2. This allows all of the sealant 40 to not adhere to other locations on the flexible circuit board 10.

In some embodiments, the fingerprint recognition component 100 includes a reinforcing sheet 50 disposed on the mounting portion 12, and the reinforcing sheet 50 and the fingerprint recognition module 20 are respectively disposed on opposite sides of the mounting portion 12.

In this way, the reinforcing sheet 50 can improve the strength of the mounting portion 12, and avoid the looseness of the flexible circuit board 10 and the fingerprint recognition module 20, resulting in poor electrical contact and affecting the fingerprint recognition function of the fingerprint recognition component 100. The reinforcing sheet 50 is, for example, a steel sheet, so that the strength of the reinforcing sheet 50 can be ensured even when the thickness of the reinforcing sheet 50 is thin.

The reinforcing piece 50 is fitted to the mounting portion 12, and for example, the shape of the reinforcing piece 50 is substantially the same as the shape of the mounting portion 12. In the present embodiment, both the reinforcing sheet 50 and the mounting portion 12 are substantially rectangular. In addition, the size of the reinforcing sheet 50 is slightly smaller than the size of the mounting portion 12.

In some embodiments, the fingerprint recognition component 100 includes a cover plate 60 overlaid on the fingerprint recognition module 20, and the cover plate 60 and the flexible circuit board 10 are respectively disposed on opposite sides of the fingerprint recognition module 20.

As such, the cover 60 can prevent the fingerprint recognition module 20 from being damaged by impact. The cover plate 60 is made of, for example, a harder material such as sapphire or ceramic to improve the impact resistance of the cover plate 60. The cover plate 60 can be fixed to the fingerprint recognition module 20, for example, by an adhesive.

Referring to FIG. 4, the terminal 200 of the embodiment of the present invention includes the fingerprint identification component 100 of any of the above embodiments. The terminal 200 includes electronic devices such as a mobile phone, a tablet computer, and a smart wearable device.

In the terminal 200 of the embodiment of the present invention, the glue releasing layer 30 can prevent the sealant 40 around the periphery of the mounting portion 12 from adhering to other portions of the flexible circuit board 10, thereby preventing the flexible circuit board 10 from becoming hard and facilitating the flexible circuit board. 10 deformation and normal use.

In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples", etc. The specific features, structures, materials or characteristics described in the embodiments or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

While the embodiments of the present invention have been shown and described, the embodiments of the invention may The scope of the invention is defined by the claims and their equivalents.

Claims

A fingerprint identification component, comprising:

a flexible circuit board including a mounting portion and a protrusion connecting the mounting portion; and

a fingerprint identification module, the fingerprint recognition module is disposed on the mounting portion, the protruding portion protrudes from the mounting portion to an outer side of the fingerprint recognition module, and the protrusion portion includes the fingerprint recognition module On the opposite surface, the surface is provided with a glue-repellent layer disposed adjacent to or in contact with the mounting portion.
The fingerprint recognition assembly of claim 1 wherein said extension portion includes an extension extending outwardly from an edge of said fingerprint recognition module and a connection portion connecting said extension portion and said mounting portion, The connecting portion is opposite to the fingerprint identification module, and the surface of the connecting portion opposite to the fingerprint recognition module is provided with the glue-repellent layer.
The fingerprint recognition assembly according to claim 2, wherein the mounting portion is substantially rectangular, the connecting portion is connected to a long edge of the mounting portion, and the connecting portion is smaller than the mounting portion. The length of the mounting portion.
The fingerprint identification module of claim 1 , wherein the fingerprint identification module comprises a fingerprint identification chip and a package enclosing the fingerprint identification chip, and the mounting portion is electrically connected to the fingerprint identification chip.
The fingerprint recognition assembly of claim 1 wherein said glue layer comprises a screen printing ink layer and/or a fluoride layer.
The fingerprint recognition component according to claim 1, wherein said fingerprint recognition component comprises a sealant that seals a gap between said mounting portion and said fingerprint recognition module, said glue layer being adjacent to said sealant Set or in contact with the sealant.
The fingerprint recognition assembly according to claim 6, wherein the sealant is annular and located at a periphery of the mounting portion, and the adhesive layer extends from the mounting portion along the protruding portion The direction is extended, and the absorbent layer has an extended size larger than a width of the annular sealant.
The fingerprint recognition component according to claim 1, wherein the fingerprint recognition component comprises a reinforcing sheet disposed on the mounting portion, and the reinforcing patch and the fingerprint recognition module are respectively disposed in the mounting The opposite sides of the section.
The fingerprint recognition component according to claim 1, wherein the fingerprint recognition component comprises a cover plate overlying the fingerprint recognition module, and the cover plate and the flexible circuit board are respectively disposed on the fingerprint recognition The sides of the module are opposite each other.
A terminal, comprising: a fingerprint identification component, the fingerprint identification component comprising:

a flexible circuit board, the flexible circuit board comprising a mounting portion and a protruding portion connecting the mounting portion;

a fingerprint identification module, the fingerprint recognition module is disposed on the mounting portion, the protruding portion protrudes from the mounting portion to an outer side of the fingerprint recognition module, and the protrusion portion includes the fingerprint recognition module On the opposite surface, the surface is provided with a glue-repellent layer disposed adjacent to or in contact with the mounting portion.
The terminal according to claim 10, wherein the extension portion includes an extension portion extending outward from an edge of the fingerprint recognition module and a connection portion connecting the extension portion and the mounting portion, The connecting portion is opposite to the fingerprint recognition module, and the surface of the connecting portion opposite to the fingerprint recognition module is provided with the glue-repellent layer.
The terminal according to claim 11, wherein the mounting portion is substantially rectangular, the connecting portion is connected to a long edge of the mounting portion, and a size of the connecting portion to the mounting portion is smaller than the mounting. The length of the department.
The terminal according to claim 10, wherein the fingerprint identification module comprises a fingerprint identification chip and a package enclosing the fingerprint identification chip, and the mounting portion is electrically connected to the fingerprint identification chip.
The terminal of claim 10 wherein said layer of glue is comprised of a screen printing ink layer and/or a fluoride layer.
The terminal according to claim 10, wherein said fingerprint recognition component comprises a sealant that seals a gap between said mounting portion and said fingerprint recognition module, said glue layer being disposed adjacent to said sealant or Contact with the sealant.
The terminal according to claim 15, wherein the sealant is annular and located at a periphery of the mounting portion, and the glue releasing layer extends from the mounting portion in a protruding direction of the protruding portion The absorbent layer has an extended dimension that is greater than a width of the annular sealant.
The terminal according to claim 10, wherein the fingerprint recognition component comprises a reinforcing sheet disposed on the mounting portion, and the reinforcing sheet and the fingerprint recognition module are respectively disposed at the mounting portion On both sides of the back.
The terminal according to claim 10, wherein the fingerprint recognition component comprises a cover plate overlying the fingerprint recognition module, and the cover plate and the flexible circuit board are respectively disposed on the fingerprint recognition module On both sides of the back.