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WO2018150551A1 - Procédé de fabrication de substrat imprimé - Google Patents

Procédé de fabrication de substrat imprimé Download PDF

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Publication number
WO2018150551A1
WO2018150551A1 PCT/JP2017/006015 JP2017006015W WO2018150551A1 WO 2018150551 A1 WO2018150551 A1 WO 2018150551A1 JP 2017006015 W JP2017006015 W JP 2017006015W WO 2018150551 A1 WO2018150551 A1 WO 2018150551A1
Authority
WO
WIPO (PCT)
Prior art keywords
printing
base plate
circuit board
printed circuit
printed
Prior art date
Application number
PCT/JP2017/006015
Other languages
English (en)
Japanese (ja)
Inventor
裕久 今家
Original Assignee
裕久 今家
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 裕久 今家 filed Critical 裕久 今家
Priority to PCT/JP2017/006015 priority Critical patent/WO2018150551A1/fr
Publication of WO2018150551A1 publication Critical patent/WO2018150551A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/26—Printing on other surfaces than ordinary paper
    • B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • Patent Documents 1 and 2 disclose printed circuit board technology. This web page (http://www.nedo.go.jp/news/press/AA5_100246.html) describes semiconductor formation by printing.
  • the problem to be solved by the present invention is to produce a printed circuit board (printed circuit board) with a printing apparatus for printing.
  • the printed circuit board manufacturing method of the present invention comprises a conductive printing step of printing with a conductive ink on a flexible and insulating thin plate-like base plate, and a conductive ink after the first printing step. And an insulating printing step of printing an insulating varnish in a layered manner on at least a part of the printed portion.
  • the base plate is a film or paper.
  • the printing process is performed once again after the printing is completed.
  • the printed board of the present invention has a thin plate-like base plate having a flexible and insulating thickness, and a semiconductor circuit formed by printing on the base plate, and the base plate has at least 1 It is formed by being folded.
  • the printed circuit board is folded so that terminals formed on one surface and the other surface of the printed circuit board come into contact with each other.
  • the semiconductor circuit is formed on both sides of the base plate.
  • a printed circuit board includes a first printed board having at least a thin plate-like base plate having a flexible and insulating thickness and a semiconductor circuit formed on the base plate by printing.
  • Second printing having substantially the same shape as the first printed circuit board, comprising a substrate, a thin plate-like base plate having a flexible and insulating thickness, and a semiconductor circuit formed on the base plate by printing.
  • a first printed circuit board and a second printed circuit board, and the terminals formed on each of the first printed circuit board and the second printed circuit board are connected to each other to form one printed circuit board. It becomes a circuit.
  • the printing method and the printed board according to the present invention make it possible to produce a printed board with a printing apparatus for printing. Furthermore, it has become possible to provide a new printed circuit board.
  • FIG. 3 is an explanatory diagram of a III-III cross section of FIG. 1. It is explanatory drawing of other embodiment. It is explanatory drawing of other embodiment. It is a further development of FIG. It is explanatory drawing of the manufacturing method of a printed circuit board. It is explanatory drawing of the example of a more complicated circuit. It is explanatory drawing of a developed form. It is explanatory drawing of a more suitable example in the case of forming a circuit on both surfaces of a base plate. It is explanatory drawing of the method of connecting the circuit of the surfaces in the middle when the big baseplate like FIG. 9 is folded. It is an example of the method of manufacturing a display etc.
  • FIG. 1 is an explanatory diagram of a printed circuit board according to the first embodiment of the present invention.
  • a terminal 11 and a connection line 13 that connects the plurality of terminals 11 are formed on a base plate 21.
  • a terminal 11 and a connection line 13 that connects the plurality of terminals 11 are formed on a base plate 21.
  • the connection line 13b it is also possible to provide another terminal 11 between the two terminals as in the connection line 13b.
  • the terminal 11 may be provided at each end of the branching part.
  • the printed circuit board 1 of this embodiment can freely provide the terminals 11 and the connection lines 13.
  • FIG. 2 is an explanatory diagram of the II-II cross section of FIG.
  • the connection line 13 is formed on the base plate 21. Further, a varnish portion 31 is formed.
  • the base plate 21 is formed of a flexible and insulating sheet.
  • the base plate 21 is made of paper or a plastic material.
  • the connection line 13 is formed of a conductive ink material (having flexibility). Further, a flexible and insulating ink material is printed on the side of the base plate 21 on which the connection line 13 is printed, and this printed portion is a varnish portion 31.
  • the varnish portion 31 it is more appropriate to use a varnish made of a material capable of preventing static electricity.
  • FIG. 3 is an explanatory diagram of the III-III cross section of FIG.
  • the portion where the connecting wire 13 is not covered with the varnish portion 31 functions as the terminal 11.
  • the portion of the terminal 11 is more preferably a quadrangular shape or a circular shape having an area larger than that of the connection line 13 in order to facilitate connection with a terminal portion of another electronic device.
  • FIG. 4 is an explanatory diagram of another embodiment.
  • the base plate 21 is not necessarily square as shown in FIG. 1, but may be rectangular as shown in FIG. Furthermore, it may be L-shaped, circular, elliptical, or star-shaped. Further, any other shape may be used.
  • FIG. 5 is an explanatory diagram of still another embodiment.
  • the number of times of printing the connection line 13 (terminal 11) and the varnish portion 31 of the printed circuit board 1 is not limited to one, and it is also possible to perform printing (stacked printing) on top of each other multiple times as shown in FIG. It is. Moreover, it is possible to print and form not only on the front side of the base plate 21 but also on the back side. Here, even in the case of printing on both the front side and the back side, it is also possible to perform multilayer printing a plurality of times.
  • FIG. 6 is a further development of FIG.
  • FIG. 7 is an explanatory diagram of a method for manufacturing the printed circuit board 1.
  • Printing is performed on the flexible and insulating base plate 21 as shown in FIG. In this case, an offset printing machine for two-color printing is used.
  • a first printing process is performed in which printing is performed at a predetermined position with conductive (flexible) ink. Furthermore, it forms like FIG.7 (c) by the 2nd printing process which prints in a predetermined position with an insulating (flexible) varnish.
  • the printed circuit board 1 is manufactured by passing through the above processes at least once. In the description so far, the description has been made with the two-color printing in mind, but of course, there are many four-color printing machines. There are more than that. Therefore, it is possible to form a complicated circuit more than the above description by one printing. It is also possible to form a more complicated circuit by performing overprinting on what has been printed once or printing on the opposite side.
  • FIG. 8 is an explanatory diagram of an example of a more complicated circuit.
  • This circuit is an example in which an N-type MOSFET circuit is formed by printing of the present embodiment. Even such a relatively complex circuit can be formed by printing.
  • the manufacturing method it is created by the following procedure. (1) An N-type semiconductor ink 101 having the properties of an N-type semiconductor (may be more flexible) on a flexible and insulating base plate 21 (paper or plastic film). Print two places (role of source and drain, respectively). (2) Print P-type semiconductor ink 102 having P-type semiconductor properties (may be more flexible) so as to span the two N-type semiconductor inks 101 in (1) To do. (3) Printing is performed so that the terminals 11 (connection lines 13) are connected to the two N-type semiconductor inks 101 in (1).
  • the insulating varnish portion 31 is printed so as to cover at least the P-type semiconductor ink 102.
  • the terminal 11 (connection line 13) is printed on the varnish portion 31 of (4) (role of the gate).
  • An insulating varnish is printed so as to cover each printing from (1) to (5).
  • offset printing on-demand printing
  • offset printing is inexpensive and high-speed, so that a large number of printed boards can be manufactured at a very low cost.
  • both the first printing process and the second printing process described above can be performed at once.
  • offset printing on-demand printing
  • offset printing machines usually print books, pamphlets and the like.
  • the offset printing machine is high speed, it is difficult to increase its operating rate.
  • the printed substrate 1 formed by the method as described above can be manufactured at a low cost and with a short period. Further, since printing is possible in any shape, it is possible to reduce the size and the weight. Note that the above description is not limited to offset printing. Any printing machine may be used. Further, the varnish portion 31 is not limited to varnish, but may be any material as long as it has insulating properties and flexibility and is suitable for printing.
  • FIG. 9 is an explanatory diagram of the developed form.
  • the B0 size has an area corresponding to 16 B5 size circuits.
  • Such a circuit area is very large compared to the size of a conventional semiconductor, and many circuits can be manufactured even if the degree of miniaturization is low compared to the manufacturing of a conventional semiconductor. .
  • printing technology is evolving day by day, and quite fine printing is possible. If miniaturization similar to that formed on a conventional wafer is performed, the amount of semiconductor that can be mounted can be made extremely large.
  • the printed circuit board 1 has flexibility, and the surface has insulation by the varnish part 31, it can be folded like FIG.9 (b). . Therefore, even if a circuit board having a large area is formed, it can be made compact. Further, since it is flexible, there is an effect that it is relatively easy to handle (it may not be precise).
  • connection line 13 connection line 13
  • FIG. 10 is an explanatory diagram of a more preferable example when circuits are formed on both surfaces of the base plate 21.
  • circuits are formed on both sides of the base plate 21.
  • the through hole 41 is formed in the base plate 21 as shown in FIG.
  • the connection line 13 or the terminal 11 thereon the circuits on both sides of the base plate 21 can be finely connected.
  • the through-hole 41 can be formed in advance in a minute and large amount.
  • FIG. 11 is an explanatory diagram of a method of connecting the circuits between the faces halfway when the large base plate 21 as shown in FIG. 9 is folded.
  • terminals 11 are formed on the respective surfaces (first surface 121a, second surface 121b) formed by folding.
  • a fourth terminal 11d) is formed.
  • a method for connecting the terminals 11 will be described with reference to FIG.
  • a first terminal 11a is formed on the first surface 121a.
  • a second terminal 11b is formed on the second surface 121b.
  • the conductive adhesion part 132 which has flexibility, electroconductivity, and adhesiveness is printed on the surface side of the 2nd terminal 11b.
  • a non-conductive adhesive part 131 having flexibility, insulation and adhesiveness is printed. In this state, it is possible to fold the first surface 121a and the second surface 121b, thus forming a shorted connection portion.
  • FIG. 12 shows an example of a method for manufacturing a display or the like.
  • a Red color circuit, a Green color circuit, a Blue color circuit, and the above-described control circuit for controlling RGB are formed on each surface by printing. It is also possible to form a display by folding it as shown in FIG. In this case, the base plate 21 needs to be transparent.
  • the base plate 21 has flexibility. Further, the ink to be printed (conductive, semiconductor, non-conductive) is also flexible. Therefore, the printed board 1 itself has flexibility. Therefore, bending, a gentle curve, etc. are possible. In addition, since it is sufficient that the shape of the base plate 21 can be simply printed, various shapes can be created in addition to the conventional square. In the case of stacking a plurality of layers, it is possible to manufacture a printed substrate 1 having a complicated shape as if a 3D printer is produced by gradually changing the shape of each printed substrate 1 to be stacked. Thereby, in addition to the use as a circuit, it can be used in the aspect of an object, for example, the appearance of a personal computer.
  • the size of the base plate 21 may be not only B0 but also A0, B1, and A1, and may be larger than that, or conversely, may be smaller than that.
  • the printed circuit board 1 of this embodiment can be made into a large area, it is also possible to form a coil with a large number of windings.
  • the present invention is particularly effective for non-contact type power supply. It is also useful for building a system that does not require a power cable. Also, it can be used for, for example, a non-contact type IC card system in which an IC is driven by a non-contact type power supply.
  • the printing method is described with offset printing in mind, but the same is possible with the ink jet method and the laser printing method.
  • the base plate 21 is not limited to paper. In particular, an insulating film or the like can be used. However, it is more preferable to use a material that allows ink to penetrate to some extent in order to prevent disconnection when folded.
  • printing uses two-color offset printing. Because it has such a configuration, the connection line 13 (terminal 11) and the varnish portion 31 that is the coating can be printed at a time. This is also because there are relatively many machines for two-color offset printing, and they exist in printers and tend to have a long free time.
  • the insulating varnish uses a material that prevents static electricity. With such a configuration, it is possible to prevent static electricity.
  • the method of this embodiment can create a computer, a substrate (circuit) having a semiconductor element function, wiring, a display, a keyboard, other input devices, and the like.
  • a short delivery time and power saving can be achieved. It can also be used for other smartphones, TVs, and other electrical appliances.
  • the basis is a sheet of paper (plastic)
  • a desk, a table, a pillar, a bookshelf, and other furniture can be formed by stacking paper (plastic). That is, a further essence of the present invention is that the semiconductor circuit can also serve as a structure.
  • the purpose is not limited to two-color offset printing, and multi-color printing is more preferable. However, in terms of cost and precision, multiple colors are not necessarily unilaterally advantageous, and the case where the number of colors is small is not optimal.
  • the printed board manufacturing method of the present invention includes a conductive printing step of printing with a conductive ink on a flexible and insulating thin plate-like base plate 21, and a conductive ink after the first printing step. And an insulating printing step of printing an insulating varnish in a layered manner on at least a part of the printed portion. Since it has such a structure, it is possible to manufacture a printed circuit board with the printing apparatus for printing.
  • the base plate 21 uses a film or paper. Since it has such a structure, it becomes possible to manufacture a printed board cheaply and easily, maintaining flexibility. This is also because paper is the most commonly used material for printing machines that print pamphlets and the like, so that engineers are accustomed and printing can be performed easily.
  • the printing process after the printing is once completed, the printing process is performed again.
  • a more complicated circuit can be formed.
  • the printed board 1 of the present invention has a thin plate-like base plate 21 having a flexible and insulating thickness, and a semiconductor circuit formed on the base plate 21 by printing. At least one fold is formed. With such a configuration, a more complicated circuit can be formed, and a larger area can be used as a circuit.
  • the printed circuit board 1 is folded so that terminals formed on one surface of the other and the other surface come into contact with each other. With such a configuration, a more complicated circuit can be formed, and a larger area can be used as a circuit. It is also possible to create a shortcut circuit.
  • semiconductor circuits are formed on both sides of the base plate 21. With such a configuration, a more complicated circuit can be formed, and a larger area can be used as a circuit.
  • a printed circuit board 1 includes at least a thin plate-like base plate 21 having a flexible and insulating thickness and a semiconductor circuit formed on the base plate 21 by printing.
  • the first printed circuit board having substantially the same shape as the first printed circuit board having a printed circuit board, a flexible and insulating thin plate-like base plate 21, and a semiconductor circuit formed on the base plate 21 by printing. 2 printed circuit boards. Then, by stacking the first printed circuit board and the second printed circuit board, the terminals formed on each of the first printed circuit board and the second printed circuit board are connected to form one printed circuit.
  • each member, scientific substance, and the like of the present invention can be variously changed without changing the gist of the present invention.
  • material metal, plastic, FRP, wood, concrete and the like can be freely selected.
  • one member can be composed of two or more other members and connected.
  • said embodiment is only one of the best forms at present.
  • connection line 13a connection line 13b: connection line 21: base plate 31: varnish portion 41: penetration Hole 101: N-type semiconductor ink 102: P-type semiconductor ink 121a: First surface 121b: Second surface 131: Nonconductive adhesive portion 132: Conductive adhesive portion

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Selon la présente invention, le taux de fonctionnement de dispositifs d'impression destinés à l'impression n'est pas de 100 %, et il y a une demande pour une utilisation plus efficace de dispositifs d'impression. Ce procédé de fabrication d'un substrat imprimé comprend : une première étape d'impression permettant d'imprimer de l'encre électroconductrice (11) sur une plaque de base flexible, isolante et en forme de plaque mince (21) ; et une seconde étape d'impression permettant d'imprimer, après la première étape d'impression et sous une forme de couche, un vernis (31) ayant des propriétés d'isolation sur au moins une partie de la partie marquée avec l'encre électroconductrice (11).
PCT/JP2017/006015 2017-02-17 2017-02-17 Procédé de fabrication de substrat imprimé WO2018150551A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/006015 WO2018150551A1 (fr) 2017-02-17 2017-02-17 Procédé de fabrication de substrat imprimé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/006015 WO2018150551A1 (fr) 2017-02-17 2017-02-17 Procédé de fabrication de substrat imprimé

Publications (1)

Publication Number Publication Date
WO2018150551A1 true WO2018150551A1 (fr) 2018-08-23

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PCT/JP2017/006015 WO2018150551A1 (fr) 2017-02-17 2017-02-17 Procédé de fabrication de substrat imprimé

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WO (1) WO2018150551A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003283112A (ja) * 2002-03-26 2003-10-03 Toppan Forms Co Ltd 静電保護層を有する導電回路シート
JP2005228298A (ja) * 2003-12-19 2005-08-25 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
JP2012510115A (ja) * 2008-11-25 2012-04-26 コヴィオ インコーポレイテッド 印刷アンテナ、アンテナを印刷する方法、および、印刷アンテナを備えるデバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003283112A (ja) * 2002-03-26 2003-10-03 Toppan Forms Co Ltd 静電保護層を有する導電回路シート
JP2005228298A (ja) * 2003-12-19 2005-08-25 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
JP2012510115A (ja) * 2008-11-25 2012-04-26 コヴィオ インコーポレイテッド 印刷アンテナ、アンテナを印刷する方法、および、印刷アンテナを備えるデバイス

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