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WO2018161210A1 - Dispositif et procédé de test de puce d'empreinte digitale - Google Patents

Dispositif et procédé de test de puce d'empreinte digitale Download PDF

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Publication number
WO2018161210A1
WO2018161210A1 PCT/CN2017/075744 CN2017075744W WO2018161210A1 WO 2018161210 A1 WO2018161210 A1 WO 2018161210A1 CN 2017075744 W CN2017075744 W CN 2017075744W WO 2018161210 A1 WO2018161210 A1 WO 2018161210A1
Authority
WO
WIPO (PCT)
Prior art keywords
fingerprint chip
tray
cover plate
testing
fingerprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/075744
Other languages
English (en)
Chinese (zh)
Inventor
李亮
江建威
肖裕权
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Goodix Technology Co Ltd
Original Assignee
Shenzhen Goodix Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Goodix Technology Co Ltd filed Critical Shenzhen Goodix Technology Co Ltd
Priority to CN201780000120.3A priority Critical patent/CN107000920A/zh
Priority to PCT/CN2017/075744 priority patent/WO2018161210A1/fr
Publication of WO2018161210A1 publication Critical patent/WO2018161210A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/22—Details
    • B65D77/24—Inserts or accessories added or incorporated during filling of containers
    • B65D77/26—Elements or devices for locating or protecting articles

Definitions

  • the present application relates to the field of terminal devices and, more particularly, to an apparatus and method for testing a fingerprint chip.
  • the test for the fingerprint identification chip has changed from the original single chip test to the entire substrate.
  • a substrate can be packaged in different numbers according to the size of the chip. Therefore, there is a need for a technology that enables testing of such chips.
  • the embodiment of the present application provides an apparatus and method for testing a fingerprint chip, which can implement testing of a whole board fingerprint chip.
  • an apparatus for testing a fingerprint chip comprising:
  • the outer ring of the cover plate is a trapezoidal structure, and the main body portion of the cover plate is provided with a hollow structure of M rows and N columns of meshes, and the M and the N are positive integers;
  • the inner ring of the tray is a trapezoidal structure
  • the main body portion of the tray is provided with a hollow structure of a row A and a column B grid, and the A and the B are positive integers;
  • the trapezoidal structure and the trapezoidal structure have an anti-fracture space, and the height of the anti-fracture space is greater than the thickness of the whole plate fingerprint chip;
  • the cover plate and the tray are configured to fix the whole board fingerprint chip to the anti-fracture space when the cover plate is closed.
  • the trapezoidal structure of the cover plate of the device for testing and the trapezoidal structure of the tray have an anti-fracture space when the cover plate is closed, and the height of the anti-fracture space is greater than the thickness of the entire plate fingerprint chip to be tested, thereby The entire panel fingerprint chip can be fixed to the anti-fracture space by the cover plate and the tray, and the chip is not fractured due to excessive pressure.
  • the difference between the height of the anti-fracture space and the thickness of the whole board fingerprint chip is less than a height threshold.
  • the height of the anti-fracture space is set to be slightly larger than the thickness of the entire fingerprint chip, thereby enabling It is enough to ensure that the whole board fingerprint chip can be flattened, but not to be fractured.
  • the smallest inner ring of the trapezoidal structure has the same size as the full-board fingerprint chip.
  • the A and the B are determined according to an arrangement of the fingerprint chips in the whole board fingerprint chip.
  • the means for testing the fingerprint chip further comprises a linker for linking the cover plate and the tray.
  • the device for testing a fingerprint chip further comprises a locking structure for fixing the cover plate and the tray when the cover plate is closed.
  • the locking structure is a locking buckle.
  • the device for testing a fingerprint chip further comprises at least one positioning pin, wherein when the at least one positioning pin is used to place the device in the testing machine, the positioning device configuration in the testing machine is The device is fixed in the test machine.
  • a method for testing a fingerprint chip comprising: a cover plate, an outer ring of the cover plate
  • the main body portion of the cover plate is provided with a hollow structure of M rows and N columns of meshes, the M and the N are positive integers, the tray, the inner ring of the tray is a trapezoidal structure, and the tray is
  • the main body portion is provided with a hollow structure of an A-row B-column grid, and the A and the B are positive integers, and in the case where the cover plate is closed, the trapezoidal structure and the trapezoidal structure are provided with anti-fracture
  • the height of the anti-fracture space is greater than the thickness of the whole board fingerprint chip to be tested, and the method includes:
  • the pressed whole plate fingerprint chip is fixed to the anti-fracture space by the cover plate and the tray.
  • the method for testing a fingerprint chip in the embodiment of the present application can pass through a net on a cover plate.
  • the lattice hollow structure realizes the test of the surface of the chip by the fake finger
  • the grid type hollow structure on the tray realizes the needle connection of the test pad of the test chip of each chip in the whole fingerprint chip, so
  • the method for testing a fingerprint chip in the embodiment of the present application can implement testing of a whole board fingerprint chip.
  • the method for testing a fingerprint chip in the embodiment of the present application presses a warpage position of the whole fingerprint chip by a physical portion between two adjacent grids in the M-row N-column grid, because
  • the trapezoidal structure of the cover plate of the device for testing and the trapezoidal structure of the tray have an anti-fracture space when the cover plate is closed, and the height of the anti-fracture space is greater than the thickness of the entire plate fingerprint chip to be tested, and therefore, through the cover
  • the board and the tray are capable of fixing the entire board fingerprint chip in the anti-fracture space without causing the fingerprint chip to be fractured due to excessive pressure.
  • the difference between the height of the anti-fracture space and the thickness of the whole board fingerprint chip is less than a height threshold.
  • the height of the anti-fracture space is set to be slightly larger than the thickness of the whole board fingerprint chip, so that the whole board fingerprint chip can be flattened without being fractured.
  • the smallest inner ring of the trapezoidal structure has the same size as the full-board fingerprint chip.
  • the A and the B are determined according to an arrangement of the fingerprint chips in the whole board fingerprint chip.
  • the device for testing a fingerprint chip further includes a linker, the method further comprising:
  • the cover and the tray are linked by the linker.
  • the device for testing a fingerprint chip further includes a locking structure, the method further comprising:
  • the cover and the tray are secured by the locking structure when the cover is closed.
  • the locking structure is a locking buckle.
  • the device also includes at least one locating peg for securing the device to the test in cooperation with the locating device under test when the device is placed in the testing machine.
  • the device for testing a fingerprint chip includes a cover plate and a tray, and the main body of the cover plate and the tray are provided with a mesh type hollow structure, and a grid on the cover plate
  • the type hollow structure can be used for the test of the surface of the chip by the dummy finger
  • the grid type hollow structure on the tray can be used for the pad of each chip in the whole board fingerprint chip to be tested to leak out from the grid, so as to facilitate The test probe of the test machine is connected to the needle. Therefore, the device for testing the fingerprint chip of the embodiment of the present application can implement the test of the whole board fingerprint chip.
  • FIG. 1 is a schematic diagram of an apparatus for testing a fingerprint chip in accordance with an embodiment of the present application.
  • Figure 2 is a cross-sectional view of the apparatus for testing a fingerprint chip in a closed state of the cover.
  • Fig. 3 is a view showing a state in which the whole board fingerprint chip is in the tray in a state where the cover is opened.
  • FIG. 4 is a schematic view showing the state of the whole board fingerprint chip in the tray in a closed state of the cover plate;
  • FIG. 5 is a schematic flow chart of a method for testing a fingerprint chip according to the present application.
  • Figure 6 is a flow chart showing the operation of the apparatus for testing a fingerprint chip.
  • Figure 7 is a flow chart showing the operation of the apparatus for testing a fingerprint chip.
  • the apparatus 100 for testing a fingerprint chip includes:
  • a cover plate 110 the outer ring of the cover plate 110 is a trapezoidal structure 111, the main body portion of the cover plate 110 is provided with a hollow structure 112 of M rows and N columns of meshes, and M and N are positive integers;
  • the inner circumference of the tray 120 is a trapezoidal structure 121, and the main body portion of the tray 120 is provided with a hollow structure 122 of a row A and a column B grid, and the A and the B are positive integers;
  • the trapezoidal structure 111 and the trapezoidal structure 121 have an anti-fracture space 20, and the height of the anti-fracturing space 20 is greater than the thickness of the whole board fingerprint chip;
  • the cover plate 110 and the tray 120 are used to fix the whole board fingerprint chip to the anti-fracture space 20 when the cover plate 110 is closed.
  • the inner ring of the tray 120 has a trapezoidal structure, that is, the tray 120 is a trapezoidal groove as a whole, and the main body portion of the tray 120 is provided with a hollow structure 122 of A rows and B columns of grids, and the tray 120 can be used.
  • the hollow structure 122 of the A row and B column grid can be used for the pad of each chip in the whole board fingerprint chip to pass the A line B.
  • the column grid leaks from the bottom surface of the tray so that the test probe of the test machine can be connected to the pad of each chip through the bottom surface of the tray.
  • the hollow structure 112 of the M rows and N columns of grids on the cover plate 110 enables the fake finger for testing the fingerprint chip to still touch each of the fingerprint chips in the whole fingerprint chip when the cover 110 is closed.
  • the surface is thus capable of testing the fingerprint recognition function of the fingerprint chip. Therefore, the apparatus for testing a fingerprint chip of the embodiment of the present application can implement testing of the whole board fingerprint chip.
  • the solid portions of the adjacent two grids in the M rows and N columns of grids can be used to press the warped portion of the whole board fingerprint chip to be tested, thereby causing the fake finger to press the surface of the fingerprint chip When the test item on the surface of the fingerprint chip can be better fitted with the fake finger.
  • Figure 2 shows a front cross-sectional view of the apparatus for testing a fingerprint chip when the cover is closed, as shown in Figure 2, the trapezoidal structure 111 of the cover 110 and the trapezoid of the tray 120 when the cover 110 is closed
  • the structure 121 has a fracturing prevention space 20, the height of the anti-fracturing space 20 is greater than the thickness of the whole board fingerprint chip to be tested, and therefore, when the cover plate 110 is closed, the trapezoidal structure 111 of the cover plate 110 and the tray 120 are The trapezoidal structure 121 cooperates with each other, so that the whole-plate fingerprint chip to be tested can be fixed to the anti-fracture space 20, and the height of the anti-fracture space 20 is greater than the thickness of the whole-plate fingerprint chip. Therefore, the embodiment of the present application
  • the device for testing the fingerprint chip can ensure that the entire fingerprint chip to be tested is not crushed due to excessive pressure while flattening the entire fingerprint chip.
  • the smallest inner ring of the trapezoidal structure 121 (that is, the inner ring where the anti-fracturing space 20 is located) has the same size as the entire fingerprint chip.
  • the size of the smallest inner ring of the trapezoidal structure 121 can be set to be the same as the size of the whole board fingerprint chip, so that the displacement of the whole board fingerprint chip in the tray can be prevented.
  • the tray 120 is provided with an A-row B-column grid, and the A-row B-column grid may be disposed to exactly correspond to each chip in the whole-plate fingerprint chip, so that when the whole-board fingerprint chip is placed in the tray 120, The pads of each chip can leak out just from the A-row B-column grid, so that the pads of each chip in the whole-plate fingerprint chip and the test probe of the test machine can be connected to the needle faster.
  • the size of the minimum inner ring of the tray 120 may also be larger than the size of the whole board fingerprint chip to be tested. In this case, it is only necessary to manually adjust the grid of each chip pad of the whole board fingerprint chip from the tray. The entire fingerprint chip is fixed in the anti-fracture space by leaking out and then closing the cover, so that the displacement of the whole fingerprint chip in the tray can be prevented.
  • FIG. 3 is a schematic view showing the state of the whole board fingerprint chip in the tray when the cover is opened.
  • FIG. 4 is a schematic view showing the state of the whole fingerprint chip in the tray after the cover is closed, as can be seen from FIG.
  • the warped whole-plate fingerprint chip can be flattened, and the whole-board fingerprint chip can be fixed in the anti-fracture space 20 by the cooperation of the cover plate and the trapezoidal structure of the tray, The height of the anti-fracturing space 20 is greater than the thickness of the whole board fingerprint chip, so that the whole board fingerprint chip can be prevented from being fractured.
  • the difference between the height of the anti-fracturing space 20 and the thickness of the whole board fingerprint chip is less than a height threshold.
  • the height of the anti-fracture space may be set to be slightly larger than the thickness of the whole board fingerprint chip, so that the whole board fingerprint chip can be flattened without being fractured.
  • the apparatus for testing a fingerprint chip of the embodiment of the present application can flatten the whole fingerprint chip by the physical part of two adjacent grids in the cover plate before testing the whole board fingerprint chip to be tested. And fixing the whole board fingerprint chip to the anti-fracture space through the trapezoidal structure of the cover plate and the tray. Since the height of the anti-fracture space is greater than the thickness of the whole board fingerprint chip, the whole can be guaranteed The board fingerprint chip is flat and does not cause the chip to be fractured due to excessive pressure.
  • the A and the B are determined according to the arrangement of the fingerprint chips in the whole board fingerprint chip.
  • the tray 120 can be determined according to the arrangement of the fingerprint chips in the whole board fingerprint chip.
  • the size of each grid can be slightly larger than the size of the pad of the fingerprint chip, and the spacing between adjacent grids can also be The arrangement of the fingerprint chips in the whole board fingerprint chip is determined.
  • the apparatus 100 for testing a fingerprint chip further includes a linker 130 for linking the cover plate 110 and the tray 120.
  • the apparatus 100 for testing a fingerprint chip may further include a linker 130, which may be active, and the trapezoidal structure of the cover plate 110 may be implemented by adjusting the linker 130. Alignment of the trapezoidal structure of the tray 120.
  • the device 100 for testing a fingerprint chip further includes a locking structure 140, the locking The structure 140 is used to secure the cover plate 110 and the tray 120 when the cover is closed.
  • the apparatus 100 for testing a fingerprint chip further includes a locking structure 140 that can be used to secure the cover 110 and the tray 120 when the cover is closed.
  • the locking structure may be a locking buckle. Therefore, after the whole board fingerprint chip to be tested is placed in the tray 120, the cover plate 110 is closed, and the locking structure 140 is locked, and the device 100 for testing the fingerprint chip can be placed in the testing machine for testing. Since the whole board fingerprint chip is placed in the device 100 for testing the fingerprint chip for moving and testing, the fingerprint chip is prevented from being scratched by the fingerprint chip by directly clamping the chip, or the fingerprint chip is affected by the collision. The appearance even affects the problem of use. At the same time, the problem that the fingerprint chip is moved by the adsorption method is easy to leave a fingerprint on the surface of the fingerprint chip or the fingerprint chip is deformed due to excessive suction.
  • the apparatus 100 for testing a fingerprint chip may further include at least one positioning pin for cooperating with a positioning device in the testing machine when the device 100 is placed in the testing machine, The device 100 is fixed in the test machine.
  • FIG. 1 exemplarily shows four positioning pins 150.
  • the device 100 may include fewer than four positioning pins, for example, two, or more than four, for example, six, The number of the positioning pins is not limited in the application embodiment.
  • the position of the positioning pin in the device 100 is not limited in the embodiment of the present application.
  • the device embodiment of the present application is described in detail above with reference to FIG. 1 to FIG. 4 .
  • the method embodiment of the present application is described in detail below with reference to FIG. 5 to FIG. 7 . It should be understood that the method embodiment and the device embodiment correspond to each other. The description can be made with reference to the device embodiment.
  • FIG. 5 shows a schematic flow chart of a method for testing a fingerprint chip according to an embodiment of the present application, the method being applied to a device for testing a fingerprint chip
  • the device for testing a fingerprint chip comprising: a cover plate,
  • the outer ring of the cover plate has a trapezoidal structure, and the main body portion of the cover plate is provided with a hollow structure of M rows and N columns of meshes, the M and the N are positive integers, the tray, the inner ring of the tray is a trapezoidal structure, and the tray is
  • the main body portion is provided with a hollow structure of a row A and a column B grid, and the A and the B are positive integers.
  • the method 500 includes:
  • the whole board fingerprint chip is placed on the main body portion of the tray;
  • the fake finger can perform the test of the fingerprint recognition function on the surface of the chip through the mesh type hollow structure on the cover plate, and the test probe of the test machine can pass through the tray.
  • the mesh type hollow structure is connected to the pad of each chip in the whole board fingerprint chip. Therefore, the method for testing the fingerprint chip in the embodiment of the present application can implement the test of the whole board fingerprint chip.
  • the method for testing a fingerprint chip in the embodiment of the present application presses a warpage position of the whole fingerprint chip by a physical portion between two adjacent grids in the M-row N-column grid, because
  • the trapezoidal structure of the cover plate of the device for testing and the trapezoidal structure of the tray have an anti-fracture space when the cover plate is closed, so that the entire plate can be passed through the trapezoidal structure of the cover plate and the tray in the case where the cover plate is closed
  • the fingerprint chip is fixed in the anti-fracture space, and since the height of the anti-fracture space is larger than the thickness of the whole-plate fingerprint chip to be tested, the fingerprint chip is not fractured due to excessive pressure.
  • the difference between the height of the anti-fracture space and the thickness of the whole board fingerprint chip is less than a height threshold.
  • the smallest inner ring of the trapezoidal structure has the same size as the full-board fingerprint chip.
  • the A and the B are determined according to the number of fingerprint chips included in the whole board fingerprint chip.
  • the device for testing the fingerprint chip further includes a linker, the method further comprising:
  • the cover and the tray are linked by the linker.
  • the device for testing the fingerprint chip further includes a locking structure, the method further comprising:
  • the cover and the tray are secured by the locking structure when the cover is closed.
  • the locking structure is a locking buckle.
  • the device for testing the fingerprint chip may further comprise at least one positioning pin, wherein the at least one positioning pin is used to cooperate with the positioning device in the testing machine when the device is placed in the testing machine, and fix the device In the test machine.
  • the operation flow may include the following steps:
  • the device for testing the fingerprint chip is opened, and the whole board fingerprint chip is placed in the tray of the device for testing the fingerprint chip;
  • a device for testing the fingerprint chip with the entire fingerprint chip can be obtained.
  • the device for testing the fingerprint chip equipped with the whole board fingerprint chip can be placed in the testing machine by the robot, so that the whole board fingerprint chip can be tested by the testing machine, because The whole board fingerprint chip is placed in the device for testing the fingerprint chip for movement, so the robot grips the device for testing the fingerprint chip, so that the fingerprint chip is not scratched or bumped.
  • the size of the sequence numbers of the foregoing processes does not mean the order of execution sequence, and the order of execution of each process should be determined by its function and internal logic, and should not be applied to the embodiment of the present application.
  • the implementation process constitutes any limitation.
  • the disclosed systems, devices, and methods may be implemented in other manners.
  • the device embodiments described above are merely illustrative.
  • the division of the unit is only a logical function division.
  • there may be another division manner for example, multiple units or components may be combined or may be Integrate into another system, or some features can be ignored or not executed.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in an electrical, mechanical or other form.
  • the unit described as a separate component may or may not be physically separated, and the component displayed as a unit may or may not be a physical unit, that is, may be located in one place, or It can also be distributed to multiple network elements. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
  • the functions may be stored in a computer readable storage medium if implemented in the form of a software functional unit and sold or used as a standalone product.
  • the technical solution of the present application which is essential or contributes to the prior art, or a part of the technical solution, may be embodied in the form of a software product, which is stored in a storage medium, including
  • the instructions are used to cause a computer device (which may be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present application.
  • the foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like. .

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Image Input (AREA)

Abstract

La présente invention concerne un dispositif de test d'une puce d'empreinte digitale (100) et un procédé de test d'une puce d'empreinte digitale, permettant de tester l'ensemble d'un substrat de puces d'empreinte digitale. Le dispositif de test d'une puce d'empreinte digitale (100) comprend : une plaque de couverture (110), un anneau externe de la plaque de recouvrement (110) représentant une première structure trapézoïdale (111), et une partie principale de la plaque de couverture (110) étant pourvue d'une structure évidée (112) qui est une grille de M rangées et N colonnes, M et N étant des nombres entiers positifs ; un plateau (120), un anneau interne du plateau (120) représentant une seconde structure trapézoïdale (121), une partie principale du plateau (120) étant pourvue d'une structure évidée (122) qui est une grille de A rangées et B colonnes, A et B étant des nombres entiers positifs. Lorsque la plaque de couverture (110) est fermée, il y a un espace anti-fissures (20) entre la première structure trapézoïdale (111) et la seconde structure trapézoïdale (121), la hauteur de l'espace anti-fissures (20) étant supérieure à l'épaisseur de l'ensemble du substrat de puces d'empreintes digitales. La plaque de couverture (110) et le plateau (120) sont destinés à fixer l'ensemble du substrat de puces d'empreinte digitale dans l'espace anti-fissures (20) lorsque la plaque de couverture (110) est fermée.
PCT/CN2017/075744 2017-03-06 2017-03-06 Dispositif et procédé de test de puce d'empreinte digitale Ceased WO2018161210A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201780000120.3A CN107000920A (zh) 2017-03-06 2017-03-06 用于测试指纹芯片的装置和方法
PCT/CN2017/075744 WO2018161210A1 (fr) 2017-03-06 2017-03-06 Dispositif et procédé de test de puce d'empreinte digitale

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/075744 WO2018161210A1 (fr) 2017-03-06 2017-03-06 Dispositif et procédé de test de puce d'empreinte digitale

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WO2018161210A1 true WO2018161210A1 (fr) 2018-09-13

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CN109196364A (zh) * 2018-08-31 2019-01-11 深圳市汇顶科技股份有限公司 一种夹盘装置
CN114279318A (zh) * 2020-09-28 2022-04-05 未势能源科技有限公司 用于双极板的检测工装
CN112478370A (zh) * 2020-11-17 2021-03-12 昆山国显光电有限公司 托盘、翘曲检测系统及翘曲检测方法

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CN106269581A (zh) * 2015-06-10 2017-01-04 鸿劲科技股份有限公司 指纹辨识电子元件作业装置及其应用的测试分类设备
CN205385660U (zh) * 2016-01-28 2016-07-13 环维电子(上海)有限公司 一种pcb载具

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