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WO2018168352A1 - Réceptacle - Google Patents

Réceptacle Download PDF

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Publication number
WO2018168352A1
WO2018168352A1 PCT/JP2018/005941 JP2018005941W WO2018168352A1 WO 2018168352 A1 WO2018168352 A1 WO 2018168352A1 JP 2018005941 W JP2018005941 W JP 2018005941W WO 2018168352 A1 WO2018168352 A1 WO 2018168352A1
Authority
WO
WIPO (PCT)
Prior art keywords
multilayer substrate
folded
receptacle
tongue
folded portion
Prior art date
Application number
PCT/JP2018/005941
Other languages
English (en)
Japanese (ja)
Inventor
匡彦 松本
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2018168352A1 publication Critical patent/WO2018168352A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component

Definitions

  • This invention relates to a receptacle.
  • Japanese Patent Laying-Open No. 2016-100082 discloses a connector for the purpose of improving a holding force for holding a contact at a predetermined position in the connector (Patent Document 1). .
  • the connector disclosed in Patent Document 1 includes an upper contact group, a lower contact group, a main body molded part in which the upper contact group and the lower contact group are press-fitted forward in the mating direction of the mating connector, and an upper contact And an upper contact insert part integrated by insert molding.
  • the upper contact insert part is provided so as to restrict the movement of the lower contact group when the mating connector is fitted.
  • a receptacle configured to be capable of inserting and removing a plug is known. Such a receptacle is required to exhibit high durability against repeated plug insertion and removal while having a simple configuration.
  • an object of the present invention is to solve the above-described problems, and to provide a receptacle that exhibits a high durability against plug insertion and removal while having a simple configuration.
  • the receptacle according to the present invention is a receptacle configured so that a plug can be inserted and removed.
  • the receptacle includes a multilayer substrate.
  • the multilayer substrate has a tongue portion located at the periphery when the multilayer substrate is viewed in plan.
  • the receptacle includes a group of electrodes provided on both surfaces of the multilayer substrate at the tongue, and a metal cover connected to the multilayer substrate.
  • the cover has a shell portion disposed so as to surround the tongue portion, a first folded portion configured to be elastically deformable, having a folded shape that is folded from the shell portion so as to approach one surface of the multilayer substrate, A second folded portion is provided opposite to the first folded portion, has a folded shape that is folded back from the shell portion so as to approach the other surface of the multilayer substrate, and is configured to be elastically deformable.
  • the tongue portion is disposed between the first folded portion and the second folded portion while elastically deforming the first folded portion and the second folded portion in a direction away from each other.
  • FIG. 3 is an exploded view illustrating a cover and a multilayer substrate in FIG. 2. It is a top view which shows the cover and multilayer substrate in FIG. FIG.
  • FIG. 9 is a cross-sectional view showing the cover and the multilayer substrate as seen from the direction of the arrow on the line IX-IX in FIG. It is sectional drawing which shows the connection process of the cover in FIG. 9, and a multilayer substrate.
  • FIG. 10 is a cross-sectional view showing a state in which a plug is connected to the receptacle in FIG. 9.
  • FIG. 10 is a cross-sectional view showing a step of connecting a plug to the receptacle in FIG. 9.
  • FIG. 1 is a perspective view showing a usage pattern of a receptacle according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing the receptacle in FIG. Referring to FIGS. 1 and 2, receptacle 10 is configured so that plug 70 can be inserted and removed.
  • the receptacle 10 and the plug 70 constitute a connector for transmitting and receiving at least one of a signal and power in an electronic device.
  • the receptacle 10 and the plug 70 constitute a USB type C connector.
  • the receptacle 10 is mounted on, for example, a mobile phone or a personal computer.
  • the receptacle 10 includes a cover 41, a case 12 (base member), and a multilayer substrate 21.
  • the cover 41 is made of metal.
  • the cover 41 forms an insertion port 14 when the plug 70 is inserted into the receptacle 10.
  • the cover 41 and the multilayer substrate 21 are accommodated in the case 12.
  • the case 12 has the appearance of a device on which the receptacle 10 is mounted.
  • the case 12 has a thin plate shape.
  • the case 12 is configured by combining an upper case 12m and a lower case 12n.
  • the combination direction of the upper case 12m and the lower case 12n is the thickness direction of the case 12.
  • the case 12 is provided with an opening 13 so as to expose the insertion opening 14 formed by the cover 41.
  • the opening 13 is provided at the boundary between the upper case 12m and the lower case 12n.
  • the cover 41 is connected to the multilayer substrate 21.
  • the multilayer substrate 21 is disposed in a plane orthogonal to the thickness direction of the case 12.
  • the multilayer substrate 21 is supported by the case 12 (more specifically, the lower case 12n).
  • the multilayer substrate 21 is fixed to the case 12 by screws 36 (fixing members) described later.
  • the multilayer substrate 21 has a first surface 21a and a second surface 21b disposed on the back side of the first surface 21a.
  • the first surface 21 a faces the upper case 12 m in the thickness direction of the case 12.
  • the second surface 21b faces the lower case 12n in the thickness direction of the case 12.
  • FIG. 3 is a plan view of the multilayer substrate in FIG. 2 viewed from the first surface side.
  • FIG. 4 is a plan view of the multilayer substrate in FIG. 2 viewed from the second surface side.
  • FIG. 5 is a block diagram of a circuit module constituted by the receptacle in FIG.
  • the receptacle 10 further includes a DC / DC converter 50 and a high-frequency signal transmission unit 60.
  • the DC / DC converter 50 and the high-frequency signal transmission unit 60 are provided on the multilayer substrate 21.
  • the DC / DC converter 50 includes a choke coil 51, a load switch 52, a capacitor (Cbus) 53, a capacitor (Cin) 54, a main switch 55, an SR 56, and an SMPS (Switched Mode Power Supply) controller 57. Have. These components constituting the DC / DC converter 50 are provided on the first surface 21a.
  • the high-frequency signal transmission unit 60 has a MUXEQ 61.
  • the MUXEQ 61 is provided on the second surface 21b.
  • the receptacle 10 further includes a USB PD (Universal Serial Bus Power Delivery) controller 62 and a connector 63.
  • the USBPD controller 62 and the connector 63 are provided on the second surface 21b.
  • the receptacle 10 satisfies the USB PD standard.
  • the USB PD standard (1) It is possible to supply power up to 100W with a USB cable, (2) the roles of power and USB data sender and receiver can be switched (roll swap), and (3) DisplayPort And HDMI (registered trademark), which have three characteristics such that a signal of a communication standard that cannot be communicated by conventional USB can be transmitted via a USB cable.
  • the USBPD controller 62 is a control circuit that takes over communication processing between devices when devices compliant with the USB PD standard are connected.
  • the receptacle 10 has terminals for transmitting and receiving signals Vin, I2C, Tx1, Tx2, Rx1, Rx2, DP, SBU, Vbus, CC, GND, Tx1, Tx2, Rx1, Rx2, SBU, D +, D- Yes.
  • the terminals are arranged symmetrically so that communication and power transmission are possible even when the plug 70 is inserted into the receptacle 10 upside down.
  • the MUXEQ 61 has a function (multiplexer) for detecting the insertion direction and connecting the terminal of the plug 70 to the internal circuit by connection according to the direction, and an equalizer function for lifting the high-frequency component of the signal on the receiving side.
  • the multilayer substrate 21 has a rectangular planar view as a whole.
  • the multilayer substrate 21 has a tongue portion 22, a first protrusion portion 25, and a second protrusion portion 28 as constituent parts thereof.
  • the tongue 22 is located at the periphery when the multilayer substrate 21 is viewed in plan.
  • the tongue 22 is located on the periphery of the first surface 21a and the second surface 21b of the multilayer substrate 21.
  • the tongue 22 is located at the end of the rectangular shape of the multilayer substrate 21 in plan view.
  • the first protrusion 25 and the second protrusion 28 are located on both sides of the tongue 22.
  • the tongue 22 and the first protrusion 25 are separated via the first notch 26.
  • the tongue 22 and the second protrusion 28 are separated via the second notch 29.
  • the tongue 22, the first protrusion 25, and the second protrusion 28 have a shape that protrudes in one direction.
  • the tongue 22 has a tongue shape between the first protrusion 25 and the second protrusion 28.
  • the first cutout portion 26 and the second cutout portion 29 have a slit shape in which the protruding direction of the tongue portion 22, the first protrusion portion 25, and the second protrusion portion 28 is the longitudinal direction.
  • the first protrusion 25, the first notch 26, the tongue 22, the second notch 29, and the second protrusion 28 are arranged along one side of the rectangular shape of the multilayer substrate 21 in plan view.
  • the DC / DC converter 50 is provided on the first surface 21 a of the multilayer substrate 21 excluding the first protrusion 25, the tongue 22, and the second protrusion 28.
  • the choke coil 51, the load switch 52 and the capacitor (Cbus) 53 are provided in a region on the first surface 21 a relatively far from the first protrusion 25, the tongue 22 and the second protrusion 28, and the capacitor (Cin) 54, the main switch 55, SR 56, and the SMPS controller 57 are provided in a region on the first surface 21 a that is relatively close to the first protrusion 25, the tongue 22, and the second protrusion 28.
  • the high-frequency signal transmission unit 60, the USBPD controller 62, and the connector 63 are provided on the second surface 21b of the multilayer substrate 21 excluding the first protrusion 25, the tongue 22, and the second protrusion 28.
  • a screw insertion hole 27 is formed in the first protrusion 25 and the second protrusion 28.
  • the screw insertion hole 27 is a through hole that penetrates the multilayer substrate 21 in the thickness direction.
  • FIG. 6 is a cross-sectional view showing the multilayer substrate in FIG. Referring to FIGS. 3 to 6, a signal pattern and a GND (ground) pattern are provided inside multilayer substrate 21.
  • the receptacle 10 further includes an electrode group 24 and a ground electrode 23.
  • the electrode group 24 and the ground electrode 23 are provided on the tongue 22.
  • the electrode group 24 and the ground electrode 23 are provided on both surfaces of the first surface 21a and the second surface 21b.
  • the electrode group 24 is connected to a signal pattern inside the multilayer substrate 21.
  • the ground electrode 23 is connected to the GND pattern inside the multilayer substrate 21.
  • the electrode group 24 includes a plurality of electrodes (more specifically, eight signal electrodes and two power electrodes) and a ground electrode provided at both ends and extending so as to surround the electrode group). It is configured.
  • the electrode group 24 is provided on the distal end side of the tongue 22.
  • the ground electrode 23 is provided on the proximal end side of the tongue 22.
  • the ground electrode 23 is provided so as to surround the electrode group 24 from three directions excluding the tip side of the tongue portion 22.
  • receptacle 10 further includes a resin portion 31 and a heat dissipation sheet 32.
  • the resin part 31 is provided on the first surface 21a.
  • the resin part 31 is provided so as to cover the DC / DC converter 50.
  • the heat radiation sheet 32 is interposed between the case 12 (more specifically, the upper case 12 m) and the resin portion 31.
  • the receptacle 10 further includes a base substrate 33.
  • the base substrate 33 is disposed between the multilayer substrate 21 and the case 12 (more specifically, the lower case 12n).
  • the base substrate 33 is disposed in parallel with the multilayer substrate 21.
  • the base substrate 33 is provided to face the second surface 21 b of the multilayer substrate 21.
  • the base substrate 33 is electrically connected to the multilayer substrate 21 via the connector 63.
  • FIG. 7 is an exploded view showing the cover and multilayer substrate in FIG.
  • FIG. 8 is a top view showing the cover and the multilayer substrate in FIG.
  • FIG. 7 shows a form in which the cover 41 and the multilayer substrate 21 in FIG. 2 are viewed from the second surface 21b side of the multilayer substrate 21.
  • the cover 41 in FIG. 2 is represented by a two-dot chain line.
  • cover 41 has shell portion 42.
  • the shell part 42 has a cylindrical shape.
  • the shell portion 42 extends in a cylindrical shape along the direction indicated by the arrow 121 in FIG.
  • the shell portion 42 has a flat shape that is perpendicular to the insertion / extraction direction of the plug 70 and has a small thickness in the direction indicated by the arrow 122 in FIG.
  • the shell part 42 forms the insertion port 14 at one end 42j extending in a cylindrical shape. Inside the shell part 42, the tongue part 22 of the multilayer substrate 21 is inserted. The tongue portion 22 is inserted from the other end 42k side of the shell portion 42 opposite to the one end 42j. The shell portion 42 is disposed so as to surround the tongue portion 22. In other words, the tongue portion 22 is disposed inside the shell portion 42.
  • the shell portion 42 is passed through the first cutout portion 26 between the tongue portion 22 and the first protrusion 25.
  • the shell portion 42 is passed through the second notch portion 29 between the tongue portion 22 and the second protrusion 28.
  • the first protrusion 25 and the second protrusion 28 are disposed outside the shell part 42.
  • FIG. 9 is a cross-sectional view showing the cover and the multilayer substrate as seen from the direction of the arrow on the line IX-IX in FIG.
  • FIG. 10 is a cross-sectional view showing a connection step between the cover and the multilayer substrate in FIG.
  • the cover 41 further includes a first folded portion 81 and a second folded portion 86.
  • the first folded portion 81 and the second folded portion 86 are provided integrally with the shell portion 42.
  • the first folded portion 81 and the second folded portion 86 are configured by bending a metal plate that constitutes the shell portion 42.
  • the first folded portion 81 is provided facing the first surface 21 a of the multilayer substrate 21.
  • the first folded portion 81 has a folded shape that is folded from the shell portion 42 so as to approach the first surface 21 a of the multilayer substrate 21. More specifically, the first folded portion 81 has a folded shape that is folded back in a substantially U shape from the end portion on the other end 42 k side of the shell portion 42 and extends toward the one end 42 j side of the shell portion 42.
  • the second folded portion 86 is provided to face the first folded portion 81 with the multilayer substrate 21 interposed therebetween.
  • the second folded portion 86 is provided facing the second surface 21 b of the multilayer substrate 21.
  • the second folded portion 86 has a folded shape that is folded from the shell portion 42 so as to approach the second surface 21 b of the multilayer substrate 21. More specifically, the second folded portion 86 has a folded shape that is folded back in a substantially U shape from the other end 42 k side end of the shell portion 42 and extends toward the one end 42 j side of the shell portion 42.
  • the second folded portion 86 has a symmetrical shape with the first folded portion 81 across the multilayer substrate 21.
  • the first folded portion 81 and the second folded portion 86 are configured to be elastically deformable. That is, the first folded portion 81 and the second folded portion 86 have spring properties. The first folded portion 81 and the second folded portion 86 are configured to be elastically deformable in directions away from each other (the direction indicated by the arrow 122 in FIG. 7).
  • the tongue portion 22 is disposed between the first folded portion 81 and the second folded portion 86 while elastically deforming the first folded portion 81 and the second folded portion 86 away from each other.
  • a biasing force that biases the first surface 21 a acts on the tongue 22 from the first folded portion 81
  • the second surface 21 b is biased on the tongue 22 from the second folded portion 86.
  • the urging force to act acts.
  • the tongue portion 22 is sandwiched between the first folded portion 81 and the second folded portion 86.
  • the assembly of the cover 41 and the multilayer substrate 21 to the case 12 can be easily performed while maintaining the state in which the tongue portion 22 is disposed inside the shell portion 42. it can.
  • the first folded portion 81 and the second folded portion 86 are provided integrally with the shell portion 42, the multilayer substrate 21 can be held on the shell portion 42 with a simple configuration.
  • the first folded portion 81 is electrically connected to the ground electrode 23 on the first surface 21a.
  • the first folded portion 81 is in contact with the ground electrode 23 on the first surface 21a.
  • the second folded portion 86 is electrically connected to the ground electrode 23 on the second surface 21b.
  • the second folded portion 86 is in contact with the ground electrode 23 on the second surface 21b.
  • the electrode group 24 on the first surface 21 a and the electrode group 24 on the second surface 21 b are surrounded by the shell portion 42.
  • the shell portion 42 is set to the ground potential.
  • the electromagnetic shield surrounding the electrode group 24 can be realized with a simple configuration.
  • the shell portion 42 alone in which the thickness between the ground electrode 23 on the first surface 21 a and the ground electrode 23 on the second surface 21 b is L1 and the tongue portion 22 is not inserted.
  • the shortest length between the first folded portion 81 and the second folded portion 86 is L2
  • the relationship of L1> L2 is satisfied.
  • the holding state of the multilayer substrate 21 by the first folded portion 81 and the second folded portion 86 can be obtained more reliably.
  • the first folded part 81 is reversed from the shell part 42 into a substantially U shape, and then is opposed to the first folded part 81 and the second folded part 86 (in the direction of the arrow 122 in FIG. 7). In the direction shown), the shell portion 42 extends toward the one end 42j side while approaching the second folded portion 86.
  • the second folded part 86 is reversed from the shell part 42 into a substantially U shape, and then is opposed to the first folded part 81 and the second folded part 86 (in the direction of the arrow 122 in FIG. 7). In the direction shown), the shell portion 42 extends toward the one end 42j while approaching the first folded portion 81.
  • first folded portion 81 and the second folded portion 86 are not limited to the shapes shown in FIGS. 9 and 10.
  • the first folded portion 81 and the second folded portion 86 may have a folded shape that is inverted while forming a corner from the end of the shell portion 42 on the other end 42k side.
  • FIG. 11 is a cross-sectional view showing a state in which a plug is connected to the receptacle in FIG. 12 is a cross-sectional view showing a step of connecting a plug to the receptacle in FIG.
  • the plug 70 includes an exterior body 71, a first contact 72, and a second contact 73.
  • the exterior body 71 has a cylindrical shape.
  • the exterior body 71 has an opening 71d that opens in one direction.
  • the first contact 72 and the second contact 73 are accommodated in the exterior body 71.
  • the 1st contact 72 is provided corresponding to a plurality of electrodes which constitute electrode group 24 on the 1st surface 21a and the 2nd surface 21b.
  • the second contact 73 is provided corresponding to the ground electrode 23 on the first surface 21a and the second surface 21b.
  • the first contact 72 is provided on the back side of the second contact 73, and the second contact 73 is provided on the near side of the first contact 72.
  • the first contact 72 and the second contact 73 are configured to be elastically deformable. When the plug 70 is connected to the receptacle 10, the first contact 72 and the second contact 73 apply a biasing force to the first surface 21 a and the second surface 21 b of the multilayer substrate 21.
  • the exterior body 71 enters the inside of the shell portion 42 through the insertion port 14, and the multilayer substrate 21 (more specifically, the tongue portion 22) passes through the opening 71 d. Enter inside 71.
  • the first contact 72 contacts the electrode group 24, the first contact 72 and the electrode group 24 are electrically connected.
  • the second contact 73 is superimposed on the ground electrode 23 via the first folded portion 81 and the second folded portion 86, whereby the second contact 73 and the ground electrode 23 are electrically connected.
  • first folded portion 81 and the second folded portion 86 of the shell portion 42 are grounded by the ground electrode 23 across the second contact 73 (ground spring portion) inside the plug 70, the plug 70 and the cable are also shielded.
  • the first folded portion 81 and the second folded portion 86 of the shell portion 42 also function as an EMC pad for shielding the plug 70 and the cable.
  • cover 41 further includes an extending portion 43.
  • the extending portion 43 is integrated with the shell portion 42, for example, by welding.
  • the extending portion 43 is provided so as to extend from the shell portion 42 to both sides thereof.
  • the extending portion 43 extends from the shell portion 42 in the direction indicated by the arrow 123 that is orthogonal to both the direction indicated by the arrow 121 and the direction indicated by the arrow 122 in FIG.
  • the extending portion 43 has a plate shape parallel to the multilayer substrate 21 on both sides of the shell portion 42.
  • a screw insertion hole 46 is formed in the extending portion 43.
  • the screw insertion hole 46 is a through hole that penetrates the extending portion 43.
  • the first protrusion 25 and the second protrusion 28 are superimposed on the case 12 (more specifically, the lower case 12n). Further, the extending portion 43 is overlapped in a plane with respect to the first protrusion 25 and the second protrusion 28. The extending portion 43 is in surface contact with the first surface 21 a of the first protrusion 25 and the second protrusion 28. At this time, the screw insertion hole 46 formed in the extending portion 43 and the screw insertion hole 27 formed in the multilayer substrate 21 overlap.
  • the receptacle 10 further has a screw 36.
  • the screw 36 is made of metal.
  • the screw 36 is inserted into the screw insertion hole 46 and the screw insertion hole 27 from the first surface 21a side of the multilayer substrate 21 and is screwed into the case 12 (more specifically, the lower case 12n).
  • the multilayer substrate 21 is fixed to the case 12 by the screws 36.
  • the cover 41 (extending portion 43) is fixed to the case 12 together with the multilayer substrate 21 by screws 36.
  • the present invention is not limited thereto, and, for example, a clip or a bolt may be used.
  • a receptacle structure is assumed in which a pin member corresponding to the electrode group 24 is disposed in the shell, and the pin member is fixed to the substrate using solder.
  • the solder portion since stress is repeatedly applied to the solder portion as the plug is inserted and removed, the solder portion may be damaged.
  • the electrode group 24 is provided on the tongue portion 22 of the multilayer substrate 21 and the plug 70 is inserted into and removed from the tongue portion 22.
  • High durability for example, durability against 10,000 or more insertions / removals
  • the case 12 can be reduced in thickness.
  • the multilayer substrate 21 since the multilayer substrate 21 is fixed to the case 12 by the screw 36, the multilayer substrate 21 receives the stress accompanying the insertion / extraction of the plug integrally with the case 12. Thereby, higher durability can be exhibited with respect to the insertion and removal of the plug 70. Further, since the screw 36 for fixing the multilayer substrate 21 to the case 12 is provided adjacent to the tongue portion 22 into which the plug 70 is inserted and removed, durability against the insertion and removal of the plug 70 can be further enhanced.
  • the cover 41 further includes a shield part 44.
  • the shield part 44 is integrated with the shell part 42, for example, by welding.
  • the shield part 44 is provided so as to cover the circuit components mounted on the multilayer substrate 21.
  • the shield part 44 has a bottom part 44p, a first side part 44q, and a second side part 44r as its constituent parts.
  • the bottom portion 44p is disposed to face the first surface 21a of the multilayer substrate 21.
  • the bottom portion 44p continues from the other end 42k of the shell portion 42.
  • the bottom 44p is in contact with the heat dissipation sheet 32.
  • the first side portion 44q and the second side portion 44r rise from both ends of the bottom portion 44p and extend to the second surface 21b of the multilayer substrate 21.
  • the first side portion 44q and the second side portion 44r are provided to face each other in the direction indicated by the arrow 123 in FIG.
  • the shield portion 44 is provided on the first surface 21a of the multilayer substrate 21 so as to cover the Cin 54, the main switch 55, the SR 56, and the SMPS controller 57 among the components of the DC / DC converter 50.
  • the electromagnetic shield of the DC / DC converter 50 can be realized with a simple configuration.
  • the structure of the receptacle 10 according to the embodiment of the present invention described above will be described together.
  • the receptacle 10 according to the present embodiment is configured so that the plug 70 can be inserted and removed.
  • the receptacle 10 includes a multilayer substrate 21.
  • the multilayer substrate 21 has a tongue 22 located on the periphery when the multilayer substrate 21 is viewed in plan.
  • the receptacle 10 includes an electrode group 24 provided on both surfaces of the multilayer substrate 21 in the tongue portion 22, and a metal cover 41 connected to the multilayer substrate 21.
  • the cover 41 has a shell portion 42 disposed so as to surround the tongue portion 22, and a folded shape that is folded back from the shell portion 42 so as to approach the first surface 21 a as one surface of the multilayer substrate 21, and is elastically deformed.
  • a first folded portion 81 that can be configured, and a folded shape that is provided to face the first folded portion 81 and is folded back so as to approach the second surface 21 b as the other surface of the multilayer substrate 21 from the shell portion 42.
  • a second folded portion 86 configured to be elastically deformable.
  • the tongue portion 22 is disposed between the first folded portion 81 and the second folded portion 86 while elastically deforming the first folded portion 81 and the second folded portion 86 in directions away from each other.
  • the receptacle 10 configured as described above, it is possible to realize a receptacle that exhibits a high durability against plug insertion / extraction while having a simple configuration.
  • the receptacle according to the present invention is a receptacle configured so that a plug can be inserted and removed.
  • the receptacle includes a multilayer substrate.
  • the multilayer substrate has a tongue portion located at the periphery when the multilayer substrate is viewed in plan.
  • the receptacle includes an electrode group provided on both surfaces of the multilayer substrate at the tongue, and a metal cover connected to the multilayer substrate.
  • the cover has a shell portion disposed so as to surround the tongue portion, a first folded portion configured to be elastically deformable, having a folded shape that is folded from the shell portion so as to approach one surface of the multilayer substrate, A second folded portion is provided opposite to the first folded portion, has a folded shape that is folded back from the shell portion so as to approach the other surface of the multilayer substrate, and is configured to be elastically deformable.
  • the tongue portion is disposed between the first folded portion and the second folded portion while elastically deforming the first folded portion and the second folded portion in a direction away from each other.
  • the receptacle is a general term for a connector on an electronic device side that is electrically connected to a plug and a cable connected to the plug.
  • the first cover portion and the second return portion that can be elastically deformed are provided on the metal cover, thereby allowing the tongue portion to be held inside the shell portion with a simple configuration. can do.
  • the electrode group used as an electrical contact with a plug is provided in the tongue part of the multilayer board
  • the receptacle further includes a ground terminal provided on the multilayer substrate at the tongue. At least one of the first folded portion and the second folded portion is electrically connected to the ground terminal.
  • the receptacle further includes a plurality of ground terminals provided on the multilayer substrate at the tongue. The first folded portion and the second folded portion are electrically connected to a plurality of ground terminals.
  • the shell portion can function as an electromagnetic shield with a simple configuration.
  • the receptacle further includes a base member that supports the multilayer substrate and a fixing member that fixes the multilayer substrate to the base member.
  • the multilayer substrate is integrated with the base member and receives stress accompanying insertion and removal of the plug. Thereby, higher durability can be exhibited with respect to plug insertion / extraction.
  • the fixing members are provided on both sides of the tongue when the multilayer substrate is viewed in plan.
  • the fixing member is provided in the vicinity of the tongue portion into which the plug is inserted / extracted, whereby higher durability against plug insertion / extraction can be exhibited.
  • the cover further includes an extending portion that extends from the shell portion and is planarly superimposed on the multilayer substrate.
  • the extending portion is fixed to the base member together with the multilayer substrate by a fixing member.
  • the shell portion can be fixed to the base member with a simple configuration.
  • the receptacle further includes a DC / DC converter having an inductor, a capacitor, and a switching element and provided on the multilayer substrate.
  • a DC / DC converter having an inductor, a capacitor, and a switching element and provided on the multilayer substrate.
  • a circuit module including a DC / DC converter can be configured with a simple configuration.
  • This invention is applied to a receptacle of a USB connector, for example.

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  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

Le présent réceptacle comporte: un substrat multicouche (21) doté d'une partie (22) de languette; un groupe (24) d'électrodes équipant les deux surfaces du substrat multicouche (21) dans la partie (22) de languette; et un couvercle métallique (41) relié au substrat multicouche (21). Le couvercle (41) comporte: une partie (42) de coque; une première partie repliée (81) qui présente une forme repliée obtenue sous l'effet d'un repliement à partir de la partie (42) de coque vers une première surface (21a) du substrat multicouche (21), et qui est formée de façon à être capable d'une déformation élastique; et une seconde partie repliée (86) qui présente une forme repliée obtenue sous l'effet d'un repliement à partir de la partie (42) de coque vers une seconde surface (21b) du substrat multicouche (21), et qui est formée de façon à être capable d'une déformation élastique. La partie (22) de languette est disposée entre la première partie repliée (81) et la seconde partie repliée (86), et amène la première partie repliée (81) et la seconde partie repliée (86) à se déformer élastiquement dans des directions s'écartant l'une de l'autre.
PCT/JP2018/005941 2017-03-13 2018-02-20 Réceptacle WO2018168352A1 (fr)

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JP2017047324 2017-03-13

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CN110518387A (zh) * 2019-08-30 2019-11-29 Oppo（重庆）智能科技有限公司 插接件及其制作方法、电子设备
JP2020053415A (ja) * 2018-09-21 2020-04-02 日本航空電子工業株式会社 コネクタ、コネクタを備える装置及びコネクタの製造方法
JPWO2022034925A1 (fr) * 2020-08-13 2022-02-17
EP3972061A1 (fr) 2020-09-18 2022-03-23 Hosiden Corporation Connecteur et dispositif connecteur

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JPH0660082U (ja) * 1993-01-26 1994-08-19 ミツミ電機株式会社 配線基板接続構造
JPH07245157A (ja) * 1994-03-02 1995-09-19 Oki Electric Ind Co Ltd コネクタ構造
JP2010055798A (ja) * 2008-08-26 2010-03-11 Furukawa Electric Co Ltd:The プリント基板とコネクタとの接続構造
US20100216341A1 (en) * 2009-02-26 2010-08-26 Sandisk Il Ltd. Memory card and host device

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Publication number Priority date Publication date Assignee Title
JPH0584074U (ja) * 1992-04-13 1993-11-12 矢崎総業株式会社 基板用コネクタ
JPH0660082U (ja) * 1993-01-26 1994-08-19 ミツミ電機株式会社 配線基板接続構造
JPH07245157A (ja) * 1994-03-02 1995-09-19 Oki Electric Ind Co Ltd コネクタ構造
JP2010055798A (ja) * 2008-08-26 2010-03-11 Furukawa Electric Co Ltd:The プリント基板とコネクタとの接続構造
US20100216341A1 (en) * 2009-02-26 2010-08-26 Sandisk Il Ltd. Memory card and host device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020053415A (ja) * 2018-09-21 2020-04-02 日本航空電子工業株式会社 コネクタ、コネクタを備える装置及びコネクタの製造方法
JP7232006B2 (ja) 2018-09-21 2023-03-02 日本航空電子工業株式会社 コネクタ、コネクタを備える装置及びコネクタの製造方法
CN110518387A (zh) * 2019-08-30 2019-11-29 Oppo（重庆）智能科技有限公司 插接件及其制作方法、电子设备
JPWO2022034925A1 (fr) * 2020-08-13 2022-02-17
JP7411150B2 (ja) 2020-08-13 2024-01-11 株式会社ExH 給電コネクタ
EP3972061A1 (fr) 2020-09-18 2022-03-23 Hosiden Corporation Connecteur et dispositif connecteur
US11670891B2 (en) 2020-09-18 2023-06-06 Hosiden Corporation Electrical connector with water evacuation features and connector device using the same

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