WO2018170998A1 - Deformation measurement device - Google Patents

Abstract

A deformation measurement device comprises one or more deformation measurement elements. The deformation measurement element comprises: a substrate (1) made of an elastomer material having brittle properties; a sensitive grid (2) fixed to a surface of the substrate (1) to form an integral structure. The sensitive grid (2) outputs a measured value according to an amount of deformation on the basis of a preset ratio. The present invention employs the integral structure comprising the substrate (1) and the sensitive grid (2) and the elastomer material having brittle properties to eliminate an error resulting from plastic deformation. The deformation measurement device can eliminate the issues caused by plastic deformation, and has high precision, repeatability and reliability.

Description

Deformation measuring device Technical field

The present invention relates to the field of stress measurement, and in particular to a deformation measuring device.

Background technique

The deformation measuring device generally includes a strain gauge unit which is a deformation measuring element, and the deformation measuring element is usually fixed on an elastic body to be tested and deformed, and after the deformation measuring element is placed on the surface of the elastic body, the deformation of the elastic body can be tested. The deformation measuring element converts the measured deformation of the elastomer into a signal output of a test signal such as mechanical, electrical, magnetic or optical.

The deformation determining element includes a sensitive gate that converts the deformation into a signal and an electrically insulating substrate, and the sensitive gate is usually a resistive sheet. In the prior art, the elastomer is usually a conductive metal (aluminum, alloy steel, stainless steel), and there must be an electrically insulating substrate between the deformed resistive sheet, and the substrate is usually organic and flexible. .

The resistance sheet and the substrate are collectively referred to as a strain gauge or a strain gauge, and the strain gauge is composed of one or more strain gauge units, that is, deformation measuring elements. After the deformation strain gauge is fixed to the surface of the elastic body, the deformation of the elastic body can be tested. When manufacturing the load cell, the deformation strain gauge is bonded to the elastomer using an adhesive, so that the load to be weighed is placed on the elastic body to deform the elastic body, and the deformation is performed by the strain gauge. Measurement, according to the measurement results, the weight of the load can be converted to achieve weighing.

When the above-mentioned weighing sensor is used as the scale, the scale body needs to adopt a load-bearing structure such as a load-bearing frame and a weighing platform in addition to the load cell, and the elastic body in the load-bearing structure and the load cell is a different component. A powerful delivery mechanism.

As can be seen from the above, the deformation measuring device includes a deformation measuring element composed of a sensitive grid and a substrate, and the deformation measuring element can be tested for deformation of the elastic body after being fixed on the elastic body; and the deformation measuring element and the elastic body can be combined to form a scale. The weight sensor; the load cell combined with the load-bearing structure can form a scale that can be used directly in daily life.

In the above deformation measuring device, the material of the sensitive grid also changes after the elastic body is deformed. The sensitive gate is converted into a corresponding test signal such as mechanical, electrical, magnetic or optical signal according to the deformation of the material itself.

The principle of the sensitive grid test deformation is based on Hooke's law, and has been widely used as the center of weight. In the range of elastic deformation, the ratio of solid deformation to external force is linear. This principle has been widely recognized and applied to many practical fields such as springs.

Deformation strain gauges for deformation detection and measurement are available in a variety of ways, all based on Hooke's law, which translates the changes produced by deformation into mechanical, electrical, magnetic or optical changes. The detector is applied.

However, Hooke's law is only established within a limited stress range, and most of the materials used for elastomers undergo plastic deformation under high stress, which is separated from Hooke's law and exhibits a nonlinear response.

Since the material of the conventional strain gauge substrate is plastic, it will follow the plastic deformation of the elastic body, so that the deformation strain gauge loses linearity, and the so-called history effect causes an error. At the same time, exceeding the elastic limit results in loss of resilience, which reduces repeatability. If you continue to withstand stress, it will eventually lead to damage.

On the other hand, as a material which has almost no plastic deformation or virtually no plastic deformation, glass, ceramics and the like are well known. These materials, so-called brittle materials, show little characteristic of plastic deformation. Therefore, after loading the load according to Hooke's law, the brittle material will undergo deformation proportional to the stress, and the material will be able to withstand the maximum stress and then cause brittle failure. This indicates that when glass or ceramic is used as the elastomer or substrate for detecting deformation, it will always have excellent stress-deformation linearity and repeatability before brittle failure is achieved.

Glass and ceramics have long been too small (generally less than 10-3) because of their elastic deformation limit. Therefore, the prior art believes that glass and ceramics are not suitable for general deformation measurement such as weighing.

The resistance strain gauge detection method is a method for converting a deformation signal by using a metal resistor as a sensitive gate. It is a well-known method for converting a deformation into an electrical signal, and detecting deformation by detecting a change in resistance caused by a volume change of a metal resistor. A typical example of this method is as follows Bottom: A metal resistance wire or a metal resistor sheet processed into a line shape is fixed on an electrically insulating organic substrate such as an epoxy resin or a polyimide resin to form a strain gauge, and it is bonded with an adhesive. Detecting the deformed elastomer. Such strain gauges are relatively inexpensive and are widely used in load cells.

However, this technology still has the following limitations:

1) In a strain gage using a metal resistor as a sensitive gate, since the sensitive gate needs to be fixed on an electrically insulating organic substrate such as an epoxy resin or a polyimide resin, these electrically insulating substrates are flexible. No flexibility. When the load of the elastomer is too large and exceeds its yield point, and the flexible deformation occurs, the substrate will be plastically deformed. At this time, the resistive sheet will still work, outputting a non-linear signal, causing an error. Since the flexible substrate in the existing strain gauge has inevitably has plastic deformation characteristics, the error caused by plastic deformation cannot be eliminated.

2) When the deformation strain gauge is further applied to form the load cell, it can be seen from the above description that the deformation strain gauge needs to be attached to the elastic body, which is not only labor-intensive, but also due to limitations of manual work, the strain gauge cannot be made. Too small, thus limiting the miniaturization of the load cell.

3) When the load cell is further applied to form the scale, the load-bearing structure is also required, and the load cell and the load-bearing structure cannot be integrated, and a strong transmission mechanism is required between the two, which reduces the volume, Reducing costs, improving reliability and measuring accuracy are all disadvantageous.

Summary of the invention

The technical problem to be solved by the present invention is to provide a deformation measuring device capable of eliminating the influence of plastic deformation, having high precision, high repeatability and high reliability, and also reducing manual, simplification and reduction of the scale body structure.

In order to solve the above technical problems, the deformation measuring device provided by the present invention includes one or more deformation measuring elements, and the deformation measuring element includes:

The substrate consists of an elastomeric material having the properties of a brittle material.

a sensitive grid fixedly coupled to the surface of the substrate and forming an integrated structure, wherein the sensitive gate outputs a detected value proportionally according to the deformation, and the integrated structure of the substrate and the sensitive grid is utilized And the substrate has brittle material properties to eliminate errors caused by plastic deformation. Brittle materials show almost no plastic deformation characteristics, so they are also called materials without substantial plastic deformation.

A further improvement is that the material of the sensitive grid has a higher elastic limit than the material of the substrate.

A further improvement is that the substrate has a three-dimensional structure, and the sensitive grid is disposed on one or more sides of the three sides of the substrate.

A further improvement is that the deformation determining device further comprises a metal elastic body, the deformation measuring element is fixed on the metal elastic body, and the elastic limit of the material of the substrate is smaller than the elastic limit of the metal elastic body, the base The material is bonded to a surface of the metal elastomer, the substrate being located between the metal elastomer and the sensitive grid.

A further improvement is that the deformation determining device further comprises an elastomer, the elastomer and the substrate being the same component.

In a further improvement, the deformation measuring device and the load-bearing structure constitute a scale, and the load-bearing structure, the elastic body and the substrate are the same member.

A further improvement is that the load-bearing structure, the second elastomer and the substrate are flat plate structures for loading external loads.

A further improvement is that the deformation determining element is a film deformation measuring element, and the material of the sensitive gate is a film structure and is formed on the surface of the substrate by a thin film process.

A further improvement is that the material of the substrate is glass.

A further improvement is that the thickness of the glass of the substrate is 0.1 mm or more.

A further improvement is that the material of the substrate is ceramic.

A further improvement is that the ceramic of the substrate has a thickness of 0.01 mm or more.

A further improvement is that the material of the sensitive gate is a metal resistor film.

Further, the thickness of the metal resistor film of the sensitive gate is 10 nm or more and 5 μm or less.

A further improvement is that the deformation measuring device comprises the plurality of overlapping deformation determinations The components, each of the deformation measuring elements, constitute a multi-axis test structure.

A further improvement is that the deformation measuring device includes a plurality of the deformation measuring elements arranged in the same plane, and each of the deformation measuring elements constitutes a multi-axis test structure.

A further improvement is that the deformation measuring element further comprises a compensating element composed of a material having a characteristic compensation function provided on the surface of the substrate.

A further improvement is that the thin film process corresponding to the film structure of the material of the sensitive gate includes a physical film forming process and a chemical film forming process.

A further improvement is that the physical film forming process includes MBE or sputtering; the chemical film forming process includes electroplating and CVD.

A further improvement is that a buffer layer is interposed between the substrate and the sensitive gate for enhancing the bonding strength of the substrate and the sensitive grid.

A further improvement is that the material of the sensitive gate is a semiconductor film.

The invention has specially designed the deformation measuring component to directly fix the sensitive grid to the substrate composed of the elastomer material having the brittle material property, thereby eliminating the need in the prior art to fix the sensitive grid on the flexible material. The plastic deformation error caused by the flexible material on the substrate is composed, so that the present invention can eliminate the influence of plastic deformation, thereby making the deformation measuring element have the advantages of high precision, high repeatability, and high reliability.

By directly using the material of the substrate of the deformation measuring element of the present invention as an elastic body, integration of the elastic body and the deformation measuring element can be realized, and the deformation measuring element in the load cell of the prior art needs to be manually attached to the elasticity. The physical defects can not only save the time and cost of labor, but also realize the miniaturization of the deformation measuring component and the load cell, and also eliminate the reliability caused by the glue in the bonding process. This further improves reliability.

The invention can also conveniently use the substrate of the deformation measuring element as an elastic body, and design it as a load-bearing structure capable of directly supporting the load, that is, a substrate capable of realizing the load-bearing structure and the elastic body and the deformation measuring element. An integrated structure consisting of the same component. No need to add another Further, the load-bearing body structure does not need to provide a force transmission structure between the load-bearing body structure and the elastic body, and the structure is simple, the cost is low, and the test accuracy and reliability can be further improved.

In combination with the substrate structure, the sensitive gate of the present invention can be directly formed on the surface of the substrate through a thin film process, which not only achieves a firm bond between the sensitive gate and the substrate, but also the thickness of the sensitive gate film is very thin relative to the substrate, and the substrate is The elastic deformation has almost no effect; and after the sensitive gate film is firmly bonded to the substrate, the volume change of the sensitive gate film is suppressed by the substrate, and in this state, the sensitive gate film hardly has plastic deformation, thereby having a high Repeatability.

In addition, the present invention abandons the prejudice that the prior art considers that glass and ceramics are not suitable for general-purpose deformation measurement such as weighing, and utilizes recent technological advancements, such as advances in glass manufacturing technology, and the elastic deformation limit of new tempered glass has The characteristics of the large-scale improvement have been achieved by applying brittle materials such as glass and ceramics to the deformation measurement, thereby achieving the technical effects of applying the above-described brittle material to the deformation measurement.

DRAWINGS

The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

1 is a schematic view of a deformation measuring device according to an embodiment of the present invention having a single deformation measuring element;

2 is a schematic view of a multi-axis device having a plurality of deformation measuring elements of a deformation measuring device according to an embodiment of the present invention;

Fig. 3 is a graph showing a characteristic curve of a uniaxial deformation measuring element of a deformation measuring apparatus according to an embodiment of the present invention.

detailed description

As shown in FIG. 1 , it is a schematic diagram of a deformation measuring device according to an embodiment of the present invention having a single deformation measuring component; the deformation measuring device of the embodiment of the present invention includes one or more deformation measuring components, and FIG. 1 shows one of the deformation measuring components. The deformation determining component includes:

The substrate 1 is composed of an elastomer material having brittle material properties.

a sensitive grid 2 fixedly bonded to the surface of the substrate 1 and forming an integrated structure, the sensitivity The grid 2 outputs the detected value proportionally according to the deformation, and the integrated structure of the substrate 1 and the sensitive grid 2 and the substrate 1 have brittle material properties to eliminate errors caused by plastic deformation.

Preferably, the material of the sensitive grid 2 has a higher elastic limit than the material of the substrate 1.

The substrate 1 has a three-dimensional structure, and the sensitive gate 2 is disposed on one or more sides of the three sides of the substrate 1 . In FIG. 1, only the sensitive gate 2 is disposed on one surface of the substrate 1. In other embodiments, the sensitive gate 2 can be disposed on either side of the three sides of the substrate 1. On the multiple sides, the sensitive gate 2 is all disposed on the three sides of the solid surface of the substrate 1.

In the embodiment of the present invention, the deformation measuring element is a film deformation measuring element, and the material of the sensitive gate 2 is a film structure and is formed on the surface of the substrate 1 by a thin film process. Preferably, the material of the sensitive gate 2 is a metal resistor film; the thickness of the metal resistor film of the sensitive gate 2 is 10 nm or more and 5 μm or less. In other embodiments, the material of the sensitive gate 2 is a semiconductor film.

The thin film process corresponding to the film structure of the material of the sensitive gate 2 includes a physical film forming process such as MBE or sputtering and chemical film forming processes such as electroplating and CVD.

Preferably, a buffer layer 3 is interposed between the substrate 1 and the sensitive gate 2 for enhancing the bonding strength between the substrate 1 and the sensitive gate 2. A protective layer 4 is formed on the surface of the sensitive gate 2. The sensitive grid 2 is also formed with an output connected to the wiring 5, through which the detected deformation signal is output. In Fig. 1, L1 represents the length of the substrate 1, and W1 represents the width of the substrate 1.

The deformation measuring device further includes an elastic body 6 to which the deformation measuring member is fixed. The elastomer 6 and the substrate 1 may be the same component.

The deformation measuring device and the load-bearing structure constitute a scale. The load-bearing structure, the elastic body 6, and the substrate 1 may be the same member. Preferably, the load-bearing structure is a flat structure for loading an external load.

In other embodiments, the elastic body 6 in FIG. 1 may also be a metal elastic body, and the deformation measuring element is disposed on the metal elastic body, and the elastic limit of the material of the base material 1 is smaller than the metal elastic body. The elastic limit is that the substrate 1 is bonded to the surface of the metal elastomer, and the substrate 1 is located between the metal elastic body and the sensitive gate 2.

In the embodiment of the present invention, the material of the substrate 1 is glass; the thickness of the glass of the substrate 1 is 0.1 mm or more. The glass of the material of the substrate 1 may be selected from ion exchange chemically strengthened glass, and the ion exchange chemically strengthened glass serves as both the substrate 1 and the elastomer 6. The following is a detailed description of the specific parameters of the glass as follows: The chemically strengthened soda lime glass used for the glass of the material of the substrate 1 can be bent to about 200 MPa by chemical strengthening. If the damage limit is expressed by deformation, it can reach about 0.3%, which is about 3 times that of ordinary soda lime glass.

There are many varieties of ion exchange chemically strengthened glass that can be used in the embodiments of the present invention, and are not necessarily limited to soda lime glass. For example, a K-substituted aluminosilicate-based ion exchange chemical glass and a Li-substituted ion exchange chemically strengthened glass can be used.

Among these ion exchange chemically strengthened glass, in particular, the K-substituted aluminosilicate glass has a large bending strength of 800 MPa or more. However, since the longitudinal elastic modulus is almost equal to that of soda lime glass, the maximum allowable deformation amount is about 1%. This value is 10 times that of the unreinforced soda lime glass. The relationship between the depth of the glass ion exchange layer and the bending strength has been grasped, and the depth of the ion exchange layer can be appropriately selected to suit different uses.

In other embodiments, the material of the substrate 1 may be ceramic; the thickness of the ceramic of the substrate 1 is 0.01 mm or more. The ceramic of the material of the substrate 1 may be zirconia which is known as a high-strength ceramic material, and has a large longitudinal modulus and a bending strength of about 1000 MPa.

In the embodiment of the present invention, the buffer layer 3 is inserted to increase the bonding strength of the substrate 1 of the chemically strengthened glass and the metal resistor film sensor material, that is, the sensitive gate 2, and the buffer layer 3 may also be used for the substrate if necessary. The precipitation of an alkali metal or the like in 1 has an inhibitory action. Silicon dioxide and silicon nitride The insulator is preferably used, but the buffer layer 3 may be formed as a conductor as needed. In the example of the present invention, the substrate 1 of the chemically strengthened glass and the metal resistor film 2 have sufficient bonding strength, and it is not necessary to consider the influence of the alkali metal, so the buffer layer 3 can be omitted.

In the embodiment of the present invention, the metal resistor film of the sensitive gate 2 can use a single metal having a sufficient volume resistivity, or an alloy such as nickel chrome or constantan, and can be widely used according to the characteristics of the required strain gauge element. select. The thickness thereof is extremely thin with respect to the substrate 1, and has little influence on the elastic deformation of the substrate 1.

Further, since the metal resistor film which is one of the sensitive gates 2 is firmly bonded to the glass of the substrate 1, the volume change of the metal resistor film is suppressed by the substrate 1. In this state, the metal resistor film hardly plastically deforms, making high repeatability possible.

The wiring 5 is a connecting portion of the metal resistor film, and is a terminal portion which is electrically connected to an external measuring device such as a bridge circuit, and the connecting portion should be made of a suitable material depending on the connection condition.

In the embodiment of the present invention, the metal resistor film of the sensitive gate 2 is formed on the substrate 1 by a physical film forming method such as MBE or sputtering, or a chemical film forming method such as electroplating or CVD, and combining the respective materials. Choose the most suitable film formation method. In order to avoid peeling of the film from the substrate 1, a high-strength bonding method should be employed, and generally, a sputtering method and an ion press method are suitable. In short, the specific method is not limited as long as the metal resistor film of the sensitive gate 2 is uniformly and firmly formed in the range used.

When the ion exchange chemical strength glass is used as the substrate 1 which is a substrate, the thickness thereof may be 0.1 mm or more, and there is no other particular requirement.

The thickness of the metal resistor film of the sensitive gate 2 may be a thickness that is uniform and does not cause damage due to accumulation of stress in the film during deposition. The thickness of the metal resistor film of the sensitive gate 2 varies depending on the material and the film formation method, and a thickness of 10 nm or more and 5 μm or less is preferably used.

The shape of the top surface of the sensitive grid 2 composed of a metal resistor body, that is, a metal resistor film may be an angular comb shape or other shape. The portion marked with the length L1 and the width W1 in Fig. 1 is a plan view, and the bottom portion of the top view is a cross-sectional view. The patterning of the metal resistor can be performed by a general electrode pattern forming technique such as a metal stencil method, a photo-etching method, or an etching method, and can be selected according to the size of the formed element.

Only a single-axis test structure including one of the deformation measuring elements is shown in FIG. In other embodiments, the deformation measuring device may include a plurality of the deformation measuring elements arranged in the same plane. For example, the other deformation measuring elements may be set in the deformation measurement shown in FIG. 1 . Each of the deformation measuring elements constitutes a multi-axis test structure. The position and direction of each of the deformation measuring elements are different; the structure of each of the deformation measuring elements may be identical; of course, according to the sensitivity of the strain gauge element and the configuration of the connecting electrodes, the deformation measuring elements may be The graphics are changed accordingly.

In addition, as shown in FIG. 2, it is a schematic diagram of a multi-axis device having a plurality of deformation measuring elements according to an embodiment of the present invention; the deformation measuring device includes a plurality of overlapping deformation measuring elements, as shown in FIG. As shown by the marks 101a, 101b, and 101c, each of the deformation measuring elements constitutes a multi-axis test structure, and the structure shown in Fig. 2 has a three-axis, three-layer stacked-layer strain gauge element which is a cross-axis, that is, a deformation measuring element. An insulating film which does not undergo plastic deformation such as SiO2 is interposed between the deformation measuring elements of each layer, and after the formation of the deformation measuring element 101a at the bottom layer, plastic deformation is not caused by SiO2 or the like on the deformation measuring element 101a. The insulating film can be easily formed into the deformation measuring element at an arbitrary crossing angle, as shown in the deformation measuring element 101b shown in FIG. In this way, a plurality of strain gauge elements can be multi-layered to form a multi-axis strain gauge element, and the strain in the corresponding direction can be detected to manufacture a multi-component force sensor.

In the embodiment of the present invention, the deformation measuring component further includes a compensating component composed of a material having a characteristic compensation function disposed on a surface of the substrate 1, for example, a temperature can be formed in the vicinity of the deformable strain gauge component. A temperature measuring element composed of a compensation film.

As shown in FIG. 3, it is a uniaxial deformation measuring component of the deformation measuring device of the embodiment of the present invention. The characteristic curve test chart; the horizontal axis represents the load, that is, the stress, and the vertical axis represents the output voltage, that is, the voltage formed by the change of the resistance value, the point corresponding to the mark 201 represents each test value obtained by gradually increasing the load, and the point corresponding to the mark 202 indicates that the load is gradually decreased. For each test value, it can be seen that the points corresponding to the marks 201 and 202 are substantially coincident, and the fitted lines of the two are basically the same, and the fitted lines of the two are the same line 203 in FIG. 3; it can be seen that The deformation measuring device exhibits an excellent linearity index from the start of no-load to the near-destructive stress. As can be seen from Fig. 3, the history related to the increase and decrease of the load is basically unchanged.

The present invention has been described in detail by way of specific examples, but these are not intended to limit the invention. Many modifications and improvements can be made by those skilled in the art without departing from the principles of the invention.

Claims (21)

A deformation measuring device comprising one or more deformation measuring elements, the deformation measuring element comprising: a substrate consisting of an elastomeric material having the properties of a brittle material; The sensitive grid is fixedly coupled to the surface of the substrate and forms an integrated structure, and the sensitive gate outputs the detected value proportionally according to the deformation. The deformation measuring apparatus according to claim 1, wherein the material of the sensitive gate has a higher elastic limit than the material of the substrate. The deformation measuring apparatus according to claim 1 or 2, wherein the substrate has a three-dimensional structure, and the sensitive grid is disposed on one or more of the three sides of the three-dimensional surface of the substrate. The deformation measuring apparatus according to claim 1 or 2, wherein the deformation measuring device further comprises a metal elastic body, and the deformation measuring element is provided on the metal elastic body, and a material elastic limit of the substrate is smaller than The elastic limit of the metal elastomer, the substrate is bonded to the surface of the metal elastomer, and the substrate is located between the metal elastomer and the sensitive grid. The deformation measuring apparatus according to claim 4, wherein said elastomer material and said base material are the same member. The deformation measuring apparatus according to claim 5, wherein the deformation measuring device and the load-bearing structure constitute a scale, and the load-bearing structure, the elastic body, and the base material are the same member. The deformation measuring apparatus according to claim 6, wherein said load-bearing structure, said elastic body, and said base material are flat plate structures for loading an external load. The deformation measuring device according to claim 1 or 2 or 3, wherein the deformation measuring element is a film deformation measuring element, and the material of the sensitive gate is a film structure and is formed on the substrate by a thin film process. surface. The deformation measuring apparatus according to claim 8, wherein said substrate material The material is glass. The deformation measuring apparatus according to claim 9, wherein the glass of the base material has a thickness of 0.1 mm or more. The deformation measuring apparatus according to claim 8, wherein the material of the substrate is ceramic. The deformation measuring apparatus according to claim 11, wherein the ceramic of the base material has a thickness of 0.01 mm or more. The deformation measuring apparatus according to claim 8, wherein the material of the sensitive gate is a metal resistor film. The deformation measuring apparatus according to claim 13, wherein the thickness of the metal resistor film of the sensitive gate is 10 nm or more and 5 μm or less. The deformation measuring apparatus according to claim 1 or 2 or 3, wherein the deformation measuring device includes the deformation measuring elements stacked in a plurality of layers, and each of the deformation measuring elements constitutes a multi-axis test structure. The deformation measuring apparatus according to claim 1 or 2 or 3, wherein the deformation measuring device comprises a plurality of the deformation measuring elements arranged in the same plane, and each of the deformation measuring elements constitutes a multi-axis test structure. . The deformation measuring apparatus according to claim 1 or 2 or 3, wherein the deformation measuring element further comprises a compensating element composed of a material having a characteristic compensation function provided on a surface of the substrate. The deformation measuring apparatus according to claim 8, wherein the thin film structure corresponding to the film structure of the material of the sensitive gate comprises a physical film forming process and a chemical film forming process. The deformation measuring apparatus according to claim 18, wherein said physical film forming process comprises MBE or sputtering; and said chemical film forming process comprises electroplating and CVD. The deformation measuring apparatus according to claim 1 or 2 or 3, wherein a buffer layer is interposed between said substrate and said sensitive grid for reinforcing said substrate and said sensitive The bonding strength of the grid. The deformation measuring apparatus according to claim 8, wherein the material of the sensitive gate is a semiconductor film.

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