WO2018173942A1

WO2018173942A1 - Cooling structure, cooling system, heating device, and structural object

Info

Publication number: WO2018173942A1
Application number: PCT/JP2018/010409
Authority: WO
Inventors: ベジ佐々木
Original assignee: フリージア・マクロス株式会社
Priority date: 2017-03-22
Filing date: 2018-03-16
Publication date: 2018-09-27

Abstract

The purpose of the present invention is to increase cooling effect and to easily achieve a decrease in size and the like. A cooling structure comprises a heat dissipation section having a mounting surface 2a on which an electronic component 101 is directly or indirectly mounted. The heat dissipation section is internally provided with a medium flow passageway for a flow of a medium.

Description

Cooling structure, cooling system, heating device and structure

The present invention relates to a cooling structure, a cooling system, a heating device, and a structure.

In recent years, electronic parts such as integrated circuit devices in electronic devices have been increasing in scale, high functionality, high-density mounting, etc., and accompanying this, the amount of heat generated during operation (during use) tends to increase. It is in. In addition, in recent years, technological developments that require high voltage and large current, such as electric vehicles, robots, and generators of renewable energy, have become active. For this reason, a cooling structure that cools electronic components is required to further improve the cooling effect.

Under such a background, as an electronic component cooling structure, for example, the heat generated in an integrated circuit device mounted on a wiring board is passed through heat dissipation vias (through holes) formed in the wiring board. There is one configured to transmit to a heat sink provided on a surface opposite to the mounting surface of the device and to dissipate heat by the heat sink (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 10-275883

However, in the conventional cooling structure described above, in order to cope with an increase in the amount of heat generated in recent years, it is necessary to increase the heat sink, forced cooling power, etc. in proportion thereto, and thus the size of the cooling structure needs to be increased. Therefore, it is contrary to the technical development guidelines such as high density and light and short which are the propositions of the electronic device industry in recent years.

An object of the present invention is to provide a cooling structure, a cooling system, a heat generating device, and a structure that can enhance the cooling effect as compared with the conventional structure, and thereby can easily cope with downsizing.

According to one aspect of the invention,
A heat dissipating part having a mounting surface on which electronic components are mounted directly or indirectly,
A medium flow path for flowing the medium in the heat radiating portion is provided.

According to the present invention, the cooling effect of the electronic component cooling structure can be enhanced more than that of the conventional structure, thereby making it possible to easily cope with downsizing and the like.

It is explanatory drawing which shows typically the example of schematic structure of the cooling structure of the electronic component which concerns on 1st embodiment of this invention. It is explanatory drawing which shows the structural example of the heat-medium hole in the cooling structure of the electronic component which concerns on 1st embodiment of this invention, (a) is a figure which shows the example, (b) is a figure which shows another example, ( (c) is a figure which shows another example, (d) is a figure which shows another example. It is explanatory drawing which shows the other structural example regarding the heat-medium hole in the cooling structure of the electronic component which concerns on 1st embodiment of this invention. It is explanatory drawing which shows the further another structural example regarding the heat-medium hole in the cooling structure of the electronic component which concerns on 1st embodiment of this invention. It is explanatory drawing which shows typically the schematic structural example of the cooling structure of the electronic component which concerns on 2nd embodiment of this invention, (a) is a figure which shows the example, (b) is a figure which shows another example. . It is explanatory drawing which shows typically the schematic structural example of the cooling structure of the electronic component which concerns on 3rd embodiment of this invention. It is explanatory drawing which shows typically the example of schematic structure of the cooling structure of the electronic component which concerns on 4th embodiment of this invention, (a) is a figure which shows the example, (b) is a figure which shows another example. . It is explanatory drawing which shows typically the other structural example of the cooling structure of the electronic component which concerns on 4th embodiment of this invention. It is explanatory drawing which shows typically the example of schematic structure of the cooling structure of the electronic component which concerns on 5th embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<1. First embodiment of the present invention>
First, a first embodiment of the present invention will be described.

(1-i) Configuration of Electronic Component Cooling Structure FIG. 1 is an explanatory diagram schematically showing a schematic configuration example of an electronic component cooling structure according to the first embodiment of the present invention. In addition, the example of a figure shows typically the example of schematic structure of the cooling structure, and about the display size, the display scale, etc., it does not necessarily follow the actual thing.

(overall structure)
The cooling structure according to the present embodiment includes a heat radiating portion having a placement surface on which the electronic component 101 is placed directly or indirectly. “Directly” “placed” means a mode of being placed without any intervention, and “indirectly placed” is a mode of being placed via any member. Means. The electronic component 101 may be placed indirectly on the placement surface via the insulating substrate 4, the heat dissipation insulation sheet, or the like, or may be placed directly on the placement surface. The heat radiating part of the cooling structure may include a heat sink 5 which is a heat radiating member to be described later and / or a heat conductive plate 2 as a heat conductive member. The heat dissipating member may include a heat dissipating main body 7 and heat dissipating fins 6 which are examples of a heat dissipating structure provided in the heat dissipating main body 7. The heat radiating body 7 and the heat radiating structure may be formed integrally. The heat radiating member does not have a heat radiating structure, and may be a heat radiating block, for example.

The cooling structure 1 described later is a concept including the insulating substrate 4 in addition to the cooling structure. As the heat conduction plate 2, a heat exhaust plate having high heat exhaust properties may be used, or a cooling plate having a cooling function may be used. The heat conducting member and the cooling structure 1 may be made of different materials or may be made of the same material. As an example, the first metal may be used as the material of the heat conduction member, and the second metal may be used as the material of the cooling structure. For example, a material containing copper as the material of the heat conduction member may be used. A material containing aluminum may be used as the material. Further, a metal may be used as the material of the heat conducting member, and a non-metal may be used as the material of the cooling structure. For example, a material containing copper or aluminum is used as the material of the heat conducting member, and the material of the cooling structure is used. A material containing ceramic may be used.

As shown in FIG. 1, the electronic component cooling structure 1 according to the first embodiment includes an insulating substrate 4 on which an electronic component 101 serving as a heating element is mounted on one surface (upper surface in FIG. 1), and an insulating substrate 4. A heat conducting plate 2 as a heat conducting member joined to another surface (lower surface in FIG. 1) and a heat sink 5 as a heat radiating member joined to the lower surface of the heat conducting plate 2 are provided. That is, the cooling structure 1 includes an insulating substrate 4 on which the electronic component 101 is mounted, a heat sink 5 that is indirectly bonded to the insulating substrate 4 through the heat conducting plate 2, and the insulating substrate 4 and the heat sink 5. And a heat conductive plate 2 interposed therebetween. The heat conductive plate 2 has a mounting surface 2a on which the insulating substrate 4 is mounted. At least a part of the heat medium hole 3 that is a medium flow path (at least a part shown in FIG. 1) is arranged to extend in a direction along the placement surface 2a. In the embodiment shown in FIG. 1, the in-plane direction of the insulating substrate 4 (the direction including the left-right direction in FIG. 1 and the front and back direction of the paper surface) is the in-plane direction of the mounting surface 2a, and the in-plane direction of the tower mounting surface 2a At least a part of the heat medium hole 3 extends along the line. In the present embodiment, the “direction along the mounting surface 2a” is not only a direction extending in parallel with the direction in which the mounting surface 2a extends, but also the direction in which the mounting surface 2a extends. A direction extending in the direction is also included.

(Insulated substrate)
The insulating substrate 4 has a plate shape on which the electronic component 101 is mounted. A circuit pattern 24 that forms an electric circuit is formed on the surface of the insulating substrate 4, and the electronic component 101 that is a heating element is attached to the circuit pattern 24.

Various types of electronic components 101 can be applied as the electronic component 101 mounted on the insulating substrate 4. However, the type is not particularly limited as long as it is a heating element. For example, a semiconductor chip such as a light emitting diode or a power device is used. It may be an integrated circuit device such as an MPU (CPU) or a power supply component such as a transistor or a capacitor.

(heatsink)
The heat sink 5 functions as a heat radiating member that radiates heat from the electronic component 101. Therefore, the heat sink 5 is formed of a metal material having good thermal conductivity, and is on the side opposite to the electronic component 101 side (that is, the side of the joint surface with the thermal conduction plate 2) (the lower side in the figure). The heat sink 5 has heat radiation fins 6 as heat radiation structures for radiating heat transmitted to the heat sink 5.

(Heat conduction plate)
The heat conductive plate 2 is a plate-shaped member made of a material having thermal conductivity, and functions as a heat conductive member that transfers heat from the insulating substrate 4 to the heat sink 5. Therefore, it is preferable that the heat conductive plate 2 is formed of a metal plate member having good heat conductivity.

The heat conduction plate 2 is not necessarily a single plate-like member, and may have a multilayer structure in which a plurality of layers are laminated, for example. Specifically, the heat conductive plate 2 may include a plate material that forms the intermediate layer in a side view and a metal layer that is provided so as to cover the upper surface and the lower surface of the plate material. . In this case, as the plate material, for example, a material such as copper, copper alloy, aluminum, and aluminum alloy is applied, and as the metal layer, for example, a plating layer such as copper is applied. Moreover, you may comprise the heat conductive board 2 by carrying out adhesion construction of the insulating resin and copper foil on the single side | surface side or both surface side of a board | plate material.
In addition, the heat conductive plate 2 is not necessarily limited to a metal material, and may be formed of a non-metal material such as ceramics as long as the material has good heat conductivity.
Furthermore, even if the surface of the heat conductive plate 2 or the inner wall surface of the heat medium hole 3 to be described later is formed with a thin film rust preventive film that does not deteriorate the thermal conductivity such as gold plating in order to prevent oxidative corrosion. Good.

In such a heat conductive plate 2, details of the insulating substrate 4 immediately below the place where the electronic component 101 is mounted and the area immediately below the area (that is, the area including immediately below the position where the electronic component is mounted) will be described in detail later. Next, it is defined as a mounting region 25 of the electronic component 101 on the heat conducting plate 2 (see, for example, FIG. 2 described later). The number and shape of the scheduled mounting areas 25 are appropriately set according to specifications and the like, and are not particularly limited.

(Heat medium hole)
Inside the heat conducting plate 2, a through-hole-shaped heat medium hole 3 extending in a predetermined direction is provided. The heat medium hole 3 is for performing heat sink (cooling) of the heat conducting plate 2 by convection of a medium such as a gas (for example, air) passing through the heat medium hole 3 or a liquid such as water or oil. . That is, the heat medium hole 3 is configured to exhaust heat by the flow of the medium in the hole. The heat medium hole 3 serving as a medium flow path is provided between the insulating substrate 4 and the heat radiating fins 6 of the heat sink 5 by being provided in the heat conducting plate 2.

The heat medium hole 3 includes a first opening 301 that is an inlet portion into which a medium such as gas or liquid flows, and a second opening 302 that is an outlet portion through which the medium is discharged. The first opening 301 and the second opening 302 are provided so as to be exposed at the end face of the heat conducting plate 2. As a result, the heat medium hole 3 has a through-hole configuration from the inlet portion on one end face of the heat conducting plate 2 to the outlet portion on the other end face.

Such a heat medium hole 3 can be formed by utilizing mechanical processing, etching processing, or the like for the heat conductive plate 2. For example, if the heat conductive plate 2 has a multilayer structure in which a plate material and a metal layer are laminated, a groove shape in which one surface side (the side to which the insulating substrate 4 is bonded or the opposite side) of the plate material opens. Thus, the heat medium hole 3 can be easily formed by providing a metal layer so as to close the opening of the recess. The metal layer in this case is an example of a lid member that closes the recess. However, the formation method of the heat medium hole 3 is not particularly limited, and the heat medium hole 3 may be formed by any method as long as it is configured in a through hole shape.

In addition, at least a part (a part or all) of the heat medium hole 3 serving as a medium flow path passes through a region to be mounted 25 of the electronic component 101 on the heat conductive plate 2 (for example, see FIG. 2 described later). It is formed as follows. In other words, the heat medium hole 3 is arranged so that at least a part thereof overlaps with the vicinity of the place where the electronic component 101 is mounted when viewed in plan.

Here, the description is made assuming that one heat medium hole 3 is provided for one mounting region 25 in the heat conductive plate 2, but the heat medium hole in the heat conductive plate 2 is described. 3 and the number of scheduled mounting areas 25 are not particularly limited. For example, a configuration in which a plurality of mounting regions 25 and a plurality of heat medium holes 3 are provided in the heat medium hole 2 may be employed.
Further, the present invention is not limited to the configuration in which one heat medium hole 3 overlaps one mounting scheduled area 25. For example, the heat conduction plate 2 may be provided with a plurality of scheduled mounting areas 25 and the heat medium holes 3 may be provided so as to overlap with some of the plurality of scheduled mounting areas 25. Furthermore, the structure provided so that the some heat-medium hole 3 may overlap with respect to the one mounting plan area | region 25 may be sufficient.

(1-ii) Stretching direction of heat medium hole Next, the arrangement when using the cooling structure 1 of the electronic component having the above-described configuration, particularly the stretching direction of the heat medium hole 3 when using the cooling structure 1 is described in detail. I will explain it.
Here, a case where the convection of the medium in the hole of the heat medium hole 3 is generated by natural convection rather than forcibly generated will be described as an example.
FIG. 2 is an explanatory diagram showing a configuration example of the heat medium hole in the electronic component cooling structure according to the first embodiment of the present invention.

As shown in FIG. 2 (a), the extending direction of the heat medium hole 3 may be along the vertical direction (gravity direction) when the electronic component cooling structure 1 is used. In this case, the first opening 301 serving as the medium inlet is disposed on the lower surface in the vertical direction, and the second opening 302 serving as the medium outlet is disposed on the upper surface in the vertical direction. As will be described later, the flow of the medium in the hole of the heat medium hole 3 can be generated using, for example, thermal convection (natural convection) due to the chimney effect (draft effect).

Such an extending direction of the heat medium hole 3 can be realized, for example, by arranging the entire cooling structure 1 in such a manner (rotating the cooling structure 1 shown in FIG. 1 90 degrees to the left). Further, the heat medium hole 3 may be arranged such that the extending direction of the heat medium hole 3 is inclined with respect to the horizontal direction when the electronic component cooling structure 1 is used. In short, when the electronic component 101 is used, the first opening 301 serving as a medium inlet to the heat medium hole 3 provided on one surface of the heat conducting plate 2 is an outlet of the medium from the heat medium hole 3. The first opening 301 and the second opening 302 cause a height difference in the direction of gravity between the first opening 301 and the second opening 302. I just need it.

At least a part of the heat medium hole 3 in a direction perpendicular to the upper surface of the heat conduction plate 2 (hereinafter referred to as “normal direction view”) is a region 25 in which the electronic component 101 is to be mounted on the heat conduction plate 2. It may be formed to pass through. That is, the heat medium hole 3 may be disposed so that at least a part of the heat medium hole 3 overlaps the planned mounting area 25 of the electronic component 101 when viewed in the normal direction.

The cross-sectional shape of the heat medium hole 3 (referred to as a cross-sectional shape obtained by cutting the heat medium hole 3 along a plane parallel to the extending direction) is, for example, a uniform cross-sectional dimension from the first opening 301 to the second opening 302. Is formed. Therefore, it is possible to facilitate the formation of the heat medium hole 3, and it is possible to suppress the complexity of the structure of the cooling structure 1 and the increase in cost. However, the heat medium hole 3 is not limited to such a form, and may have a cross-sectional shape as described later.

As described above, the heat medium hole 3 may be configured to have the following characteristics.
(1) The first opening 301 serving as a medium inlet portion provided on one surface of the heat conducting plate 2 is communicated with the second opening 302 serving as a medium outlet portion, which is stretched in a predetermined stretching direction. It has a through-hole configuration for the purpose of exhaust heat (heat extraction) due to the flow of the medium in the hole.
(2) When viewed in the normal direction, at least a part of the heat medium hole 3 overlaps at least a part of the mounting region 25 of the electronic component 101 mounted on the insulating substrate 4.
(3) When the electronic component 101 is used, the heat medium hole 3 extends in the vertical direction (gravity direction) (at least in a direction other than the horizontal direction).

(1-iii) Heat and Medium Flow Next, the heat and medium flow in the electronic component cooling structure 1 configured as described above will be described in detail.

In the electronic component cooling structure 1 configured as described above, the heat generated by the electronic component 101 is transmitted to the heat sink 5 as the heat radiating member via the insulating substrate 4 and the heat conductive plate 2, and the heat radiating structure portion in the heat sink 5 Heat is dissipated by the radiation fins 6.

However, in the process, the heat from the electronic component 101 is also transmitted to the hole of the heat medium hole 3 in the heat conducting plate 2 and heats the medium (for example, gas or liquid such as air) in the hole. As a result, the medium in the heat medium hole 3 is heated and expands in temperature, rises in the hole of the heat medium hole 3, and passes through the second opening 302 (opening located on the upper side) to the heat conduction plate 2. Leaks out of the water. A new medium (for example, outside air) is sucked from the first opening 301 (opening located on the lower side) of the heat medium hole 3. As described above, when heat from the electronic component 101 is transmitted, heat convection is generated in the hole of the heat medium hole 3. Specifically, if the medium is a gas, a medium flow from the lower side to the upper side is generated by the chimney effect (draft effect).

Accordingly, since heat from the electronic component 101 is transmitted to the heat sink 5 through the heat conducting plate 2, the heat conducting plate 2 is provided with the through-hole-shaped heat medium hole 3. The heat is also exhausted by the medium flow in the three holes. That is, regarding the heat from the electronic component 101, first, “rough heat” is exhausted by the flow of the medium in the heat medium hole 3, and then “remaining heat” transmitted to the heat radiation fin 6 of the heat sink 5 is the heat radiation fin. The heat is dissipated by 6.

As described above, according to the electronic component cooling structure 1 having the above-described configuration, heat is exhausted not only by the heat radiation fins 6 of the heat sink 5 but also by the flow of the medium in the heat medium hole 3. The cooling effect on the heat can be enhanced as compared with the conventional structure. In addition, the heat dissipating fins 6 of the heat sink 5 only need to dissipate “remaining heat” after exhaust heat is exhausted due to the flow of the medium in the heat medium hole 3, thereby suppressing an increase in size and the like for increasing the cooling capacity. As a result, it is possible to easily cope with downsizing and the like.

By the way, in the heat medium hole 3 responsible for exhaust heat of “rough heat”, the first opening 301 serving as a medium inlet is disposed below the second opening 302 serving as a medium outlet, and the heat medium The medium flow in the hole 3 is configured to be generated by thermal convection due to a chimney effect (draft effect) or the like. Therefore, if heat is transferred into the hole of the heat medium hole 3, it is possible to surely generate the medium flow by the heat convection naturally generated due to the density change due to the heating of the medium. That is, reliable exhaust heat using thermal convection (natural convection) is possible, which is very preferable for enhancing the cooling effect. In addition, by using natural convection, the configuration of the cooling structure 1 can be prevented from becoming complicated, which is preferable in terms of downsizing and the like.

Further, at least a part of the heat medium hole 3 is arranged so as to overlap with the planned mounting area 25 of the electronic component 101, and passes through a region near the mounting position of the electronic component 101. As described above, if the heat medium hole 3 passes through the vicinity of the electronic component 101, the heat transmitted from the electronic component 101 can be efficiently transferred in a state where the temperature difference from the medium flowing through the hole of the heat medium hole 3 is large. Therefore, it is possible to improve the exhaust heat efficiency (that is, the cooling efficiency with respect to the heat from the electronic component 101) by the medium.

Further, the heat medium hole 3 is formed in the heat conductive plate 2 interposed between the insulating substrate 4 and the heat sink 5. That is, the heat medium hole 3 is formed in the heat conductive plate 2 which is a separate member from the insulating substrate 4 and the heat sink 5. Therefore, it is easy to realize a sufficient degree of freedom in setting the path, shape, and the like of the heat medium hole 3, which is preferable in securing the versatility of the cooling structure 1 and the like.

(1-iv) Modified Example Here, another structural example of the heat medium hole 3 in the present embodiment will be described.
In the configuration example described above, the case where the cross-sectional shape of the heat medium hole 3 is uniform from the first opening 301 to the second opening 302 has been described (see FIG. 2A). is not.

For example, in the configuration example shown in FIG. 2B, in the cross-sectional shape of the heat medium hole 3, the hole cross-sectional area of the first opening 301 (here, the first opening 301 is perpendicular to the extending direction of the heat medium hole 3). Is the cross-sectional area of the second opening 302 (the cross-sectional area of the second opening 301 is cut by a plane perpendicular to the extending direction of the heat medium hole 3). The same shall apply hereinafter.) The entire heat medium hole 3 is formed in a tapered hole shape. The tapered hole shape is realized by forming the first opening 301 side larger than the second opening 302 side with respect to the hole volume in consideration of a predetermined dimension in the extending direction of the heat medium hole 3. It may be.

That is, in the heat medium hole 3 shown in FIG. 2B, the hole cross-sectional area or hole volume on the medium inlet side in the hole of the heat medium hole 3 is larger than the hole cross-sectional area or hole volume on the medium outlet side in the hole. It has a part formed so that it may become larger. As described above, by increasing the hole cross-sectional area on the inlet side, the medium can be actively taken into the hole of the heat medium hole 3, while by reducing the hole cross-sectional area on the outlet side, Heat exchange to the incorporated media can be facilitated. Therefore, according to the heat medium hole 3 having such a configuration, it is useful in improving the exhaust heat efficiency by the medium.

For example, the configuration example shown in FIG. 2C includes a small cross-sectional area 31 and a large cross-sectional area 32 having different cross-sectional areas in the cross-sectional shape of the heat medium hole 3. More specifically, a small cross-sectional area 31 is formed in each of the vicinity of the first opening 301 and the vicinity of the second opening 302, and the small cross-sectional area 31 in the vicinity of the first opening 301. A large cross-sectional area portion 32 having a larger cross-sectional area than that of the small cross-sectional area portion 31 is provided in an intermediate portion in the extending direction of the heat medium hole 3.

The large cross-sectional area 32 is provided so as to overlap the predetermined mounting scheduled area 25 when viewed in the normal direction. For example, it is conceivable that the large cross-sectional area portion 32 is provided so as to cover the entire area of the predetermined mounting area 25. With such a configuration, the entire electronic component 101 mounted in the planned mounting area 25 is superimposed on the large cross-sectional area portion 32. In this case, the size and shape of the large cross-sectional area portion 32 in the normal direction view depend on the size and shape of the planned mounting region 25 (in other words, the size and shape of the element 101 mounted in the planned mounting region 25). Is set.

In other words, the heat medium hole 3 shown in FIG. 2C is arranged so as to pass through the planned mounting area 25 that is an area corresponding to the electronic component 101 and the non-mounted target area other than the planned mounting area 25. In addition, the size (specifically, the width or height) of the hole cross-sectional shape of the large cross-sectional area portion 32 that passes through the planned mounting area 25 is smaller than the hole cross-sectional shape of the small cross-sectional area portion 31 that passes through the non-mounted area. It is formed to be larger than the size of. As described above, by increasing the size of the hole cross-sectional shape of the large cross-sectional area portion 32 that passes through the planned mounting region 25, the heat from the electronic component 101 is transferred to the medium in the hole of the heat medium hole 3. A sufficient effective area can be secured. On the other hand, by reducing the size of the hole cross-sectional shape of the small cross-sectional area portion 31 that passes through the non-mounting scheduled region, it is possible to suppress a decrease in heat capacity in the heat conduction plate 2 in which the heat medium hole 3 is formed. Therefore, providing a difference in the size of the hole cross-sectional shape between the mounting planned area and the non-mounting planned area is useful in improving the heat exhaust efficiency by the medium.

Further, for example, the configuration example shown in FIG. 2D is a combination of the configuration example shown in FIG. 2B and the configuration example shown in FIG. That is, the cross-sectional shape of the heat medium hole 3 includes a small cross-sectional area portion 31 and a large cross-sectional area portion 32 having different cross-sectional areas in the portion, and two small area portions 31 are formed in a tapered hole shape. . In other words, the large cross-sectional area 32 that is directly below or in the vicinity of the electronic component 101 mounted on the insulating substrate 4 is formed larger than the other parts, and the medium in the two small cross-sectional areas 31 is discharged. The portion on the opening side is formed smaller than the portion of one small cross-sectional area portion 31. With such a configuration, it is possible to have both the operational effects obtained in the configuration example shown in FIG. 2B and the operational effects obtained in the configuration example shown in FIG.

FIG. 3 is an explanatory diagram showing another configuration example related to the heat medium hole in the electronic component cooling structure according to the first embodiment of the present invention.
In the configuration example shown in FIG. 3, a heat insulating member 229 with good heat insulating performance is attached in the vicinity of the first opening 301 and in the vicinity of the second opening 302. Specifically, a heat insulating member 229 is mounted on the surface of the heat conductive plate 2 so as to surround the first opening 301, and the heat conductive plate 2 is surrounded so as to surround the second opening 302. A heat insulating member 229 is mounted on the surface. Examples of the heat insulating member 229 include those made of a resin material such as silicon or heat insulating rubber. Further, for example, a material having high heat insulation properties such as heat insulation ink may be applied. Furthermore, for example, it may be configured by using a fiber heat insulating material typified by glass wool, a foam heat insulating material typified by polystyrene foam, or the like.

The heat insulating member 229 has an external gas or liquid that is an ambient atmosphere in the vicinity of the first opening 301 that is the medium inlet of the heat medium hole 3 and the second opening 302 that is the medium outlet. It arrange | positions in each location for the purpose of raising the heat insulation between the insides of the medium hole 3. FIG. If the temperature difference between the atmosphere around the heat medium hole 3 and the inside of the heat medium hole 3 can be increased in the vicinity of the first opening 301, natural convection easily occurs, and the heat medium hole 3 enters the hole. Since the suction force of the heat medium is increased, the heat insulating member 229 is provided for the purpose of preventing the heat from being transmitted to the surrounding atmosphere and preventing the temperature of the atmosphere from rising. On the other hand, in the vicinity of the second opening 302, when the inside of the hole of the heat medium hole 3 is cooled by the surrounding cold medium, the effect of the heat convection is reduced. The heat insulating member 229 is disposed for the purpose of preventing a temperature drop inside the 3.

By mounting such a heat insulating member 229, the heat insulating property between the atmosphere around the first opening 301 or the second opening 302 and the inside of the heat medium hole 3 can be improved. Therefore, a sufficient temperature difference between the atmosphere and the inside of the hole can be secured, which is useful for improving the exhaust heat efficiency by the medium. In particular, when the chimney effect is used, the chimney effect can be enhanced, which is very useful.

Here, the case where the heat insulating member 229 is disposed in the vicinity of the first opening 301 and the vicinity of the second opening 302 is described as an example, but the present invention is not limited to this. The case where only the part 301 side is insulated and the case where only the second opening 302 side is insulated are also included. That is, even when heat insulation is performed inside and outside the hole of the heat medium hole 3, the heat insulating member 229 having a heat insulating function is mounted in the vicinity of at least one of the first opening 301 and the second opening 302. It is sufficient that the heat insulation effect is obtained at each part by heat insulating each part. Therefore, a heat insulation process that matches the target embodiment may be performed.
Here, an example in which the heat insulating member 229 is provided outside the heat medium hole 3 (that is, on the surface of the heat conductive plate 2) is shown, but the present invention is not limited to this. The heat insulating member 229 may be provided in the vicinity of each opening inside the heat medium hole 3.
Furthermore, although the case where the cross-sectional shape of the heat medium hole 3 is uniform is given here as in the configuration example shown in FIG. 2A, it is not limited to such a form. The same applies to the heat medium hole 3 as in the configuration example shown in (d).

FIG. 4 is an explanatory view showing still another configuration example regarding the heat medium hole in the electronic component cooling structure according to the first embodiment of the present invention.
In the configuration example shown in FIG. 4, a projecting portion 2 x projecting outward from one surface of the heat conducting plate 2 along the extending direction of the heat medium hole 3 is provided, and so as to penetrate the projecting portion 2 x. The heat medium hole 3 is disposed in the front. And the 2nd opening part 302 used as the medium exit part from the heat-medium hole 2 is located in the edge of the protrusion part 2x. In the vicinity of the second opening 302, a heat insulating member 229 may be attached as in the configuration example shown in FIG.

In this way, by securing the projecting length of the projecting portion 2x as necessary and sufficient, the second opening 302 is positioned at the end edge of the projecting portion 2x (that is, a position far from the electronic component 101). It is possible to suppress the influence of heat from the electronic component 101 on the atmosphere around the second opening 302. Therefore, a sufficient temperature difference between the atmosphere and the inside of the heat medium hole 3 can be secured, which is useful for improving the exhaust heat efficiency by the medium. In particular, when the chimney effect is used, the chimney effect can be enhanced, for example, by appropriately setting the protruding length of the protruding portion 2x or insulating the entire protruding portion 2x, which is very useful. .

Here, the case where the protrusion 2x is provided on the medium outlet side of the heat medium hole 3 and the second opening 302 is located at the edge of the protrusion 2x is described as an example. However, the present invention is not limited to this, and includes a case in which the protrusion 2x is provided on the medium inlet side of the heat medium hole 3 and the first opening 301 is located at the edge of the protrusion 2x. That is, the protrusion 2x only needs to be provided on at least one of the medium inlet side and the medium outlet side of the heat medium hole 3. Even in such a case, the heat insulating effect at each portion is improved, which is useful for improving the exhaust heat efficiency by the medium.
Here, the case where the cross-sectional shape of the heat medium hole 3 is uniform as in the configuration example shown in FIG. 2A is described, but the present invention is not limited to such a form, and FIG. The same applies to the heat medium hole 3 as in the configuration example shown in (d).

(1-v) Effects Obtained by the Present Embodiment According to the present embodiment, one or more effects shown below can be obtained.

(A) According to the present embodiment, the heat generated by the electronic component 101 is transmitted to the heat sink 5 through the insulating substrate 4 and the heat conductive plate 2 and is radiated by the heat radiating fins 6 of the heat sink 5. Since the heat medium hole 3 is disposed in the heat conduction plate 2, the heat is also exhausted by the medium flow in the hole of the heat medium hole 3. That is, regarding the heat from the electronic component 101, first, “rough heat” is exhausted by the flow of the medium in the heat medium hole 3, and then “remaining heat” transmitted to the heat radiation fin 6 of the heat sink 5 is the heat radiation fin. 6 dissipates heat. Accordingly, since heat is exhausted not only by the heat radiating fins 6 of the heat sink 5 but also by the flow of the medium in the heat medium hole 3, the cooling effect on the heat from the electronic component 101 can be enhanced as compared with the conventional structure. . In addition, since it is only necessary to radiate the “remaining heat” after the heat exhausted by the flow of the medium in the heat radiating fins 6 of the heat sink 5 of the heat sink 5, it is possible to suppress an increase in size and the like for increasing the cooling capacity. As a result, it is possible to easily cope with downsizing and the like.

In other words, in the case of the conventional structure, in order to increase the cooling efficiency, it is common to increase the amount of heat radiated from the surface side of the heat sink by increasing the surface area or volume of the heat sink. In contrast, in the electronic component cooling structure 1 according to the present embodiment, the heat conduction plate 2 is provided with the heat medium hole 3 to increase the amount of heat of the medium that absorbs heat not only from the surface side of the cooling structure 1 but also from the inside. Therefore, the cooling efficiency is improved. Therefore, according to the present embodiment, the cooling capacity of the entire cooling structure 1 is increased as compared with the conventional cooling structure, and the cooling effect on the electronic component 101 can be enhanced. As a result, it is possible to provide the electronic component cooling structure 1 that is further downsized.

(B) The electronic component cooling structure 1 according to the present embodiment is arranged such that at least a part of the heat medium hole 3 passes through a region in the vicinity of the mounting location of the electronic component 101. As described above, if the heat medium hole 3 passes through the vicinity of the electronic component 101, the heat transmitted from the electronic component 101 can be efficiently transferred with a large temperature difference from the medium flowing through the hole of the heat medium hole 3. Therefore, the exhaust heat efficiency (that is, the cooling efficiency with respect to the heat from the electronic component 101) by the medium can be improved.

(C) In the electronic component cooling structure 1 according to this embodiment, the heat conduction plate 2 is interposed between the insulating substrate 4 and the heat sink 5, and the heat medium hole 3 is formed in the heat conduction plate 2. Yes. As described above, since the heat medium hole 3 is formed in the heat conductive plate 2 which is a separate member from the insulating substrate 4 and the heat sink 5, a sufficient degree of freedom in setting the path, shape, etc. of the heat medium hole 3 is ensured. This is easy to realize, and is preferable in securing the versatility of the cooling structure 1 and the like.

(D) In the electronic component cooling structure 1 according to this embodiment, the first opening 301 serving as a medium inlet is disposed below the second opening 302 serving as a medium outlet, and the heat medium hole The medium flow in the three holes is generated by thermal convection. Therefore, if heat is transferred into the hole of the heat medium hole 3, it is possible to surely generate a medium flow by natural convection. That is, reliable exhaust heat utilizing natural convection is possible, which is very preferable for enhancing the cooling effect. In addition, by using natural convection, the configuration of the cooling structure 1 can be prevented from becoming complicated, which is preferable in terms of downsizing and the like.

(E) As described in the present embodiment, for the heat medium hole 3, the hole sectional area or the hole volume on the medium inlet side in the hole of the heat medium hole 3 is the hole sectional area on the medium outlet side in the hole. Or it has a part formed so that it may become larger than a hole volume, and if the whole hole of the heat carrier hole 3 is formed in the shape of a taper hole, it will be useful in improving the exhaust heat efficiency by the medium It becomes. In other words, by increasing the hole cross-sectional area or hole volume on the inlet side, the medium can be actively introduced into the hole of the heat medium hole 3, while the hole cross-sectional area or hole volume on the outlet side is reduced. The heat exchange with the medium taken into the hole can be promoted.

(F) Further, as described in the present embodiment, the heat medium hole 3 passes through the planned mounting area 25 that is an area corresponding to the electronic component 101 and the non-mounted target area other than the planned mounting area 25. If the hole cross-sectional shape in the planned mounting region 25 is larger than the size of the hole cross-sectional shape in the non-mounted region, the mounting region 25 and the non-mounted region are not mounted. Since a difference is provided in the size of the hole cross-sectional shape in each of the planned areas, it is useful for improving the heat exhaust efficiency by the medium. That is, the effective area for moving the heat from the electronic component 101 to the medium in the hole of the heat medium hole 3 by increasing the size of the hole cross-sectional shape of the large cross-sectional area portion 32 that passes through the planned mounting region 25. Can be secured sufficiently. On the other hand, by reducing the size of the hole cross-sectional shape of the small cross-sectional area portion 31 that passes through the non-mounting scheduled region, it is possible to suppress a decrease in heat capacity in the heat conduction plate 2 in which the heat medium hole 3 is formed.

(G) As described in the present embodiment, if a heat insulating member 229 having a heat insulating function is mounted in the vicinity of at least one of the first opening 301 and the second opening 302, the first opening The heat insulation between the atmosphere around the part 301 or the second opening 302 and the inside of the heat medium hole 3 can be improved. Therefore, a sufficient temperature difference between the atmosphere and the inside of the hole can be secured, which is useful for improving the exhaust heat efficiency by the medium. In particular, when the chimney effect is used, the chimney effect can be enhanced, which is very useful.

(H) Further, as described in the present embodiment, the protrusion 2x through which the heat medium hole 3 passes is provided, and the first opening 301 or the medium serving as the medium inlet at the end edge of the protrusion 2x. If the second opening 302 serving as the outlet is located, the influence of heat from the electronic component 101 on the atmosphere around the first opening 301 or the second opening 302 can be suppressed. Accordingly, a sufficient temperature difference between the atmosphere and the inside of the heat medium hole 3 can be secured, which is useful for improving the exhaust heat efficiency by the medium. In particular, when the chimney effect is used, the chimney effect can be enhanced, for example, by appropriately setting the protruding length of the protruding portion 2x or insulating the entire protruding portion 2x, which is very useful. .

<2. Second embodiment of the present invention>
Next, a second embodiment of the present invention will be described.
Here, differences from the above-described first embodiment will be mainly described. That is, in the second embodiment, components similar to those in the first embodiment described above are denoted by the same reference numerals in the drawings, and detailed description thereof is omitted.

(2-i) Configuration of Electronic Component Cooling Structure FIG. 5 is an explanatory diagram schematically showing a schematic configuration example of an electronic component cooling structure according to the second embodiment of the present invention. In addition, the example of a figure shows typically the example of schematic structure of the cooling structure, and about the display size, the display scale, etc., it does not necessarily follow the actual thing.

(overall structure)
As shown to Fig.5 (a), although the cooling structure 1A of the electronic component which concerns on 2nd embodiment is comprised similarly to the case of 1st embodiment, the following points differ. Unlike the case of the first embodiment, the cooling structure 1A does not include the heat conductive plate 2, and includes an insulating substrate 4 on which an electronic component 101 serving as a heating element is mounted on one surface, and the insulating substrate 4 And a heat sink 5A directly joined to the surface. In the embodiment shown in FIG. 5A, the heat sink 5 A that is a heat radiating member has a placement surface 5 a on which the insulating substrate 4 is placed. In the aspect shown in FIG. 5A, the heat dissipation member may include a heat dissipation main body portion 7A and fins 6A that are an example of a heat dissipation structure portion provided in the heat dissipation main body portion 7A.

(Heat medium hole)
Since the cooling structure 1A does not include the heat conducting plate 2, a heat medium hole 3A having a through hole extending in a predetermined direction is provided in the vicinity of the insulating substrate bonding surface in the heat sink 5A. That is, the heat medium hole 3A is disposed between the insulating substrate 4 and the heat radiation fin 6A of the heat sink 5A.

As in the case of the first embodiment, the heat medium hole 3A is a through hole that communicates the first opening 301 and the second opening 302, and heat is exhausted by the flow of the medium in the hole. It is composed of.

That is, the heat medium hole 3 A may be configured to have the following characteristics.
(1) A first opening 301 serving as a medium inlet provided on one surface of the heat sink 5A and a second opening 302 serving as a medium outlet provided in one surface of the heat sink 5A are communicated with each other in a predetermined direction. Through-hole-shaped structure for the purpose of exhaust heat (heat extraction) due to the medium flow.
(2) When viewed in the normal direction, at least a part of the heat medium hole 3A overlaps at least a part of the mounting region 25 of the electronic component 101 mounted on the insulating substrate 4.
(3) When the electronic component 101 is used, the heat medium hole 3A extends in the vertical direction (gravity direction) (at least extends in a direction other than the horizontal direction).

(2-ii) Flow of Heat and Medium In the electronic component cooling structure 1A having the above-described configuration, the heat generated by the electronic component 101 is the heat sink 5A via the insulating substrate 4 as in the first embodiment. The heat dissipation fin 6A of the heat sink 5A dissipates heat, but in the process, the heat medium hole 3A is disposed in the heat sink 5A. Be heated. That is, with respect to the heat from the electronic component 101, first, “rough heat” is exhausted by the flow of the medium in the heat medium hole 3A, and then “remaining heat” transmitted to the heat radiation fin 6A of the heat sink 5A is the heat radiation fin. The heat is dissipated by 6A.

(2-iii) Effects Obtained by the Present Embodiment According to the present embodiment, one or more effects shown below can be obtained.

(A) According to the cooling structure 1A for an electronic component according to the present embodiment, not only the heat radiation fins 6A of the heat sink 5A but also the heat medium holes 3A formed in the region near the insulating substrate 4 in the heat sink 5A. Since exhaust heat is also performed by the flow of the medium, the same effect as in the first embodiment can be obtained.

(B) In the electronic component cooling structure 1A according to the present embodiment, the heat sink 5A is directly bonded to the insulating substrate 4, and the heat medium hole 3A is formed in a region near the insulating substrate 4 in the heat sink 5A. Therefore, the intervention of the heat conduction plate 2 which is a separate member becomes unnecessary. Therefore, it is possible to suppress the complication of the configuration of the cooling structure 1A while obtaining the effect that the cooling effect on the electronic component 101 can be enhanced.

(2-iv) Modified Example Here, a case where the heat medium hole 3A is formed in the heat sink 5A and the heat conducting plate 2 as a separate member is not interposed is described as an example. The configuration example described in the first embodiment may be used in combination.
Specifically, as shown in FIG. 5B, in the configuration in which the heat conductive plate 2B is interposed between the insulating substrate 4 and the heat sink 5B, the heat medium holes are formed in the heat conductive plate 2B and the heat sink 5B, respectively. 3B may be formed and these heat medium holes 3B may be used in combination. In such a configuration example, the same effect as in the first embodiment can be obtained. In the embodiment shown in FIG. 5B, the heat conducting plate 2B included in the heat radiating portion has a placement surface 5a on which the insulating substrate 4 is placed. And in the aspect shown in FIG.5 (b), the heat radiating member may have the heat radiating main body part 7B and the fin 6B which is an example of the heat radiating structure part provided in the heat radiating main body part 7B.

<3. Third embodiment of the present invention>
Next, a third embodiment of the present invention will be described.
Again, the differences from the first embodiment described above will be mainly described. That is, in the third embodiment, the same components as those in the first embodiment described above are denoted by the same reference numerals in the drawings, and detailed description thereof is omitted.

(3-i) Configuration of Electronic Component Cooling Structure FIG. 6 is an explanatory view schematically showing a schematic configuration example of the electronic component cooling structure according to the third embodiment of the present invention. In addition, the example of a figure shows typically the example of schematic structure of the cooling structure, and about the display size, the display scale, etc., it does not necessarily follow the actual thing.

(overall structure)
As shown in FIG. 6, the electronic component cooling structure 1 C according to the third embodiment is configured in substantially the same manner as in the first embodiment, except for the following points. In addition to the configuration described in the first embodiment, the cooling structure 1 C includes a first vent pipe 710 as a piping member attached to the first opening 301 and a chimney member attached to the second opening 302. As a second ventilation pipe 720.

(First vent pipe)
The first vent pipe 710 functions as a cylindrical introduction pipe, and a first joint formed in the first opening 301 of the heat conducting plate 2C is provided with a through hole 730 along its axis. It is comprised so that 700 may be mounted | worn. That is, the first vent pipe 710 is connected to the first opening 301 via the first joint 700, and the heat medium hole 3C in the heat conduction plate 2C is formed by the through hole 730 included in the first vent pipe 710. It is comprised so that it may extend | stretch.

(Second vent pipe)
The second vent pipe 720 functions as a cylindrical exhaust pipe, is provided with a through hole 740, and is attached to a second joint 701 formed in the second opening 302 of the heat conducting plate 2C. It is configured to be. That is, the second vent pipe 720 is connected to the second opening 302 via the second joint 701, and the heat medium hole 3C in the heat conduction plate 2C is formed by the through hole 740 of the second vent pipe 720. It is comprised so that it may extend | stretch.

However, the second vent pipe 720 includes a main body 721 and a chimney 722.
The main body 721 has a cylindrical shape, is provided with a through hole 740 along the axis thereof, and is configured to be attached to the second joint 701 formed in the second opening 302 of the heat conducting plate 2C. Has been.
The chimney 722 has a cylindrical shape and is provided with a through hole 740 along the axis thereof. One end of the chimney 722 is connected to the end of the main body 721 opposite to the side of the heat conduction plate 2C, An opening facing upward is provided at the other end. The axis of the chimney 722 is, for example, along a direction orthogonal to the axis direction of the heat medium hole 3C in the heat conducting plate 2C. However, it does not necessarily have to be orthogonal, and may be inclined so as to intersect with the axial direction of the heat medium hole 3C.
The second vent pipe 720 including the main body 721 and the chimney 722 is attached to the second joint 701 of the heat conducting plate 2. At this time, since the axial direction of the main body 721 and the axial direction of the chimney 722 intersect, the end of the chimney 722 on the opening side (that is, the end not connected to the main body 721) is vertical. With respect to the direction (the direction perpendicular to the surface of the heat conducting plate 2C), the second joint 701 is disposed at a different position. More specifically, the opening on the side opposite to the heat conduction plate 2C in the second vent pipe 720 is located above the reference surface in the vertical direction when one surface of the heat conduction plate 2C is used as the reference surface. It faces to the upper side.

(First joint, second joint)
The first joint 700 functions as a mounting portion for mounting the first vent pipe 710 as a piping member in the first opening 301 in the heat conducting plate 2C. In addition, the second joint 701 functions as a mounting portion for mounting the second vent pipe 720 as a chimney member in the second opening 302 in the heat conducting plate 2C.
Both the first joint 700 and the second joint 701 are formed integrally with the heat conducting plate 2C. Specifically, for example, the first joint 700 and the second joint 701 are threaded on the outer peripheral side surface of the protruding portion from the heat conducting plate 2C, thereby constituting a male screw portion. In this case, each of the first vent pipe 710 and the second vent pipe 720 is formed with a female screw portion that is screwed with the male screw portion. However, the present invention is not necessarily limited to this. For example, the first joint 700 and the second joint 701 are threaded on the inner peripheral side surface of the concave portion of the heat conducting plate 2C, and thereby the female screw portion. May be included. In this case, each of the first vent pipe 710 and the second vent pipe 720 is formed with a male screw portion that is screwed with the female screw portion.
With this configuration, the first joint 700 and the second joint 701 are configured such that the through-hole 730 of the first vent pipe 710 and the through-hole 740 of the second vent pipe 720 are heated in the heat conduction plate 2C. It is possible to mount the medium hole 3C in an airtight state.
Here, the configuration example in which the male screw portion and the female screw portion are screwed together has been described. However, the present invention is not limited to this, and any other mode (for example, a convex portion and a concave portion) can be used as long as airtight installation is possible. (Press-fit mounting) may be used.

(Insulation member)
It is preferable that the first joint 700 and the second joint 701 can be mounted in a state having heat insulation properties when the first vent pipe 710 and the second vent pipe 720 are mounted. Specifically, for example, a heat insulating member having a heat insulating function (not shown) at any one of the outer peripheral surface, the inner peripheral surface, or the end surface of the first joint 700 and the second joint 701, or at a plurality of these locations. ) Is preferably mounted. As a heat insulating member, it is possible to use the same thing as the case of 1st embodiment. With such a configuration, if mounting in a heat-insulating state is possible, the space between the heat conducting plate 2C and the first vent pipe 710 or the second vent pipe 720 (that is, the hole of the heat medium hole 3C). It is possible to improve the heat insulating property between the inside and the through

holes

730 and 740.

As described above, the cooling structure 1 C of the present embodiment may be a configuration having the following characteristics.
(1) The heat medium hole 3C extends in a predetermined extending direction and is provided with a first opening 301 as a medium inlet provided on one surface of the heat conducting plate 2 and a second opening as a medium outlet. 302 has a through-hole-shaped configuration for the purpose of exhaust heat (heat extraction) due to the medium flow in the hole.
(2) When viewed in the normal direction, at least a part of the heat medium hole 3 C overlaps with at least a part of the planned mounting area 25 of the electronic component 101 mounted on the insulating substrate 4.
(3) A second vent pipe 720 as a chimney member is attached to the second opening 302, and the heat medium hole 3C is extended by the through hole 740 of the second vent pipe 720, whereby the opening of the through hole 740 is opened. Is positioned above the second opening 302 in the vertical direction (gravity direction).
(4) Preferably, a first vent pipe 710 as a piping member is attached to the first opening 301, and the heat medium hole 3 C is extended by the through hole 730 of the first vent pipe 710.
(5) Preferably, the first joint 700 and the second joint 701 which are the mounting portions of the first ventilation pipe 710 and the second ventilation pipe 720 have airtightness and heat insulation.

(3-ii) Flow of Heat and Medium In the electronic component cooling structure 1C having the above-described configuration, the heat medium hole 3C is extended by the through hole 740 of the second ventilation pipe 720, whereby the opening of the through hole 740 is opened. It is located above the second opening 302 in the vertical direction (gravity direction). Therefore, when the electronic component 101 is used, even if the heat medium hole 3C is arranged so as to extend in the horizontal direction, the opening of the through hole 730 of the first vent pipe 710 serving as the medium inlet is not provided. Since the second vent pipe 720 serving as the medium outlet portion is disposed below the second opening of the through hole 740, the hole of the heat medium hole 3C is formed by thermal convection due to a chimney effect (draft effect) or the like. The flow of the medium inside occurs. That is, regardless of the arrangement of the electronic component 101 and the insulating substrate 4, it is possible to cause a medium flow using natural convection in the hole of the heat medium hole 3C. If a medium flow occurs in the hole of the heat medium hole 3C, the heat generated by the electronic component 101 is discharged as in the case of the first embodiment.

At this time, if the heat medium hole 3 C is extended by the through hole 730 of the first vent pipe 710, the opening of the through hole 730 is disposed at a position far from the electronic component 101, and the through hole 730 is formed. It is possible to suppress the influence of heat from the electronic component 101 on the atmosphere around the opening. Therefore, a sufficient temperature difference between the atmosphere and the inside of the heat medium hole 3 can be secured, which is useful for improving the exhaust heat efficiency by the medium. Moreover, since the exhaust heat efficiency can be improved by mounting the first ventilation pipe 710 which is a separate member from the heat conduction plate 2C, the heat medium hole 3C and the first opening 301 which are the mounting side are arranged. Is fully secured.

Further, at this time, by extending the heat medium hole 3C by the through hole 740 of the second vent pipe 720, similarly to the case of the first vent pipe 710 described above, the area around the opening of the through hole 740 is increased. A sufficient temperature difference between the atmosphere and the inside of the heat medium hole 3 can be secured. Therefore, in particular, the effect of thermal convection can be enhanced, which is useful for improving the exhaust heat efficiency by the medium. Furthermore, since the exhaust heat efficiency can be improved by mounting the second ventilation pipe 720 which is a separate member from the heat conduction plate 2C, the heat medium hole 3C and the second opening 302 which are the mounting side are The degree of freedom of placement is sufficiently secured.

These matters are particularly effective when the first joint 700 and the second joint 701 have airtightness and heat insulation. If it has airtightness, the first joint 700 or the second joint 701 will not leak a medium, and if it has heat insulation properties, heat from the electronic component 101 will not be generated. Is surely insulated by the first joint 700 or the second joint 701. Therefore, the flow of the medium in the hole of the heat medium hole 3C can be ensured, which is very useful for improving the exhaust heat efficiency by the medium.

(3-iii) Effects Obtained by the Present Embodiment According to the present embodiment, one or more effects shown below can be obtained.

(A) According to the electronic component cooling structure 1C according to the present embodiment, exhaust heat is not only caused by the heat dissipation fins 6 of the heat sink 5 but also by the flow of the medium in the heat medium hole 3C formed in the heat conduction plate 2C. Therefore, the same effect as in the first embodiment can be obtained.

(B) In the electronic component cooling structure 1C according to the present embodiment, since the heat medium hole 3C is extended by the through hole 740 of the second vent pipe 720 functioning as a chimney member, the periphery of the opening of the through hole 740 Thus, a sufficient temperature difference between the atmosphere and the inside of the heat medium hole 3 can be secured, which is useful for improving the exhaust heat efficiency by the medium. In particular, when natural convection due to the chimney effect is used, the chimney effect can be enhanced, which is very useful.
Moreover, since the exhaust heat efficiency can be improved by mounting the second ventilation pipe 720, which is a separate member from the heat conduction plate 2C, the heat medium hole 3C and the second opening 302 which are the mounting side are arranged. Is fully secured.

(C) In the electronic component cooling structure 1C according to the present embodiment, since the heat medium hole 3C is extended by the through hole 730 of the first vent pipe 710 functioning as a piping member, the periphery of the opening of the through hole 730 The temperature difference between the atmosphere and the inside of the heat medium hole 3 C can be sufficiently secured, which is useful for improving the exhaust heat efficiency by the medium. Moreover, since the exhaust heat efficiency can be improved by mounting the first ventilation pipe 710 which is a separate member from the heat conduction plate 2C, the heat medium hole 3C and the first opening 301 which are the mounting side are arranged. Is fully secured.

(D) Further, as described in the present embodiment, if the first joint 700 and the second joint 701 have airtightness and heat insulation properties, the flow of the medium in the hole of the heat medium hole 3C is reduced. It can be ensured and is very useful in improving the exhaust heat efficiency of the medium.

(3-iv) Modified Example Here, the case where both the first vent pipe 710 and the second vent pipe 720 are attached to the heat conducting plate 2C has been described as an example. The configuration example is not limited, and any one of these may be installed. For example, when only the second vent pipe 710 is attached, a chimney effect can be generated regardless of the extending direction of the heat medium hole 3C, and in terms of improving exhaust heat efficiency by securing a temperature difference, It will be useful. For example, when only the first vent pipe 710 is attached, it is very useful in terms of improving the exhaust heat efficiency by securing a temperature difference. In that case, the chimney effect may be generated in the same manner as in the first embodiment.

<4. Fourth embodiment of the present invention>
Next, a fourth embodiment of the present invention will be described.
Again, differences from the first to third embodiments described above will be mainly described. That is, in the fourth embodiment, the same components as those in the first to third embodiments described above are denoted by the same reference numerals in the drawings, and detailed description thereof is omitted.

(4-i) Structure of electronic component cooling structure In the first to third embodiments described above, the case where natural convection caused by thermal convection is used has been described. In the fourth embodiment, forcible generation is performed. Take the case of using the flow of the recorded medium as an example. In addition, regarding the configuration related to the heat medium hole through which the medium flows, any of the configuration examples of the first to third embodiments described above can be applied, but here, the configuration example described in the first embodiment is applied. Take the case as an example.

FIG. 7 is an explanatory view schematically showing a schematic configuration example of a cooling structure for an electronic component according to the fourth embodiment of the present invention. In addition, the example of a figure shows typically the example of schematic structure of the cooling structure, and about the display size, the display scale, etc., it does not necessarily follow the actual thing.

(overall structure)
As shown in FIG. 7A, the electronic component cooling structure 1 according to the fourth embodiment is configured in substantially the same manner as in the first embodiment, except for the following points. In the fourth embodiment, the medium flow in the hole of the heat medium hole 3 is generated by using a medium flow forcibly supplied from outside the heat medium hole 3. For this purpose, a fan 50 as a medium flow generator for generating a forced medium flow is provided on the extension line of the heat medium hole 3 in the extending direction. By generating a forced medium flow in this way, the exhaust heat effect and the cooling effect can be further enhanced.

(Media flow generator)
The fan 50 as the medium flow generator may be any fan that generates a forced medium flow, and may be configured using, for example, a propeller type axial flow fan, a sirocco type or turbo type centrifugal fan, or the like. it can. However, the medium flow generator is not limited to the fan 50 as long as it generates a forced medium flow, and may be a compressor, a pump, or the like. Furthermore, for example, when applied to a cooling structure for an in-vehicle electronic component, it may be configured to take in and use traveling wind generated when the vehicle (vehicle) travels. Moreover, you may make it cool forcedly using a radiator.

(Heat medium hole)
The heat medium hole 3 corresponds to a forced medium flow by the fan 50, and is configured to generate a medium flow in the hole by using the forced medium flow. Therefore, in the heat medium hole 3, the first opening 301 serving as the medium inlet to the heat medium hole 3 is arranged toward the upstream side of the forced medium flow generated by the fan 50, thereby A medium is fed into the hole of the heat medium hole 3. However, the present invention is not limited to this. For example, even if the second opening 302 serving as the medium outlet from the heat medium hole 3 is disposed toward the downstream side of the forced medium flow generated by the fan 50. Even in such a case, it is possible to generate a medium flow in the hole of the heat medium hole 3 by using the negative pressure of the forced medium flow. That is, the fan 50 is disposed on at least one side of the first opening 301 serving as a medium inlet to the heat medium hole 3 and the second opening 302 serving as a medium outlet from the heat medium hole 3. That's fine.

Further, since the heat medium hole 3 corresponds to the forced medium flow by the fan 50, the heat medium hole 3 may be arranged to extend in the horizontal direction when the electronic component 101 is used.
Furthermore, since the heat medium hole 3 corresponds to the forced medium flow by the fan 50, it is not always necessary to have a straight path from the first opening 301 to the second opening 302. For example, it may be arranged so as to have a curved portion, a bent portion or the like in the middle thereof. If the path is arranged in a straight line, complication of the heat medium hole 3 can be suppressed. However, if the path has a curved portion, a bent portion, or the like, the heat medium is selectively selected according to the arrangement of the planned mounting region 25. The path of the hole 3 can be set, which is suitable for exhaust heat (heat induction). Specifically, it is conceivable to set the path of the heat medium hole 3 so as to have a corrugated shape portion, a spiral shape portion, or the like in the normal direction view. This also means that the first opening 301 and the second opening 302 do not necessarily have to be arranged on each of the two opposing surfaces of the heat conducting plate 2. Specifically, for example, the first opening 301 and the second opening 302 are arranged on the same surface of the heat conducting plate 2, or any one of the upper surface, the lower surface, and the side end surface of the heat conducting plate 2. It may be distributed separately.

(Pressure feeding mechanism)
By the way, the heat medium hole 3 corresponds to a forced medium flow by the fan 50, and the medium flow is sent into the hole of the heat medium hole 3 from the first opening 301. However, with respect to the first opening 301 serving as the medium inlet to the heat medium hole 3, it is not always possible to ensure a sufficient hole cross-sectional area. Therefore, it is preferable that a pressure feeding mechanism 60 that pumps the medium into the hole of the heat medium hole 3 is provided on the side of the first opening 301 serving as a medium inlet to the heat medium hole 3. Even if the hole cross-sectional area of the first opening 301 is small by the pressure feeding mechanism 60 pumping the medium, the medium flow is efficiently fed into the hole of the heat medium hole 3, and the heat medium hole 3 It is possible to reliably generate a medium flow in the hole.

Examples of the pressure feeding mechanism 60 include the following configurations. That is, the pressure feeding mechanism 60 includes a funnel-shaped case portion 61 that is wide on the inlet side and narrowed on the outlet side, and a driven fan that is arranged on the inlet side in the case portion 61 and rotates by the medium flow from the fan 50. 62 and a pumping fan 63 that is arranged coaxially with the driven fan 62 on the outlet side in the case portion 61 and rotates with the driven fan 62 to pump the medium. With the pressure feeding mechanism 60 having such a configuration, the inlet side of the case portion 61 is wide open, so that the medium flow from the fan 50 can be taken in efficiently. Moreover, by having the driven fan 62 and the pressure feeding fan 63 in the case part 61, the pressure feeding mechanism 60 can pressure-feed a medium in the hole of the heat medium hole 3 without requiring a separate drive source. Therefore, the complication of the configuration can be suppressed, which is preferable from the viewpoint of miniaturization and the like.

Further, it is preferable that the pressure feeding mechanism 60 has a dustproof filter 64 in the case portion 61. This is because, if the pressure feeding mechanism 60 has the dustproof filter 64, it is possible to prevent foreign matters and the like from entering the medium flowing through the hole of the heat medium hole 3.

(Medium storage room)
Even in the case where such a pressure feeding mechanism 60 is provided, if the forced medium flow is interrupted, the medium flow in the hole of the heat medium hole 3 may disappear accordingly. As a case where the forced medium flow is interrupted, for example, a failure of the fan 50 or a power supply trouble may occur. Further, for example, when traveling wind at the time of traveling of the vehicle is used, this corresponds to when the vehicle is stopped. Even if the forced medium flow is interrupted for these reasons, it is not preferable that the medium flow in the heat medium hole 3 immediately disappears due to this. Therefore, as shown in FIG. 7B, it is preferable that a medium storage chamber 65 that functions as a buffer tank for storing the medium is provided between the heat medium hole 3 and the pressure feeding mechanism 60.

By providing such a medium storage chamber 65, the medium is temporarily stored in the medium storage chamber 65. In particular, if the pressure feeding mechanism 60 is provided in the front stage of the medium storage chamber 65, the medium fed from the pressure feeding mechanism 60 is stored in the medium storage chamber 65 in a compressed state. Therefore, for example, even when the forced medium flow supplied from the outside stops, while the medium storage chamber 65 stores the medium, the medium storage chamber 65 enters the hole of the heat medium hole 3. Since the medium flows and the exhaust heat is performed by the flow of the medium, the cooling effect is not hindered.

As described above, the configuration example of the present embodiment only needs to have the following characteristics.
(1) The heat medium hole 3 extends in a predetermined extending direction and is provided with a first opening 301 as a medium inlet provided on one surface of the heat conducting plate 2 and a second opening as a medium outlet. 302 has a through-hole-shaped configuration for the purpose of exhaust heat (heat extraction) due to the medium flow in the hole.
(2) When viewed in the normal direction, at least a part of the heat medium hole 3 overlaps at least a part of the mounting region 25 of the electronic component 101 mounted on the insulating substrate 4.
(3) The first opening 301 serving as a medium inlet to the heat medium hole 3 is arranged toward the upstream side of the forced medium flow, and the flow of the medium in the hole of the heat medium hole 3 is related to the heat. The medium hole 3 is configured to be generated by using a forced medium flow from outside the hole.
(4) Preferably, a pressure feeding mechanism 60 that pumps the medium into the hole of the heat medium hole 3 is provided on the side of the first opening 301 serving as a medium inlet to the heat medium hole 3.
(5) Preferably, a medium storage chamber 65 for storing a medium is provided between the heat medium hole 3 and the pressure feeding mechanism 60.

(4-ii) Flow of heat and medium In the electronic component cooling structure 1 in the above-described embodiment, first, the fan 50 is operated to thereby generate a forced medium flow. When the forced medium flow occurs, the driven fan 62 and the pressure feeding fan 63 in the pressure feeding mechanism 60 rotate according to the forced medium flow, so that the medium taken in on the inlet side of the case portion 61 is the first in the heat medium hole 3. It is pumped toward the one opening 301 side. Thus, a medium flow is generated in the hole of the heat medium hole 3 from the first opening 301 side toward the second opening 302 side. At this time, if the medium storage chamber 65 is provided between the heat medium hole 3 and the pressure feeding mechanism 60, the medium is temporarily stored in the medium storage chamber 65. Even when the medium flow is interrupted, the medium flows from the medium storage chamber 65 into the hole of the heat medium hole 3 while the medium storage chamber 65 stores the medium.

If a medium flow occurs in the hole of the heat medium hole 3, the heat generated by the electronic component 101 is exhausted as in the case of the first embodiment. That is, regarding the heat from the electronic component 101, first, “rough heat” is exhausted by the flow of the medium in the heat medium hole 3, and then “remaining heat” transmitted to the heat radiation fin 6 of the heat sink 5 is the heat radiation fin. The heat is dissipated by 6.

(4-iii) Effects Obtained by the Present Embodiment According to the present embodiment, one or more effects shown below can be obtained.

(A) In the present embodiment, heat is exhausted not only by the heat radiation fins 6 of the heat sink 5 but also by the flow of the medium in the heat medium hole 3 formed in the heat conduction plate 2, so that in the first embodiment, The same effect as the case can be obtained.

(B) In the electronic component cooling structure 1 according to the present embodiment, the first opening 301 serving as a medium inlet to the heat medium hole 3 is arranged toward the upstream side of the forced medium flow, A medium flow in the hole of the medium hole 3 is generated using a forced medium flow from outside the heat medium hole 3. That is, the medium flow in the hole of the heat medium hole 3 is generated by using the medium flow that is forcibly supplied. Therefore, it is possible to reliably generate a medium flow in the hole of the heat medium hole 3, which is very preferable for enhancing the cooling effect. In addition, by using the medium flow that is forcibly supplied, it is possible to increase the degree of freedom in the arrangement of the heat medium holes 3 in the extending direction, the path of the heat medium holes 3, and the like. It is preferable also in correspondence.

(C) In the present embodiment, a fan 50 as a medium flow generator is disposed on the side of the first opening 301 serving as a medium inlet to the heat medium hole 3, and the fan 50 is compulsory. A smooth medium flow. That is, the flow of the medium in the hole of the heat medium hole 3 is generated using the fan 50 as the medium flow generator. Therefore, the flow of the medium and the flow velocity are controlled by controlling the operation of the fan 50 in addition to the fact that the medium flow is surely generated in the hole of the heat medium hole 3 and the cooling effect is enhanced. As a result, it becomes possible to improve the controllability of the cooling effect.

(D) As described in the present embodiment, if the pressure feeding mechanism 60 is provided on the side of the first opening 301 serving as the medium inlet to the heat medium hole 3, the pressure feeding mechanism 60 is the heat medium hole 3. The medium is pumped into the holes. Therefore, even when the hole cross-sectional area of the first opening 301 is small, the medium flow is efficiently sent into the hole of the heat medium hole 3, and the flow of the medium is surely ensured within the hole of the heat medium hole 3. Since it can be generated, it is very preferable for enhancing the cooling effect.

(E) Further, as described in the present embodiment, if the pressure feeding mechanism 60 includes the driven fan 62 and the pressure feeding fan 63, the pressure feeding mechanism 60 requires a separate drive source. Instead, the medium can be pumped into the hole of the heat medium hole 3. Therefore, while enhancing the cooling effect by pumping the medium, even in such a case, the complication of the configuration can be suppressed, which is preferable in terms of downsizing and the like.

(F) Further, as described in the present embodiment, if the pressure feeding mechanism 60 has the dustproof filter 64, it is possible to prevent foreign matters and the like from entering the medium flowing in the hole of the heat medium hole 3.

(G) Further, as described in the present embodiment, if a medium storage chamber 65 is provided between the heat medium hole 3 and the pressure feeding mechanism 60, a medium (for example, the pressure feeding mechanism 60) is provided in the medium storage chamber 65. Is stored in a state where the medium storage chamber 65 stores the medium, for example, even when the forced medium flow supplied from the outside is interrupted. Since the medium flows from the medium storage chamber 65 into the hole of the heat medium hole 3 and the heat is exhausted by the flow of the medium, the cooling effect is not hindered.

(4-iv) Modified Example Here, the case where the forced medium flow by the fan 50 is mainly used to generate the medium flow in the hole of the heat medium hole 3 is described as an example. However, the present invention is not limited to this and may be applied to the following configuration example.

FIG. 8 is an explanatory view schematically showing another configuration example of the cooling structure for an electronic component according to the fourth embodiment of the present invention.
In the illustrated configuration example, the forced medium flow by the fan 50 is supplied not only to the inside of the heat medium hole 3 but also to the heat radiating fins 6 as the heat radiating structure portion in the heat sink 5 as the heat radiating member. The fan 50 and the heat radiating fin 6 are arranged. Specifically, the fan 50 is disposed so as to face the heat radiation fin 6 of the heat sink 5, and the fan 50 generates a forced medium flow toward the heat radiation fin 6. The radiating fin 6 is provided with a first opening 301 serving as a medium inlet to the heat medium hole 3, and a pressure feeding mechanism 60 is built in the vicinity of the first opening 301. The heat medium holes 3 connected to the pressure feeding mechanism 60 are arranged so as to pass through the mounting scheduled area 25 of the heat conducting plate 2.

In such a configuration example, the forced medium flow generated by the fan 50 is supplied to the radiating fins 6 of the heat sink 5 in addition to the function of generating the medium flow in the holes of the heat medium hole 3. It also has a function of promoting heat dissipation by the heat dissipation fins 6. Therefore, the medium flow has these functions, and further improvement of the cooling effect can be realized.

<5. Fifth embodiment of the present invention>
Next, a fifth embodiment of the present invention will be described.
Here, differences from the above-described fourth embodiment will be mainly described. That is, in the fifth embodiment, the same components as those in the fourth embodiment described above are denoted by the same reference numerals in the drawings, and detailed description thereof is omitted.

In the fifth embodiment, as in the case of the fourth embodiment described above, a case where a medium flow is generated in the hole of the heat medium hole using a forced medium flow will be described. For the configuration related to the heat medium hole through which the medium flows, any of the configuration examples of the first embodiment to the third embodiment described above can be applied, but here the case where the configuration example described in the first embodiment is applied. Take an example.

(5-i) Configuration of Electronic Component Cooling Structure FIG. 9 is an explanatory view schematically showing a schematic configuration example of an electronic component cooling structure according to the fifth embodiment of the present invention. In addition, the example of a figure shows typically the example of schematic structure of the cooling structure, and about the display size, the display scale, etc., it does not necessarily follow the actual thing.

(overall structure)
As shown in FIG. 9, the electronic component cooling structure 1 according to the fifth embodiment is configured in substantially the same manner as in the first embodiment, except for the following points.
In the fifth embodiment, the electronic component 101 is a light emitting diode (LED) chip, and is an automobile vehicle such as a four-wheeled vehicle or a two-wheeled vehicle, a railway vehicle, an aircraft, a ship, other transportation machines, etc. (hereinafter simply referred to as a vehicle). ) Is used as a light source of a headlamp 200. Therefore, in order to cool the electronic component (LED chip) 101, the cooling structure 1 is disposed in the housing 201 of the headlamp that is a sealed space.
In the fifth embodiment, the medium flow in the hole of the heat medium hole 3 is generated using the forced medium flow by taking in the traveling wind generated when the vehicle is traveling as the forced medium flow. It is configured. For this purpose, the cooling structure 1 includes a first guide tube portion 66 attached to the first opening 301 and a second guide tube portion 67 attached to the second opening 302.

(Headlight)
In the headlamp 200 on which the LED chip 101 is mounted, a sealed space is formed inside the housing 201, and the LED chip 101 and the reflector 202 are arranged in the sealed space. Then, the light emitted from the LED chip 101 is reflected by the reflector 202, so that light is irradiated to the front (light irradiation destination) side of the headlamp 200 through the lens portion 203 constituting a part of the housing 201. Is configured to do.

(Guide pipe part)
Both the first guide tube portion 66 and the second guide tube portion 67 are tubular ones that guide the medium flow.
The first guide pipe portion 66 is mounted so as to be connected to the first opening 301 serving as a medium inlet to the heat medium hole 3, and the forced flow of the medium from the outside is supplied to the first opening 301. It leads to. As in the case of the first vent pipe 710 described in the third embodiment, the first opening 301 may be attached using the first joint 700 described in the third embodiment. However, the present invention is not limited to this, and other known methods may be used. Further, since the medium flow to be guided is compulsory, the first guide pipe portion 66 is restricted in the arrangement of the inlet portion and the outlet portion as long as the first guide tube portion 66 has a tubular shape capable of guiding the medium flow. In addition, a bent portion or a curved portion may be provided in the middle of the pipeline.
The second guide pipe portion 67 is mounted so as to be connected to the second opening 302 serving as the medium outlet from the heat medium hole 3, and the forced medium flow discharged from the second opening 302 is provided. To the outside. Similarly to the case of the second ventilation pipe 720 described in the third embodiment, the attachment to the second opening 302 can be performed using the second joint 701 described in the third embodiment. Although it can be considered, the present invention is not limited to this, and other known methods may be used. Further, since the second guide pipe portion 67 is a forced medium flow to be guided, the second guide pipe portion 67 is restricted in the arrangement of the inlet portion and the outlet portion and the like as long as it is a tubular shape that can guide the medium flow. In addition, a bent portion or a curved portion may be provided in the middle of the pipeline.

By the way, in the present embodiment, the heat medium hole 3 passing through the LED chip 101 and the vicinity thereof is arranged inside the housing 201 of the headlamp 200 (that is, in a sealed space). For this purpose, the first guide pipe portion 66 is arranged so as to guide the medium flow that passes through the housing 201 and is supplied outside the sealed space to the heat medium hole 3 inside the sealed space. Further, the second guide pipe portion 67 is arranged so as to penetrate the housing 201 and guide the medium flow in the hole of the heat medium hole 3 in the sealed space to the outside of the sealed space.

The first guide pipe portion 66 is provided with the pressure feeding mechanism 60 and the medium storage chamber 65 described in the fourth embodiment in the vicinity of the edge opposite to the side connected to the first opening 301. Preferably it is. This is because if the pressure feeding mechanism 60 is provided, the medium flow can be efficiently fed, and if the medium storage chamber 65 is provided, it is possible to suppress the disappearance of the medium flow immediately even when the vehicle is stopped.

As described above, the configuration example of the present embodiment only needs to have the following characteristics.
(1) The heat medium hole 3 extends in a predetermined extending direction and is provided with a first opening 301 as a medium inlet provided on one surface of the heat conducting plate 2 and a second opening as a medium outlet. 302 has a through-hole-shaped configuration for the purpose of exhaust heat (heat extraction) due to the medium flow in the hole.
(2) When viewed in the normal direction, at least a part of the heat medium hole 3 overlaps at least a part of the mounting region 25 of the electronic component 101 mounted on the insulating substrate 4.
(3) A first guide pipe 66 for guiding the medium flow is connected to the first opening 301 serving as a medium inlet to the heat medium hole 3, and a first outlet serving as a medium outlet from the heat medium hole 3. A second guide pipe portion 67 that guides the medium flow is connected to the two openings 302.
(4) The medium intake side of the first guide pipe portion 66 (for example, the inlet side of the case portion 61 in the attached pressure feeding mechanism 60) is arranged toward the upstream side of the forced medium flow, and the heat medium The medium flow in the hole 3 is configured to be generated by using a forced medium flow from outside the heat medium hole 3.
(5) Preferably, when the heat medium hole 3 that passes through the electronic component 101 and the vicinity thereof is disposed in the sealed space, the medium flow in which the first guide pipe portion 66 is supplied outside the sealed space. Is guided to the heat medium hole 3 in the sealed space, and the second guide pipe portion 67 is arranged to guide the flow of the medium in the hole of the heat medium hole 3 to the outside of the sealed space.

(5-ii) Flow of heat and medium In the electronic component cooling structure 1 in the above-described embodiment, first, when the vehicle travels, a forced medium flow is generated. When a forced medium flow occurs, after the medium is pumped by the pumping mechanism 60 according to the forced medium flow and temporarily stored in the medium storage chamber 65, the medium flow is changed to the first guide pipe portion 66. Guides to the first opening 301 in the heat medium hole 3. Thus, a medium flow is generated in the hole of the heat medium hole 3 from the first opening 301 side toward the second opening 302 side. At this time, through the storage of the medium in the medium storage chamber 65, for example, even when the vehicle stops and the forced medium flow stops, the medium storage chamber 65 stores the medium. The medium flows from the medium storage chamber 65 into the hole of the heat medium hole 3.

If a medium flow occurs in the hole of the heat medium hole 3, the heat generated by the LED chip 101 is exhausted as in the case of the first embodiment. That is, regarding the heat from the LED chip 101, first, “rough heat” is exhausted by the flow of the medium in the heat medium hole 3, and then “residual heat” transmitted to the heat radiation fin 6 of the heat sink 5 is the heat radiation fin. The heat is dissipated by 6.

Then, when the medium is discharged from the second opening 302 of the heat medium hole 3, the second guide pipe portion 67 guides the flow of the medium to the outside of the housing 201 of the headlamp 200. Therefore, even when the LED chip 101 or the like is disposed in the housing 201 that is a sealed space, the heat from the LED chip 101 is exhausted by the flow of the medium in the hole of the heat medium hole 2 and the heat is discharged. Since it is possible to prevent the medium used for heat from adversely affecting the gas or the like in the housing 201, for example, it is possible to avoid the occurrence of condensation or the like in the housing 201.

(5-iii) Effects Obtained by the Present Embodiment According to the present embodiment, one or more effects shown below can be obtained.

(B) Also in the present embodiment, the medium flow in the hole of the heat medium hole 3 is generated by using the forcibly supplied medium flow. Therefore, the same effect as in the fourth embodiment is obtained. Is obtained.

(C) In the present embodiment, the first guide pipe portion 66 is connected to the first opening 301 serving as the medium inlet to the heat medium hole 3, and the first outlet 301 serving as the medium outlet from the heat medium hole 3 is used. Since the second guide tube portion 67 is connected to the two openings 302, the first guide tube portion is provided even when a forced medium flow is supplied at a location away from the heat medium hole 3. By guiding the medium flow through 66 and the second guide pipe portion 67, it is possible to generate a medium flow in the hole of the heat medium hole 3. Therefore, it is possible to ensure a sufficient degree of freedom in arrangement of the electronic component 101, the heat medium hole 3, and the like.

(D) In the present embodiment, when the heat medium hole 3 that passes through the electronic component 101 and the vicinity thereof is arranged in the sealed space, the first guide tube portion 66 is supplied outside the sealed space. The medium flow is guided to the heat medium hole 3 in the sealed space, and the second guide pipe portion 67 is arranged to guide the medium flow in the hole of the heat medium hole 3 to the outside of the sealed space. . Therefore, even when the electronic component 101 or the like is disposed in a sealed space, the heat from the electronic component 101 can be exhausted by the flow of the medium in the hole of the heat medium hole 3, and an excellent cooling effect can be obtained. Can do. Moreover, the medium used for exhaust heat does not affect the gas or the like in the sealed space, and for example, it is possible to avoid condensation or the like in the sealed space.

(5-iv) Modifications Here, the electronic component 101 is an LED chip used as the light source of the vehicle headlamp 200, and the electronic component ( The case of cooling the (LED chip) 101 has been described as an example. However, the present invention is not limited to this and may be applied to the following configuration example. For example, the electronic component 101 is not limited to the LED chip for headlamps, and may be arranged in an open space instead of a sealed space. Further, the forced medium flow may be generated by a medium flow generator such as the fan 50 as in the case of the fourth embodiment.

Specifically, for example, electronic parts for lighting equipment arranged near the ceiling of a building, large electronic devices in which various electronic parts are closely mounted, electronic parts for engines, etc. The vehicle-mounted electronic components and the like that are arranged away from the cooler may be configuration examples applied to these cooling operations, and in any case, they are very suitable for obtaining an excellent cooling effect.

Further, here, the case where both the first guide tube portion 66 and the second guide tube portion 67 are provided is described as an example, but the present invention is not limited to this, and the first guide tube portion 66 or only one of the second guide pipe portions 67 may be provided. If at least one of the first guide tube portion 66 and the second guide tube portion 67 is provided, at least one of the first guide tube portion 66 and the second guide tube portion 67 guides the medium flow so that the electronic component 101, the heat medium hole 3 and the like can be freely arranged. This is because a sufficient degree can be secured.

<6. Other embodiments>
As described above, the embodiments of the present invention have been specifically described by taking the first to fifth embodiments as examples. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

For example, the present invention is not necessarily as described in each of the above-described embodiments, and can be realized by appropriately combining the contents described in each of the embodiments. Even in that case, the description of each embodiment is provided. Technical effects can be obtained.

The cooling structure or cooling system of each embodiment can be combined with members having a known cooling function. Moreover, the cooling structure or cooling system of each embodiment can be used for a device having a high heat generation amount or a device in which the heat generation amount can be a problem, such as an automobile control device, a solar power generation device, or a supercomputer.

The cooling structure or cooling system of each embodiment is a vehicle, a household appliance including a lighting fixture, a computer, a robot, a laser device, an exposure device, an inspection device, a medical device, a communication device, a toy, a ship, an airplane, a drone, etc. It can be installed in a device and used in the heat generating device. In addition, the cooling structure or the cooling system of each embodiment can be installed in a structure such as a house or a factory and used in the structure.

<7. Preferred embodiment of the present invention>
Hereinafter, preferred embodiments of the present invention will be additionally described.

(Appendix 1)
According to one aspect of the invention,
A heat dissipating part having a mounting surface on which electronic components are mounted directly or indirectly,
There is provided a cooling structure provided with a medium flow path for flowing a medium in the heat radiating section.

(Appendix 2)
The heat dissipating part has a heat dissipating member having a heat dissipating body part and a heat dissipating structure part,
The cooling structure according to attachment 1 may be provided in which part or all of the medium flow path extends in a direction along the placement surface in the heat dissipation main body.

(Appendix 3)
The heat dissipating part includes a heat dissipating member and a heat conducting member provided on the heat dissipating member and having the placement surface described above.
A part or all of the medium flow path is provided in the heat conducting member. The cooling structure according to

attachment

1 or 2 may be provided.

(Appendix 4)
The heat dissipating part has a heat dissipating body part and a heat dissipating member having a heat dissipating structure part provided in the heat dissipating main body part, and a heat conducting member having the mounting surface.
A part of the medium flow path is provided in the heat dissipation main body,
A part of the medium flow path is provided in the heat conducting member. The cooling structure according to any one of supplementary notes 1 to 3 may be provided.

(Appendix 5)
The cooling structure according to any one of appendices 1 to 4, configured to generate a medium flow in the medium flow path by thermal convection.

(Appendix 6)
The first opening serving as the medium inlet of the medium flow path is disposed below the second opening serving as the medium outlet of the medium flow path in the gravity direction. One cooling structure may be provided.

(Appendix 7)
The medium flow path has a portion formed such that the hole cross-sectional area or hole volume on the medium inlet side of the medium flow path is larger than the hole cross-sectional area or hole volume on the medium outlet side. A cooling structure according to any one of the above may be provided.

(Appendix 8)
The medium flow path is disposed so as to pass through a mounting scheduled area corresponding to an area where electronic components are to be placed and a non-mounting scheduled area other than the mounting planned area,
The size of the hole cross-sectional shape in a part or all of the medium flow path located in the mounting scheduled area is larger than the size of the hole cross-sectional shape of the medium flow path positioned in the non-mounting planned area. 7. The cooling structure according to any one of 7 may be provided.

(Appendix 9)
A heat insulating member is provided in at least one of the first opening serving as the medium inlet of the medium flow path and the second opening serving as the medium outlet of the medium flow path. May be provided.

(Appendix 10)
The heat dissipating part has a protrusion provided with the medium flow path,
The first opening serving as the medium inlet of the medium flow path or the second opening serving as the medium outlet of the medium flow path is located at the edge of the protrusion. One cooling structure may be provided.

(Appendix 11)
A chimney member having a through hole is provided in the second opening serving as the medium outlet of the medium flow path,
The cooling structure according to any one of appendices 1 to 10, wherein the medium flow path and the through hole of the chimney member are communicated with each other.

(Appendix 12)
A piping member having a through hole is provided in the first opening serving as the medium inlet of the medium flow path,
The cooling structure according to any one of appendices 1 to 11, wherein the medium flow path and the through hole of the piping member are communicated with each other.

(Appendix 13)
The heat dissipating part has a heat dissipating body part and a heat dissipating structure part provided in the heat dissipating body part,
The cooling medium according to any one of appendices 1 to 12, wherein the medium flow path is also provided in the heat dissipation structure.

(Appendix 14)
The cooling structure according to any one of appendices 1 to 13,
A medium flow supply unit for flowing a medium into the medium flow path of the cooling structure;
A cooling system may be provided.

(Appendix 15)
The cooling system according to attachment 14, wherein the medium flow supply unit includes a medium flow generator or a pressure feeding mechanism.

(Appendix 16)
The cooling system according to appendix 14 or 15, further comprising a medium storage chamber that is provided between the cooling structure and the medium flow supply unit and stores the medium.

(Appendix 17)
The cooling system according to any one of appendices 14 to 16, further comprising a guide pipe portion that is provided between the cooling structure and the medium flow supply unit and guides the medium to the medium flow path.

(Appendix 18)
The cooling structure is disposed in a sealed space;
A first guide pipe part that guides the medium to the medium flow path located in the sealed space and a second guide pipe part that guides the medium from the medium flow path to the outside of the sealed space are provided. The cooling system according to any one of 14 to 17.

(Appendix 19)
The cooling system according to any one of appendices 14 to 18, wherein the medium flow supply unit supplies air, water, or oil into the medium flow path of the cooling structure.

(Appendix 20)
The cooling structure and the medium flow supply unit are provided in a vehicle,
The cooling system according to any one of appendices 14 to 19, wherein the medium flow supply unit supplies a traveling wind generated when the vehicle travels to the medium flow path.

(Appendix 21)
A heating device comprising the cooling structure according to any one of appendices 1 to 13 or the cooling system according to any one of appendices 14 to 20.

(Appendix 22)
A structure including the cooling structure according to any one of Supplementary Notes 1 to 13 or the cooling system according to any one of Supplementary Notes 14 to 20.

1, 1A, 1B, 1C ... Electronic

component cooling structure

2, 2B, 2C ... Heat conduction plate 2x ...

Projection

3, 3A, 3B, 3C ... Heat medium hole 4 ... Insulating

substrate

5, 5A, 5B ... Heat sink (heat dissipation) Element)
6, 6A, 6B ... Radiation fin (heat radiation structure)
25 ... Mounting area 31 ... Small cross-sectional area 32 ... Large cross-sectional area 50 ... Fan (medium flow generator)
DESCRIPTION OF SYMBOLS 60 ... Pressure feeding mechanism 62 ... Follower fan 63 ... Pressure feeding fan 64 ... Dust-proof filter 65 ... Medium storage chamber 66 ... 1st guide pipe part 67 ... 2nd guide pipe part 101 ... Electronic component 229 ... Heat insulation member 301 ... 1st opening Part 302 ... Second opening 700 ... First joint 701 ... Second joint 710 ... First vent pipe (pipe member)
720 ... Second vent pipe (chimney member)
730, 740 ... through hole

Claims

A heat dissipating part having a mounting surface on which electronic components are mounted directly or indirectly,
A cooling structure provided with a medium flow path for flowing a medium in the heat radiating section.
The heat dissipating part has a heat dissipating member having a heat dissipating body part and a heat dissipating structure part provided in the heat dissipating body part,
The cooling structure according to claim 1, wherein part or all of the medium flow path extends in a direction along the placement surface in the heat dissipation main body.
The heat dissipating part has a heat dissipating member and a heat conducting member having the placement surface described above,
The cooling structure according to claim 1, wherein a part or all of the medium flow path is provided in the heat conducting member.
The heat dissipating part has a heat dissipating body part and a heat dissipating member having a heat dissipating structure part provided in the heat dissipating main body part, and a heat conducting member having the mounting surface.
A part of the medium flow path is provided in the heat dissipation main body,
The cooling structure according to any one of claims 1 to 3, wherein a part of the medium flow path is provided in the heat conducting member.
The cooling structure according to any one of claims 1 to 4, wherein the cooling structure is configured to generate a flow of the medium in the medium flow path by thermal convection.
6. The first opening that serves as a medium inlet of the medium flow path is disposed below the second opening that serves as a medium outlet of the medium flow path in the gravity direction. The cooling structure according to claim 1.
The medium flow path has a portion formed such that a hole cross-sectional area on the medium inlet side of the medium flow path is larger than a hole cross-sectional area on the medium outlet side. The cooling structure described.
The medium flow path is disposed so as to pass through a mounting scheduled area corresponding to an area where electronic components are to be placed and a non-mounting scheduled area other than the mounting planned area,
2. The size of the hole cross-sectional shape of a part or all of the medium flow path located in the planned mounting area is larger than the size of the hole cross-sectional shape of the medium flow path positioned in the non-mounting planned area. The cooling structure according to any one of 1 to 7.
The heat insulation member is provided in at least one of the 1st opening part used as the medium entrance part of the said medium flow path, and the 2nd opening part used as the medium exit part of the said medium flow path. The cooling structure according to item.
The heat dissipating part has a protrusion provided with the medium flow path,
The first opening serving as a medium inlet of the medium flow path or the second opening serving as a medium outlet of the medium flow path is located at an edge of the protrusion. The cooling structure according to item 1.
A chimney member having a through hole is provided in the second opening serving as the medium outlet of the medium flow path,
The cooling structure according to any one of claims 1 to 10, wherein the medium flow path and the through-hole of the chimney member are communicated with each other.
A piping member having a through hole is provided in the first opening serving as the medium inlet of the medium flow path,
The cooling structure according to any one of claims 1 to 11, wherein the medium flow path and the through hole of the piping member communicate with each other.
The heat dissipating part has a heat dissipating body part and a heat dissipating structure part provided in the heat dissipating body part,
The cooling structure according to any one of claims 1 to 12, wherein the medium flow path is also provided in the heat dissipation structure.
The cooling structure according to any one of claims 1 to 13,
A medium flow supply unit for flowing a medium into the medium flow path of the cooling structure;
With cooling system.
The cooling system according to claim 14, wherein the medium flow supply unit includes a medium flow generator or a pressure feeding mechanism.
The cooling system according to claim 14 or 15, further comprising a medium storage chamber that is provided between the cooling structure and the medium flow supply unit and stores the medium.
The cooling system according to any one of claims 14 to 16, further comprising a guide pipe portion that is provided between the cooling structure and the medium flow supply unit and guides the medium to the medium flow path. .
The cooling structure is disposed in a sealed space;
A first guide pipe portion that guides the medium to the medium flow path positioned in the sealed space, and a second guide pipe section that guides the medium from the medium flow path to the outside of the sealed space are provided. Item 18. The cooling system according to any one of Items 14 to 17.
The cooling system according to any one of claims 14 to 18, wherein the medium flow supply unit supplies air, water, or oil into the medium flow path of the cooling structure.
The cooling structure and the medium flow supply unit are provided in a vehicle,
The cooling system according to any one of claims 14 to 19, wherein the medium flow supply unit supplies a traveling wind generated when the vehicle travels to the medium flow path.
A heat generating device comprising the cooling structure according to any one of claims 1 to 13 or the cooling system according to any one of claims 14 to 20.
A structure provided with the cooling structure according to any one of claims 1 to 13 or the cooling system according to any one of claims 14 to 20.