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WO2018181708A1 - Module - Google Patents

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Publication number
WO2018181708A1
WO2018181708A1 PCT/JP2018/013234 JP2018013234W WO2018181708A1 WO 2018181708 A1 WO2018181708 A1 WO 2018181708A1 JP 2018013234 W JP2018013234 W JP 2018013234W WO 2018181708 A1 WO2018181708 A1 WO 2018181708A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
wiring board
heat
module
resin layer
Prior art date
Application number
PCT/JP2018/013234
Other languages
English (en)
Japanese (ja)
Inventor
喜孝 松川
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2019510121A priority Critical patent/JP6911917B2/ja
Publication of WO2018181708A1 publication Critical patent/WO2018181708A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Definitions

  • the present invention relates to a module including a heat dissipation member.
  • modules mounted on portable terminal devices have a plurality of components including an IC mounted on a wiring board and the components are sealed with resin.
  • heat may be generated during use due to heat generated from the mounted components, and problems such as changes in the characteristics of the mounted components and malfunctions may occur.
  • a module having a heat dissipation mechanism has been proposed.
  • a semiconductor element 102 that is a heat generating component and a plurality of chip components 103 such as chip capacitors are mounted on a wiring board 101, and these mountings are performed.
  • Components semiconductor element 102 and a plurality of chip components 103 are sealed in sealing resin layer 104.
  • the upper surface 104 a of the sealing resin layer 104 is covered with a heat radiating conductor layer 105, and the upper surface 102 a of the semiconductor element 102 and the conductor layer 105 are connected by a plurality of conductive posts 106.
  • the semiconductor element 102 is mounted face-down as in the conventional module 100, since the heat generation area is the lower surface 102b on which the circuit is formed, the conductive post 106 is provided on the upper surface 102a away from the heat generation area. In the configuration of connecting and radiating heat, there is a possibility that heat radiation is not sufficiently performed.
  • the present invention has been made in view of the above-described problems, and an object thereof is to provide a module that can efficiently dissipate heat generated from a mounted component.
  • a module of the present invention includes a wiring board, a component mounted on the main surface of the wiring board, a heat dissipation member having a portion in contact with the component, and the main board of the wiring board.
  • a seal that seals the component and the heat dissipating member.
  • the seal includes a contact surface that contacts the surface, a facing surface that faces the contact surface, and a side surface that connects edges of the contact surface and the facing surface.
  • a first resin surface disposed opposite to the main surface of the wiring board; a second surface opposed to the first surface; the first surface and the second surface.
  • the heat radiation member is in contact with at least the side surface of the component.
  • the heat dissipating member since the heat dissipating member is in contact with the part close to the heat generation region of the part, the heat generated from the part can be efficiently dissipated.
  • the heat dissipation member may have a portion exposed from the facing surface of the sealing resin layer. According to this configuration, heat from the component can be radiated from the facing surface side of the sealing resin layer.
  • a shield film that covers the facing surface and the side surface of the sealing resin layer may be further provided, and the heat dissipation member may be connected to the shield film.
  • the heat generated from the components can be radiated from the shield film, the heat radiation characteristics of the module can be improved.
  • the heat radiating member and the shield film may both be made of a conductive material. According to this configuration, the heat dissipation characteristics of the module can be further improved.
  • the heat dissipation member may have a portion exposed from the contact surface of the sealing resin layer.
  • the heat dissipation member may be in contact with an electrode formed on the main surface of the wiring board, and the electrode may be connected to a ground electrode formed on the wiring board.
  • the heat dissipation member is connected to the ground electrode formed with a relatively large area, the heat dissipation characteristics of the heat dissipation member are improved.
  • the ground electrode is connected to a mother board on which the module is mounted. Therefore, the heat generated from the component can be released to the mother board via the ground electrode. Thereby, more efficient heat dissipation of the heat generated from the components can be achieved.
  • the shield film and the ground electrode are connected by a heat radiating member, the heat radiating member can be used as a conductor for grounding the shield film.
  • the heat radiating member may have a portion in contact with the second surface of the component. According to this structure, since the contact area of a heat radiating member and components increases, the heat radiating characteristic by a heat radiating member can be improved.
  • the heat dissipating member includes a plate-shaped portion that contacts the second surface of the component, and a surface of the plate-shaped portion that contacts the second surface of the component.
  • a plurality of legs extending in a direction, and the plurality of legs may be in contact with the side surface of the component.
  • the heat dissipation path to the wiring board side can be formed by the heat dissipation member. Further, since the component is not sealed with the heat radiating member, the sealing performance of the component by the sealing resin layer is improved.
  • the heat dissipating member since the heat dissipating member is in contact with the part close to the heat generating region of the part, the heat generated from the part can be efficiently dissipated.
  • FIG. 2 is a plan view of the module of FIG. 1 with a shield film removed. It is a figure for demonstrating the manufacturing method of the module of FIG. It is a figure which shows the modification of the heat radiating member of FIG. It is sectional drawing of the module concerning 2nd Embodiment of this invention. It is sectional drawing of the module concerning 3rd Embodiment of this invention. It is sectional drawing of the module concerning 4th Embodiment of this invention. It is sectional drawing of the module concerning 5th Embodiment of this invention. It is a perspective view of the heat radiating member of FIG. It is sectional drawing of the module concerning 6th Embodiment of this invention. It is sectional drawing of the conventional module.
  • FIGS. 1 is a cross-sectional view of the module 1a
  • FIG. 2 is a plan view of the module 1a with the shield film 6 removed
  • FIG. 3 is a view for explaining a method of manufacturing the module 1a. (F) shows each process.
  • a module 1a includes a wiring board 2 and a plurality of components 3a mounted on the upper surface 2a of the wiring board 2 (corresponding to the “main surface of the wiring board” of the present invention).
  • 3b the sealing resin layer 4 laminated on the upper surface 2a of the wiring substrate 2, the upper surface 4a and the side surface 4c of the sealing resin layer 4, and the shielding film 6 covering the side surface 2c of the wiring substrate 2,
  • it is mounted on a mother substrate of an electronic device using a high-frequency signal.
  • the wiring board 2 is formed by laminating a plurality of insulating layers made of, for example, a low-temperature co-fired ceramic or glass epoxy resin.
  • a mounting electrode 7a for mounting the components 3a and 3b and a surface layer electrode 7b (corresponding to an “electrode” in the present invention) connected to the heat radiating member 5a are formed on the upper surface 2a of the wiring board 2, a mounting electrode 7a for mounting the components 3a and 3b and a surface layer electrode 7b (corresponding to an “electrode” in the present invention) connected to the heat radiating member 5a are formed.
  • the surface layer electrode 7b is positioned so as to overlap the heat radiating member 5a when viewed from a direction perpendicular to the upper surface 2a of the wiring board 2, and has the same shape as the heat radiating member 5a and has a rectangular outline and surrounds the component 3a. It is formed into a shape.
  • a plurality of external electrodes (not shown) for external connection are formed on the lower surface 2 b of the wiring board 2.
  • Various internal wiring electrodes 8 are formed between adjacent insulating layers, and a plurality of via conductors for connecting the internal wiring electrodes 8 formed in different insulating layers to each other inside the wiring board 2. (Not shown) is formed.
  • the mounting electrode 7a, the surface layer electrode 7b, the external electrode, and the internal wiring electrode 8 are all made of a metal generally adopted as a wiring electrode such as Cu, Ag, or Al. Each via conductor is formed of a metal such as Ag or Cu. Each mounting electrode 7a, surface layer electrode 7b, and external electrode may be plated with Ni / Au.
  • the components 3a and 3b are composed of semiconductor elements formed of a semiconductor such as Si or GaAs, and chip components such as a chip inductor, a chip capacitor, and a chip resistor.
  • the wiring board 2 is formed by a general surface mounting technique such as solder bonding.
  • the component 3a (corresponding to the “component” of the present invention) surrounded by the heat radiating member 5a is constituted by a semiconductor element which is a heat-generating component, and the component 3b is formed by a chip capacitor.
  • the component 3a has a circuit formed on the lower surface 3a2 (corresponding to the “first surface of the component” of the present invention) and is flip-chip mounted face down.
  • the sealing resin layer 4 is laminated on the wiring board 2 so as to cover the components 3a and 3b and the heat dissipation member 5a.
  • the sealing resin layer 4 can be formed of a resin that is generally employed as a sealing resin such as an epoxy resin.
  • the upper surface 4a of the sealing resin layer 4 corresponds to the “opposing surface of the sealing resin layer” of the present invention, and the lower surface 4b corresponds to the “abutting surface of the sealing resin layer” of the present invention.
  • the heat dissipating member 5a is formed of, for example, a conductive paste mainly composed of Ag or Cu, and when viewed from a direction perpendicular to the upper surface 2a of the wiring board 2, the component 3a formed of a semiconductor element. Is disposed in the sealing resin layer 4 so as to surround the. Specifically, the heat dissipation member 5a is formed in a rectangular tube shape, and the inner side surface 5a1 is in contact with all four side surfaces 3a3 of the component 3a. Further, the upper end of the heat radiation member 5 a in the thickness direction of the sealing resin layer 4 is exposed from the upper surface 4 a of the sealing resin layer 4 and is connected to the shield film 6.
  • the lower end of the heat radiation member 5a in the thickness direction of the sealing resin layer 4 is exposed from the lower surface 4b of the sealing resin layer 4 and connected to the surface layer electrode 7b.
  • the surface layer electrode 7b is connected to an internal wiring electrode 8 (ground electrode (not shown)) formed on the wiring substrate 2, and the heat radiation member 5a is connected to the surface layer electrode 7b. Grounding is possible.
  • the shield film 6 can be formed, for example, in a multilayer structure having an adhesion film, a conductive film laminated on the adhesion film, and a protective film laminated on the conductive film.
  • the adhesion film is provided to increase the adhesion strength between the conductive film and the sealing resin layer 4 and can be formed of a metal such as SUS, for example.
  • the conductive film is a layer that bears the substantial shielding function of the shield film 6 and can be formed of, for example, any one of Cu, Ag, and Al.
  • the protective film is provided to prevent the conductive film from being corroded or scratched, and can be formed of, for example, SUS.
  • solder paste application method examples include a printing method using a metal mask, a dispenser method, and the like.
  • the components 3a and 3b are mounted at predetermined positions on the upper surface 2a of the wiring board 2 by a component mounting apparatus such as a mounter, and then soldered in a reflow furnace. After soldering, it is preferable to perform flux cleaning.
  • a sealing resin layer 4 is formed on the upper surface 2 a of the wiring board 2.
  • Examples of the method for forming the sealing resin layer 4 include a dispensing method, a printing method, and a compression mold method.
  • a groove 9 for disposing the heat radiating member 5 a is formed in the sealing resin layer 4.
  • the groove 9 is formed so that the side surface 3a3 of the component 3a is exposed from the sealing resin layer 4.
  • Examples of the groove forming method include laser processing, router processing, and dicing.
  • the groove 9 is filled with a conductive paste mainly composed of Ag or Cu, and cured to form the heat radiating member 5a.
  • a conductive paste mainly composed of Ag or Cu is filled with a conductive paste mainly composed of Ag or Cu, and cured to form the heat radiating member 5a.
  • the shield film 6 covering the upper surface 4a and the side surface 4c of the sealing resin layer 4 and the side surface 2c of the wiring board 2 is formed, and the module 1a is completed.
  • the shield film 6 can be obtained by, for example, forming an adhesion film, a conductive film, and a protective film in this order by sputtering or vacuum deposition, respectively.
  • the heat radiating member 5a is in contact with the side surface 3a3 close to the lower surface 3a2 that is the heat generation region of the component 3a, the upper surface 3a1 of the component 3a (the “second surface of the component” of the present invention).
  • the heat generated from the component 3a can be efficiently radiated as compared with the configuration in which the heat radiating member is in contact with Further, since the entire surface of the side surface 3a3 of the component 3a is in contact with the heat radiating member 5a, heat can be radiated more efficiently.
  • the heat radiating member 5 a is connected to the shield film 6, heat generated from the component 3 a is transmitted to the shield film 6 and can be radiated to the outside air through the shield film 6. Further, since the heat dissipating member 5a is also connected to the surface layer electrode 7b formed on the wiring board 2, the heat generated from the component 3a can be dissipated from the wiring board 2 side having many conductors such as the internal wiring electrode 8. Can do. In addition, when heat is radiated to the mother substrate side on which the module 1a is mounted, the heat radiation path is shortened, so that efficient heat radiation is possible.
  • the internal wiring electrode 8 (ground electrode) of the wiring board 2 and the shield film 6 are connected via the heat radiating member 5a.
  • the connection resistance between the shield film 6 and the internal wiring electrode 8 can be reduced as compared with the configuration in which the internal wiring electrode 8 (ground electrode) is exposed from the side surface 2 c of the wiring substrate 2 and connected to the shield film 6.
  • the heat radiating member 5a can be used as a shield for the component 3a, and the shielding characteristics for the component 3a are improved.
  • the heat radiating member 5a is formed in a rectangular tube shape, and the entire surface of the four side surfaces 3a3 of the component 3a is in contact with the heat radiating member 5a.
  • the structure which contacts may be sufficient.
  • two plate-like heat radiating members 5b may be formed so as to contact only two opposing side surfaces 3a3 among the four side surfaces 3a3 of the component 3a.
  • a plurality of columnar heat radiating members 5c are erected on the wiring board 2 so as to surround the component 3a, and a part of the peripheral side surface of each heat radiating member 5c is part 3a. It may be in contact with the side surface 3a3.
  • FIGS. 4A and 4B are diagrams showing modifications of the heat radiating member, and correspond to FIG.
  • FIG. 5 is a cross-sectional view of the module 1b.
  • the module 1b according to this embodiment differs from the module 1a according to the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
  • the heat dissipating member 5d of this embodiment has a portion 5d1 that abuts on the upper surface 3a1 of the component 3a (hereinafter also referred to as the upper surface abutting portion 5d1) in addition to the configuration of the heat dissipating member 5a of the first embodiment.
  • a conductive paste is applied to the upper surface 3a1 of the component 3a to form the upper surface contact portion 5d1, and after forming the sealing resin layer 4 in this state,
  • the remaining part of the heat radiating member 5d is formed by the same method as the method of forming the heat radiating member 5a of the first embodiment.
  • FIG. 6 is a cross-sectional view of the module 1c.
  • the module 1c according to this embodiment differs from the module 1a of the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
  • the heat dissipating member 5e of this embodiment is formed so that the upper end is substantially the same height as the upper surface 3a1 of the component 3a, and the heat dissipating member 5e is not exposed from the upper surface 4a of the sealing resin layer 4.
  • a heat dissipation member 5e can be formed, for example, by forming the sealing resin layer 4 in two stages. Specifically, after mounting the components 3a and 3b, the components 3a and 3b are sealed with an epoxy resin (first-stage sealing resin layer), and then the upper surface of the sealing resin layer is polished or ground. The upper surface 3a1 of 3a is exposed.
  • a groove is formed so that the four side surfaces 3a3 of the component 3a are exposed, and the heat dissipation member 5e is filled with a conductive paste in the groove.
  • the sealing resin layer 4 is completed by laminating the sealing resin layer of the second stage on the sealing resin layer of the first stage.
  • the heat generated from the component 3a can be efficiently radiated to the wiring board 2 side.
  • FIG. 7 is a cross-sectional view of the module 1d.
  • the module 1d according to this embodiment is different from the module 1a according to the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
  • the heat dissipating member 5f of this embodiment is different from the heat dissipating member 5a of the first embodiment in that the lower end is not exposed from the lower surface 4b of the sealing resin layer 4.
  • the heat radiating member 5f is formed in substantially the same manner as the heat radiating member 5a of the first embodiment, but the groove 9 (see FIG. 3) filled with the conductive paste reaches the lower surface 3a2 of the component 3a. 7b is formed with a depth not exposed.
  • the heat generated from the component 3a can be efficiently radiated to the outside air through the shield film 6.
  • FIGS. 8 is a cross-sectional view of the module 1e
  • FIG. 9 is a perspective view of the heat dissipation member 5g.
  • the module 1e according to this embodiment is different from the module 1a of the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
  • the heat radiating member 5g of this embodiment includes a plate-like portion 5g1 (hereinafter referred to as a plate-like portion 5g1) that contacts the upper surface 3a1 of the component 3a, and a component of the plate-like portion 5g1. And a plurality of (four in this embodiment) leg portions 5g2 extending in the direction of the upper surface 2a of the wiring board 2 from the contact surface of the 3a with the upper surface 3a1.
  • the plate-like portion 5g1 is formed in a rectangular shape, and leg portions 5g2 are arranged at the four corners of the plate-like portion 5g1, and the tip portions of the leg portions 5g2 are connected to the surface layer electrodes 7b of the wiring board 2 by soldering.
  • the plate-like portion 5g1 is in contact with the upper surface 3a1 of the component 3a, and the four leg portions 5g2 are in contact with the side surface 3a3 of the component 3a, so that the heat radiating member 5g is disposed so as to cover the component 3a.
  • the heat radiating member 5g can be formed, for example, by bending a plate-shaped metal plate.
  • the heat radiation member 5g can form a heat radiation path for radiating the heat generated from the component 3a to the wiring board 2 side. Moreover, since the heat radiating member 5g is shaped to cover the component 3a, there is a gap between the leg portions 5g2, so even if the sealing resin layer 4 is formed after the heat radiating member 5g is mounted on the wiring board 2, Since the resin of the sealing resin layer 4 can be easily filled between the lower surface 3a2 of the component 3a and the upper surface 2a of the wiring board 2, the sealing performance of the component 3a is improved.
  • FIG. 10 is a cross-sectional view of the module 1f.
  • the module 1f according to this embodiment is different from the module 1a of the first embodiment described with reference to FIGS. 1 to 3 in that the arrangement of the component 3a and the heat dissipating member 5a is different as shown in FIG. It is. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
  • the component 3 a is disposed near the periphery of the upper surface 2 a of the wiring board 2, and a part of the outer surface 5 a 2 of the heat radiating member 5 a is exposed from the side surface 4 c of the sealing resin layer 4 and contacts the shield film 6. is doing.
  • the number of insulating layers and wiring layers constituting the wiring board 2 can be changed as appropriate.
  • the present invention can be applied to various modules including a sealing resin layer that covers a component mounted on a wiring board and a heat dissipation member that dissipates heat generated from the component.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un module qui est capable de dissiper efficacement la chaleur qui est générée par un composant monté. Un module (1a) selon la présente invention comprend : une carte de câblage (2) ; un composant (3a) qui est monté sur une surface supérieure (2a) de la carte de câblage (2) ; un élément de dissipation de chaleur (5a) ayant une portion qui est en contact avec le composant (3a) ; et une couche de résine de scellement (4) qui est stratifiée sur la surface supérieure (2a) de la carte de câblage (2) de façon à sceller le composant (3a) et l'élément de dissipation de chaleur (5a). Par ailleurs, l'élément de dissipation de chaleur (5a) est réalisé sous la forme d'un tube carré et une surface latérale interne (5a1) est en contact avec une surface latérale (3a3) du composant (3a). De plus, l'extrémité supérieure de l'élément de dissipation de chaleur (5a) est exposée depuis une surface supérieure (4a) de la couche de résine de scellement (4) et elle est reliée à un film de protection (6), tandis que l'extrémité inférieure est reliée à une électrode de couche de surface (7b) de la carte de câblage (2).
PCT/JP2018/013234 2017-03-31 2018-03-29 Module WO2018181708A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019510121A JP6911917B2 (ja) 2017-03-31 2018-03-29 モジュール

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-070572 2017-03-31
JP2017070572 2017-03-31

Publications (1)

Publication Number Publication Date
WO2018181708A1 true WO2018181708A1 (fr) 2018-10-04

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WO (1) WO2018181708A1 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
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WO2020162614A1 (fr) * 2019-02-08 2020-08-13 株式会社村田製作所 Module
JP2021005674A (ja) * 2019-06-27 2021-01-14 株式会社村田製作所 電子部品モジュール、電子部品ユニット、および、電子部品モジュールの製造方法
JPWO2021079851A1 (fr) * 2019-10-25 2021-04-29
WO2021131776A1 (fr) * 2019-12-27 2021-07-01 株式会社村田製作所 Module
WO2021140850A1 (fr) * 2020-01-10 2021-07-15 株式会社村田製作所 Module
WO2022050042A1 (fr) * 2020-09-03 2022-03-10 株式会社村田製作所 Module
WO2022153789A1 (fr) * 2021-01-12 2022-07-21 株式会社村田製作所 Module de circuit
EP4225004A1 (fr) * 2022-02-03 2023-08-09 Qorvo US, Inc. Blindage compartimenté d'un module utilisant des sous-modules auto-blindés
JP2023535813A (ja) * 2020-07-31 2023-08-21 華為技術有限公司 パッケージングモジュールおよびそのためのパッケージング方法、ならびに電子デバイス
WO2024029313A1 (fr) * 2022-08-01 2024-02-08 株式会社村田製作所 Module
US12356538B2 (en) 2020-08-20 2025-07-08 Murata Manufacturing Co., Ltd. Electronic component module
US12446157B2 (en) 2020-06-16 2025-10-14 Murata Manufacturing Co., Ltd. Module

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Cited By (21)

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JP2021005674A (ja) * 2019-06-27 2021-01-14 株式会社村田製作所 電子部品モジュール、電子部品ユニット、および、電子部品モジュールの製造方法
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JPWO2021079851A1 (fr) * 2019-10-25 2021-04-29
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JP7302669B2 (ja) 2019-10-25 2023-07-04 株式会社村田製作所 回路モジュールおよびその製造方法
WO2021131776A1 (fr) * 2019-12-27 2021-07-01 株式会社村田製作所 Module
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JP7507960B2 (ja) 2020-07-31 2024-06-28 華為技術有限公司 パッケージングモジュールおよびそのためのパッケージング方法、ならびに電子デバイス
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WO2022153789A1 (fr) * 2021-01-12 2022-07-21 株式会社村田製作所 Module de circuit
EP4225004A1 (fr) * 2022-02-03 2023-08-09 Qorvo US, Inc. Blindage compartimenté d'un module utilisant des sous-modules auto-blindés
US12342518B2 (en) 2022-02-03 2025-06-24 Qorvo Us, Inc. Compartmentalized shielding of a module utilizing self-shielded sub-modules
WO2024029313A1 (fr) * 2022-08-01 2024-02-08 株式会社村田製作所 Module

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