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WO2018191834A1 - Système de refroidissement d'ordinateur portable basé sur un caloduc à boucle plate - Google Patents

Système de refroidissement d'ordinateur portable basé sur un caloduc à boucle plate Download PDF

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Publication number
WO2018191834A1
WO2018191834A1 PCT/CN2017/000653 CN2017000653W WO2018191834A1 WO 2018191834 A1 WO2018191834 A1 WO 2018191834A1 CN 2017000653 W CN2017000653 W CN 2017000653W WO 2018191834 A1 WO2018191834 A1 WO 2018191834A1
Authority
WO
WIPO (PCT)
Prior art keywords
flat
evaporator
heat pipe
liquid
notebook computer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/000653
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English (en)
Chinese (zh)
Inventor
满广龙
张红星
李国广
励精图治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Institute of Spacecraft System Engineering
Original Assignee
Beijing Institute of Spacecraft System Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Institute of Spacecraft System Engineering filed Critical Beijing Institute of Spacecraft System Engineering
Publication of WO2018191834A1 publication Critical patent/WO2018191834A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the invention relates to a heat dissipation system, in particular to a notebook computer heat dissipation system, belonging to the technical field of electronic device heat dissipation.
  • the loop heat pipe is a high-efficiency two-phase heat transfer device, which has high heat transfer performance, long-distance heat transfer, excellent temperature control characteristics, and can be bent and installed easily, and has many other heat transfer devices. Comparable advantages, loop heat pipes have broad application prospects in many fields such as aviation, aerospace and ground electronic equipment cooling.
  • the loop heat pipe mainly includes an evaporator, a condenser, a liquid reservoir, a steam line, and a liquid line.
  • the whole cycle is as follows: the liquid evaporates on the outer surface of the capillary core in the evaporator, absorbs the heat outside the evaporator, and the generated steam flows from the steam line to the condenser, releasing heat in the condenser to condense the heat sink into a liquid, and finally passing through the liquid.
  • the pipeline flows into the accumulator, and the liquid working fluid in the accumulator maintains the supply of the capillary core in the evaporator. Because of the small installation space required for the flat-loop heat pipe, the flat evaporator and the heat source plane are easy to install, which is a research hotspot and a key application direction in recent years.
  • a copper water heat pipe sintered core, groove or composite core
  • the heat of the CPU and the graphics chip is transferred to the side of the notebook using a copper water heat pipe, using a fan and a heat sink. Heat is dissipated.
  • the radiator is arranged on the side, on the one hand, the air circulation path can be optimized; on the other hand, a high-efficiency heat exchanger can be used to reduce the air flow demand, reduce the fan energy consumption and noise, and prolong the battery standby time.
  • the transmission path is still limited by the length. If the transmission path is too long, the heat transfer capacity of the heat pipe will decrease as the length increases. In addition, the heat pipe must have a certain bending radius to take up space. Heat pipe bending and length restrictions still have certain constraints on the layout design of the notebook.
  • the limitation of the traditional heat pipe structure makes it impossible to use an efficient radiator.
  • the heat pipe has a cylindrical or flat structure, and it is difficult to design a high-efficiency radiator sample.
  • the present invention provides a notebook computer heat dissipation system based on a flat loop heat pipe, which can effectively reduce the installation space and facilitate the internal layout design; can realize the silent cooling of the notebook computer, the standby time is extended, and the reliability is improved. Technical effect.
  • the tablet heat pipe-based notebook computer cooling system is characterized in that: a flat loop heat pipe evaporator, a screen back plate heat sink, a keyboard bottom plate radiator and a flat plate evaporator; the flat ring heat pipe evaporates And the flat evaporator are respectively attached to the parts of the notebook that require heat dissipation;
  • connection relationship is: a liquid reservoir filled with a liquid working medium is integrated on one side of the flat loop heat pipe evaporator, and the liquid storage device supplies liquid to the flat loop heat pipe evaporator, the flat ring loop
  • the heat pipe evaporator absorbs the heat of the heat dissipating component attached thereto to evaporate the liquid into a vapor;
  • the flat loop heat pipe evaporator is connected to the screen back plate radiator through the gas pipe A, and the screen back plate radiator passes through the liquid
  • the pipeline A is connected to the flat evaporator, the flat evaporator is connected to the keyboard bottom radiator through the gas pipeline B, and the keyboard bottom radiator is connected to the flat loop heat pipe evaporator through the liquid pipeline B, thereby forming a loop;
  • the vapor in the flat loop heat pipe evaporator flows into the back panel heat sink through the gas pipeline A, and the heat is discharged, and the steam is condensed into a liquid.
  • the liquid flows into the flat evaporator through the liquid pipeline A, and then evaporates to generate steam and vapor. Passing through the gas pipeline B through the keyboard bottom plate radiator, cooling into a liquid, and then returning through the liquid pipe B to the liquid storage device of the flat ring heat pipe;
  • a flexible thermal joint is disposed on the gas line A to which the flat loop heat pipe evaporator is connected to the screen back panel and the liquid line A to which the screen back panel is connected to the flat evaporator.
  • the flat loop heat pipe evaporator is attached to a CPU chip in a notebook computer, and the flat plate evaporator is attached to a graphics chip in a notebook computer.
  • the flat evaporator is a microchannel or tube fin structure.
  • the gas line A, the gas line B, the liquid line A, and the liquid line B are stainless steel of ⁇ 3 mm or less or a hollow tube of copper or titanium alloy.
  • the flexible thermal joint is a polymer material hose.
  • the flexible thermal joint is a spring tube.
  • the screen back panel heat sink is of a tube fin type.
  • a heat dissipation hole is provided in the keyboard bottom plate.
  • the heat transfer capability of the flat-loop heat pipe is larger than that of the conventional heat pipe, which can solve the heat dissipation problem of the higher power chip.
  • the gas pipeline and the liquid pipeline are small-diameter metal pipes, which are suitable for small space installation and have certain flexibility (because when the pipe diameter is small and the length is long, it has flexibility and can be bent), it can be bent and is convenient for notebooks.
  • the layout design inside the computer is small-diameter metal pipes, which are suitable for small space installation and have certain flexibility (because when the pipe diameter is small and the length is long, it has flexibility and can be bent), it can be bent and is convenient for notebooks.
  • the natural convection heat of the air of the notebook keyboard bottom plate and the screen back plate can be used to cancel the fan and the radiator, thereby reducing the volume and weight; eliminating the fan noise and realizing Silent cooling; eliminating the fan reduces the battery power consumption, which can extend the standby time of the computer; in addition, canceling the fan also avoids the problem of computer running reliability caused by the fan failure.
  • a flexible thermal joint is arranged on the gas pipeline connected to the flat loop heat pipe evaporator and the screen back panel, and the liquid pipeline connected to the screen back panel and the flat evaporator, which can be adapted to the opening and closing of the notebook screen.
  • 1 is a layout diagram of the cooling system of the notebook computer
  • FIG. 2 is a schematic structural view of a flat plate evaporator
  • Figure 3 is a schematic view of a flexible material joint using a polymer material hose
  • Figure 4 is a schematic view showing the use of a spring as a flexible thermal joint
  • Figure 5 is a schematic view showing the arrangement of the heat sink on the back panel of the screen
  • Figure 6 is a schematic view showing the arrangement of the heat sink on the keyboard bottom plate.
  • the embodiment provides a notebook computer heat dissipation system based on a flat loop heat pipe, which eliminates the fan and the heat sink assembly, can effectively reduce the installation space, facilitate the internal layout design, improve the operation reliability, and can eliminate the noise caused by the fan. Reduce power consumption requirements and increase computer standby and usage time.
  • the system uses a flat loop heat pipe to collect, transfer, and dissipate heat from the CPU and graphics chips in the notebook.
  • the notebook cooling system based on the flat loop heat pipe includes a flat loop heat pipe evaporator, a gas line, a liquid line, a screen back plate heat sink, a keyboard bottom plate radiator, and a flat plate evaporator.
  • the flat loop heat pipe evaporator is attached to the computer CPU chip, and the flat loop heat pipe evaporator is connected to the screen back plate heat sink disposed on the back panel of the screen through the gas line A, and the screen back plate radiator passes through the liquid.
  • the pipeline A is connected to a flat evaporator connected to the graphics card GPU chip, and the flat evaporator is connected to the keyboard bottom radiator provided on the keyboard bottom plate through the gas pipeline B, and the keyboard bottom radiator passes through the liquid pipeline B and the flat loop
  • the heat pipe evaporators are connected, thereby forming a loop.
  • the vapor in the flat-plate loop heat pipe evaporator flows into the back plate radiator through the gas pipe A, and the heat is discharged by the natural convection of the air.
  • the gas condenses into a liquid, and the liquid flows into the flat evaporator through the liquid pipeline A to evaporate to form a vapor.
  • the vapor flows through the bottom plate radiator through the gas pipeline B, is naturally convected by the air to be cooled, and finally flows back to the flat plate through the liquid pipeline B.
  • the flat-loop heat pipe evaporator attached to the CPU chip adopts an evaporator structure in a rectangular flat-loop heat pipe, and a liquid-filled liquid storage device is integrated on the evaporator side, and the liquid storage device supplies the liquid to the evaporator.
  • the evaporator absorbs the heat from the CPU chip and the liquid evaporates into steam.
  • the flat evaporator attached to the graphics card GPU chip is a micro-channel or tube-fin structure. As shown in FIG. 2, the liquid flows through the flat evaporator to absorb the heat generated by the graphics card GPU chip and evaporate into a gas.
  • the gas pipeline A, the gas pipeline B, the liquid pipeline A and the liquid pipeline B adopt a metal hollow pipeline such as stainless steel, copper or titanium alloy of ⁇ 3 mm or less, which has certain flexibility and can be bent to facilitate layout.
  • the flat loop heat pipe evaporator is connected to the gas pipeline connected to the screen back panel and the screen back panel is connected with the flat evaporator.
  • the flexible liquid joint is provided with a flexible thermal joint, which is a polymer material hose (as shown in FIG. 3) or a spring tube (shown in FIG. 4), thereby achieving a flexible connection, and the gas and liquid can pass through the flexible Hot joints flow through while meeting the flexibility requirements of screen opening and closing.
  • the heat dissipation system uses a screen back panel and a keyboard backplane to perform heat dissipation by means of natural convection.
  • the back panel heat sink of the screen is a tube-fin type, as shown in FIG. 5, that is, the screen back panel is finned to enhance natural convection. heat radiation.
  • the keyboard backplane can add heat dissipation holes to facilitate natural convection heat dissipation, as shown in Figure 6.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un système de refroidissement d'ordinateur portable basé sur un caloduc à boucle plate. Ledit système de refroidissement comprend : un évaporateur de caloduc à boucle plate, un dissipateur thermique de panneau arrière d'écran, un dissipateur thermique de plaque de base de clavier, et un évaporateur plat. L'évaporateur de caloduc à boucle plate est fixé à une puce de CPU d'ordinateur. La vapeur circule dans le dissipateur thermique de panneau arrière d'écran par l'intermédiaire d'un tuyau pour dissiper la chaleur au moyen de la convection naturelle de l'air et se condense en liquide, le liquide s'écoule vers l'évaporateur plat fixé à une puce de GPU de carte vidéo et s'évapore pour produire de la vapeur, et la vapeur circule vers le dissipateur thermique de plaque de base de clavier par l'intermédiaire d'un tuyau de manière à refroidir et à redevenir liquide grâce à la convection naturelle de l'air, puis retourne dans un réservoir de liquide du caloduc à boucle plate. Le système de refroidissement facilite la conception de la disposition interne d'un ordinateur portable, réduit nettement l'espace d'installation, et, puisque aucun ensemble ventilateur et dissipateur thermique n'est nécessaire, il évite le bruit provoqué par un ventilateur, réduit la demande d'électricité, et augmente la durée de veille et d'utilisation d'un ordinateur.
PCT/CN2017/000653 2017-04-19 2017-10-31 Système de refroidissement d'ordinateur portable basé sur un caloduc à boucle plate Ceased WO2018191834A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710258520.6 2017-04-19
CN201710258520.6A CN107145205A (zh) 2017-04-19 2017-04-19 基于平板环路热管的笔记本电脑散热系统

Publications (1)

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WO2018191834A1 true WO2018191834A1 (fr) 2018-10-25

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WO (1) WO2018191834A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107145205A (zh) * 2017-04-19 2017-09-08 北京空间飞行器总体设计部 基于平板环路热管的笔记本电脑散热系统
CN107643815A (zh) * 2017-11-10 2018-01-30 山东超越数控电子股份有限公司 一种无风扇笔记本散热系统
CN108415539A (zh) * 2018-05-02 2018-08-17 昆山莹帆精密五金有限公司 双联式自动循环冷却装置
CN108819114A (zh) * 2018-07-18 2018-11-16 太仓市众翔精密五金有限公司 一种生产带有散热结构笔记本电脑按键面板的模具
CN111351146A (zh) * 2020-03-23 2020-06-30 青岛海尔空调器有限总公司 散热器和空调室外机
CN115087295A (zh) * 2021-03-12 2022-09-20 北京小米移动软件有限公司 中框组件、中框组件的制造方法以及移动终端
CN113434030B (zh) * 2021-06-16 2023-03-21 华南理工大学 一种用于服务器cpu散热的环路热管散热器及使用方法
CN114415802B (zh) * 2021-11-23 2025-02-18 西安交通大学 一种采用内外两相散热循环耦合的笔记本散热系统及方法
CN115412649A (zh) * 2022-08-16 2022-11-29 常州大学 一种传真机用热管式散热系统
CN115826331A (zh) * 2022-12-22 2023-03-21 福州鑫图光电有限公司 一种基于环路热管散热的制冷相机

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CN101901036A (zh) * 2010-07-02 2010-12-01 华南理工大学 一种用于笔记本电脑的散热装置
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CN102472597A (zh) * 2009-07-13 2012-05-23 富士通株式会社 环型热导管及其起动方法
CN102208375A (zh) * 2011-04-11 2011-10-05 锘威科技(深圳)有限公司 一种循环散热装置、其制作方法及其组件
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