[go: up one dir, main page]

WO2018194545A1 - Boîtier destiné à des dispositifs électroniques - Google Patents

Boîtier destiné à des dispositifs électroniques Download PDF

Info

Publication number
WO2018194545A1
WO2018194545A1 PCT/US2017/027943 US2017027943W WO2018194545A1 WO 2018194545 A1 WO2018194545 A1 WO 2018194545A1 US 2017027943 W US2017027943 W US 2017027943W WO 2018194545 A1 WO2018194545 A1 WO 2018194545A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal body
base
supporting bracket
housing
electronic device
Prior art date
Application number
PCT/US2017/027943
Other languages
English (en)
Inventor
Kuo-Chih Huang
Chi-Hao Chang
Kuan-Ting Wu
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to PCT/US2017/027943 priority Critical patent/WO2018194545A1/fr
Publication of WO2018194545A1 publication Critical patent/WO2018194545A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • Electronic devices such as stylus, display devices, laptops and mobile phones include a housing, which also forms an exterior body of the electronic devices.
  • the housing is made of different substrates, such as metals, fibers, and composite materials and houses the various components of the electronic device.
  • the housing of the electronic device should be able to withstand wear and tear in course of its regular use.
  • the housing of the electronic device should also be able to withstand minor impacts, such as falls and crashes.
  • FIG. 1 illustrates a housing of an electronic device including a supporting bracket, according to an example implementation of the present subject matter
  • FIG. 2 illustrates integration of a supporting bracket with a metal body to form a housing of an electronic device, according to an example implementation of the present subject matter
  • FIG. 3 illustrates a supporting bracket for integration with a metal body to form a housing of an electronic device, according to an example implementation of the present subject matter
  • FIG.4 illustrates a cross-section view of the housing for an electronic device, according to an example implementation of the present subject matter
  • FIG. 5 illustrates an electronic device comprising a housing, according to an example implementation of the present subject matter.
  • Fig 6 illustrates a method of fabricating a housing for an electronic device, according to an example implementation of the present subject matter.
  • housings of electronic devices accommodate various components, such as motherboards, cameras, displays, antennas, and input/output (I/O) units. With the electronic devices becoming smaller and lighter, the housings are also acting as an outer body of the electronic devices.
  • metal bodies are generally used as substrates of the housings.
  • housings made of light metals, such as aluminum do not provide sufficient protection to components of the electronic devices. Therefore, to provide further support to the housings of electronic devices, support structures, such as reinforcing strips are used.
  • the support structures are generally made of materials such as plastics, and are generally coupled to the housing by thermal bonding. Such thermally bonded materials are neither stable, nor do they provide sufficient support to the housing to withstand prolonged wear and tear.
  • the described techniques provide support to the metaJ body of the housing to allow the housing to withstand wear and tear, and provide protection to the components of the electronic device. Therefore, the housings fabricated based on the described techniques can enhance robustness of the electronic device.
  • a housing of an electronic device includes a metal body having a base, along with multiple edges and walls extending from such edges. Further, the metal body is coupled to a supporting bracket to offer structural support to the metal body of the housing.
  • the supporting bracket includes two or more bends, such that while providing strength to a base of the metal body, the supporting bracket also provides structural support to walls of the metal body.
  • the supporting bracket conforms to the shape of at least two edges of the base, and is laser welded to the metal body of the housing. Further, the supporting bracket also abuts at least one of, the base and a wail of the metal body, to provide structural support to the metal body. In another example, the bends of the supporting bracket may also conform to the shape of one or more walls of the metal body.
  • the supporting bracket may be a metal or a metal a Boy such that the laser welding between the supporting bracket and the metal body provides a strong adhesion and a resilient joint.
  • the laser welding of the supporting bracket to the metal body provides structural strength to the housing, and also reduces the stacking size of the housing of electronic devices. Further, the laser welded supporting bracket provides protection to the metal body of the housing against deformation and regular wear and tears.
  • the present subject matter further describes example techniques for fabrication a housing for a smartphone.
  • the housing of the smartphone may include a metal body with a rectangular base with walls extending from each edge of the rectangular base.
  • a rectangular supporting bracket may be used.
  • the rectangular supporting bracket may have two bends at about 90 degrees to form a 'C shaped supporting bracket.
  • the 'C shaped supporting bracket may be laser welded to the base of the metal body, such that the supporting bracket abuts the walls of the metal body.
  • the laser welded 'C shaped supporting bracket provides structural support to the metal body, and therefore, provide a rugged housing for the smartphone.
  • the supporting bracket used for providing support to the metal body may be of different shapes and sizes, depending on the geometry of the metal body. Further, it would also be noted that multiple supporting brackets may be included in a housing, laser welded to the metal body, to provide structural support to the base and walls of the metal body.
  • Fig. 1 Illustrates a housing 100 of an electronic device including a supporting bracket according to an example implementation of the present subject matter.
  • the housing 100 may include a metal body comprising of a base 102 and walla 104 extending from the edges of the base 102. Further, the metal body may include two supporting brackets 106*1 and 106-2, laser welded to the base 102.
  • the supporting brackets 106-1 and 106-2 have been coBectrvely referred to as supporting brackets 106, hereinafter.
  • the base 102 is made of a light metal, such as magnesium, aluminium, steel, or an alloy thereof. Further, thickness of the base 102 of the metal body may be about 0.5 to 1 millimetre (mm).
  • the base 102 has been depicted to be rectangular, the shape of the base 102 may vary, depending upon the shape of the housing 100.
  • the base 102 may be hexagonal with 6 edges and corresponding 6 walls 104 extending each edge.
  • the base 102 may be a quadrilateral including a square, rectangle, etc., to have 4 edges and corresponding 4 walls 104, each wall extending from each edge of the base 102.
  • the base 102 may include multiple edges, and the shape of the edge may vary depending upon the shape of the housing 100.
  • the walls 104 extending from the edges of the base 102 may also be made of a light metal, such as magnesium, aluminium, steel, or an alloy thereof. Furthermore, the height and width of the walls 104 may vary depending upon an electronic device requisite, and the structural strength to be provided to the housing 100. In an example implementation, if the base 102 is octagonal in shape, 8 walls 104 may extend from the edges of the octagonal base 102.
  • the walls 104 may extend from some of the edges of the base 102, while some of the edges of the base 102 may not include any walls.
  • an electronic device having a curved display, curved towards one edge of the electronic device may include a housing with walls 104 extending from all edges, but from the edge towards which the display of the electronic device is curved.
  • the base 102 may include no wall on one such edge while all the other edges may extend walls 104.
  • the supporting brackets 106 may include at least two bends, such that they conform to at least three edges of the base 102, or may conform to the shape of one or more walls of the metal body.
  • a supporting bracket with two bends at about 90 degrees, forming a ' ⁇ ' shaped bracket may be utilized.
  • a supporting bracket with three bends at about 90 degrees, forming a ' ' shaped bracket may be utilized. It would be noted that if the base 102 includes multiple edges, one or more supporting brackets 106 may be utilized to provide support to the base 102 and the walls 104.
  • the base 102 includes 8 edges, two or more supporting brackets 106 may be utilized to provide support to the base 102 and the walls 104. Further, the supporting brackets 106 may include two or more bends to provide support to multiple walls 104 of the housing 100. In an example implementation of the present subject matter, the thickness of the supporting bracket is about 0.3 to 0.5 mm. Therefore, various geometries of the metal body and that of the supporting brackets 106 may be utilized to form the housing 100.
  • the supporting brackets 106 are laser welded to the metal body.
  • the laser welding may provide strong adhesion between the metal body and the supporting brackets 106.
  • the supporting brackets 106 are laser welded with the base 102 of the metal body at different welding points, such as 108-1. 08-2, 108-N.
  • the welding points such as 108-1, 08-2, .... 108-N have been commonly referred to as welding points 108, hereinafter.
  • the supporting brackets 106 may be laser welded to the walls 104 of the metal body, instead of the base 102. to provide support to the walls 104.
  • the supporting brackets 106 may be laser welded to both the walls 104 as well as the base 102 of the metal body. Therefore, it would be noted that the supporting brackets 106 are laser welded to the metal body to provide support to the base 102 and the walls 104, and the welding points 108 may either be included at the base 102, or at the wails 104, or both.
  • Rg. 2 illustrates integration of a supporting bracket with a metal body to form the housing 100 of an electronic device, according to an example implementation of the present subject matter.
  • Two supporting brackets 106 each including two bends at about 90 degrees is formed to fit within a metal body having the base 102 and the walls 104.
  • the bends of the supporting brackets 106 are such that the supporting brackets 106 conform to at least three edges of the base 102, or to the shape of one or more wails of the metal body, in an example implementation of the present subject matter, the supporting brackets 106 are placed inside the metal body such that the supporting brackets 106 abut the base 102 and the walls 104.
  • each of the supporting brackets 106 is laser welded to form the housing 100.
  • the laser welding is done at the welding points 108.
  • the welding points 108 may either be located at the base 102 of the metal body, or may also be located at the walls 104. In another implementation of the present subject matter, some welding points 108 are located at the base 102, while other welding points 108 are located at the walls 104.
  • Such a laser welding between the supporting brackets 106 and the metal body may aHow string adhesion between the supporting brackets 106 and the metal body, thereby providing structural support the base 102 and walls 104, and providing a sturdy housing 100.
  • Fig.3 illustrates a supporting bracket for integration with a metal body to form the housing 100 of an electronic device, according to an example implementation of the present subject matter.
  • supporting brackets 106 of different shapes and sizes may be utilized to provide support to the base 102 and walls 104 of the metal body, and form the housing 100.
  • the supporting brackets 106 may have different cross-sections, such as a 'C shaped cross-section, an T shaped cross-section, an inverted T shaped cross-section, a V shaped cross- section, a ' ⁇ ' shaped cross-section, a ⁇ ' shaped cross-section, and aV shaped cross-section.
  • the supporting brackets 106 may include a groove, to provide a 'C shaped cross- section to the supporting brackets 106.
  • Cross-sectional view 302. of one of the supporting brackets 106 depicts such a groove, and a corresponding 'C shaped cross-section of the supporting bracket 106-1.
  • the supporting bracket 106-1 includes two bends, it forms a C shaped supporting bracket 106-1.
  • the C shaped supporting bracket 106-1 includes a groove such that it has a 'C shaped cross-section.
  • a 'C shaped bracket having different cross-sections, such as T and T, and 'U' may be utilized to provide support to the base 102 and the walls 104 of the metal body.
  • either a single supporting bracket or more than two supporting brackets may also be utilized to provide support to the metal body.
  • 4 supporting brackets may be utilized in case of an octagonal base 102 of the metal body.
  • a lower overhang of the supporting bracket may be longer than an upper overhang of the supporting bracket, as shown in view 302. Such an arrangement may be provided to allow laser welding between the supporting bracket and the base 102.
  • the upper overhang and the lower overhang of the supporting bracket may be of similar lengths.
  • the supporting bracket may include a single overhang, i.e.. the lower overhang. It would be noted that in such an implementation, the supporting bracket may have a 'L' shaped cross-section.
  • Fig. 4 illustrates a cross-section view of the housing 100, for an electronic device, according to an example implementation of the present subject matter.
  • the supporting brackets 106 are laser welded with the base 102 of the metal body, and abut the walls 104.
  • the metal body is made of a light metal substrate 402, anodized to form an anodized layer 404 over the metal body.
  • the anodized layer 404 may provide corrosion-resistance to the metal body and increasing durability of the meta body.
  • the substrate 402 may be forged, or stamped to form the base 102 and the walls 104.
  • the supporting brackets 106 may be laser welded to the base 102 of the metal body at the welding points 106.
  • the supporting brackets 106 may include a chamfered edge to provide stability to the supporting brackets 106.
  • each supporting bracket may be stamped to form the bends and the grooves.
  • the bends in the supporting brackets 106 may conform to the edges of the base 102 and the grooves of the supporting brackets 106 may correspond to the cross- section of the supporting brackets 106.
  • Fig.5 illustrates an electronic device 502 comprising the housing 100, according to an example implementation of the present subject matter.
  • the electronic device 502 may include, but are not limited to, servers, workstations, aR-in-one computers, laptops, smartphones, personal digital assistants (PDAs), tablets and other handheld portable devices.
  • PDAs personal digital assistants
  • the electronic device 502 may include the housing 100 comprising of a metal body which includes the base 102 and the walls 104 extending from the edges of the base 102. Further, the housing 100 may include one or more supporting brackets, such as the supporting brackets 106-1 and 106-2. The supporting brackets may be laser welded to the metal body of the housing 100 to provide strong adhesion between the supporting brackets and the metal body.
  • the supporting brackets may include two or more bends which conform to shape of at least one wall of the metal body to provide support to the at least one wall of the metal body.
  • the housing of the electronic device 502 may form the outer body of the electronic device 502. In another example, an outer body may be provided over the housing 100 of the electronic device 502.
  • Fig. 6 illustrates a method 600 of fabricating a housing for an electronic device, according to an example implementation of the present subject matter. While the method 600 is described in context of fabrication of the housing 100 for devices, die method may be utilized for fabrication of other housings for electronic devices.
  • a metal body of a housing of an electronic device is anodized to form an oxide layer over the metal body.
  • the anodized metal body may include a base and walls extending from edges of the base.
  • the metal body is surface cleaned for anodizing.
  • the anodized metal body may also be forged, or stamped to form the base and the walls.
  • the metal body is made of a light metal or their alloys, such as magnesium, aluminium, and steel. Further, the thickness and height of the waBs, extending from the edges of the base, may depend on the electronic device and its design.
  • a supporting bracket is laser welded to the metal body to provide support to the metal body of the housing.
  • the supporting bracket supporting bracket confirms to edges of the base and abuts a wall of the metal body.
  • the supporting bracket is laser welded to the base of the metal body.
  • the supporting bracket is laser welded to the walls of the metal body.
  • the supporting bracket may be made of a light metal or alloys thereof, such as magnesium, aluminium, and steel.
  • the supporting bracket may have a cross-section that is L' shaped, T shaped, T shaped, 'U * shaped, ⁇ ' shaped, and 'Z shaped.
  • the different cross-sections of the supporting brackets may provide requisite support to the metal body to provide a rugged and sturdy housing 100.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

La présente invention concerne des boîtiers destinés à des dispositifs électroniques. Selon un mode de réalisation donné à titre d'exemple, la présente invention concerne des techniques de fabrication de tels boîtiers. Dans un exemple, un boîtier comprend un corps métallique permettant de recevoir des composants du dispositif électronique, le corps métallique comprenant une base et des parois prenant naissance aux bords de la base. Le boîtier comprend en outre une console de support, soudée par laser au corps métallique, comprenant une pluralité de courbures destinées à assurer un support structural au corps métallique. Dans un exemple, la console de support s'adapte à la forme des bords de la base.
PCT/US2017/027943 2017-04-17 2017-04-17 Boîtier destiné à des dispositifs électroniques WO2018194545A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2017/027943 WO2018194545A1 (fr) 2017-04-17 2017-04-17 Boîtier destiné à des dispositifs électroniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2017/027943 WO2018194545A1 (fr) 2017-04-17 2017-04-17 Boîtier destiné à des dispositifs électroniques

Publications (1)

Publication Number Publication Date
WO2018194545A1 true WO2018194545A1 (fr) 2018-10-25

Family

ID=63856774

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2017/027943 WO2018194545A1 (fr) 2017-04-17 2017-04-17 Boîtier destiné à des dispositifs électroniques

Country Status (1)

Country Link
WO (1) WO2018194545A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130077221A1 (en) * 2011-09-27 2013-03-28 Z124 L bracket for handheld device activators
US20140268598A1 (en) * 2013-03-15 2014-09-18 Apple Inc. Electronic Device Having Connector With Integrated Shielding
EP2176049B1 (fr) * 2007-07-13 2016-09-21 Apple Inc. Procédé pour former un logement et dispostif comprenant logement
US20160302319A1 (en) * 2015-04-10 2016-10-13 Apple Inc. Methods for electrically isolating areas of a metal body

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2176049B1 (fr) * 2007-07-13 2016-09-21 Apple Inc. Procédé pour former un logement et dispostif comprenant logement
US20130077221A1 (en) * 2011-09-27 2013-03-28 Z124 L bracket for handheld device activators
US20140268598A1 (en) * 2013-03-15 2014-09-18 Apple Inc. Electronic Device Having Connector With Integrated Shielding
US20160302319A1 (en) * 2015-04-10 2016-10-13 Apple Inc. Methods for electrically isolating areas of a metal body

Similar Documents

Publication Publication Date Title
CN102291954B (zh) 复合壳体结构
US8982544B2 (en) Housing and electronic device
TW201345360A (zh) 電子裝置及其殼體
CN108067839A (zh) 弯曲加工构件及其制造方法
US8456812B2 (en) Electronic device housing and manufacturing method thereof
US20120305356A1 (en) Seismic isolation device
WO2019052125A1 (fr) Panneau de commande tactile, appareil d'affichage à commande tactile et procédé de fabrication associé
US11538369B2 (en) Support plate, display module, and electronic device
US20200355445A1 (en) Vapor chamber
WO2018194545A1 (fr) Boîtier destiné à des dispositifs électroniques
JP2014001535A (ja) 外壁板取付金具
JP5715095B2 (ja) 電子機器用筐体及び電子機器
US20120097687A1 (en) Housing and method for making the same
US20130084431A1 (en) Bonding structure
TWI445482B (zh) 電子裝置
CN104349651A (zh) 手持通讯装置及其薄型化散热结构
JP6940804B2 (ja) 蒸着パターン形成方法、蒸着パターン形成装置、フレーム付き蒸着マスク、およびフレーム
CN103140086A (zh) 电子装置壳体及其制造方法
CN202425223U (zh) 电子组件安装盒
TWI459885B (zh) 電子裝置及其殼體之製造方法
CN201078881Y (zh) 防勾多段式弹片
CN107097027A (zh) 一种汽车操纵杆加工夹具
US20140020879A1 (en) Heat sink
US20110255261A1 (en) Frame For Retaining A Display Screen
TWI459882B (zh) 電子裝置殼體

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17906363

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17906363

Country of ref document: EP

Kind code of ref document: A1