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WO2018123189A1 - Dispositif imageur à rayonnement, procédé de fabrication d'un dispositif imageur à rayonnement, et système imageur - Google Patents

Dispositif imageur à rayonnement, procédé de fabrication d'un dispositif imageur à rayonnement, et système imageur Download PDF

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Publication number
WO2018123189A1
WO2018123189A1 PCT/JP2017/036226 JP2017036226W WO2018123189A1 WO 2018123189 A1 WO2018123189 A1 WO 2018123189A1 JP 2017036226 W JP2017036226 W JP 2017036226W WO 2018123189 A1 WO2018123189 A1 WO 2018123189A1
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WO
WIPO (PCT)
Prior art keywords
radiation imaging
panel
substrate
wiring
radiation
Prior art date
Application number
PCT/JP2017/036226
Other languages
English (en)
Japanese (ja)
Inventor
知貴 小松
尚志郎 猿田
石井　孝昌
知昭 市村
智之 大池
Original Assignee
キヤノン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キヤノン株式会社 filed Critical キヤノン株式会社
Publication of WO2018123189A1 publication Critical patent/WO2018123189A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T7/00—Details of radiation-measuring instruments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass

Definitions

  • the present invention relates to a radiation imaging apparatus, a manufacturing method thereof, and an imaging system.
  • Some radiation imaging apparatuses enable processing to acquire two image data for the same subject and form one radiation image based on the difference between them. Specifically, two image data are acquired under different radiation doses, and a desired target region is observed by taking a difference between them using a predetermined coefficient, or an observation target is changed by changing the coefficient. Can be changed (eg from an organ to a bone). Such image processing is called energy subtraction processing or the like.
  • each sensor panel is connected and fixed with a wiring portion (for example, COF) for reading out image data in the end region.
  • This fixing is realized by, for example, bonding by pressure bonding or the like, and can be performed using a predetermined jig.
  • Patent Document 1 when the wiring part is fixed to one sensor panel, interference occurs between the jig used for the fixing and the other sensor panel, and the fixing is appropriately performed. May be difficult. Further, when the wiring part is peeled off in one sensor panel, the same problem may occur when the wiring part is re-fixed.
  • An object of the present invention is to provide a technique advantageous in appropriately realizing the connection of the wiring portions in a radiation imaging apparatus including two sensor panels.
  • One aspect of the present invention relates to a radiation imaging apparatus, which includes a first panel having a first radiation imaging unit disposed on a first substrate, and a second radiation imaging unit disposed on a second substrate.
  • the first panel and the second panel have both a region overlapping each other and a region not overlapping each other in plan view with respect to the upper surface of the first substrate, and At least a part of the first radiation imaging unit and at least a part of the second radiation imaging unit are arranged so as to be located in the overlapping region in the plan view, and the first panel is in the plan view.
  • a first connection part configured to connect a first wiring part for reading a signal from the first radiation imaging part in a region not overlapping with the second panel; In plan view In a region not overlapping with the first panel Te, and having a second connection configured to connect the second wiring portion for reading a signal from the second radiation image pickup unit.
  • FIG. 1A is a perspective view showing a structure of a radiation imaging apparatus 1R as a reference example.
  • the radiation imaging apparatus 1R includes two sensor panels 11 and 12 arranged in parallel to each other.
  • the sensor panel 11 is one of the upper sides of the two sensor panels 11 and 12 in this reference example.
  • the sensor panel 11 includes a substrate 110 and a radiation imaging unit 111.
  • the substrate 110 a glass substrate is used in this reference example, but as another example, a plastic substrate may be used, and the substrate 110 may be made of a known insulating material.
  • the substrate 110 (or the sensor panel 11) has a rectangular shape in plan view.
  • plane view refers to a plan view with respect to the upper surface (or a plane parallel thereto) of the substrate 110 and may be expressed as an orthogonal projection in a direction perpendicular to the upper surface.
  • the radiation imaging unit 111 is provided on the substrate 110 using amorphous silicon or the like.
  • the radiation imaging unit 111 includes a plurality of radiation detection elements arranged in a matrix (so as to form a plurality of rows and a plurality of columns) on the substrate 110.
  • the sensor panel 11 is a panel that performs radiation imaging using an indirect conversion method (a method of detecting radiation by converting radiation into light and converting the light into an electrical signal).
  • a PIN sensor is used for each radiation detection element, but as another example, a known photoelectric conversion element such as a MIS sensor may be used.
  • the sensor panel 11 may be configured by disposing one or more CCD / CMOS image sensor chips on a support substrate.
  • each radiation detection element is connected to one or more thin film transistors for reading out the electric signal to form a single pixel
  • the radiation imaging unit 111 can also be expressed as a pixel array.
  • the radiation imaging unit 111 may be expressed as a sensor array.
  • a plurality of wiring portions 141 are connected to the end portion of the substrate 110.
  • COF Chip On Film (Flexible)
  • FPC Flexible Print Circuit
  • TAB Tunnel Automated Bonding
  • the other sensor panel 12 is one of the lower sides of the two sensor panels 11 and 12 in this reference example, and the sensor panel 12 has the same configuration as the sensor panel 11 described above.
  • the sensor panel 12 includes a substrate 120 corresponding to the substrate 110 and a radiation imaging unit 121 corresponding to the radiation imaging unit 111. Although details will be described later, like the sensor panel 11, a plurality of wiring portions 142 are connected to the end portion of the substrate 120.
  • each of the radiation detection elements of the radiation edge imaging unit 111 and each of the radiation detection elements of the radiation edge imaging unit 121 overlap each other.
  • the radiation imaging apparatus 1R includes a drive unit (vertical scanning circuit or the like) for driving each radiation detection element, and a readout unit (reading unit) for reading out an electrical signal from each radiation detection element.
  • These drive unit and readout unit are arranged outside the sensor panel 11 via the wiring unit 141 (at other positions not on the substrate 110).
  • COF is used for the wiring portion 141. Therefore, one or both of the driving unit and the reading unit are arranged on the wiring units 141 and 142, respectively, or part or all of the functions can be realized on the wiring units 141 and 142.
  • the driving unit and the reading unit may be provided along two adjacent sides on the substrate 110 (two sides forming an angle between them). The same applies to the sensor panel 12.
  • the radiation imaging apparatus 1R further includes a filter 13 disposed between the sensor panel 11 and the sensor panel 12.
  • the filter 13 is a plate or thin film that absorbs part of the energy of the radiation irradiated to the device 1R.
  • a material using lanthanoid specifically, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, etc.
  • a lanthanoid compound may be used, or a resin to which lanthanoid and / or particles of the compound are added may be used.
  • Radiation is irradiated from above in FIG. 1A. That is, an unillustrated subject (subject) is placed or lying on the sensor panel 11 side, and radiation that has passed through (passed through) the subject first enters the sensor panel 11 and is detected. Thereafter, the radiation transmitted through the sensor panel 11 and the filter 13 enters the sensor panel 12 and is detected.
  • the sensor panels 11 and 12 can acquire two pieces of image data at a time by one radiation imaging.
  • the radiation dose (intensity) incident on the sensor panel 12 is smaller than the radiation dose incident on the sensor panel 11 because a part of the radiation energy is absorbed by the filter 13. Therefore, the image data obtained from the sensor panel 11 and the image data obtained from the sensor panel 12 both show image information about the same subject, but there is a difference in data value (signal value) between them. Arise. And it becomes possible to perform an energy subtraction process using these two image data. Specifically, the region to be inspected can be observed by performing arithmetic processing on these two image data using a predetermined coefficient, and the observation object can be changed to another region by changing this coefficient. It can also be changed.
  • FIG. 1B is a top view of the radiation imaging apparatus 1R.
  • the wiring part 141 and the wiring part 142 are arranged so as not to overlap each other in plan view.
  • the outer edge of the substrate 110 (or the outer edge of the sensor panel 11) and the outer edge of the substrate 120 (or the outer edge of the sensor panel 12) substantially overlap each other.
  • the plurality of wiring portions 141 are arranged along two adjacent sides of the substrate 110 in plan view.
  • the plurality of wiring portions 142 are arranged along two sides that are adjacent to each other on the substrate 120 and do not overlap with the two sides of the substrate 110 on which the plurality of wiring portions 141 are arranged in plan view. Is done.
  • each wiring part 141 has a portion that is inside the outer edge of the substrate 120 in a plan view
  • each wiring part 142 has a portion that is inside the outer edge of the substrate 110. That is, a part of each wiring part 141 arranged at the end of the substrate 110 overlaps with the substrate 120, and a part of each wiring part 142 arranged at the end of the substrate 120 overlaps with the substrate 110. In the drawing, a portion of each wiring part 142 overlapping the substrate 110 is indicated by a broken line.
  • the sensor panels 11 and 12 may each have a front-side irradiation type configuration or a back-side irradiation type configuration.
  • 2A to 2C show sectional views taken along line XX in FIG. 1B as first to third examples of reference examples.
  • the sensor panels 11 and 12 both have a surface irradiation type configuration.
  • the sensor panel 11 includes a protective film 112 disposed on the substrate 110 so as to cover the radiation imaging unit 111, a scintillator 113 disposed on the protective film 112, and the protective film 112 and the scintillator 113.
  • a protective film 114 is further included.
  • the sensor panel 12 includes a protective film 122 disposed on the substrate 120 so as to cover the radiation imaging unit 121, a scintillator 123 disposed on the protective film 122, and a protective film covering the protective film 122 and the scintillator 123. 124.
  • the scintillator 113 is positioned on the radiation incident side with respect to the substrate 110 and the radiation imaging unit 111, and the scintillator 123 is positioned on the radiation incident side with respect to the substrate 120 and the radiation imaging unit 121.
  • Each is arranged so as to be located. That is, the sensor panels 11 and 12 are arranged such that the substrate 110 and the scintillator 123 are positioned between the scintillator 113 and the substrate 120.
  • the filter 13 is disposed between the substrate 110 and the protective film 124, and couples (fixes) the sensor panels 11 and 12 to each other via an adhesive (not shown) (for example, an acrylic adhesive resin).
  • the radiation transmitted through the subject is converted into light by the scintillator 113, and this light is detected by the radiation imaging unit 111, thereby obtaining image data.
  • the radiation that has passed through the sensor panel 11 and the filter 13 is converted into light by the scintillator 123, and this light is detected by the radiation imaging unit 121, thereby obtaining image data.
  • a phosphor material that generates light upon receiving radiation is used.
  • CsI Tl (thallium-added cesium iodide) or the like is used as the material of the scintillators 113 and 123.
  • the scintillators 113 and 123 are formed using a vacuum deposition apparatus (conditions: pressure of about 10 ⁇ 5 [Pa], temperature of about 180 [° C.]).
  • the protective films 112 and 122 are made of a material that is advantageous for protecting the upper surfaces of the sensor panels 11 and 12 and has light transmittance. Thereby, the light from the scintillators 113 and 123 passes through the protective films 112 and 122 and enters the radiation imaging units 111 and 121, respectively.
  • a silicone resin, a polyimide resin, a polyamide resin, an epoxy resin, a resin containing an organic substance such as paraxylylene or acrylic, or the like is used as a material for the protective films 112 and 122.
  • the protective films 114 and 124 are made of a material that is advantageous for preventing the deliquescence of the scintillators 113 and 123 and having light reflectivity. Thereby, the protective film 114 reflects the light generated in the scintillator 113 toward the radiation imaging unit 111, and the protective film 124 reflects the light generated in the scintillator 123 toward the radiation imaging unit 121.
  • a protective film 114 and 124 in which a resin film is bonded to a metal thin film such as Ag, Cu, Au, Al, or Ni is used.
  • the resin material include polyethylene terephthalate, polycarbonate, vinyl chloride, polyethylene naphthalate, polyimide, and acrylic.
  • the protective films 114 and 124 are respectively formed by laminating so as to cover the upper and side surfaces of the scintillators 113 and 123 (conditions: temperature of about 85 to 95 [° C.], pressure of 4 [hPa] or less). Further, the protective films 114 and 124 further include an adhesive layer.
  • an adhesive layer for example, polyimide, epoxy, polyolefin, polyester, polyurethane, and polyamide hot melt resins are used. With this adhesive layer, the protective films 114 and 124 are fixed by crimping at the ends.
  • the sensor panel 11 further includes a connecting portion 115 at the end of the substrate 110.
  • the wiring unit 141 is fixed at the connection unit 115 and configured to be able to exchange signals with the radiation imaging unit 111 or supply power to the radiation imaging unit 111.
  • the sensor panel 12 further includes a connection portion 125 at the end of the substrate 120, and the wiring portion 142 is fixed at the connection portion 125, and exchanges signals with the radiation imaging unit 121 or the radiation imaging unit 121. It is configured to be able to supply power.
  • the connection portions 115 and 125 are electrode pads here, but may be any one that realizes electrical contact with external wiring.
  • the sensor panel 12 has a surface irradiation type configuration (similar to the first example).
  • the sensor panel 11 has a backside illumination type configuration. Specifically, the sensor panel 11 is arranged such that the scintillator 113 is positioned on the opposite side of the radiation incident side with respect to the substrate 110 and the radiation imaging unit 111, that is, the sensor panel 11 is vertically moved as compared with the first example. Arranged in an inverted form. That is, the sensor panels 11 and 12 are arranged such that the scintillator 113 and the scintillator 123 are positioned between the substrate 110 and the substrate 120. In this case, the filter 13 is disposed between the protective film 114 and the protective film 124, and couples the sensor panels 11 and 12 to each other via an adhesive.
  • the sensor panel 11 has a surface irradiation type configuration (similar to the first example).
  • the sensor panel 12 has a back-illuminated configuration (similar to the sensor panel 11 of the second example).
  • the sensor panel 12 is arranged in an upside down manner compared to the first example. That is, the sensor panels 11 and 12 are arranged such that the substrate 110 and the substrate 120 are positioned between the scintillator 113 and the scintillator 123.
  • the filter 13 is disposed between the substrate 110 and the substrate 120, and couples the sensor panels 11 and 12 to each other via an adhesive.
  • the sensor panel 11 can obtain image data as in the first example.
  • the radiation transmitted through the sensor panel 11 and the filter 13 passes through the substrate 120 and the radiation imaging unit 121 and enters the scintillator 123, and is converted into light by the scintillator 123.
  • the light is reflected by the protective layer 124 toward the radiation imaging unit 121 and detected by the radiation imaging unit 121, thereby obtaining image data.
  • the fixing of the wiring part 141 to the connecting part 115 and the fixing of the wiring part 142 to the connecting part 125 are realized by, for example, bonding by pressure bonding (conditions: temperature about 180 [° C.], pressure About 3 [MPa]).
  • pressure bonding condition: temperature about 180 [° C.], pressure About 3 [MPa]
  • the crimping head 21 is pressed against the wiring part 141, and at that time, the substrate 110 (particularly, the part opposite to the connection part 115 to be fixed).
  • the backup member 22 Is preferably supported by the backup member 22.
  • the backup member 22 interferes with the sensor panel 12.
  • the crimping head 21 when the wiring part 142 is fixed to the connection part 125 by crimping, generally, the crimping head 21 is pressed against the wiring part 142, and at that time, the substrate 120 (in particular, the side opposite to the connection part 125 to be fixed). Is preferably supported by the backup member 22. However, in the first example, the crimping head 21 interferes with the sensor panel 11.
  • 3B to 3C correspond to the second to third examples, respectively, and a step of connecting and fixing the wiring part 141 to the connecting part 115 and manufacturing the wiring imaging unit 1R 2 to 1R 3 and the wiring part.
  • a state in which the step of connecting and fixing 142 to the connecting portion 125 is performed is shown in the same manner as FIG. 3A.
  • the crimping head 21 interferes with the sensor panel 12, and when the wiring part 142 is fixed to the connection part 125 by crimping.
  • the crimping head 21 interferes with the sensor panel 11.
  • the backup member 22 interferes with the sensor panel 12, and the wiring portion 142 is fixed to the connection portion 125 by pressure bonding. At this time, the backup member 22 interferes with the sensor panel 11.
  • any of the first to third examples there is a possibility that the crimping of the wiring portions 141 and 142 to the connection portions 115 and 125 cannot be properly realized (a sufficient pressure cannot be applied). there is a possibility.). This may cause peeling of the wiring portions 141 and / or 142.
  • FIG. 4A shows a state in the first example when peeling occurs in the wiring portions 141 and 142 and repair is necessary.
  • FIG. 4B shows a state in the second example when the wiring portions 141 and 142 are peeled off and repair is necessary.
  • the resins 31 and 32 are formed using the jig 30, and the connection portions 115 and 125 to which the wiring portions 141 and 142 are fixed are respectively connected to the resins 31 and 32.
  • the aspect which seals by is shown.
  • the resin 31 is formed so as to cover the wiring part 141 and the connection part 115
  • the resin 32 is formed so as to cover the wiring part 142 and the connection part 125.
  • the jig 30 may interfere with the sensor panel 11, and this may cause the sealing process to be difficult.
  • a radiation imaging apparatus (hereinafter referred to as a radiation imaging apparatus 1) that makes it possible to appropriately connect and fix the wiring parts 141 and 142 to the connection parts 115 and 125, respectively, with reference to some embodiments. )
  • a radiation imaging apparatus 1 that makes it possible to appropriately connect and fix the wiring parts 141 and 142 to the connection parts 115 and 125, respectively, with reference to some embodiments.
  • the description will be made focusing on differences from the above-described reference example, and the contents omitted here shall appropriately conform to the contents of the above-described reference example.
  • FIG. 6A is a perspective view showing a structure of a radiation imaging apparatus 1 according to the present embodiment (referred to as “apparatus 1 1 ” for distinction from other embodiments described later), and FIG. 6B is a radiation imaging apparatus.
  • 1 is a top view of one.
  • This embodiment is different from the reference example described above in that the sensor panels 11 and 12 are mainly arranged so as to have a relatively shifted positional relationship.
  • the sensor panels 11 and 12 both have a rectangular shape and are arranged so as to shift in a diagonal direction.
  • the diagonal direction is a direction from a certain corner in the rectangular shape toward the opposite corner.
  • an angle C1 formed by two adjacent sides of the substrate 110 on which the plurality of wiring portions 141 are arranged is the angle of the substrate 120 on which the plurality of wiring portions 142 are arranged. It is located diagonally with respect to the angle C2 formed by two adjacent sides.
  • the sensor panels 11 and 12 are arranged so as to be shifted by a predetermined distance in a direction in which the angles C1 and C2 are separated from each other. Thereby, each wiring part 141 does not overlap with the board
  • the radiation imaging unit 111 is provided in advance so as to be eccentric on the substrate 110, that is, is located away from two adjacent sides of the substrate 110 on which the plurality of wiring units 141 are arranged.
  • the radiation imaging unit 121 is provided in advance so as to be eccentric on the substrate 120, that is, is located away from two adjacent sides of the substrate 120 on which the plurality of wiring units 142 are arranged.
  • the radiation edge imaging units 111 and 121 each include a plurality of radiation detection elements arranged in a matrix.
  • Each of the radiation detection elements of the radiation edge imaging unit 111 overlaps with each of the radiation detection elements of the radiation edge imaging unit 121 in plan view.
  • each pixel value which comprises the image data obtained from the sensor panel 11 can be appropriately associated with each pixel value which constitutes the image data obtained from the sensor panel 12, and the radiation image is obtained by energy subtraction processing. Appropriate acquisition is possible.
  • the radiation imaging unit 111 may be disposed in the central part on the substrate 110 and the radiation imaging unit 121 may be disposed in the central part on the substrate 120. That is, the radiation imaging units 111 and 121 do not have to be eccentric on the substrates 110 and 120, respectively.
  • the sensor panels 11 and 12 have a part of the radiation imaging unit 111 (a plurality of radiation detection elements) and a part of the radiation imaging unit 121 (a plurality of radiation detection elements) overlap each other. In this way, they may be shifted in a diagonal direction.
  • the energy subtraction process may be performed using the portions corresponding to the overlapping portions of the radiation imaging units 111 and 121 of the two image data obtained from the sensor panels 11 and 12, respectively.
  • two sensor panels having a known structure can be used.
  • FIG. 7A shows a cross-sectional view taken along line XX in FIG. 6B.
  • the radiation imaging apparatus 1 1, the sensor panel 11 and 12 are both a configuration of a front-illuminated.
  • the present embodiment is mainly different in the following points. That is, the sensor panel 11 in plan view, has a region R1 overlapping the sensor panel 12, both of the regions R2 1 which does not overlap the sensor panel 12.
  • the sensor panel 12 is viewed in plan, it has an area R1 overlaps the sensor panel 11, both of the regions R2 2 not overlapping with the sensor panel 11.
  • the connection portion 115 is provided in the region R2 1 which does not overlap the substrate 120 of the substrate 110, also, the connecting portion 125 is provided in a region R2 2 that does not overlap the substrate 110 of the substrate 120.
  • the radiation imaging apparatus 1 1 can be obtained by the following procedure. First, after preparing the sensor panels 11 and 12, respectively, in plan view, they are arranged in parallel and coupled so that a region R1 where they overlap each other and R2 1 and R2 2 where they do not overlap each other are formed. To do. Here, the connection portion 115 is located in the region R2 1, the connecting portion 125 is positioned in the region R2 2. A filter 13 is disposed between the sensor panels 11 and 12, and couples the sensor panels 11 and 12 with an adhesive. Then, connect the wiring portion 141 in the region R2 1 to the connection portion 115, also connects the wire 142 in the region R2 2 to the connecting portion 125.
  • FIG. 7B shows a state in which the process of fixing the wiring part 141 to the connection part 115 by crimping and the process of fixing the wiring part 142 to the connection part 125 by crimping are performed for this embodiment.
  • the crimping fixed to the connection portion 115 of the wiring portion 141 since the case of the crimping fixed to the connection portion 115 of the wiring portion 141, connecting portion 115 in a region R2 1 which does not overlap with the sensor panel 12 of the sensor panel 11 is provided, the backup member 22 Interference with the sensor panel 12 can be prevented.
  • connection portion 125 of the wire 142 when performing the crimping fixed to the connection portion 125 of the wire 142, since the connecting portion 125 is provided in a region R2 2 which does not overlap with the sensor panel 11 of the sensor panel 12, the sensor panel 11 of the compression bonding head 21 Interference with can be prevented. Therefore, as shown in FIG. 7C, even if the wiring portions 141 and / or 142 are peeled off and repair is necessary, when the fixing is performed by the crimping using the crimping head 21 and the backup member 22. Can prevent the interference.
  • the wiring part 142 when the wiring part 142 is fixed to the connection part 125 by pressure bonding, the wiring part 142 is connected to the connection part 125 by the pressure bonding head 21 while supporting the portion of the substrate 120 opposite to the connection part 125 by the backup member 22. Press vertically against the top surface of 120.
  • connecting portions 125 are provided in the region R2 2, it is possible to prevent interference with the sensor panel 11 of the compression bonding head 21.
  • the connection part 125 to which the wiring part 142 is fixed is sealed with the resin 32, when the jig 30 is brought close to the connection part 125, interference with the sensor panel 11 of the jig 30 can be prevented.
  • the case of fixing by pressure bonding and sealing with resin is illustrated, but according to the configuration of the present embodiment, when any other fixing method is performed, the interference of the jig that realizes it is prevented. Is possible.
  • FIG. 8A is a cross-sectional view of the radiation imaging apparatus 1 2, shows similar Figure 7A.
  • the radiation imaging apparatus 1 2 the sensor panel 11 takes a configuration of a backside illuminated sensor panel 12 takes the configuration of a front-illuminated. That is, the present embodiment, the configuration of the second example described above (see FIG. 2B), the relative position of the sensor panel 11 and 12 as regions R1, R2 1 and R2 2 are formed is shifted It is in shape.
  • FIG. 8B shows a state in which the process of fixing the wiring part 141 to the connection part 115 by crimping and the process of fixing the wiring part 142 to the connection part 125 by crimping are respectively performed in this embodiment.
  • the crimping fixed to the connection portion 115 of the wiring portion 141 since the case of the crimping fixed to the connection portion 115 of the wiring portion 141, connecting portion 115 in a region R2 1 which does not overlap with the sensor panel 12 of the sensor panel 11 is provided, bonding head 21 Interference with the sensor panel 12 can be prevented.
  • connection portion 125 of the wire 142 since the connecting portion 125 is provided in a region R2 2 which does not overlap with the sensor panel 11 of the sensor panel 12, the sensor panel 11 of the compression bonding head 21 Interference with can be prevented. Therefore, as shown in FIG. 8C, even if the wiring portions 141 and / or 142 are peeled off and need to be repaired, when re-fixing by crimping using the crimping head 21 and the backup member 22, Can prevent the interference.
  • FIG. 8D shows a mode in which the resins 31 and 32 are formed using the jig 30, and the connection portions 115 and 125 to which the wiring portions 141 and 142 are fixed are sealed with the resins 31 and 32, respectively, as in FIG. 7D. Show. According to the present embodiment, it is possible to prevent the interference (see FIG. 5B) of the jig 30 described above.
  • FIG. 9A is a sectional view of a radiation imaging device 1 3 shows similarly Figure 7A.
  • the radiation imaging apparatus 1 3 the sensor panel 11 takes a configuration of a front-illuminated
  • the sensor panel 12 takes the configuration of a back-illuminated type. That is, the present embodiment, the configuration of the third example described above (see FIG. 2C), the relative position of the sensor panel 11 and 12 as regions R1, R2 1 and R2 2 are formed is shifted It is in shape.
  • connection portion 125 of the wire 142 when performing the crimping fixed to the connection portion 125 of the wire 142, since the connecting portion 125 is provided in a region R2 2 which does not overlap with the sensor panel 11 of the sensor panel 12, the sensor panel 11 of the backup member 22 Interference with can be prevented. Therefore, as shown in FIG. 9C, even when the wiring portions 141 and / or 142 are peeled off and repair is necessary, when the fixing is performed by the crimping using the crimping head 21 and the backup member 22, Can prevent the interference.
  • FIG. 9D shows a mode in which the resin 31 and 32 are formed using the jig 30, and the connection portions 115 and 125 to which the wiring portions 141 and 142 are fixed are sealed with the resins 31 and 32, respectively, as in FIG. 7D. Show.
  • the present embodiment there is a low possibility of the interference of the jig 30 described above. Therefore, after the above-described crimping has properly fixed the wiring part 141 and the like to the connection part 115 and the like, they are sealed, and the fixing is reinforced by the resins 31 and 32 so that the peeling does not occur. Is possible.
  • each sensor panel 11 and 12 has a configuration of an indirect conversion method.
  • the above contents can also be applied to the configuration of a direct conversion method (method of directly converting radiation into an electrical signal).
  • the configuration in which the wiring part 141 or 142 is disposed along two adjacent sides of the substrate 110 or 120 in plan view is shown.
  • the above contents can also be applied to a configuration in which the wiring portion 141 or 142 is disposed along two opposite sides, or a configuration in which the wiring portion 141 or 142 is disposed on only one side.
  • the wiring portions 141 and 142 are exemplified as having flexibility. However, the above contents can also be applied to the case where the wiring portions 141 and 142 are not flexible (for example, a rigid wiring board).
  • the radiation imaging apparatus described in the above embodiment can be applied to an imaging system for performing so-called X-ray imaging.
  • X-rays are typically used as radiation, but alpha rays, beta rays, and the like may be used.
  • X-rays 611 generated by the X-ray tube 610 (radiation source) pass through the chest 621 of the subject 620 (patient) and enter the radiation imaging apparatus 630.
  • the X-ray 611 incident on the device 630 includes information inside the patient 620, and the device 630 can obtain electrical information corresponding to the X-ray 611. This electrical information is converted into a digital signal, and then subjected to predetermined signal processing, for example, by an image processor 640 (signal processing unit).
  • a user can observe a radiographic image corresponding to this electrical information on, for example, a display 650 (display unit) in a control room.
  • the user can transfer the radiographic image or the data thereof to a remote place by a predetermined communication means 660, and can observe the radiographic image on the display 651 in another place such as a doctor room.
  • the user can record the radiographic image or the data thereof on a predetermined recording medium.
  • the user can record the radiation image or the data on the film 671 by the film processor 670.

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medical Informatics (AREA)
  • General Physics & Mathematics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • General Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Pathology (AREA)
  • Optics & Photonics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biophysics (AREA)
  • Measurement Of Radiation (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

Dans un dispositif imageur à rayonnement comportant deux panneaux de capteurs, la présente invention présente un attribut avantageux permettant la réalisation appropriée de connexion de ses parties de câblage. Le dispositif imageur à rayonnement selon la présente invention comporte un premier panneau pour lequel une première unité imageuse à rayonnement est agencée sur un premier substrat, et un deuxième panneau pour lequel une deuxième unité imageuse à rayonnement est agencée sur un deuxième substrat. Le premier panneau et le deuxième panneau sont agencés de sorte que, en vue planaire par rapport à la surface supérieure du premier substrat, il y a une zone de superposition mutuelle, et une zone de non-superposition mutuelle, et également de sorte qu'au moins une partie de la première unité imageuse à rayonnement et au moins une partie de la deuxième unité imageuse à rayonnement sont positionnées dans la zone de superposition en vue planaire. Le premier panneau a une première partie de connexion à laquelle est connectée une première partie de câblage pour la lecture de signaux de la première unité imageuse à rayonnement dans la zone ou il n'y a pas de superposition avec le deuxième panneau en vue planaire, et le deuxième panneau a une deuxième partie de connexion à laquelle est connectée une deuxième partie de câblage pour la lecture de signaux de la deuxième unité imageuse à rayonnement dans la zone où il n'y a pas de superposition avec le premier panneau en vue planaire.
PCT/JP2017/036226 2016-12-27 2017-10-05 Dispositif imageur à rayonnement, procédé de fabrication d'un dispositif imageur à rayonnement, et système imageur WO2018123189A1 (fr)

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JP2016254089A JP2018107343A (ja) 2016-12-27 2016-12-27 放射線撮像装置、その製造方法および撮像システム
JP2016-254089 2016-12-27

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