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WO2018123961A1 - Carte de circuit imprimé multicouche et procédé de fabrication de carte de circuit imprimé multicouche - Google Patents

Carte de circuit imprimé multicouche et procédé de fabrication de carte de circuit imprimé multicouche Download PDF

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Publication number
WO2018123961A1
WO2018123961A1 PCT/JP2017/046415 JP2017046415W WO2018123961A1 WO 2018123961 A1 WO2018123961 A1 WO 2018123961A1 JP 2017046415 W JP2017046415 W JP 2017046415W WO 2018123961 A1 WO2018123961 A1 WO 2018123961A1
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WO
WIPO (PCT)
Prior art keywords
sub
board
substrate
wiring board
multilayer wiring
Prior art date
Application number
PCT/JP2017/046415
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English (en)
Japanese (ja)
Inventor
一郎 小岩
Original Assignee
学校法人関東学院
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Publication date
Application filed by 学校法人関東学院 filed Critical 学校法人関東学院
Priority to JP2018559453A priority Critical patent/JPWO2018123961A1/ja
Publication of WO2018123961A1 publication Critical patent/WO2018123961A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • This application relates to a multilayer wiring board and a multilayer wiring board manufacturing method.
  • this multilayering technique provides a method for producing a multilayer printed wiring board that is excellent in wiring density and efficiency, and therefore, “(a) at least An adhesive layer is provided on the insulating material surface of the laminated board whose one side is an insulating material, and the adhesive layer is formed into a B stage, (b) a hole is formed, and (c) an adhesive layer is provided.
  • Patent Document 2 Japanese Patent Laid-Open No. 11-177237
  • the build-up is excellent in reducing the thickness, improving the connection reliability, and smoothing the substrate surface.
  • an inner layer circuit board 4 in which the inner layer circuit 2 and the inner layer circuit 2 on both sides thereof are electrically connected by the inner layer circuit 2 and the through hole 3, and an electrically insulating filler are uniformly distributed on the surface thereof.
  • the first thermocouple resin layer 6, the first circuit 7 formed on the surface of the thermoset resin layer 6, the inner layer circuit 2 and the first circuit 7 are electrically connected.
  • the environment surrounding Japan's printed wiring board industry in the world has become more severe, and the conventional multilayer printed wiring board manufacturing process has become unable to compete with products manufactured by emerging countries in terms of cost. Yes.
  • the IoT era it is necessary to mass-produce inexpensive sensor modules.
  • an innovative manufacturing method is required without sticking to the manufacturing process of the conventional multilayer printed wiring board. Therefore, the present application provides an unprecedented multilayer wiring board and a method capable of producing a high-quality multilayer wiring board at a low cost.
  • the multilayer wiring board according to the present application is a multilayer wiring board obtained by laminating the first sub-substrate to the N-th sub-substrate, and is adjacent to the circuit and the multilayer substrate from one end side to the other end side.
  • a first sub-board to an N-th sub-board (N: a positive integer greater than or equal to 2) provided with electronic-component housing openings when it is necessary to house an electronic component protruding from the surface, Using the tape-shaped resin film with mounted sub-boards connected by a resin film at intervals, from the first sub-board on the one end side of the tape-shaped resin film with mounted sub-board toward the N-th sub-board, The first sub-substrate to the N-th sub-substrate are stacked by folding the electronic components protruding from the adjacent sub-substrate surfaces in a state of being accommodated in the electronic component accommodation opening.
  • the multilayer wiring board according to the present application preferably adopts one of the following specific embodiments of “first multilayer wiring board 1A” and “second multilayer wiring board 1B”.
  • first multilayer wiring board 1A when the N-th sub-board is folded from the first sub-board on one end side of the mounted sub-board-attached tape-like resin film, the mounted sub-board-attached tape-like resin film is provided. Is preferably folded in an accordion shape from the first sub-board on the one end side to the N-th sub-board (hereinafter referred to as “first multilayer wiring board 1A”).
  • the mounted sub-board-attached tape-like resin film is provided. It is also preferable to fold and fold the first sub-board from the first sub-board toward the N-th sub-board (hereinafter referred to as “second multilayer wiring board 1B”).
  • the first sub-substrate to the N-th sub-substrate in a stacked state include an adhesive layer on at least one surface of the sub-substrate that is opposed when stacked.
  • connection terminal circuit portion that protrudes to the outside from the side surface of at least one sub-board in a state where the first to N-th sub-boards are stacked.
  • a resin layer and a resin film layer that can be electrically insulated are provided between the first to N-th sub-boards in the stacked state.
  • the manufacturing method of the multilayer wiring board according to the present application is roughly divided into two manufacturing methods (referred to as “a manufacturing method of the first multilayer wiring board 1A” and “a manufacturing method of the second multilayer wiring board 1B”). It is preferable to adopt.
  • a manufacturing method of a first multilayer wiring board 1A according to the present application is a manufacturing method of a multilayer wiring board obtained by laminating a first sub-substrate to an N-th sub-substrate, and includes the following steps: A process is provided.
  • Step for preparing sub-substrate-attached tape-like material From one end side to the other end side, provided with an electronic component receiving opening when it is necessary to store an electronic component projecting from the surface of the adjacent sub substrate at the time of multilayering
  • a tape-shaped resin film with a mounted sub-board is prepared by connecting the first to N-th sub-boards (N: a positive integer equal to or greater than 2) on which component mounting is performed with a resin film at a predetermined interval.
  • Multi-layering step An electronic component protruding from the surface of the adjacent sub-board toward the N-th sub-board from the first sub-board on the one end side of the mounted sub-board-attached tape-shaped resin film to the electronic component housing opening While being accommodated, it is folded into an accordion shape or wound into a roll shape to form a multilayer wiring board in which the first to Nth sub substrates are laminated in layers.
  • the method for manufacturing a multilayer wiring board classified as manufacturing method 2 according to the present application is a method for manufacturing a multilayer wiring board obtained by stacking first to Nth sub-boards. The following steps are provided.
  • Step for preparing sub-substrate-attached tape-like material From one end side to the other end side, provided with an electronic component receiving opening when it is necessary to store an electronic component projecting from the surface of the adjacent sub substrate at the time of multilayering
  • a tape-shaped resin film with a mounted sub-board is prepared by connecting the first to N-th sub-boards (N: a positive integer equal to or greater than 2) on which component mounting is performed with a resin film at a predetermined interval.
  • Step of forming adhesive layer In the first sub-substrate to the N-th sub-substrate constituting the mounted sub-substrate-attached tape-shaped resin film, an adhesive layer is provided on at least one surface of the sub-substrate opposed to each other when stacked.
  • Multi-layering step An electronic component protruding from the surface of the adjacent sub-board toward the N-th sub-board from the first sub-board on the one end side of the mounted sub-board-attached tape-shaped resin film to the electronic component housing opening While being accommodated, it is folded into an accordion shape through the adhesive layer or rolled into a roll shape and heated to form a multilayer wiring board in which the first to Nth sub-substrates are laminated in layers.
  • connection terminal circuit connection step In the method for manufacturing a multilayer wiring board according to the present application described above, it is preferable to include the following connection terminal circuit connection step.
  • Connection terminal circuit connection process Connection terminals protruding outside from the side surfaces of a plurality of sub-substrates among the first to Nth sub-substrates in a state where they are folded into an accordion shape or rolled into a multilayer shape By electrically connecting predetermined circuits in the circuit section, signal output / input terminals, power supply terminals, ground terminals, interlayer continuity, etc. are obtained between desired substrates of the first sub-board to the N-th sub-board. .
  • the multilayer wiring board according to the present application is obtained by folding and laminating a tape-shaped resin film with a mounted sub-board including the first to Nth sub-boards, and thus obtained by a conventional method. Compared to a multilayer wiring board, it can be supplied as a very inexpensive product while maintaining the quality required for conventional products.
  • the manufacturing method of the multilayer wiring board according to the present application is very simplified, and the repeated lamination press, lamination heating, interlayer conductive plating, etc. used in the production of the conventional multilayer wiring board are not required. Therefore, the overwhelming manufacturing cost can be reduced.
  • the multilayer wiring board according to the present application is a multilayer wiring board obtained by laminating the first sub-substrate to the N-th sub-substrate, and the circuit and multilayer circuit are formed from one end side to the other end side.
  • a first sub-board to an N-th sub-board (N: 2 or more positive) provided with electronic-component housing openings when it is necessary to house electronic components protruding from the surface of the adjacent sub-board sometimes.
  • a tape-shaped resin film with a mounted sub-board which is an integer) connected with a resin film at a predetermined interval, from the first sub-board to the N-th sub at one end of the mounted tape-shaped resin film with a sub-board.
  • the first sub-substrate to the N-th sub-substrate are stacked by folding the electronic components protruding from the surface of the adjacent sub-substrate toward the substrate in a state of being accommodated in the electronic component accommodation opening.
  • the multilayer wiring board according to the present application is not particularly limited with respect to its folding method by using the above-described tape-shaped resin film with a sub-board mounted.
  • the first sub-board is folded in an accordion shape from the first sub-board to the N-th sub-board, or is wound into a roll shape and folded to form a multilayer wiring board (hereinafter referred to as “the first method” Multilayer wiring board 1A ", and the one obtained by the latter method is referred to as” second multilayer wiring board 1B ").
  • the first method Multilayer wiring board 1A
  • the second multilayer wiring board 1B This folding procedure will be described in detail in the following manufacturing method.
  • the first to N-th sub-boards in the stacked state include an adhesive layer on at least one surface of the sub-board that is opposed to the stacked sub-board. This is because the first sub-substrate to the N-th sub-substrate can be integrated as a laminated body and easy to handle while ensuring the interlayer insulating properties of the first to N-th sub-substrates. Since those skilled in the art can easily think of the adhesive layer here, the description of the adhesive layer in the drawings is omitted.
  • an insulating resin film is sandwiched between the first sub-substrate and the N-th sub-substrate at the time of lamination. There is no special limitation also about the insulating resin film at this time.
  • connection terminal circuit portion that protrudes to the outside from the side surface of at least one sub-board is provided in a state where the first sub-board to the N-th sub-board are stacked.
  • “from the side of at least one sub-board” is because a power supply circuit, a ground circuit, and a signal transmission circuit are considered to be necessary as a minimum circuit for the multilayer wiring board. Accordingly, it is of course possible to provide the connection terminal circuit portion on the side surfaces of two or more sub-boards of the first sub-board to the N-th sub-board.
  • FIG. 1 in the two types of mounted tape-like resin films 2a and 2b with sub-boards shown in FIG.
  • connection terminals are formed on the sides of one side of the first to fifth sub-boards Sb1 to Sb5.
  • the circuit portions 7a to 7e and the connection terminal circuit portions 7a 'to 7e' are provided on the side of the other side.
  • the connection terminal circuit portion By providing the connection terminal circuit portion in this way, the power supply circuit and the signal transmission circuit are arranged on the connection terminal circuit portion on one side after stacking, and the interlayer circuit is arranged on the connection terminal circuit portion on the other side. Can be electrically joined.
  • the multilayer wiring board according to the present application described above it is preferable to adopt a form provided with heat dissipation means.
  • heat dissipation means There is no particular limitation on how to provide the heat dissipation means. Therefore, it is possible to adopt a method of attaching a heat radiating fin, a heat sink or the like to the side surface after forming a multilayer wiring board. Also, an opening for forming a hole penetrating all layers when the multilayer wiring board is formed is provided in the first to Nth sub-boards constituting the multilayer wiring board, and a heat sink is disposed in the hole.
  • Various methods are conceivable.
  • the manufacturing method of the multilayer wiring board according to the present application is roughly classified into two manufacturing methods (referred to as “first multilayer wiring board manufacturing method” and “second multilayer wiring board manufacturing method”). It is preferable.
  • first multilayer wiring board manufacturing method and “second multilayer wiring board manufacturing method”.
  • second multilayer wiring board manufacturing method it is preferable.
  • each process is demonstrated for every manufacturing method.
  • the description which overlaps as much as possible is abbreviate
  • a manufacturing method of a first multilayer wiring board according to the present application is a manufacturing method of a multilayer wiring board obtained by laminating a first sub-substrate to an N-th sub-substrate, and includes the following steps It is characterized by providing.
  • Process for preparing mounted tape-like resin film with sub-substrate Substrate-attached tape-like material manufacturing method The method of manufacturing the sub-substrate-attached tape-like material employs two types of resin film tapes used for manufacturing. Is possible.
  • a long resin film tape 3 having a shape as shown in FIG. 2 is prepared first.
  • the resin film tape shown in FIG. 2 is displayed as having a region where a flap-shaped connection terminal circuit portion is provided in a direction perpendicular to the flow direction of the resin film tape.
  • the mounted tape-shaped resin film 2a with sub-board shown in FIG. 1 is used for manufacturing the first multilayer wiring board, and an example for obtaining this mounted tape-shaped resin film with sub-board 2a is shown.
  • first sub-substrate to fifth sub-substrate are formed at portions indicated by reference numerals Sb1 to Sb5 in FIG.
  • connection terminal circuit portions can be provided at the portions indicated by 7a ′ to 7e ′.
  • symbol C1, C2 is arbitrary, and can be used as a cover layer located in the outer layer after lamination
  • a simple long resin film tape 3 as shown in FIG. 3 is prepared.
  • the resin film tape shown in FIG. 3 does not include a region where the connection terminal circuit portion is provided in a direction perpendicular to the flow direction of the resin film tape. Therefore, as shown in FIG. 3, the first sub-substrate to the fifth sub-substrate are formed at the portions indicated by reference numerals Sb1 to Sb5, and the connection terminal circuit portion is provided at the portions indicated by reference numerals 7a to 7e and 7a 'to 7e'. 4, another substrate (sub-substrate portion forming substrate) to be provided is bonded as shown in FIG.
  • the circuit formed on the surface of another substrate at this time can be formed either before or after being attached to a simple long resin film tape 3.
  • the formation of the circuit 4 and the connection terminal circuit portions 7a to 7e and 7a 'to 7e' included in each sub-substrate shown in FIG. 1 will be described in detail.
  • the first sub is placed on the surface of the resin film constituting the other substrate at the portions indicated by reference numerals Sb1 to Sb5 in FIG.
  • Substrate to fifth sub-substrate can be formed, and the connection terminal circuit portion can be formed at the portions indicated by reference numerals 7a to 7e and 7a 'to 7e'.
  • a conductive metal foil such as copper foil or nickel foil is laminated to a resin film constituting another substrate, or a desired conductive metal layer is formed on the surface of the resin film by an electroless plating method or a physical vapor deposition method.
  • the circuit and the connection terminal circuit portion can be formed, and all known methods can be applied.
  • the circuit 4 and the connection terminal circuit portions 7a to 7e and 7a 'to 7e' can be directly formed on the surface of the resin film by using an additive method.
  • the circuit 4 and the connection terminal circuit portions 7a to 7e and 7a 'to 7e' included in each sub-board can be formed using a conductive paste by a known method.
  • the circuit 4 and the connection terminal circuit portions 7a to 7e and 7a 'to 7e' included in each sub-substrate are formed on the surface of the separate substrate, the separate substrate is bonded to the surface of the resin film tape 3.
  • resin film tape 3 and the substrate for forming the sub-board part all those usable as an insulating resin base material for a wiring board such as a polyimide resin, a polyimide amide resin, a polyethylene terephthalate resin, etc. can be used. There is no limitation. Moreover, these resin films can also use a composition containing a filler.
  • a circuit 4 and connection terminal circuit portions 7a to 7e and 7a 'to 7e' included in each sub-board shown in FIG. 1 are formed.
  • a conductive metal foil such as copper foil or nickel foil is laminated on the surface of the resin film tape 3, or a desired conductive metal layer is applied to the resin film tape 3 by electroless plating or physical vapor deposition. It can be formed on the surface or by etching the conductive metal foil or the conductive metal layer, and all known methods can be applied.
  • the circuit 4 and the connection terminal circuit portions 7a to 7e and 7a 'to 7e' can be directly formed on the surface of the resin film tape 3 by using an additive method.
  • an electrolytic plating method using a plating resist, a physical vapor deposition method using a mask, or the like can be used.
  • the circuit 4 and the connection terminal circuit portions 7a to 7e and 7a 'to 7e' included in each sub-board can be formed using a conductive paste by a known method.
  • component mounting for mounting the necessary electronic components 5 is performed.
  • This component mounting includes applying a solder resist to a necessary portion, disposing the electronic component 5 on the circuit 4 and performing solder reflow, and performing a bonding process, and a known method can be used.
  • the “electronic component receiving opening 6” required when there is an electronic component 5 protruding from the surface of the adjacent sub-board when stacked is an opening provided to the resin film tape 3, and is a mounting component. Is formed in the multilayer substrate by a physical process such as punching out or cutting out the resin film tape 3.
  • the electronic component housing opening 6 may be formed at the initial stage of the resin film tape 3, formed immediately after the metal foil is laminated or the conductive metal layer is formed, or after the circuit is formed. There is no particular limitation on the timing of formation. As described above, it is possible to manufacture the mounted tape-shaped resin film 2a with a sub-board. Moreover, it is clear that the tape-shaped resin film with sub-board 2b can be manufactured by the same method.
  • Adhesive layer forming step Further, at the stage of the tape-shaped resin film 2a with mounted sub-substrate shown in FIG. 1, at least one of the opposing sub-substrates at the time of stacking in the first to N-th sub-substrates when stacked. It is preferable to provide an adhesive layer on the surface. For this lamination, it is preferable to use an adhesive resin that does not become an electrical hindrance factor, a semi-cured thermosetting resin, or the like, applied in the form of a resin varnish, or in the form of a film.
  • the adhesive layer has a thickness that can integrate the first to Nth sub-substrates at the time of stacking to ensure the electrical insulation between the layers, from the viewpoint of securing the insulation between the layers. It should be noted that it is possible to provide adhesive layers on both surfaces of the first sub-substrate to the N-th sub-substrate, and it is more preferable depending on the type of multilayer wiring board to be manufactured.
  • Multilayering Step Using the tape-shaped resin film 2a with a sub board mounted as shown in FIG. 1, the outer cover C1 is directed toward the back surface of the first sub board Sb1 as shown in FIG. 5 (1-2) to FIG. 6 (1-4) are folded.
  • the portion where the outer layer cover C1 and the first sub-substrate Sb1 are stacked is folded according to the procedures of FIGS. 7 (1-5) to 8 (1-8), and the outer-layer cover C1, the first sub-substrate Sb1, and the first sub-substrate Sb1 are folded.
  • Two sub-substrates Sb2 are stacked.
  • an insulating resin film is sandwiched between the first sub-substrate Sb1 and the second sub-substrate Sb2, if necessary.
  • the portion where the outer layer cover C1, the first sub-substrate Sb1, and the second sub-substrate Sb2 are stacked is folded by the procedure shown in FIGS. 9 (1-9) to 10 (1-12), and the outer layer cover C1 and the second sub-substrate Sb2 are folded.
  • the first sub-substrate Sb1 to the third sub-substrate Sb3 are stacked.
  • the portion where the outer cover C1, the first sub-substrate Sb1, the second sub-substrate Sb2, and the third sub-substrate Sb3 are stacked is processed according to the procedure shown in FIGS. 11 (1-13) to 12 (1-16).
  • the outer cover C1 and the first sub-substrate Sb1 to the fourth sub-substrate Sb4 are stacked.
  • FIGS. 12 (1-17) to 13 the portion where the outer layer cover C1, the first sub-substrate Sb1, the second sub-substrate Sb2, the third sub-substrate Sb3 and the fourth sub-substrate Sb4 are stacked is shown in FIGS. 12 (1-17) to 13 (1- The outer cover C1 and the first sub-board Sb1 to the fifth sub-board Sb5 are stacked by folding in the step 21).
  • FIG. 14 To FIG. 14 (1-25), the first multilayer laminated board 1 A folded in an accordion shape by laminating the outer layer cover C 1, the first sub board Sb 1 to the fifth sub board Sb 5 and the outer layer cover C 2. To do.
  • the electronic component 5 when there is an electronic component 5 protruding from the surface of the adjacent sub-board at the time of stacking, the electronic component 5 is accommodated in the electronic component-receiving opening 6 provided on the sub-board.
  • connection terminal circuit connection process In this application, it is preferable to provide the following connection terminal circuit connection processes.
  • the connection terminal circuit portions 7a to 7e and 7a ′ to 7e ′ projecting outward from the side surface of the sub-board are provided as necessary.
  • the circuits provided in the connection terminal circuit portion include a signal output terminal and a power supply. It is used as a terminal, a ground terminal, an interlayer conduction circuit, and the like. Therefore, after the first multilayer laminated board 1A is laminated, predetermined circuits in the connection terminal circuit portion projecting outside from the side surfaces of the plurality of sub-substrates among the first to N-th sub-substrates are soldered. By electrically connecting by brazing, brazing, spot welding, etc., it is possible to ensure electrical continuity between the desired substrates of the first sub-board to the N-th sub-board, or to bundle the power circuits of each layer become.
  • Manufacturing method of second multilayer wiring board A manufacturing method of a second multilayer wiring board 1B according to the present application is a manufacturing method of a multilayer wiring board obtained by laminating a first sub-substrate to an N-th sub-substrate, A process is provided.
  • Step for preparing sub-substrate-attached tape-like material The mounted sub-substrate-attached tape-like resin film 2b shown in FIG. 1 is used for manufacturing the second multilayer wiring board.
  • the method of obtaining 2b is the same as the manufacturing method of the tape-shaped resin film with mounted sub-substrate 2a described above, and the manufacturing method is omitted in order to avoid redundant description.
  • the description will be made on the assumption that the tape-shaped resin film 2b with mounted sub-substrate shown in FIG. 1 is used.
  • the “electronic component receiving opening 6” is required after another substrate to be bonded to the resin film tape 3 is bonded.
  • it can be formed in the same manner as described above at any stage.
  • the tape-shaped resin film 2b with mounted sub-board can be manufactured. It is obvious that the tape-shaped resin film with sub-board 2a can be manufactured by the same method.
  • Adhesive layer forming step This adhesive layer forming step is the same as described above, and is omitted to avoid redundant description.
  • the first sub-substrate Sb1 is directed toward the back surface of the second sub-substrate Sb2, as shown in FIG. 15 (2-1).
  • the first sub-substrate Sb1 and the second sub-substrate Sb2 are stacked by folding them so as to be wound in a roll shape according to the procedure of FIGS. 15 (2-2) to 16 (2-4).
  • the portion where the first sub-substrate Sb1 and the second sub-substrate Sb2 are stacked is folded so as to be wound in a roll shape according to the procedure of FIGS. 17 (2-5) to 18 (2-8).
  • the substrate Sb1, the second sub-substrate Sb2, and the third sub-substrate Sb3 are stacked.
  • the portion where the first sub-substrate Sb1, the second sub-substrate Sb2, and the third sub-substrate Sb3 are stacked is wound in a roll shape according to the procedure of FIGS. 19 (2-9) to 20 (2-12). And the first sub-substrate Sb1 to the fourth sub-substrate Sb4 are stacked.
  • the portion where the first sub-substrate Sb1 to the fourth sub-substrate Sb4 are stacked is folded so as to be wound into a roll shape according to the procedure of FIGS. 21 (2-13) to 22 (2-16).
  • the substrate Sb1 to the fifth sub-substrate Sb5 are stacked.
  • the portion where the first sub-substrate Sb1 to the fifth sub-substrate Sb5 are stacked is folded so as to be rolled up in the procedure of FIGS. 23 (2-17) to 23 (2-20), and the outer layer cover C2 and The first sub-substrate Sb1 to the fifth sub-substrate Sb5 are stacked.
  • the portion where the outer layer cover C2 and the first sub-substrate Sb1 to the fifth sub-substrate Sb5 are stacked is folded so as to be rolled up in the procedure of FIGS. 24 (2-21) to 24 (2-24).
  • the outer cover C1, the first sub-substrate Sb1 to the fifth sub-substrate Sb5, and the outer-layer cover C2 are stacked, and the second multilayer laminate 1B is wound and rolled up.
  • the electronic component 5 when there is an electronic component 5 protruding from the surface of the adjacent sub-board at the time of stacking, the electronic component 5 is accommodated in the electronic component-receiving opening 6 provided on the sub-board.
  • connection terminal circuit connection step This connection terminal circuit connection step is the same as described above, and is omitted to avoid redundant description.
  • the first multilayer laminated board 1A and the second multilayer laminated board 1B completed as described above have environmental resistance performance from the viewpoint of preventing air oxidation and mixing of foreign substances by finally performing resin sealing. It becomes possible to dramatically improve.
  • the resin sealing material at this time is not particularly limited as long as it can be used in the field of electronic parts such as an epoxy resin, a silicon resin, and a ceramic material.
  • the overall volume as the wiring board can be made smaller than the conventional multilayer wiring board volume.
  • the multilayer wiring board according to the present application is provided with an electronic component accommodation opening in the case where it is necessary to accommodate an electronic component protruding from the surface of the adjacent sub-board at the time of multi-layering, so that the mounting component is accommodated inside the multilayer substrate.
  • a space (cavity) can be provided. Therefore, it is also possible to adopt a design that eliminates component protrusion from the outer surface of the substrate. As a result, it has become possible to reduce the total volume of the multilayer wiring board by 20% by volume or more.
  • the multilayer wiring board according to the present application is obtained by folding and laminating a tape-shaped resin film with a mounted sub-board provided with the first to Nth sub-boards.
  • conventional hot press molding and formation of interlayer conduction such as through-holes are not required, so that it can be supplied as a very inexpensive product while maintaining the quality required for the conventional product.
  • the method for manufacturing a multilayer wiring board according to the present application has been greatly simplified, and does not require repeated lamination pressing, lamination heating, interlayer conduction plating processing, etc. used in the production of conventional multilayer wiring boards. At the same time, since all the conventional manufacturing techniques can be used, the manufacturing cost can be significantly reduced.

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'objet de la présente invention est de fournir une carte de circuit imprimé multicouche qui peut être produite à faible coût et un procédé de fabrication de la carte de circuit imprimé multicouche. À cet effet, on utilise une carte de circuit imprimé multicouche, etc., caractérisée en ce que : un film de résine en forme de bande doté de sous-cartes encapsulées est utilisé, des première à Nième sous-cartes sur lesquelles sont montés des composants étant interconnectées par un film de résine à des intervalles prescrits, le film de résine en forme de bande doté de sous-cartes encapsulées comprenant, d'une extrémité vers l'autre extrémité, des circuits et des ouvertures pour recevoir des composants électroniques lorsqu'il est nécessaire de recevoir les composants électroniques faisant saillie à partir des surfaces de sous-carte qui sont amenés à proximité les uns des autres lorsqu'ils sont superposés les uns aux autres ; et les première à Nième sous-cartes étant pliées et stratifiées ensemble, à partir de la première sous-carte à une extrémité du film de résine en forme de bande doté de sous-cartes encapsulées vers la Nième sous-carte, tandis que les composants électroniques faisant saillie à partir des surfaces de sous-carte adjacentes sont reçus dans les ouvertures destinées à recevoir les composants électroniques.
PCT/JP2017/046415 2016-12-27 2017-12-25 Carte de circuit imprimé multicouche et procédé de fabrication de carte de circuit imprimé multicouche WO2018123961A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018559453A JPWO2018123961A1 (ja) 2016-12-27 2017-12-25 多層配線板及び多層配線板製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016253992 2016-12-27
JP2016-253992 2016-12-27

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WO2018123961A1 true WO2018123961A1 (fr) 2018-07-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7558604B1 (ja) * 2024-04-25 2024-10-01 フューチャーテクノロジー株式会社 多層基板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005506713A (ja) * 2001-10-23 2005-03-03 シャフナー・エーエムファウ・アクチェンゲゼルシャフト 多層回路とその製造方法
JP2006073684A (ja) * 2004-08-31 2006-03-16 Sony Corp 多層配線板及び多層配線板の製造方法
JP2007180421A (ja) * 2005-12-28 2007-07-12 Sumitomo Bakelite Co Ltd 多層回路板の製造方法および多層回路板
US20120011713A1 (en) * 2010-07-13 2012-01-19 Foxconn Advanced Technology Inc. Method for manufacturing multilayer printed circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010103388A (ja) * 2008-10-27 2010-05-06 Panasonic Corp 積層フレキシブル配線基板、その製造方法、及びそれを用いたｒｆｉｄ用電子タグのアンテナ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005506713A (ja) * 2001-10-23 2005-03-03 シャフナー・エーエムファウ・アクチェンゲゼルシャフト 多層回路とその製造方法
JP2006073684A (ja) * 2004-08-31 2006-03-16 Sony Corp 多層配線板及び多層配線板の製造方法
JP2007180421A (ja) * 2005-12-28 2007-07-12 Sumitomo Bakelite Co Ltd 多層回路板の製造方法および多層回路板
US20120011713A1 (en) * 2010-07-13 2012-01-19 Foxconn Advanced Technology Inc. Method for manufacturing multilayer printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7558604B1 (ja) * 2024-04-25 2024-10-01 フューチャーテクノロジー株式会社 多層基板の製造方法

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