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WO2018124004A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2018124004A1
WO2018124004A1 PCT/JP2017/046514 JP2017046514W WO2018124004A1 WO 2018124004 A1 WO2018124004 A1 WO 2018124004A1 JP 2017046514 W JP2017046514 W JP 2017046514W WO 2018124004 A1 WO2018124004 A1 WO 2018124004A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
circuit board
connection
electronic device
connection portion
Prior art date
Application number
PCT/JP2017/046514
Other languages
English (en)
Japanese (ja)
Inventor
馬場　貴博
邦明 用水
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201790001441.0U priority Critical patent/CN210745655U/zh
Publication of WO2018124004A1 publication Critical patent/WO2018124004A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to an electronic device, and more particularly, to an electronic device including a circuit board and a plurality of elements mounted on the circuit board.
  • Patent Document 1 a plurality of electrodes exposed at the end of a flat cable are joined to a plurality of electrodes formed on a circuit board, thereby connecting the first element to a circuit formed on the circuit board.
  • An electronic device is disclosed.
  • a small electronic device can be realized as compared with a case where a cable is connected to a circuit formed on a circuit board using a connector (receptacle) or the like.
  • a connector (receptacle) or the like since a connector (receptacle) or the like is not necessary, the number of parts can be reduced.
  • the above flat cable can be surface-mounted on a circuit board by the same method (process) as a general chip component.
  • process processing during transportation tends to be difficult, and the posture stability on the circuit board tends to be reduced. Become.
  • an object of the present invention is to provide an electronic device in which the occupation area on a circuit board is reduced without reducing the mountability to the circuit board in a configuration in which a plurality of elongated elements are mounted on the circuit board. Is to provide.
  • the electronic device of the present invention is configured as follows.
  • An electronic apparatus of the present invention includes a circuit board, a first element and a second element that are surface-mounted on the surface of the circuit board, and a third element that is mounted on the first element and the second element. .
  • the planar shape of the first element and the second element is smaller than that of the circuit board.
  • the first element is A first surface and a second surface parallel to the surface of the circuit board and facing each other; A plurality of side surfaces connecting the first surface and the second surface; A first end and a second end in a direction along the surface of the circuit board; A first connection portion electrode formed on the first surface of the first end; A second connection electrode formed on the first surface of the second end; Have
  • the second element is A third surface and a fourth surface parallel to the surface of the circuit board and facing each other; A third end and a fourth end in a direction along the surface of the circuit board; A third connection electrode formed on the third surface of the third end; A fourth connection portion electrode formed on the fourth surface of the fourth end; Have
  • connection part electrode and the third connection part electrode are connected to the circuit board through a conductive bonding material, respectively.
  • the third element is The fifth side, A fifth connection electrode and a sixth connection electrode formed on the fifth surface;
  • connection portion electrode and the fifth connection portion electrode are connected via a conductive bonding material
  • fourth connection portion electrode and the sixth connection portion electrode are connected via a conductive bonding material. Is done.
  • the circuit board does not require a conductor pattern for connecting the first element and the second element, and the area occupied by the second connection portion and the fourth connection portion on the circuit board is minimized. It will be a thing.
  • the first element, the second element, and the third element include a high-frequency signal line and a ground conductor.
  • Each of the transmission lines has a transmission line, and the transmission line of the first element is connected by the connection between the second connection part electrode and the fifth connection part electrode and the connection between the fourth connection part electrode and the sixth connection part electrode.
  • the transmission line of the second element are connected via the transmission line of the third element.
  • first end portion and the second end portion are wider than regions other than the first end portion and the second end portion.
  • the circuit board has a dielectric part and a conductor part, and the first element and the second element have a dielectric part and a conductor part, respectively, and the dielectric part of the first element
  • the dielectric loss is lower than the dielectric loss of the dielectric portion of the circuit board
  • the dielectric loss of the dielectric portion of the second element is lower than the dielectric loss of the dielectric portion of the circuit board.
  • the third element has a dielectric part and a conductor part, and the dielectric loss of the dielectric part of the third element is lower than the dielectric loss of the dielectric part of the circuit board. preferable. As a result, the circuit loss of the third element can be reduced while using a circuit board having a large dielectric loss.
  • the first element, the second element, and the third element include a multilayer substrate in which a plurality of resin base materials including a resin base material on which a conductor pattern is formed are laminated.
  • the mounting area on a circuit board can be reduced.
  • flexibility can be given and the 1st element, 2nd element, and 3rd element can be arrange
  • the resin base material of the first element, the second element, and the third element is the same. Thereby, the linear expansion coefficients and elastic moduli of the first element, the second element, and the third element are aligned, and the mountability is improved. Along with this, the bonding strength between the elements increases.
  • a part or all of the second end portion is thinner than a portion connected to the second end portion. Thereby, the height of the portion where the first element and the third element overlap can be reduced.
  • the formation part of the fifth connection part electrode has a recess including an inner side surface along a plurality of the side surfaces of the formation part of the second connection part electrode.
  • the said recessed part is a shape part which the formation part of a said 2nd connection part electrode fits into the said recessed part. Thereby, the positional accuracy of the first element and the third element in the planar direction is easily increased.
  • a region other than the second connection portion electrode of the first element is bonded to the third element with a non-conductive bonding material. This increases the bonding strength between the first element and the third element.
  • the first element includes a dummy electrode formed on the first surface of the second end portion, the circuit board includes a substrate-side dummy electrode facing the dummy electrode, and the substrate-side dummy It is preferable that the dummy electrode is connected to an electrode. Thereby, the mountability of the 1st element with respect to a circuit board improves. In addition, the mountability of the third element with respect to the first element is improved.
  • the device may further include an element mounted on the circuit board, and the third element may be disposed at a position straddling the element.
  • an electronic device having a reduced occupied area on the circuit board can be obtained without reducing mountability on the circuit board. It is done.
  • FIG. 1 is an exploded perspective view of a main part of an electronic apparatus 101 according to the first embodiment.
  • FIG. 2 is an exploded perspective view of the main part of the electronic apparatus 101 according to the first embodiment.
  • FIG. 3 is a perspective view of the main part of the electronic device 101.
  • 4A is a longitudinal sectional view of the XX portion in FIG. 3, and
  • FIG. 4B is a longitudinal sectional view of the YY portion in FIG.
  • FIG. 5 is a perspective view of the first element 1.
  • FIG. 6 is an exploded perspective view of the first element 1.
  • FIG. 7 is a perspective view of the third element 3 as viewed from obliquely below.
  • FIG. 8 is an exploded perspective view of the third element 3.
  • FIG. 10 is a perspective view of the first element 1 according to the third embodiment.
  • FIG. 11 is an exploded perspective view of the first element 1 according to the third embodiment.
  • FIG. 12 is a perspective view of the third element according to the third embodiment as viewed from obliquely below.
  • FIG. 13 is an exploded perspective view of the third element 3 according to the third embodiment.
  • FIG. 14 is an exploded perspective view of the main part of the electronic apparatus 103 according to the third embodiment.
  • FIG. 15 is a perspective view of a main part of an electronic device 103 according to the third embodiment.
  • FIG. 16 is a cross-sectional view of a main part of an electronic device 104 according to the fourth embodiment.
  • FIG. 17 is a plan view of the main part of an electronic apparatus 105A according to the fifth embodiment.
  • FIG. 18 is a plan view of the main part of another electronic apparatus 105B according to the fifth embodiment.
  • FIG. 19 is a plan view of a main part of an electronic device 106 according to the sixth embodiment.
  • FIG. 20 is a plan view showing a main part of an electronic device 101P of a comparative example.
  • FIG. 3 is a perspective view of the main part of the electronic device 101.
  • the electronic device 101 includes a circuit board 5, a first element 1 and a second element 2 that are surface-mounted on the circuit board 5, and a third element 3 that is mounted on the first element 1 and the second element 2. .
  • the first element 1 and the second element 2 are smaller in planar size than the circuit board 5.
  • the first element 1 has a first surface (lower surface in FIG. 1) S1, a second surface (upper surface in FIG. 1) S2, a main body B1, a first end, a second end E2, and a first surface of the first end.
  • the first connection portion having the first connection portion electrode formed on S1 and the second connection portion T2 having the second connection portion electrode formed on the second surface S2 of the second end E2.
  • the first connection portion of the first element 1 is connected to the circuit board 5 via a conductive bonding material.
  • the structure of the first end of the first element 1 will be described later.
  • the second element 2 includes a third surface (lower surface in FIG. 1) S3, a fourth surface (upper surface in FIG. 1) S4, a main body B2, a third end, a fourth end E4, and a third surface of the third end.
  • the third connection portion of the second element 2 is connected to the circuit board 5 through a conductive bonding material.
  • the structure of the third end of the second element will be described later.
  • the first element 1 and the second element 2 are surface-mounted on the circuit board 5.
  • other necessary elements 4 are surface-mounted on the circuit board 5.
  • the third element 3 has a fifth connection portion and a sixth connection portion on the same surface (the lower surface in FIG. 2).
  • the second connection portion T2 of the first element 1 and the fifth connection portion of the third element Are connected to the second surface S2 (see FIG. 1) of the first element 1 via a conductive bonding material.
  • the fourth connection portion T4 of the second element 2 and the sixth connection portion of the third element 3 are connected via the conductive bonding material on the fourth surface S4 of the second element 2 (see FIG. 1). .
  • FIG. 4A is a longitudinal sectional view of the XX portion in FIG. 3, and FIG. 4B is a longitudinal sectional view of the YY portion in FIG.
  • the first surface S1 of the first end E1 of the first element 1 has a first connection portion T1 on which a first connection portion electrode P1 is formed.
  • a substrate-side connection electrode P7 is formed on the circuit board 5, and the first connection electrode P1 of the first element is connected to the substrate-side connection electrode P7 via a conductive bonding material SB such as solder.
  • a plurality of openings for partially exposing the ground conductor G11 are formed in the first surface S1 of the first element 1, and the ground conductor G11 is formed on the circuit board 5 through these openings. Connected to the electrode.
  • a region other than the connection part of the first connection part electrode P ⁇ b> 1 of the first element 1 and the connection part of the ground conductor G ⁇ b> 11 is non-conductive bonded to the circuit board 5. It joins with the underfill 6 which is a material.
  • the fifth connection portion electrode P5 is formed on the lower surface of the third element 3, and the fifth connection portion electrode P5 of the third element is made of a conductive material such as solder. It is connected to the second connection portion electrode P2 of the first element 1 through the bonding material SB.
  • the second element 2 includes a signal line SL and ground conductors G31 and G33, and the third connection portion electrode P3 is formed on the third surface S3 of the third end E3. It has the 3rd connection part T3 formed.
  • a substrate-side connection electrode P8 is formed on the circuit board 5, and the third connection electrode P3 of the second element is connected to the substrate-side connection electrode P8 via a conductive bonding material SB such as solder.
  • a plurality of openings for partially exposing the ground conductor G31 are formed in the third surface S3 of the second element 2, and the ground conductor G31 is connected to the electrodes on the circuit board 5 through these openings. .
  • the fifth connection portion electrode P ⁇ b> 5 and the sixth connection portion electrode P ⁇ b> 6 are formed on the lower surface of the third element 3, and the sixth connection portion of the third element 3.
  • the electrode P6 is connected to the fourth connection portion electrode P4 of the second element 2 through a conductive bonding material SB such as solder.
  • the fifth connection portion electrode P5 of the third element 3 is connected to the second connection portion electrode P2 of the first element 1 through a conductive bonding material SB such as solder.
  • a region other than the second connection electrode P2 of the first element 1 may be bonded to the third element 3 with a non-conductive bonding material (underfill).
  • a region other than the fourth connection portion electrode P4 of the second element 2 may be bonded to the third element 3 with a non-conductive bonding material (underfill). This increases the bonding strength between the third element 3, the first element 1, and the second element 2.
  • FIG. 5 is a perspective view of the first element 1
  • FIG. 6 is an exploded perspective view of the first element 1.
  • both the 1st end part E1 and the 2nd end part E2 are wider than main-body part B1 which is an area
  • the first element 1 includes insulating base materials 11, 12, and 13.
  • a ground conductor G11 and a first connection part electrode P1s are formed on the lower surface of the insulating base material 11.
  • the first connection portion electrode P1s is one of the first connection portion electrodes P1 shown in FIG.
  • a ground conductor G12 and a signal line SL are formed on the upper surface of the insulating base 12.
  • a ground conductor G13 and a second connection portion electrode P2s are formed on the upper surface of the insulating base 13.
  • the second connection portion electrode P2s is one of the second connection portion electrodes P2 shown in FIG.
  • Resist films R11 and R13 are coated on the surface of the multilayer substrate made of the insulating base materials 11, 12, and 13.
  • a plurality of openings OP are formed to expose a part of the first connection portion electrode P1s and the ground conductor G11.
  • the resist film R13 is formed with a plurality of openings OP that exposes a part of the second connection portion electrode P2s and the ground conductor G13.
  • the insulating bases 11, 12, and 13 are sheets of thermoplastic resin such as liquid crystal polymer (LCP).
  • the ground conductors G11, G12, G13, the signal line SL, the first connection part electrode P1s, and the second connection part electrode P2s are obtained by patterning Cu foil attached to an insulating base material by photolithography or the like.
  • a multilayer substrate is configured by laminating and heat-pressing the insulating bases 11, 12, and 13 on which these conductor patterns are formed.
  • the resist films R11 and R13 are, for example, an epoxy resin.
  • the resist films R11 and R13 are formed by printing on this multilayer substrate. These processes are processed in a collective substrate state, and finally cut into individual pieces (individual first elements).
  • the circuit board 5 is also a multilayer board having a conductor pattern therein, but the dielectric part (insulator material) is dispersed with a filler for adjusting the linear expansion coefficient. Therefore, the dielectric loss of the dielectric part of the circuit board 5 is higher than the dielectric loss of the dielectric part (insulating base material) of the first element 1 and the second element 2. In other words, the dielectric loss of the dielectric part (insulating base material) of the first element 1 and the second element 2 is lower than the dielectric loss of the dielectric part of the circuit board 5.
  • the first element 1 is a transmission line having a stripline structure having a connection portion at the first end and the second end, and is mounted on the circuit board 5.
  • Used as The basic configuration of the second element 2 is the same as that of the first element 1 and is a stripline-structured transmission line having connection portions at the third end and the fourth end, and is mounted on the circuit board 5. Used as a cable.
  • FIG. 7 is a perspective view of the third element 3 as viewed from obliquely below
  • FIG. 8 is an exploded perspective view of the third element 3.
  • the third element 3 has a fifth connection portion T5 and a sixth connection portion T6 formed on the same surface.
  • the third element 3 includes insulating base materials 31, 32, and 33.
  • a ground conductor G31, a fifth connection electrode P5s, and a sixth connection electrode P6s are formed on the lower surface of the insulating base 31.
  • the fifth connection portion electrode P5s is one of the fifth connection portion electrodes P5 shown in FIGS.
  • the sixth connection electrode P6s is one of the sixth connection electrodes P6 shown in FIG.
  • a ground conductor G32 and a signal line SL are formed on the lower surface of the insulating base 32.
  • a ground conductor G ⁇ b> 33 is formed on the lower surface of the insulating base material 33.
  • a resist film R31 is coated on one surface of the multilayer substrate made of the insulating base materials 31, 32, and 33.
  • the resist film R31 is formed with a plurality of openings OP exposing a part of the fifth connection part electrode P5s, the sixth connection part electrode P6s, and the ground conductor G31.
  • the third element 3 is a transmission line having a stripline structure having two connection portions T5 and T6, and the transmission line of the first element and the transmission line of the second element It is used as a cable that relays
  • the third element 3 is also manufactured by the same material and the same manufacturing method as the first element 1 and the second element 2.
  • the electronic device 101 shown in FIG. 3 is configured by mounting the first element 1 and the second element 2 described above on the circuit board 5 and then mounting the third element on the first element and the second element. Is done.
  • FIG. 20 is a plan view showing a main part of an electronic device 101P of a comparative example.
  • the electronic device 101P of the comparative example includes a first element 1P, a second element 2P, and a circuit board 5P.
  • the first element 1P and the second element 2P are connected by a plurality of electrode connection patterns formed on the circuit board 5P.
  • the electrode connection pattern is formed so as to bypass other conductor patterns, the occupied area OA necessary for the connection between the first element 1P and the second element 2P is large.
  • a conductive pattern for connecting the first element 1 and the second element 2 is not required on the circuit board 5, and the second connection portion T2 and the fourth connection portion T4 on the circuit board 5 are not required. Occupied area is minimized.
  • An electronic device including a transmission line on the circuit board 5 can be configured without forming a special conductor pattern for relaying the transmission line on the circuit board 5.
  • the circuit board 5 Since the first end E1 and the second end E2 of the first element 1 are wider than other regions, the circuit board 5 can be formed without unnecessarily increasing the mounting area on the circuit board 5. The posture stability (independence) of the first element 1 is increased, and surface mounting becomes easy. The same applies to the second element.
  • the circuit board 5 Since the first element 1, the second element 2 and the third element 3 are constituted by a multilayer substrate in which a plurality of resin base materials including a resin base material on which a conductor pattern is formed are laminated, the circuit board 5 The mounting area can be reduced, and flexibility can be imparted, so that the first element 1, the second element 2 and the third element 3 can be arranged at different heights and angles.
  • the ground conductor G33 is formed above the third element 3, and the second connection portion T2 of the first element 1, the fourth connection portion T4 of the second element 2, and the signal line SL of the third element are grounded. Since it is the structure covered with the conductor G33, the unnecessary radiation from the connection part of the 1st element 1 and the 2nd element 2 is suppressed.
  • the third element 3 is also composed of a multilayer substrate, and is composed of the same base material as the first element 1 and the second element 2, so that the linear expansion coefficient can be matched with that of the first element 1 and the second element 2. It is possible to prevent connection failure.
  • Second Embodiment an electronic device in which the structure of the mounting portion of the third element 3 is different from that of the first embodiment will be described.
  • FIG. 9A and 9B are longitudinal sectional views of electronic devices.
  • 9A is a longitudinal sectional view of the XX portion in FIG. 3 shown in the first embodiment
  • FIG. 9B is a longitudinal sectional view of the YY portion in FIG.
  • the dummy electrode Pd1 is formed on the lower surface of the second end portion (see E2 in FIG. 2) of the first element 1. (Some of the dummy electrodes Pd1 are also part of the ground conductor G11.) Similarly, a dummy electrode Pd2 is formed on the lower surface of the fourth end portion (see E4 in FIG. 2) of the second element 2. (In this example, the dummy electrode Pd2 is also a part of the ground conductor G31.) A substrate-side dummy electrode Pd5 is formed on the upper surface of the circuit board 5 at a position facing the dummy electrodes Pd1 and Pd2. Pd1 and Pd2 are connected to the substrate-side dummy electrode Pd5 through a conductive bonding material such as solder.
  • connection portion electrodes exposed on the lower surfaces of both end portions of the long first element 1 and the second element 2 are connected to the connection portion electrodes on the circuit board 5, the first element 1 and the first element 1
  • the mountability of the two elements 2 is high.
  • the dummy electrode Pd1 of the first element 1 is formed at a position (on the back surface) opposite to the formation position of the second connection part electrode P2 of the first element 1 on the lower surface of the first element.
  • the dummy electrode Pd2 of the second element 2 is formed at a position (on the back surface) opposite to the formation position of the fourth connection portion electrode P4 of the second element 2 on the lower surface of the second element. Therefore, the second connection portion electrode P2 of the first element 1 and the fourth connection portion electrode P4 of the second element 2 due to the presence of the dummy electrodes Pd1, Pd2, the substrate side dummy electrode Pd5 and the conductive bonding material therebetween. High rigidity in the vicinity. Accordingly, the mountability when the third element 3 is mounted on the first element 1 and the second element 2 is also high.
  • FIG. 10 is a perspective view of the first element 1 according to the third embodiment
  • FIG. 11 is an exploded perspective view of the first element 1.
  • a part of the second end E2 is thinner than the main body B1 connected to the second end E2.
  • a step portion is formed at the second end E ⁇ b> 2 of the first element 1.
  • the first element 1 includes insulating base materials 11, 12, and 13.
  • a ground conductor G11 and a first connection part electrode P1s are formed on the lower surface of the insulating base material 11.
  • the first connection portion electrode P1s is one of the first connection portion electrodes P1 shown in FIG.
  • a ground conductor G12, a second connection portion electrode P2s, and a signal line SL are formed on the upper surface of the insulating base 12.
  • the second connection portion electrode P2s is one of the second connection portion electrodes P2 shown in FIG.
  • a ground conductor G13 is formed on the upper surface of the insulating base 13.
  • Resist films R11 and R13 are coated on the surface of the multilayer substrate made of the insulating base materials 11, 12, and 13. In the resist film R11, a plurality of openings OP are formed to expose a part of the first connection portion electrode P1s and the ground conductor G11.
  • FIG. 12 is a perspective view of the third element according to the present embodiment as viewed from obliquely below, and FIG. 13 is an exploded perspective view of the third element 3.
  • the third element 3 has a fifth connection portion T5 and a sixth connection portion T6 formed on the same surface.
  • the third element 3 includes insulating base materials 31, 32, and 33.
  • a ground conductor G31 is formed on the lower surface of the insulating base 31.
  • a ground conductor G ⁇ b> 33 is formed on the lower surface of the insulating base material 33.
  • the signal line SL, the fifth connection portion electrode P5s, the sixth connection portion electrode P6s, and electrodes that are electrically connected to the ground conductors G31 and G33 via the interlayer connection conductor are formed on the lower surface of the insulating base material 32.
  • the fifth connection portion electrode P5s is one of the fifth connection portion electrodes P5 shown in FIGS.
  • the sixth connection electrode P6s is one of the sixth connection electrodes P6 shown in FIG.
  • the positions of the insulating base material 31 corresponding to the fifth connection portion T5 and the sixth connection portion T6 include three inner surfaces, and are concave portions that are recessed in both the thickness direction and the surface direction.
  • the three inner side surfaces forming the recesses of the fifth connection portion T5 are along the side surfaces in the plurality of directions (X-axis direction and Y-axis direction shown in FIG. 10) of the second connection portion T2 of the first element 1.
  • the three inner side surfaces that form the recesses of the sixth connection portion T6 are along the side surfaces in the plurality of directions of the fourth connection portion T4 of the second element 2.
  • FIG. 14 is an exploded perspective view of the main part of the electronic device 103 according to the present embodiment.
  • FIG. 15 is a perspective view of the main part of the electronic device 103.
  • the electronic device 103 includes a circuit board 5, a first element 1 and a second element 2 that are surface-mounted on the circuit board 5, and a third element 3 that is mounted on the first element 1 and the second element 2. .
  • the first element 1 and the second element 2 are smaller in planar size than the circuit board 5.
  • the recess of the fifth connection portion T5 of the third element 3 corresponds to the second connection portion T2 of the first element 1, and the recess of the sixth connection portion T6 of the third element 3 is the fourth connection portion T4 of the second element 2.
  • the lower surface of the third element 3 is in contact with or close to the upper surface of the circuit board 5, and the first element and the third element on the circuit board 5 overlap.
  • the height of the part is reduced.
  • the fifth connection portion T5 of the third element 3 has the recess including the inner side surface along the side surfaces in the plurality of directions of the second connection portion T2 of the first element 1, The height of the portion where the element 1 and the third element 3 overlap can be reduced, and the positional accuracy of the first element 1 and the third element 3 in the planar direction is increased.
  • the fifth connection portion T5 of the third element 3 is shaped to fit into the second connection portion T2 of the first element 1, the plane between the first element 1 and the third element 3 is determined. The positional accuracy of the direction is easily increased.
  • the relationship described above is the same in the relationship between the sixth connection portion T6 of the third element 3 and the fourth connection portion T4 of the second element 2.
  • FIG. 16 is a cross-sectional view of a main part of the electronic device 104 according to the fourth embodiment.
  • the first element 1 and the second element 2 are mounted on the circuit board 5, and the third element 3 is mounted on the first element 1 and the second element 2.
  • the third element 3 is arranged at a position straddling another element 4 mounted on the circuit board 5.
  • the third element 3 is disposed in a space along the circuit board 5 on the circuit board 5, the third element 3 is affected by other elements 4 mounted on the circuit board 5. Can be placed without. Accordingly, the end of the first element 1 and the end of the second element 2 can be arranged in the vicinity of the other elements 4, and the circuit board 5 of the first element 1, the second element 2, and the third element 3. Increases the degree of freedom of placement above.
  • FIG. 17 is a plan view of the main part of the electronic apparatus 105A according to the fifth embodiment.
  • the first element 1 and the two second elements 2A and 2B are mounted on the circuit board 5, respectively, and the third element 3 is mounted on the first element 1 and the second elements 2A and 2B. It is installed.
  • the first element 1 has two signal lines SL11 and SL12, and has connection portions at the first end E1 and the second end E2, respectively. Other configurations of the first element 1 are the same as those of the first element 1 shown in the first embodiment.
  • the second element 2A has a signal line SL21, and has connection portions at the third end E3 and the fourth end E4, respectively.
  • the second element 2B has a signal line SL22, and has connection portions at the third end E3 and the fourth end E4, respectively.
  • Other configurations of the second elements 2A and 2B are the same as those of the second element 2 shown in the first embodiment.
  • the third element 3 has signal lines SL31 and SL32, and their connecting portions are exposed on the lower surface.
  • the signal line SL31 connects the signal line SL11 of the first element 1 and the signal line SL21 of the second element 2A
  • the signal line SL32 connects the signal line SL12 of the first element 1 and the signal line SL22 of the second element 2B. To do.
  • two transmission lines including the signal lines SL11 and SL12 of the first element 1 a transmission line including the signal line SL21 of the second element 2A, and a transmission line including the signal line SL22 of the second element 2B.
  • a branch circuit is configured.
  • FIG. 18 is a plan view of the main part of another electronic device 105B according to the fifth embodiment.
  • the first element 1 and the two second elements 2A and 2B are mounted on the circuit board 5, respectively, and the third element 3 is mounted on the first element 1 and the second elements 2A and 2B. It is installed.
  • the first element 1 has a signal line SL1, and has connection portions at the first end E1 and the second end E2, respectively. Other configurations of the first element 1 are the same as those of the first element 1 shown in the first embodiment.
  • the second element 2A has a signal line SL21, and has connection portions at the third end E3 and the fourth end E4, respectively.
  • a high-pass filter HPF is provided on the transmission line of the second element 2A.
  • the second element 2B has a signal line SL22, and has connection portions at the third end E3 and the fourth end E4, respectively.
  • a low-pass filter LPF is provided on the transmission line of the second element 2B.
  • Other configurations of the second elements 2A and 2B are the same as those of the second element 2 shown in the first embodiment.
  • a circuit is constructed.
  • first elements there may be a plurality of first elements, and there may be three or more second elements. In this way, the third element can connect three or more elements.
  • FIG. 19 is a plan view of the main part of the electronic device 106 according to the sixth embodiment.
  • the first element 1 and the two second elements 2A and 2B are mounted on the circuit board 5, respectively, and the third element 3 is mounted on the first element 1 and the second elements 2A and 2B. It is installed.
  • the first element 1 has a signal line SL1, and has connection portions at the first end E1 and the second end E2, respectively. Other configurations of the first element 1 are the same as those of the first element 1 shown in the first embodiment.
  • the second element 2A has a signal line SL21, and has connection portions at the third end E3 and the fourth end E4, respectively.
  • the second element 2B has a signal line SL22, and has connection portions at the third end E3 and the fourth end E4, respectively.
  • Other configurations of the second elements 2A and 2B are the same as those of the second element 2 shown in the first embodiment.
  • the third element 3 has signal lines SL31 and SL32, and their connecting portions are exposed on the lower surface.
  • the signal line SL31 connects the signal line SL1 of the first element 1 and the signal line SL21 of the second element 2A
  • the signal line SL32 connects the signal line SL1 of the first element 1 and the signal line SL22 of the second element 2B.
  • a high-pass filter HPF is provided on the transmission line including the signal line SL31.
  • a low-pass filter LPF is provided on the transmission line including the signal line SL32.
  • a multiplexing / demultiplexing circuit including a transmission line including the signal line SL1 of the first element, a transmission line including the signal line SL21 of the second element 2A, and a transmission line including the signal line SL22 of the second element 2B.
  • a circuit other than the transmission line may be configured in the third element 3.
  • the dielectric portions (insulating base materials) of the first element 1, the second element 2, and the third element 3 are not limited to thermoplastic resins, and may be thermosetting resins.
  • first end E1 and the second end E2 of the first element 1 do not necessarily have to be wider than the main body B1.
  • the main body B1 of the first element 1 is not limited to a linear shape, and the bent portion may have a curved portion. The same applies to the second element 2.
  • the third element 3 is not limited to a rectangular parallelepiped plate shape, and the planar shape may be an L shape, a U shape, a crank shape, or the like.
  • a circuit component may be mounted on or inside the first element 1, the second element 2, and the third element 3.
  • the first element 1 and the second element 2 are not limited to elements used as transmission lines. Any elongated element mounted on a circuit board can be applied to the present invention.
  • Second surface S3 ... third Surface S4 ... Fourth surface SB Conductive bonding material SL1, SL11, SL12, SL21, SL22, SL31, SL32 ... Signal line T1 ... First connection portion T2 ... Second connection portion T3 ... Third connection portion T4 ... Fourth Sequential part T5 ... fifth connection part T6 ... sixth connection part 1 ... first element 2 ... second element 2A, 2B ... second element 3 ... third element 4 ... other element 5 ... circuit board 6 ... underfill 11 , 12, 13 ... insulating base materials 31, 32, 33 ... insulating base materials 101, 103, 104, 105A, 105B, 106 ... electronic equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Dispositif électronique (101) comprenant : une carte de circuit imprimé (5), un premier élément (1) et un deuxième élément (2) qui sont montés en surface sur la carte de circuit imprimé (5), et un troisième élément (3) qui est monté de manière à chevaucher le premier élément (1) et le deuxième élément (2). Une première partie de connexion du premier élément (1) est connectée à la carte de circuit imprimé (5) par l'intermédiaire d'un matériau de liaison conducteur et une électrode de troisième partie de connexion du deuxième élément (2) est connectée à la carte de circuit imprimé (5) par l'intermédiaire d'un matériau de liaison conducteur. Le troisième élément (3) comporte une cinquième partie de connexion et une sixième partie de connexion, qui sont formées sur la même surface. Une deuxième partie de connexion (T2) du premier élément (1) et la cinquième partie de connexion du troisième élément sont connectées l'une à l'autre par l'intermédiaire d'un matériau de liaison conducteur. Une quatrième partie de connexion (T4) du deuxième élément (2) et la sixième partie de connexion du troisième élément (3) sont connectées l'une à l'autre par l'intermédiaire d'un matériau de liaison conducteur.
PCT/JP2017/046514 2016-12-28 2017-12-26 Dispositif électronique WO2018124004A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201790001441.0U CN210745655U (zh) 2016-12-28 2017-12-26 电子设备

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JP2016-254794 2016-12-28
JP2016254794 2016-12-28

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WO2018124004A1 true WO2018124004A1 (fr) 2018-07-05

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005524239A (ja) * 2002-04-29 2005-08-11 シリコン・パイプ・インコーポレーテッド ダイレクト・コネクト形信号システム
WO2016088592A1 (fr) * 2014-12-01 2016-06-09 株式会社村田製作所 Appareil électronique, élément électrique, et plateau pour élément électrique

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005524239A (ja) * 2002-04-29 2005-08-11 シリコン・パイプ・インコーポレーテッド ダイレクト・コネクト形信号システム
WO2016088592A1 (fr) * 2014-12-01 2016-06-09 株式会社村田製作所 Appareil électronique, élément électrique, et plateau pour élément électrique

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