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WO2018132866A1 - Centre de données modulaire haute densité - Google Patents

Centre de données modulaire haute densité Download PDF

Info

Publication number
WO2018132866A1
WO2018132866A1 PCT/AU2018/050023 AU2018050023W WO2018132866A1 WO 2018132866 A1 WO2018132866 A1 WO 2018132866A1 AU 2018050023 W AU2018050023 W AU 2018050023W WO 2018132866 A1 WO2018132866 A1 WO 2018132866A1
Authority
WO
WIPO (PCT)
Prior art keywords
data centre
upright columns
component framework
services
module
Prior art date
Application number
PCT/AU2018/050023
Other languages
English (en)
Inventor
Timothy Mark DESMOND
Dean COETZEE
Original Assignee
The Data Exchange Network Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AU2017900127A external-priority patent/AU2017900127A0/en
Application filed by The Data Exchange Network Ltd. filed Critical The Data Exchange Network Ltd.
Publication of WO2018132866A1 publication Critical patent/WO2018132866A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1497—Rooms for data centers; Shipping containers therefor

Definitions

  • This invention relates to a high-density data centre module, a high-density data centre assembly, a high- density data centre arrangement, and an associated high- density data centre.
  • the Internet can be defined as a global network of peers or peering points that interconnect between each other. As such, the Internet is made up of many such networked peering points which can be connected to by users for the consumption of content and online services. These peering points are typically known as data centres (DCs) or Internet exchanges (IXs) and are where thousands, sometimes hundreds of thousands of computers (servers), are housed in secure, mostly specially built, facilities for access by users.
  • DCs data centres
  • IXs Internet exchanges
  • a high-density data centre module comprising: at least two upright columns braced together via at least one bracing member to define a component framework for operatively receiving and securing data centre components therein; and
  • an access platform laterally projecting from the upright columns at a bottom end of the component framework, said platform shaped, dimensioned and configured to allow a maintenance person to access data centre components in the component framework and to allow passage of air therethrough; wherein the upright columns extend below the access platform to define a passage underneath the component framework for data centre services operatively servicing said data centre components within the component framework when the upright columns rest on a support.
  • the module comprises four upright columns, two sets of each arranged at either end of the component framework, with each column of a set spaced apart to accommodate data centre components therebetween, in use.
  • the module comprises at least two bracing members extending between the two sets of upright columns arranged at either end of the component framework.
  • bracing members are arranged between the upright columns at or underneath the bottom end of the component framework.
  • ends of the upright columns are configured to be complementarily stacked on the upright columns of another module.
  • the access platform comprises a grating cantilevered to the component framework and/or upright columns .
  • the data centre services comprise a power supply, communications cabling, mechanical services, cooling services, and/or the like.
  • the data centre components comprise power supply equipment, computing equipment, cooling equipment, and/or the like.
  • a high-density data centre assembly comprising at least two high-density data centre modules stacked one on top of the other, each module comprising:
  • an access platform laterally projecting from the upright columns at a bottom end of the component framework, said platform shaped, dimensioned and configured to allow a maintenance person to access data centre components in the component framework and to allow passage of air therethrough; wherein the upright columns extend below the access platform to define a passage underneath the component framework for data centre services operatively servicing said data centre components within the component framework when the modules are stacked in such a manner.
  • the module comprises four upright columns, two sets of each arranged at either end of the component framework, with each column of a set spaced apart to accommodate data centre components therebetween, in use.
  • the module comprises at least two bracing members extending between the two sets of upright columns arranged at either end of the component framework.
  • the bracing members are arranged between the upright columns at or underneath the bottom end of the component framework.
  • ends of the upright columns are configured to be complementarily stacked on the upright columns of another module.
  • the access platform comprises a grating cantilevered to the component framework and/or upright columns .
  • the data centre services comprise a power supply, communications cabling, mechanical services, cooling services, and/or the like.
  • the data centre components comprise power supply equipment, computing equipment, cooling equipment, and/or the like.
  • a high-density data centre arrangement comprising at least two assemblies, according to the second aspect of the invention, juxtaposed with each other.
  • the respective assemblies are juxtaposed either access platform to access platform, access platform to component framework, and/or access platform to component framework .
  • a high-density data centre comprising: a plurality of high-density data centre modules stacked one on top of the other and juxtaposed, each module comprising at least two upright columns braced together via at least one bracing member to define a component framework for operatively receiving and securing data centre components therein; and an access platform laterally projecting from the upright columns at a bottom end of the component framework, said platform shaped, dimensioned and configured to allow a maintenance person to access data centre components in the component framework and to allow passage of air therethrough; wherein the upright columns extend below the access platform to define a passage underneath the component framework for data centre services operatively servicing said data centre components within the component framework when the upright columns are so stacked and juxtaposed; and
  • the respective modules are juxtaposed either access platform to access platform, access platform to component framework, and/or access platform to component framework .
  • the module comprises four upright columns, two sets of each arranged at either end of the component framework, with each column of a set spaced apart to accommodate data centre components therebetween, in use.
  • the module comprises at least two bracing members extending between the two sets of upright columns arranged at either end of the component framework.
  • the bracing members are arranged between the upright columns at or underneath the bottom end of the component framework.
  • ends of the upright columns are configured to be complementarily stacked on the upright columns of another module.
  • the access platform comprises a grating cantilevered to the component framework and/or upright columns .
  • the data centre services comprise a power supply, communications cabling, mechanical services, cooling services, and/or the like.
  • the data centre components comprise power supply equipment, computing equipment, cooling equipment, and/or the like.
  • Figure 1 is a diagrammatic perspective view representation of one example of a high-density date centre assembly, in accordance with an aspect of the invention
  • Figure 2 is a diagrammatic perspective view representation of one example of a high-density date centre arrangement, in accordance with an aspect of the invention
  • Figure 3 is diagrammatic perspective view representation of one example of a high-density date centre, in accordance with an aspect of the invention
  • Figure 4 is a diagrammatic perspective view representation of a further example of a high-density date centre.
  • Figure 5 is a diagrammatic perspective view representation of a yet further example of a high-density data centre.
  • a high-density data centre module 10 generally comprises at least two upright columns 12, e.g. one at each end 26, braced together via at least one bracing member 14 to define a component framework 16 for operatively receiving and securing data centre components 18 therein, as shown. It is to be appreciated that the current example comprises two sets 28 of upright columns 12, rather than a single upright column 12, at either end 26, which is within the scope of the invention .
  • the module 10 also typically includes an access platform 20 laterally projecting from the upright columns 12 at a bottom end 22 of the component framework 16, with the platform 20 shaped, dimensioned and configured to allow a maintenance person (not shown) to access the data centre components 18 in the component framework 16 and to allow free or relatively uninterrupted passage of air therethrough.
  • the upright columns 12 further extend below the access platform 20to define a passage 24 underneath the component framework 16 for data centre services operatively servicing said data centre components 18 within the component framework 16 when the upright columns rest on a support, such as a surface or stacked on a similar module 10, as described in more detail below.
  • the data centre services generally comprise a power supply, communications cabling, mechanical services, cooling services, and/or the like.
  • the data centre components 18 can comprise power supply equipment, computing equipment, cooling equipment, and/or the like.
  • the current example of the module 10 comprises four upright columns 12, two sets of each arranged at either end 26 of the component framework 16. As shown, each column 12 of a set 28 spaced apart to accommodate the data centre components 18 therebetween, when in use.
  • the module 10 also typically comprises at least two bracing members 14 extending between the two sets 28 of upright columns 12 arranged at either end 26 of the component framework 16.
  • the bracing members 14 are generally arranged between the upright columns 12 at or underneath the bottom end 22 of the component framework 16.
  • the ends 30 of the upright columns 12 are generally configured to be complementarily stacked on the upright columns of another module, as described in more detail below.
  • the platform typically comprises a grating cantilevered to the component framework 16 and/or upright columns 12.
  • the platform 20 is configured to allow maintenance access and can also serve as a spacer between juxtaposed modules and/or walls of a data centre structure, or the like.
  • the modules are generally stacked and/or juxtaposed close together so that the respective platforms 20 performs a spacing function between assemblies 32.
  • the platform 20 is typically sized and dimensioned to allow a relatively narrow maintenance access so as to maintain a high-density layout, as described above.
  • the present invention also provides for a high-density data centre assembly 32 which comprises at least two of the above high- density data centre modules 10 stacked one on top of the other, as shown in Figure 1.
  • the invention further provides for a high-density data centre arrangement 34 which comprises at least two data centre assemblies 32 juxtaposed with each other, several examples of which are shown in the drawings. Accordingly, at least two modules 10 stacked one of top of the other forms an assembly 32, with at least two such assemblies juxtaposed, typically in a side-by-side arrangement, to form an arrangement 34.
  • the respective assemblies 32 can be juxtaposed either access platform 20 to access platform 20, access platform 20 to component framework 16, and/or access platform 20 to component framework 16.
  • each assembly 32 and/or arrangement 34 juxtaposed with respect to each other.
  • the side of the module/assembly/arrangement without the platform 20 is considered the ⁇ rear' , then two rears can face each other to form the hot aisle and two
  • this modularity also provides for cooling redundancy, as any failure of a cooling data centre component 18 in a module's component framework 16, allows cooling components in adjacent stacked and/or juxtaposed frameworks 16 to provide cooling.
  • a high-density data centre 36 can be constructed comprising a plurality of the high-density data centre modules 10 stacked one on top of the other and/or juxtaposed, along with data centre services routed via the respective passages 24 of the modules 10 for servicing data centre components 18.
  • Figure 2 shows a data centre 36 with an arrangement 34 of two-layer assemblies 32 installed into an existing 9m truss warehouse.
  • the same warehouse in the whitespace section of roughly 1500m 2 would only allow around 500-700 component frameworks 16, whereas the invention will allow for a theoretical amount of at least 50% more component frameworks 16 to be installed than in a conventionally built whitespace area.
  • the invention allows for extremely high physical density of component frameworks to be achieved in any data centre space, which leads to cost savings.
  • the invention also provides for a high degree of flexibility in height, width and components used, as well as low time-to-market as the modules can be fabricated locally and installed by available labour .
  • the upright columns can be configured to be load-bearing, which allows the modules 10 to make-up a building by being the structural component of the building or mezzanine .
  • Optional embodiments of the present invention may also be said to broadly consist in the parts, elements and features referred to or indicated herein, individually or collectively, in any or all combinations of two or more of the parts, elements or features, and wherein specific integers are mentioned herein which have known equivalents in the art to which the invention relates, such known equivalents are deemed to be incorporated herein as if individually set forth.
  • well- known processes, well-known device structures, and well-known technologies are not described in detail, as such will be readily understood by the skilled addressee.
  • Spatially relative terms such as “inner,” “outer,” “beneath, “ “below, “ “lower, “ “above, “ “upper, “ and the like, may be used herein for ease of description to describe one element or feature's relationship to another element (s) or feature (s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
  • one example may exemplify certain aspects of the invention, whilst other aspects are exemplified in a different example.
  • These examples are intended to assist the skilled person in performing the invention and are not intended to limit the overall scope of the invention in any way unless the context clearly indicates otherwise.
  • Variations (e.g. modifications and/or enhancements) of one or more embodiments described herein might become apparent to those of ordinary skill in the art upon reading this application. The inventor (s) expects skilled artisans to employ such variations as appropriate, and the inventor (s) intends for the claimed subject matter to be practiced other than as specifically described herein.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi Processors (AREA)

Abstract

L'invention concerne un module de centre de données haute densité (10) qui comprend au moins deux colonnes verticales (12), au moins une à chaque extrémité (26), calées ensemble par l'intermédiaire d'au moins un élément de entretoisement (14) afin de définir un cadre de composants (16) destiné à recevoir et fixer de manière fonctionnelle des composants de centre de données (18) à l'intérieur de celui-ci. Le module (10) comprend également une plateforme d'accès (20) faisant saillie latéralement des colonnes verticales (12) au niveau d'une extrémité inférieure (22) du cadre de composants, la plateforme étant formée, dimensionnée et conçue pour permettre à une personne assurant la maintenance d'accéder aux composants du centre de données et laisser un passage d'air libre ou relativement ininterrompu dans celle-ci. Les colonnes verticales s'étendent en outre sous la plate-forme d'accès pour définir un passage (24) sous le cadre de composants pour des services de centre de données desservant fonctionnellement lesdits composants du centre de données lorsque les colonnes verticales reposent sur un support, tel qu'une surface ou sont empilés sur un module similaire.
PCT/AU2018/050023 2017-01-17 2018-01-16 Centre de données modulaire haute densité WO2018132866A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AU2017900127A AU2017900127A0 (en) 2017-01-17 High-density modular data centre
AU2017900127 2017-01-17

Publications (1)

Publication Number Publication Date
WO2018132866A1 true WO2018132866A1 (fr) 2018-07-26

Family

ID=62907479

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AU2018/050023 WO2018132866A1 (fr) 2017-01-17 2018-01-16 Centre de données modulaire haute densité

Country Status (1)

Country Link
WO (1) WO2018132866A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4492932A1 (fr) * 2023-07-12 2025-01-15 Ovh Configuration de centre de données modulaire multiniveau

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155635A (ja) * 2000-11-20 2002-05-31 Takenaka Komuten Co Ltd データセンタ
US20090153005A1 (en) * 2007-12-14 2009-06-18 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Cabinet for electronic devices
US20100051563A1 (en) * 2008-08-29 2010-03-04 Kevin Schreiber Modular data center
US20100165565A1 (en) * 2008-12-31 2010-07-01 Hellriegal Stephen V R Data center
US8331086B1 (en) * 2009-02-17 2012-12-11 Silver Linings Systems, LLC Modular integrated mobile cooling system and methods of operation thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155635A (ja) * 2000-11-20 2002-05-31 Takenaka Komuten Co Ltd データセンタ
US20090153005A1 (en) * 2007-12-14 2009-06-18 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Cabinet for electronic devices
US20100051563A1 (en) * 2008-08-29 2010-03-04 Kevin Schreiber Modular data center
US20100165565A1 (en) * 2008-12-31 2010-07-01 Hellriegal Stephen V R Data center
US8331086B1 (en) * 2009-02-17 2012-12-11 Silver Linings Systems, LLC Modular integrated mobile cooling system and methods of operation thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4492932A1 (fr) * 2023-07-12 2025-01-15 Ovh Configuration de centre de données modulaire multiniveau

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