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WO2018139465A1 - Dispositif de séparation de composant électronique et procédé de séparation de composant électronique - Google Patents

Dispositif de séparation de composant électronique et procédé de séparation de composant électronique Download PDF

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Publication number
WO2018139465A1
WO2018139465A1 PCT/JP2018/002024 JP2018002024W WO2018139465A1 WO 2018139465 A1 WO2018139465 A1 WO 2018139465A1 JP 2018002024 W JP2018002024 W JP 2018002024W WO 2018139465 A1 WO2018139465 A1 WO 2018139465A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
electronic component
unit
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/002024
Other languages
English (en)
Japanese (ja)
Inventor
裕司 小森
英二 井上
井上　信宏
政和 古西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astec Irie Co Ltd
Original Assignee
Astec Irie Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Astec Irie Co Ltd filed Critical Astec Irie Co Ltd
Publication of WO2018139465A1 publication Critical patent/WO2018139465A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Definitions

  • the present invention relates to an electronic component separation device and an electronic component separation method for separating an electronic component from a printed circuit board.
  • a printed circuit board is used inside a car, a home appliance, a communication device, a computer, etc., and lead solder, tin, bismuth, indium, silver, zinc, and the like are used to connect the printed circuit board and electronic parts.
  • Lead-free solder containing copper, antimony and the like is used.
  • the waste printed circuit board is valuable as a resource because it contains precious metals such as copper, gold, silver, palladium and the like.
  • metal elements such as tin, bismuth, indium, silver, zinc, copper and antimony used for lead-free solder are less expensive than lead solder, but are economically expensive and resources are exhausted. There are problems such as concern.
  • semiconductor printed circuit boards conventionally used for automobiles, home appliances, etc. are crushed as they are and treated as shredder dust, they are removed by crushing the boards, and further they are melted by melting solder from the boards, IC chips etc.
  • the precious metals are recovered by a method such as removing and crushing the members of the
  • Patent Document 1 an apparatus for collecting solder that connects and fixes electronic components mounted on a printed circuit board, a conveying apparatus that suspends, holds and conveys the printed circuit board vertically, and heats the printed circuit board SUMMARY A structure is disclosed that includes an apparatus, a vibrating device that continuously applies vibration to a printed circuit board.
  • Patent Document 2 discloses a processing method in which solder is melted by heating while placing and conveying a printed circuit board vertically or appropriately inclined on a mesh board, and as a result, the solder is dropped and the electronic component is recovered and recovered. It is done.
  • the spring member for holding the printed circuit board and other components are exposed to high temperatures for a long time, and there is a problem that the functions of the spring and other components are degraded. Also, when vibration is applied, the separation process takes time and the workability is poor.
  • Patent Document 2 a method is shown in which the surface on which the electronic component is mounted is vertically or downwardly inclined in the printed circuit board, but some time is required for dropping and separating the electronic component. Are needed, and it is desirable to improve the working efficiency.
  • thermoelectric heating As the heat treatment of the printed circuit board, a method is employed in which heating means are disposed on both sides of the printed circuit board transported together with Patent Documents 1 and 2.
  • this heating device there are infrared heating, hot air heating, combustion gas heating, high frequency heating, superheated steam heating and the like.
  • superheated steam heating is considered to be relatively efficient, but heat treatment can be performed in a shorter time than in the past, and a large amount of heat energy required for heating can be reduced, which contributes to cost reduction. Methods and apparatus capable of such heat treatment are desired.
  • the present invention has been made in view of the above-described circumstances, and an object thereof is to make it possible to easily separate an electronic component from a printed circuit board without requiring a complicated machine such as a vibration device, and to provide an electronic device with good heating efficiency.
  • a component separation device and an electronic component separation method are provided.
  • a transport unit for transporting a printed circuit board to which an electronic component is attached a heating unit for heating the printed circuit board during transport by the transport unit, and the transfer unit from the transport unit during or after heating the printed circuit board
  • An electronic component separation device comprising: a separation unit that drops the light onto the lower surface of the transport unit and separates the electronic component from the printed circuit board.
  • the transport unit includes a suspension holding unit for suspending and holding the printed circuit board, and the suspension release unit configured to release the suspension holding by the separation unit is provided in [1].
  • Electronic component separation device is provided in [1].
  • the electronic component separation device of [1] since the printed circuit board heated by the heating unit is dropped to the throwing surface at the separation unit, the electronic component can be instantaneously and easily removed from the printed circuit board by the drop impact. It can be separated. As a result, when separating the electronic component from the printed circuit board, the accuracy of the electronic component separation can be dramatically improved and the separation processing speed is dramatically improved without the need for a machine such as a vibration device. be able to.
  • the transport unit includes the suspension holding unit that suspends and holds the printed circuit board
  • the printed circuit board can be easily dropped with a simple structure.
  • the heating member can be disposed close to the printed circuit board in the transport path, so that the heating efficiency can be improved, and the heat processing speed and the running cost can be reduced. it can.
  • heating efficiency can be improved by performing heating in two steps, and By performing heating with superheated steam after preheating, higher-speed and uniform heating can be performed, and speeding-up of the heat treatment and reduction of the running cost can be achieved.
  • the printed circuit board is dropped during or after the heating step to apply a drop impact to the printed circuit board to separate the electronic component from the printed circuit board. Since the printed circuit board can be shocked easily and instantaneously after it is heated and the connecting means such as the solder is melted, the electronic component can be separated from the printed circuit board extremely easily and quickly.
  • the corner of the printed circuit board can be brought into contact with the projection surface when dropped. Can be received at the corners and effectively transmitted to the entire printed circuit board. Further, according to the hanging and holding of the printed circuit board, the heating means can be easily approached to the printed circuit board, and the heating efficiency can be enhanced.
  • FIG. 1 It is a principal part perpendicular sectional view showing a schematic structure of an electronic component separation device of one embodiment of the present invention.
  • the electronic component separation apparatus shown in FIG. 1 it is the principal part schematic of the heating part seen from the traveling direction of the conveyance part.
  • FIG. 1 is a main part vertical cross-sectional view showing a schematic configuration of the electronic component separating apparatus
  • FIG. 2 is a main part of the heating unit as viewed from the traveling direction of the transport part in the electronic component separating apparatus shown in FIG.
  • FIG. 3 is a schematic perspective view
  • FIG. 3 is an enlarged perspective view of a suspension release part in the electronic component separation device shown in FIG. 1
  • FIG. 4 is an enlarged sectional view of a separation part in the electronic component separation device shown in FIG.
  • the electronic component separation device 1 heats the printed circuit board 10 during conveyance by the conveyance unit 2 that conveys the printed circuit board 10 to which the electronic component EP is attached. And the separating unit 4 which causes the printed circuit board 10 to drop from the transport unit 2 onto the light emitting surface 6 immediately after heating and separate the electronic component EP from the printed circuit board 10.
  • the electronic component separation device 1 applies a drop impact to the printed circuit board 10 during or after the heating step of heating while transporting the printed circuit board 10 to which the electronic component EP is attached, and printing. And a separation step of separating the electronic component EP from the substrate 10.
  • examples of the electronic component EP include an IC chip, a capacitor, a resistor, a wireless tag, a coil, a transistor, a diode, a transformer, an LED, a vibrator, a speaker, a motor, a liquid crystal, a camera, a connector, a contact, and the like.
  • resin which comprises the substrate main body P of the printed circuit board 10 For example, nylon, polyacetal, modified polyphenylene ether, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, polyamide, polyether sulfone, liquid crystal polymer, polyethylene, Polypropylene, polyvinyl chloride, polystyrene, ABS resin, acrylonitrile styrene copolymer resin, MBS resin, and any one or more of these polymer alloys or polymer blends.
  • the printed circuit board 10 and the electronic component EP may include a glass fiber layer.
  • the transport unit 2 includes an endless transport main body 2a rotationally driven by a drive system (not shown) such as a drive motor, and the printed circuit board 10 is suspended from the transport main body 2a.
  • a hanging holder 2b is provided which can be held.
  • the suspension holding portion 2b is a substantially L-shaped member including a vertical portion 2bv extending downward from the transfer main body portion 2a and a horizontal portion 2bh extending substantially horizontally from the lower end of the vertical portion 2bv. It is. Further, a large number of the suspension holding portions 2 b are provided at appropriate intervals over the entire length of the transport main body portion 2 a.
  • the horizontal portion 2bh of the suspension holding portion 2b extends in the left-right direction with respect to the traveling direction of the transport body 2a, and the tip of the horizontal portion 2bh is provided facing the outside of the traveling loop of the transport body 2a. ing.
  • the horizontal portion 2bh of the suspension holder 2b penetrates the printed board mounting hole 10h formed in the substrate body P of the printed circuit board 10 and holds the printed circuit board 10 in a suspended manner. And conveyance of the printed circuit board 10 is suspended with the corner part Pc of the board
  • the board mounting holes 10 h referred to here are holes that are previously opened for screwing when the printed board 10 is mounted on an electrical product in many cases.
  • the substrate body P is substantially rectangular or a combination of rectangular shapes, and the substrate mounting holes 10h are formed in most corner portions Pc of the substrate body P. Therefore, when the suspension holder 2b is penetrated and held in one of the board mounting holes 10h, the corner portion Pc opposite to the side through which the suspension holder 2b is penetrated is held facing downward Be done.
  • the suspended printed circuit board 10 is The sheet is conveyed with the front and back sides parallel to the conveying direction. Therefore, the space on the left and right of the conveyance when the printed circuit board 10 is conveyed may be slightly larger than the thickness of the printed circuit board 10, and does not require a large space. That is, the distance d between the front and back surfaces of the printed board 10 with the hot air heaters 3aa and the like of the heating unit 3 described later can be set small, and the substrate passage opening 1s formed in the partition 1w of the heating unit 3 can be small.
  • the heating unit 3 includes a conveyance unit 2 at the upper part, and a preheating unit 3a that heats the printed circuit board 10 to a predetermined temperature while the printed circuit board 10 is moving at a predetermined speed; And a main heating unit 3b disposed downstream.
  • the preheating unit 3a is provided with, for example, a hot air heater 3aa capable of emitting hot air, and supplies hot air heated to a predetermined temperature to the front and back surfaces of the printed circuit board 10.
  • a heat source of hot air heater 3aa an infrared ray, a high frequency, a combustion gas etc. are mentioned, for example.
  • a superheated steam generation unit 3bb is provided in the main heating unit 3b, and the superheated steam generation unit 3bb supplies the superheated steam.
  • the space of the heating unit 3 is preferably configured as small as possible.
  • the bottom 7 is set higher than the bottom of the casing 1 a of the electronic component separation device 1 so as to approach the printed circuit board 10. Is desirable.
  • melted by heating is suitably provided in the bottom part 7, illustration is abbreviate
  • the separation unit 4 is disposed adjacent to the heating unit 3 and on the downstream side thereof. That is, the separation unit 4 is disposed so that separation processing can be performed in a state where the printed circuit board 10 is heated to a predetermined temperature.
  • the separating unit 4 is provided with a hanging release unit 5 for separating the printed circuit board 10 from the transport unit 2 and dropping it. Further, below the suspension release portion 5, a throwing surface 6 is provided at a distance sufficient for the printed circuit board 10 to reach a predetermined speed.
  • the throwing surface 6 is configured using the bottom surface of the casing 1a, is made of metal and has a predetermined hardness, and is configured as a substantially horizontal surface.
  • the suspension release unit 5 is a wedge-shaped block structure disposed along the transport body 2 a.
  • the suspension release unit 5 is disposed immediately below the position through which the horizontal portion 2bh of the suspension support unit 2b passes, and contacts the back surface side of the printed substrate 10 being transported to carry out the printing.
  • the substrate 10 is moved in the horizontal direction (arrow R direction) orthogonal to the transport direction. That is, the lifting unit 5 is in contact with the printed circuit board 10 along the transport movement direction of the transport body 2a and pushes the printed circuit board 10 away from the suspension holder 2b along with the transport movement.
  • An inclined substrate pressing tapered surface 5t is provided. Therefore, the printed board 10 is pushed by the board pressing tapered surface 5t of the suspension release unit 5 only by being transported and moved, and is dropped from the horizontal portion 2bh and falls automatically.
  • the temperature of the region is set lower than that of the heating unit 3 because the separation unit 4 is substantially separated from the heating unit 3 by the partition wall 1 w.
  • the reason for this is that when the substrate body P collides with the projection surface 6 with the substrate body P standing substantially vertically, an impact is applied in the direction along the surface of the substrate body P.
  • the direction along the surface of the substrate body P is the direction in which the substantial rigidity of the substrate body P is the highest. By applying an impact in this direction, the substrate body P receives an impact with the least amount of deflection.
  • the substrate body P hardly bends and strikes the lower surface 6, its impact is strong (the negative acceleration with respect to the drop acceleration is large), and the substrate body P is instantaneously stopped falling and recoiled upward Bounce back to At this time, the electronic component EP moves downward due to the inertia in the falling direction, and most of the electronic components EP are separated or detached from the substrate body P by the first impact.
  • the electronic component EP is removed from the printed circuit board 10 by the drop impact. Can be separated instantly and easily. As a result, when the electronic component EP is separated from the printed circuit board 10, separation of the electronic component EP can be reliably performed without the need for a machine such as a vibrating device or a reversing device (device for reversing the printed substrate). The speed can be dramatically improved.
  • the conveyance part 2 is provided with the suspension holding part 2b which suspends the printed circuit board 10, the fall of the printed circuit board 10 can be made easy by simple structure.
  • the heating means can be disposed close to the printed circuit board 10 in the transport path, the heating efficiency can be improved, and the heating processing speed and the running cost can be reduced. be able to.
  • the horizontal portion 2bh of the suspension holding portion 2b is held so as to hook the printed circuit board 10, the printed circuit board 10 can be easily separated from the transport unit 2.
  • the suspending and releasing unit 5 includes the substrate pressing tapered surface 5t, it can be pushed out in a direction to separate the printed circuit board 10 from the horizontal portion 2bh of the suspended holding unit 2b as the printed circuit board 10 is transported and moved. The movement of the transport unit 2 can easily drop the printed circuit board 10 without the need for a complicated mechanism.
  • heating efficiency can be improved by performing heating in two steps, and heating by superheated steam after preheating is also possible.
  • high-speed and uniform heating can be performed by latent heat heating having a high heat transfer coefficient, and faster and more uniform heating can be performed as compared with the prior art. Therefore, the heat treatment can be speeded up to improve the productivity, and the running cost can be reduced.
  • the printed circuit board 10 is dropped during the heating process or after the heating process and a drop impact is applied to the printed circuit board 10 to separate the electronic component EP from the printed circuit board 10, the printed circuit board 10 is heated by dropping. Immediately after the connection means is melted, impact can be applied to the printed circuit board 10 easily and instantaneously, and separation of the electronic component EP from the printed circuit board 10 can be performed extremely easily and quickly. Moreover, since this separation process can be performed continuously, productivity can be remarkably improved.
  • the corner portion Pc of the printed circuit board 10 can be applied to the projection surface 6 at the time of drop, It can be effectively transmitted to the entire receiving printed circuit board 10 at the corner portion Pc. Further, according to the hanging and holding portion 2b of the printed circuit board 10, the heating means can be easily approached to the printed circuit board 10, and the heating efficiency can be enhanced.
  • the hanging and holding of the printed circuit board 10 utilizes the board mounting holes 10 h formed for screwing when the printed circuit board 10 is mounted on an electric product, there is no need to process the printed circuit board 10.
  • the corner portion Pc of the printed circuit board 10 can be hung downward.
  • the printed circuit board 10 is dropped from the transport unit 2 to the discharge surface 6 immediately after heating, but the printed circuit board 10 may be dropped during heating.
  • the heating unit 3 and the separation unit 4 are arranged in a straight line in the drawing, the conveyance unit 2 may be arranged in a loop and may be arranged along the loop shape. .
  • the air is blown from above to the printed circuit board 10 separated from the suspension holding portion 2b.
  • the configuration may be such that a greater acceleration is applied to the printed circuit board 10.
  • the hanging of the printed circuit board 10 in the transport unit 2 is carried in a single row, but may be carried in a plurality of rows.
  • the method of dropping the printed circuit board 10 in the above-described embodiment adopts a method of dropping and applying an impact while keeping the printed circuit board 10 in a substantially vertical state from a suspended holding state
  • the present invention is limited thereto.
  • the printed circuit board placed on the belt conveyor may be dropped to the side of the belt conveyor while being offset. That is, as long as the printed circuit board 10 is heated while being transported, and dropped from the transport unit 2 during or after heating, it belongs to the category of the present invention.
  • the present invention it is possible to easily separate an electronic component from a printed circuit board without requiring a complicated machine such as a vibration device, and to provide an electronic component separation device and an electronic component separation method with good heating efficiency. .

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processing Of Solid Wastes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne un dispositif de séparation de composant électronique 1 et un procédé de séparation de composant électronique, conçus de telle sorte que l'efficacité de chauffage est bonne, et un composant électronique peut être facilement séparé d'un substrat imprimé sans nécessiter de machinerie complexe telle qu'un équipement vibratoire. Le dispositif de séparation de composant électronique 1 comprend : une unité de transport 2 qui transporte un substrat imprimé 10 auquel est fixé un composant électronique EP ; une unité de chauffage 3 qui chauffe le substrat imprimé 10 pendant le transport par l'unité de transport 2 ; et une unité de séparation 4 qui amène le substrat imprimé 10 à tomber sur une surface de chute 6 au-dessous de l'unité de transport 2 à partir de l'unité de transport 2 pendant le chauffage ou après le chauffage, et qui sépare le composant électronique EP du substrat imprimé 10.
PCT/JP2018/002024 2017-01-30 2018-01-23 Dispositif de séparation de composant électronique et procédé de séparation de composant électronique Ceased WO2018139465A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017014698A JP6614583B2 (ja) 2017-01-30 2017-01-30 電子部品分離方法
JP2017-014698 2017-01-30

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WO2018139465A1 true WO2018139465A1 (fr) 2018-08-02

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WO (1) WO2018139465A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020105180A1 (de) 2020-02-27 2021-09-02 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer Lotverbindung, Verfahren zum Trennen zumindest eines Bauelements von einer Kontaktfläche, Leiterplatte und Feldgerät
TWI806766B (zh) * 2022-09-14 2023-06-21 光洋應用材料科技股份有限公司 積體電路元件拆分裝置
DE102023114319A1 (de) * 2023-05-31 2024-12-05 Endress+Hauser SE+Co. KG Verfahren und Anlage zum Trennen einer Baugruppe

Citations (6)

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Publication number Priority date Publication date Assignee Title
JPH08139446A (ja) * 1994-11-08 1996-05-31 Nec Corp 部品を搭載したプリント基板からの部品の解体方法
JPH08148823A (ja) * 1994-11-16 1996-06-07 Senju Metal Ind Co Ltd プリント基板から有価物を回収する方法及びその装置
JP2006196481A (ja) * 2005-01-11 2006-07-27 Canon Inc 電子回路ユニット
WO2007077594A1 (fr) * 2005-12-28 2007-07-12 Fujitsu Limited Dispositif et procede d'elimination de soudure
JP2012138397A (ja) * 2010-12-24 2012-07-19 Fuji Denki Thermosystems Kk プリント回路板の電子部品分離方法および分離装置
WO2013111206A1 (fr) * 2012-01-27 2013-08-01 パナソニック株式会社 Procédé de séparation/collecte de composants électroniques et appareil de séparation/collecte de composants électroniques

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Publication number Priority date Publication date Assignee Title
WO2015113272A1 (fr) * 2014-01-29 2015-08-06 Li Tong (H.K.) Telecom Company Limited Système et procédé pour extraire des composants électroniques

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139446A (ja) * 1994-11-08 1996-05-31 Nec Corp 部品を搭載したプリント基板からの部品の解体方法
JPH08148823A (ja) * 1994-11-16 1996-06-07 Senju Metal Ind Co Ltd プリント基板から有価物を回収する方法及びその装置
JP2006196481A (ja) * 2005-01-11 2006-07-27 Canon Inc 電子回路ユニット
WO2007077594A1 (fr) * 2005-12-28 2007-07-12 Fujitsu Limited Dispositif et procede d'elimination de soudure
JP2012138397A (ja) * 2010-12-24 2012-07-19 Fuji Denki Thermosystems Kk プリント回路板の電子部品分離方法および分離装置
WO2013111206A1 (fr) * 2012-01-27 2013-08-01 パナソニック株式会社 Procédé de séparation/collecte de composants électroniques et appareil de séparation/collecte de composants électroniques

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020105180A1 (de) 2020-02-27 2021-09-02 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer Lotverbindung, Verfahren zum Trennen zumindest eines Bauelements von einer Kontaktfläche, Leiterplatte und Feldgerät
TWI806766B (zh) * 2022-09-14 2023-06-21 光洋應用材料科技股份有限公司 積體電路元件拆分裝置
DE102023114319A1 (de) * 2023-05-31 2024-12-05 Endress+Hauser SE+Co. KG Verfahren und Anlage zum Trennen einer Baugruppe

Also Published As

Publication number Publication date
JP6614583B2 (ja) 2019-12-04
JP2018125355A (ja) 2018-08-09

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