WO2020132802A1 - Electronic component and manufacturing method thereof - Google Patents

Abstract

The present invention provides an electronic component and manufacturing method thereof. The manufacturing method of the electronic component includes the following steps: providing a rigid substrate (101); providing a pre-extended deformation layer on the rigid substrate; forming a functional layer on the deformation layer to obtain an electronic component (103); and separating the electronic component from the rigid substrate (105). The manufacturing method of the electronic component of the present invention has a simple preparation process.

Description

Electronic device and its manufacturing method Technical field

The invention relates to the technical field of electronic devices, in particular to an electronic device and a manufacturing method thereof.

Background technique

With the development of electronic technology, consumers' demands for electronic devices are becoming more diversified and personalized. The shape of the electronic device has also changed accordingly, that is, the original straight bar has gradually evolved into a folding type, a sliding cover type, etc., and there is a tendency to further evolve into a flexible or even elastic. The manufacturing method of the existing electronic device is to form a patterned wire on an elastic substrate, and then fix the chip on the substrate by transferring a stamp to connect with the wire. However, this manufacturing method is incompatible with existing manufacturing technologies such as semiconductors and display panels, resulting in low production efficiency.

Summary of the invention

In view of the above problems in the prior art, the present invention provides an electronic device with high production efficiency and a manufacturing method thereof.

In order to achieve the above objective, the embodiments of the present invention provide the following technical solutions:

In a first aspect, the present invention provides a method for manufacturing an electronic device, which includes the following steps:

Provide rigid substrate;

Setting a pre-extended deformation layer on the rigid substrate;

Forming a functional layer on the deformation layer to obtain an electronic device; and

The electronic device is separated from the rigid substrate.

In a second aspect, the present invention provides an electronic device including a deformation layer and a functional layer provided on the deformation layer, and after the deformation layer is pre-extended, the functional layer is laminated on the deformation layer .

In the method for manufacturing an electronic device of the present invention, a pre-stretched deformation layer is provided on the rigid substrate to fix the shape of the pre-stretched deformation layer, thereby reducing the complexity of manufacturing a functional layer on the pre-stretched deformation layer , And no additional fixtures are needed. Since the electronic device of the present invention is compatible with existing semiconductor, display panel and other manufacturing technologies, the production efficiency is improved.

BRIEF DESCRIPTION

In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, without paying any creative labor, other drawings can be obtained based on these drawings.

FIG. 1 is a flowchart of a method for manufacturing an electronic device provided by the first embodiment of the present invention.

2 is a schematic diagram of the manufacturing process of the electronic device provided by the first embodiment of the present invention.

FIG. 3 is a schematic diagram of the structure in which the deformation layer of the electronic device and the rigid substrate are bonded according to the first embodiment of the present invention.

4 is a flowchart of a method for manufacturing an electronic device provided by a second embodiment of the present invention.

5 is a schematic diagram of a manufacturing process of an electronic device provided by a second embodiment of the present invention.

6 is a flowchart of a method for manufacturing an electronic device provided by a third embodiment of the present invention.

7 is a flowchart of a method for manufacturing an electronic device provided by a fourth embodiment of the present invention.

Specific examples

The technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present invention.

Please refer to FIG. 1 and FIG. 2 together. FIG. 1 shows a flowchart of a method for manufacturing an electronic device according to a first embodiment of the present invention, and FIG. 2 shows a method for manufacturing an electronic device according to a first embodiment of the present invention. Schematic diagram of the manufacturing process of the device 50. The electronic device 50 includes a deformation layer 20 and a functional layer 40 disposed on the deformation layer. After the deformation layer 20 is pre-expanded, the functional layer 40 is laminated on the deformation layer 20. The manufacturing method of the electronic device includes the following steps.

Step 101: Provide a rigid substrate.

The rigid substrate 10 may be, but not limited to, a glass substrate, a metal substrate, or a ceramic substrate. Preferably, the rigid substrate 10 is a glass substrate. Specifically, the glass substrate is, for example, but not limited to soda lime glass, alkali-free glass, phosphate-based glass, or quartz. The rigid substrate 10 is used to support the electronic device 50 during the manufacturing process. The rigid substrate 10 is made of a transparent material so that the laser can irradiate the electronic device 50 through the rigid substrate 10 so that the electronic device 50 is peeled off the rigid substrate 10.

Step 103: Set a pre-extended deformation layer on the rigid substrate.

Understandably, the deformation layer 20 contains an elastomer. The elastomer is preferably a material whose internal polymer chain or lattice structure can be stretched under the action of external force. The elastomer is, for example, but not limited to one of natural rubber, synthetic rubber, thermoplastic elastomer, or a combination thereof. The natural rubber is, for example, polyisoprene. Synthetic rubbers include, but are not limited to polyisoprene, styrene-butadiene rubber, cis-butadiene rubber, neoprene rubber, nitrile rubber, butyl rubber, or silicone rubber. Thermoplastic elastomers include, but are not limited to styrene block copolymers, thermoplastic olefins, thermoplastic vulcanizates, thermoplastic polyurethanes, thermoplastic copolyesters, or thermoplastic polyamides.

As shown in FIGS. 2 and 3, in a specific embodiment, the pre-stretched deformation layer 20 is provided on the rigid substrate 10, which specifically includes: fixing the deformation layer 20 on the rigid substrate 10 through the bonding layer 30.

The rigid substrate 10 has a flat upper surface. The pre-extended deformation layer 20 has flat upper and lower surfaces. The lower surface of the pre-extended deformation layer 20 is bonded to the upper surface of the rigid substrate 10 through the bonding layer 30. Since the deformable layer 20 is fixed to the rigid substrate 10 through the bonding layer 30, the shape of the deformable layer 20 is fixed without using an additional traditional fixture, effectively using the existing display panel manufacturing technology, thereby reducing the subsequent The complexity of making a functional layer on the deformation layer 20. The bonding layer 30 is a pressure sensitive adhesive (PSA) layer, a viscosity reducing adhesive layer, or a sacrificial layer.

It can be understood that when the bonding layer 30 is a pressure-sensitive adhesive layer, the contact pressure of the pressure-sensitive adhesive layer formed on the rigid substrate 10 is adjusted to reduce the viscosity between the pressure-sensitive adhesive and the rigid substrate 10 to The deformation layer 20 and the rigid substrate 10 are separated, and the deformation layer 20 can be quickly peeled from the rigid substrate 10. The pressure-sensitive adhesive contains one or a combination of natural rubber, synthetic rubber, acrylic compound, silicone compound, and polyurethane compound.

When the bonding layer 30 is a viscosity-reducing adhesive layer, the viscosity-reducing adhesive layer is reduced in viscosity under preset processing conditions to achieve separation of the deformation layer 20 from the rigid substrate 10. For example, when the bonding layer 30 is exposed to heat, ultraviolet light irradiation, microwave irradiation, or the like, the adhesion of the adhesion-reducing adhesive layer decreases, so that the deformation layer 20 can be quickly peeled from the rigid substrate 10. The tackifier layer includes one of ultraviolet tackifier, heated tackifier or microwave tackifier or a combination thereof.

When the bonding layer 30 is a sacrificial layer, the sacrificial layer may be dissolved by liquid or gas to peel the deformation layer 20 from the rigid substrate 10. The sacrificial layer contains one or a combination of water-soluble materials, metal materials, or soluble gum materials. Water-soluble materials are, for example, but not limited to sugars or inorganic salts. The metal material is selected from metals soluble in acid, alkali, or salt solution. The soluble glue-like material is, for example, optically clear (OCA).

Before the deformation layer 20 is fixed on the rigid substrate 10 through the bonding layer 30, the manufacturing method further includes: deforming the deformation layer 20 in a preset direction to obtain a pre-extended deformation layer 20.

In a specific embodiment, deforming the deformation layer 20 along a preset direction to obtain the pre-extended deformation layer 20 includes: mechanically stretching the deformation layer 20 along the preset direction to obtain the pre-extended deformation layer 20.

Specifically, the preset direction is a direction in which the straight line passing through the geometric center of the deformation layer 20 stretches the deformation layer 20 in the opposite direction. The preset direction is parallel to the plane where the deformation layer 20 is located. That is, the deformation layer 20 is stretched symmetrically in different directions from its geometric center, so that the elastic body in the deformation layer 20 is balanced in force. The deformation layer 20 is substantially rectangular. The deformation layer 20 includes a first straight line L1 passing through the geometric center of the deformation layer 20, a second straight line L2 passing through the geometric center of the deformation layer 20 and perpendicular to the first straight line L1, and passing through the geometric center of the deformation layer 20 and passing The two third straight lines L3 of the two diagonals of the deformation layer 20. In the present embodiment, the deformation layer 20 is stretched on two opposite sides of the first straight line L1, the second straight line L2, and the two third straight lines L3. It can be understood that the first straight line L1 is the axis of symmetry of the deformation layer 20 in the horizontal direction, the second straight line L2 is the axis of symmetry of the deformation layer 20 in the vertical direction, and the third straight line L3 is the diagonal of the deformation layer 20. In other embodiments, the deformation layer 20 may also be stretched on opposite sides of the first straight line L1, the second straight line L2, the third straight line L3, and/or other straight lines passing through the geometric center of the deformable layer 20.

The deformation layer 20 may be stretched by a stretching device. After the deformation layer 20 is mechanically stretched in a predetermined direction, the elastic body in the pre-stretched deformation layer 20 generates tensile stress. In this embodiment, the deformation layer 20 and the rigid substrate 10 are stacked, and the direction of the tensile stress of the elastic body is opposite to the direction of the adhesion force of the elastic body to the bonding layer 30. Optionally, the area and shape of the deformed layer 20 after deformation are substantially the same as the area and shape of the rigid substrate 10, so that the deformation layer 20 is attached to the rigid substrate 10. The deformation of the deformation layer 20 is reversible, that is, the deformation of the deformation layer 20 can be restored under preset conditions.

Step 105, forming a functional layer on the deformation layer to obtain an electronic device.

The electronic device 50 includes a deformation layer 20 and a functional layer 40. The functional layer 40 is made of an elastic material or a flexible material to avoid the subsequent pre-expanded deformation layer 20 from breaking during relaxation. Specifically, the functional layer 40 includes, but is not limited to a microchip and a communication bus. The microchip is an electronic device with a specific function. The microchip is, for example, but not limited to an electronic device having a processing function, a storage function, a calculation function, a display function, a sensing function, or a communication function. The communication bus is used to realize the communication connection between these electronic devices. The electronic device 50 is, for example, a display panel. The display panel is, for example, but not limited to, a liquid crystal display (Liquid Crystal Display, LCD) panel, a quantum dot display (Quantum Dot Light Emitting Diodes, QLED) panel, an electronic paper (E-paper Display, EPD), and a touch screen (Touch panel), flexible solar cell (Page, View, PV) panel, radio frequency tag (Radio Frequency Identification, RFID) and other products or components with specific functions.

Step 107: Separate the electronic device from the rigid substrate.

Wherein, the method of separating the electronic device 50 from the rigid substrate 10 includes mechanical peeling, viscosity reduction treatment of the bonding layer, or etching the bonding layer. Specifically, in an embodiment, an external force is applied to the periphery of the rigid substrate 10 away from the deformation layer 20, so that the rigid substrate 10 is separated from the electronic device 50. In another embodiment, adjusting the contact pressure, heating, or irradiating the bonding layer 30 causes the viscosity of the bonding layer 30 to decrease, thereby separating the electronic device 50 and the rigid substrate 10. In other embodiments, an etching solution is applied to cause the bonding layer 30 to be dissolved, thereby separating the electronic device 50 and the rigid substrate 10.

It is understandable that the polymer chain or lattice structure inside the elastic body of the deformation layer 20 has a higher energy when it is in a stretched state and a lower energy when it is in a relaxed state. Therefore, in a natural state, the elastomer has a transition from a stretched state It is the trend of relaxation state. When the electronic device 50 is separated from the rigid substrate 10, the adhesive force of the elastic body of the deformation layer 20 disappears, so under the action of the tensile force of the elastic body, the deformation layer 20 drives the electronic device 50 to shrink naturally until the electronic device 50 is in a relaxed state Yu.

Optionally, the bonding layer 30 further contains a laser absorber, and the laser absorber is selected from the group consisting of salicylates, benzophenones, benzotriazoles, substituted acrylonitriles, and triazines. Or a combination of them. In this way, when the laser absorber in the bonding layer 30 can absorb laser light and reduce the viscosity of the bonding layer 30, the deformation layer 20 can be quickly peeled off from the rigid substrate 10.

Please refer to FIG. 4, which is a schematic flowchart of manufacturing an electronic device according to a second embodiment of the present invention. The manufacturing method of the electronic device includes the following steps:

Step 401, providing a rigid substrate.

Specifically, reference may be made to method step 101 in the embodiment of FIG. 1, and details are not described herein again.

Step 402, a deformation layer containing an elastomer is deposited on the rigid substrate.

In a specific embodiment, the deformation layer 20 containing an elastomer is deposited on the rigid substrate 10, which specifically includes: configuring a deposition solution containing the elastomer; applying on the entire deposition surface of the rigid substrate 10 The deposition liquid is cured under preset conditions. In this embodiment, the deposition liquid may be deposited by inkjet deposition or other deposition methods.

Step 403, pretreating the deformation layer to form a pre-extended deformation layer on the rigid substrate.

Among them, the elastic body in the pre-stretched deformation layer 20 generates tensile stress F, and the direction of the tensile stress F of the elastic body is opposite to the direction of the adhesive force of the elastic body, and the magnitude of the tensile stress F of the elastic body is equal to The adhesion of the elastic body is balanced, so that the deformation layer 20 is attached to the rigid substrate 10. In this way, the shape of the deformation layer 20 is fixed, which facilitates the subsequent provision of the functional layer 40 on the deformation layer 20.

In a specific embodiment, the pretreating the deformation layer to form a pre-extended deformation layer on the rigid substrate specifically includes:

The deformation layer 20 is baked and cured to form a pre-extended deformation layer 20 on the rigid substrate 10.

The baking and curing the deformation layer 20 to form a pre-extended deformation layer 20 on the rigid substrate 10 include:

Raise the baking temperature and/or extend the baking time until the tensile stress of the elastomer is approximately equal to the adhesion of the elastomer to the rigid substrate 10. In this way, the deformation layer 20 is fixed on the rigid substrate 10, that is, the deformation layer 20 cannot relax.

In another specific embodiment, the pretreatment of the deformation layer 20 to form a pre-extended deformation layer 20 on the rigid substrate 10 specifically includes:

Light cures the deformation layer to form a pre-extended deformation layer 20 on the rigid substrate 10.

The light curing the deformation layer 20 to form a pre-extended deformation layer 20 on the rigid substrate 10 includes:

Increase the light energy density and/or extend the light time until the tensile stress of the elastic body is approximately equal to the adhesion force of the elastic body to the rigid substrate 10.

Step 405, forming a functional layer on the pre-extended deformation layer to obtain an electronic device.

Specifically, reference may be made to method step 105 in the embodiment of FIG. 1, and details are not described herein again.

Step 407, separating the electronic device from the rigid substrate.

Specifically, reference may be made to method step 107 in the embodiment of FIG. 1, and details are not described herein again.

Please refer to FIG. 6, which is a schematic flowchart of manufacturing an electronic device according to a third embodiment of the present invention. The manufacturing method of the electronic device includes the following steps:

Step 601, providing a rigid substrate.

Specifically, reference may be made to method step 101 in the embodiment of FIG. 1, and details are not described herein again.

Step 602: Configure a liquid glue containing the elastomer.

Step 603: Apply the liquid glue on the rigid substrate in a preset direction and cure to form a pre-extended deformation layer on the rigid substrate.

Among them, the elastic body in the pre-stretched deformation layer 20 generates tensile stress. It can be understood that, when the liquid glue is applied on the rigid substrate 10 in a predetermined direction, the polymer chain inside the elastomer is driven to directionally stretch to enhance the tensile stress of the deformation layer 20 in a specific direction.

Step 605: Form a functional layer on the pre-extended deformation layer to obtain an electronic device.

Specifically, reference may be made to method step 105 in the embodiment of FIG. 1, and details are not described herein again.

Step 607: Separate the electronic device from the rigid substrate.

Specifically, reference may be made to method step 107 in the embodiment of FIG. 1, and details are not described herein again.

Please refer to FIG. 7, which is a schematic flowchart of manufacturing an electronic device according to a fourth embodiment of the present invention. The manufacturing method of the electronic device includes the following steps:

Step 701, providing a rigid substrate.

Specifically, reference may be made to method step 101 in the embodiment of FIG. 1, and details are not described herein again.

Step 702: Prepare the solid deformation layer containing an elastomer in advance.

In step 703, the deformation layer and the rigid substrate are laminated, pressed/heated and bonded to form a pre-extended deformation layer on the rigid substrate.

Among them, the elastic body in the pre-stretched deformation layer 20 generates tensile stress. It is understandable that the elastomer in the deformation layer 20 is stretched under heat or pressure, and the polymer chain or lattice structure inside the elastomer is stretched to increase the energy of the polymer chain or lattice structure, and the deformation layer 20 is in an extended state.

Step 705, forming a functional layer on the pre-extended deformation layer to obtain an electronic device.

Specifically, reference may be made to method step 105 in the embodiment of FIG. 1, and details are not described herein again.

Step 707: Separate the electronic device from the rigid substrate.

Specifically, reference may be made to method step 107 in the embodiment of FIG. 1, and details are not described herein again.

The manufacturing method of the electronic device of the present invention fixes the deformation layer on the rigid substrate, that is, the deformation layer can be attached to the rigid substrate to fix the shape of the deformation layer, thereby reducing the manufacturing function on the deformation layer The complexity of the layer, and no additional fixtures are needed. Because the electronic device of the present invention is compatible with existing semiconductor, display panel and other manufacturing technologies, and the manufacturing method is simple in preparation process, the production efficiency is improved, and it is suitable for large-scale production.

The above-mentioned embodiments do not constitute a limitation on the protection scope of the technical solution. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the foregoing embodiments should be included in the protection scope of the technical solution.

Claims (20)

An electronic device manufacturing method, characterized in that it includes the following steps: Provide rigid substrate; Setting a pre-extended deformation layer on the rigid substrate; Forming a functional layer on the deformation layer to obtain an electronic device; and The electronic device is separated from the rigid substrate. The method for manufacturing an electronic device according to claim 1, wherein the providing the pre-stretched deformation layer on the rigid substrate specifically comprises: fixing the deformation layer to the rigid substrate through a bonding layer on. The method of manufacturing an electronic device according to claim 2, wherein before the fixing the deformation layer on the rigid substrate via a bonding layer, the manufacturing method further comprises: Deforming the deformation layer along a preset direction to obtain a pre-extended deformation layer. The method for manufacturing an electronic device according to claim 3, wherein the deforming the deformation layer along a preset direction to obtain a pre-extended deformation layer specifically includes: mechanically pulling along the preset direction Stretching the deformation layer to obtain a pre-extended deformation layer, wherein the preset direction is a direction in which a straight line passing through the geometric center of the deformation layer stretches the deformation layer in the opposite direction. The method for manufacturing an electronic device according to claim 4, wherein after the deformation layer is mechanically stretched in the predetermined direction, the elastic body in the pre-extended deformation layer generates tensile stress. The method for manufacturing an electronic device according to claim 5, wherein the deformation layer and the rigid substrate are stacked and the direction of the tensile stress of the elastic body and the adhesion of the deformation layer The direction is opposite. The method for manufacturing an electronic device according to claim 2, wherein the bonding layer is a pressure-sensitive adhesive layer, an optical adhesive layer, a tackifying adhesive layer, or a sacrificial layer. The method for manufacturing an electronic device according to claim 7, wherein the viscosity reducing adhesive layer contains one or a combination of ultraviolet light viscosity reducing adhesive, heating viscosity reducing adhesive or microwave adhesive, The sacrificial layer includes one or a combination of water-soluble materials, metal materials, or soluble gum materials. The method for manufacturing an electronic device according to claim 1, wherein the provision of a pre-stretched deformation layer on the rigid substrate specifically includes: Depositing a deformation layer containing an elastomer on the rigid substrate; Pretreating the deformation layer to form a pre-stretched deformation layer on the rigid substrate, wherein the elastic body in the pre-stretched deformation layer generates tensile stress. The method for manufacturing an electronic device according to claim 9, wherein the pretreatment of the deformation layer to form a pre-extended deformation layer on the rigid substrate specifically includes: The deformation layer is baked and cured to form a pre-extended deformation layer on the rigid substrate. The method for manufacturing an electronic device according to claim 10, wherein the baking and curing the deformation layer to form a pre-extended deformation layer on the rigid substrate specifically include: Raise the baking temperature and/or extend the baking time until the tensile stress of the elastomer equals the adhesion of the elastomer to the rigid substrate. The method for manufacturing an electronic device according to claim 9, wherein the pretreatment of the deformation layer to form a pre-extended deformation layer on the rigid substrate specifically includes: Light cures the deformation layer to form a pre-extended deformation layer on the rigid substrate. The method for manufacturing an electronic device according to claim 12, wherein the light curing the deformation layer to form a pre-extended deformation layer on the rigid substrate, specifically comprising: Increasing the light energy density and/or extending the light time until the tensile stress of the elastomer is equal to the adhesion of the elastomer to the rigid substrate. The method for manufacturing an electronic device according to claim 1, wherein the provision of a pre-stretched deformation layer on the rigid substrate specifically includes: Configuring a liquid glue containing the elastomer; The liquid glue is coated on the rigid substrate in a predetermined direction and cured to form a pre-stretched deformation layer on the rigid substrate, wherein the elastic body in the pre-stretched deformation layer generates tensile stress. The method for manufacturing an electronic device according to claim 1, wherein the provision of the pre-stretched deformation layer on the rigid substrate specifically includes: Pre-preparing the solid deformation layer containing an elastomer; Laminating the deformation layer and the rigid substrate, and applying pressure/heating to bond to form a pre-stretched deformation layer on the rigid substrate, wherein the elastic body in the pre-stretched deformation layer is stretched stress. The method for manufacturing an electronic device according to any one of claims 8 to 15, wherein the elastomer is selected from one of natural rubber, synthetic rubber, and thermoplastic elastomer, or a combination thereof. The method for manufacturing an electronic device according to claim 16, wherein the natural rubber includes polyisoprene, and the synthetic rubber includes polyisoprene, styrene-butadiene rubber, cis-butadiene rubber, and neoprene rubber , Nitrile rubber, butyl rubber or silicone rubber, the thermoplastic elastomer includes styrene block copolymer, thermoplastic olefin, thermoplastic vulcanizate, thermoplastic polyurethane, thermoplastic copolyester or thermoplastic polyamide. The method for manufacturing an electronic device according to any one of claims 1 or 2, wherein the method of separating the electronic device from the rigid substrate includes mechanical peeling and viscosity reduction of the bonding layer The bonding layer is processed or etched. The method for manufacturing an electronic device according to claim 18, wherein the bonding layer further contains a laser absorber selected from the group consisting of salicylates, benzophenones, and benzene One or a combination of benzotriazoles, substituted acrylonitriles, triazines. An electronic device is characterized in that it includes a deformation layer and a functional layer provided on the deformation layer. After the deformation layer is pre-extended, the functional layer is laminated on the deformation layer.

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