WO2025090161A1

WO2025090161A1 - Roll-based thin film loading system for manufacturing

Info

Publication number: WO2025090161A1
Application number: PCT/US2024/042385
Authority: WO
Inventors: Shinobu Abe; Shinichi Kurita; Duoyan Shen; Yoshiharu Hirano
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2023-10-26
Filing date: 2024-08-15
Publication date: 2025-05-01
Anticipated expiration: 2026-04-26

Abstract

A method and apparatus for processing a thin film are provided. An example method includes disposing a first carrier on a base stage; disposing a first portion of the thin film above the first carrier; raising the base stage such that the first carrier contacts the thin film; chucking the first portion of the thin film to the first carrier; and cutting the first portion of the thin film away from a second portion of the thin film.

Description

ROLL-BASED THIN FILM LOADING SYSTEM FOR MANUFACTURING

BACKGROUND

Field

[0001] Embodiments of the present disclosure generally relate to systems and apparatus for manufacturing using thin film, and more specifically for loading a thin film into a process chamber.

Description of the Related Art

[0002] Thin films, such as polyethylene terephthalate (PET) films and colorless polyimide (CPI) films, find extensive applications in various industries, including lithium ion batteries for electric vehicles and energy storage applications. During chemical vapor deposition (CVD) processing of a thin film in a process chamber, it is desirable for the thin film to be forcefully held flat on a susceptor of the process chamber to avoid the surface of the film warping and/or forming waves. Therefore, techniques for holding thin films during processing are desirable.

SUMMARY

[0003] The present disclosure generally provides a system and apparatus for loading a thin film into a process chamber.

[0004] In one embodiment, a method for processing a thin film includes disposing a first carrier on a base stage; disposing a first portion of the thin film above the first carrier; raising the base stage such that the first carrier contacts the thin film; chucking the first portion of the thin film to the first carrier; and cutting the first portion of the thin film away from a second portion of the thin film.

[0005] In one embodiment, a system for processing a thin film includes a first roll operable to dispense the thin film; a second roll operable to take up the thin film; a base stage, disposed between the first roll and the second roll; at least one of: a probe operable to electrically charge one or more supporters on the first carrier to electrostatically chuck the first portion of the thin film to the first carrier; or a mask handling tool operable to place a mask on the first portion of the thin film to clamp the first portion of the thin film between the first carrier and the mask; and a cutter. The base stage is configured to support a first carrier and operable to raise the first carrier to contact a first portion of the thin film. The cutter is operable to cut the first portion of the thin film away from a second portion of the thin film.

[0006] In one embodiment, a carrier for processing a thin film includes a rigid substrate; and one or more supporters on the rigid substrate. The one or more supporters are operable to electrostatically chuck a first portion of the thin film to the carrier.

BRIEF DESCRIPTION OF THE DRAWINGS

[0007] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, may admit to other equally effective embodiments.

[0008] Figure 1 is a schematic diagram of a thin film processing system, according to embodiments of the present disclosure.

[0009] Figures 2A and 2B are a schematic top view and a schematic side view of a carrier, according to embodiments of the present disclosure.

[0010] Figures 3A and 3B are a schematic top view and a schematic side view of a film loading station before thin film is chucked to a carrier, according to embodiments of the present disclosure.

[0011] Figures 4A and 4B are a schematic top view and a schematic side view of the film loading station of Figures 3A-3B while thin film is being chucked to a carrier, according to embodiments of the present disclosure. [0012] Figures 5A and 5B are a schematic top view and a schematic side view of the film loading station of Figures 4A-4B while thin film is being cut, according to embodiments of the present disclosure.

[0013] Figures 6A and 6B are a schematic top view and a schematic side view of the film loading station of Figures 5A-5B after the base stage is lowered, according to embodiments of the present disclosure.

[0014] Figures 7A and 7B are a schematic top view and a schematic side view of the film loading station of Figures 6A-6B after the carrier 204 is removed, according to embodiments of the present disclosure.

[0015] Figures 8A, 8B, and 8C are a schematic top view and schematic sectional views of a carrier assembly, according to embodiments of the present disclosure.

[0016] Figures 9A and 9B are a schematic top view and a schematic side view of a film loading station before thin film is chucked to a carrier, according to embodiments of the present disclosure.

[0017] Figures 10A and 10B are a schematic top view and a schematic side view of the film loading station of Figures 9A-9B while thin film is being chucked to a carrier, according to embodiments of the present disclosure.

[0018] Figures 11 A and 11 B are a schematic top view and a schematic side view of the film loading station of Figures 10A-10B while thin film is being cut, according to embodiments of the present disclosure.

[0019] Figures 12A and 12B are a schematic top view and a schematic side view of the film loading station of Figures 11A-11 B after the base stage is lowered, according to embodiments of the present disclosure.

[0020] Figures 13A and 13B are a schematic top view and a schematic side view of the film loading station of Figures 12A-12B after the carrier assembly is removed, according to embodiments of the present disclosure. [0021] Figure 14 is a flow diagram of a method for processing a thin film, according to embodiments of the present disclosure.

[0022] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

DETAILED DESCRIPTION

[0023] The present disclosure provides systems and apparatus for loading a thin film into a process chamber. Thin films, such as PET films and CPI films, may be processed in vapor deposition chambers (e.g., chemical vapor deposition (CVD) chambers, plasma enhanced CVD (PECVD) chambers, and atomic layer deposition (ALD) chambers) and other process chambers to make components for batteries and electronic devices. The thin films may have a thickness of, for example, 50 micrometers or less. During processing of the thin film in a vapor deposition or other process chamber, it is desirable that the thin film be held flat and motionless, so as to prevent the film from forming waves or warping. A warped surface or waves in the surface of a thin film being processed may result in defects in deposited layers on the thin film and the thin film being unusable.

[0024] Embodiments of the present disclosure provide carriers for holding thin films during processing in a vapor deposition or other processing chamber. A thin film may be chucked (i.e., held securely) flat on the carriers by pads which electrostatically chuck the thin film to the carrier and/or by a frame which is held to the carrier by magnets and/or mechanical clamps.

[0025] Embodiments of the present disclosure provide a film loading station for loading thin films onto a carrier. The film loading station may include a roll operable to dispense thin film, another roll operable to take up the thin film, and a base stage between the rolls and operable to support and raise a first carrier to contact a first portion of the thin film. The film loading station further includes at least one of a probe to electrically charge supporters on the carrier or a mask handling tool operable to place a mask on the first portion of the thin film and clamp the first portion of the thin film to the carrier. The film loading station further includes a cutter operable to cut the first portion of the thin film away from a second portion of the thin film.

[0026] Embodiments of the present disclosure provide a system for processing a thin film. The system includes a film loading station, a vapor deposition chamber or another processing chamber, and a carrier handling robot operable to place a first carrier with a first portion of the thin film in the vapor deposition chamber or the other processing chamber. The system may also include a probe operable to electrically discharge one or more supporters on the carrier or a mask handling tool operable to remove a mask from the carrier. The system may further include a second carrier operable to vacuum chuck the first portion of the thin film and to remove the first portion of the thin film from the first carrier.

[0027] Figure 1 is a schematic diagram of a thin film processing system 100, according to embodiments of the present disclosure. The thin film processing system 100 includes a film loading station 110, a loader 130, a loadlock 140, a transfer chamber (TC) 150, one or more process chambers 160 and a film unloading station 170. During processing of a thin film 102, a first portion 106 of the thin film 102 is chucked on a carrier 104 in the film loading station 110. The first portion 106 of the thin film 102 may be electrostatically chucked to the carrier 104, as described below with reference to Figures 2A-2B. Additionally or alternatively, the first portion 106 of the thin film 102 may be chucked to the carrier 104 by being clamped between a mask and the carrier 104, as described below with reference to Figures 8A-8C. The first portion 106 of the thin film 102 may be cut away from a second portion 108 of the thin film 102 in the film loading station 110, as described below with reference to Figures 5A-5B and 11A-11 B. After the first portion 106 of the thin film 102 is cut away from the second portion 108 of the thin film 102, the carrier 104 and the first portion 106 of the thin film 102 may be removed from the film loading station 110. Then, a take-up roll 112 may rotate to take-up the second portion 108 of the thin film 102, and a dispenser roll 114 may dispense additional thin film 102 in preparation for loading a new first portion 106 of the thin film 102 onto another carrier 104.

[0028] During processing of the thin film 102 in the thin film processing system 100, the carrier 104 and the first portion 106 of the thin film 102 are moved to various locations by one or more of a first carrier handling robot 132 and a second carrier handling robot 152. For example, the carrier 104 and the first portion 106 of the thin film 102 may be moved by the first carrier handling robot 132 from the film loading station 110 into the loader 130, from the loader 130 into the loadlock 140, and from the loadlock 140 to the film unloading station 170. In another example, the carrier 104 and the first portion 106 of the thin film 102 may be moved by the second carrier handling robot 152 from the loadlock 140 into the transfer chamber 150, from the transfer chamber 150 into the process chamber 160, from the process chamber 160 into the transfer chamber 150, and from the transfer chamber 150 into the loadlock 140.

[0029] When the carrier 104 and the first portion 106 of the thin film 102 are moved to the film unloading station 170, the first portion 106 of the film 102 may be dechucked from the carrier 104. The first portion 106 of the thin film 102 may then be unloaded from the carrier 104 by another carrier 172 with a vacuum chuck.

[0030] Figures 2A and 2B are a schematic top view 200 and a schematic side view 250 of a carrier 204, according to embodiments of the present disclosure. The carrier 204 may be an example of the carrier 104, shown in Figure 1. The carrier 204 includes a rigid substrate 210 and one or more supporters 220 embedded in the rigid substrate 210. In some embodiments, the rigid substrate 210 may comprise glass, ceramic, carbon composite, Invar, and/or titanium. In some embodiments, a rigid substrate 210 made of titanium may expand a small amount when exposed to higher temperatures (e.g., 80-100°C) in a process chamber (e.g., process chamber 160, shown in Figure 1 ), and the expansion of the rigid substrate 210 may place the first portion 106 (see Figure 1 ) of the thin film 102 (see Figure 1 ) under additional tension, which may improve the yield of the processes performed on the first portion 106 of the thin film 102 in the process chamber. [0031] A process for operating a film loading station 110 (see Figure 1 ) to load a first portion 106 (see Figure 1 ) of a thin film 102 (see Figure 1 ) onto a carrier 204 (see Figures 2A-2B) will now be described with reference to Figures 3A-3B through 7A-7B.

[0032] Figure 3A is a top schematic view 300 of a film loading station 110 before thin film is chucked to a carrier, according to embodiments of the present disclosure. As illustrated, a thin film 102 is supported by a take-up roll 112 and a dispenser roll 114. A carrier 204 is supported between the take-up roll 112 and the dispenser roll 114 by a base stage 310.

[0033] Figure 3B is a side schematic view 350 of the film loading station 110 shown in Figure 3A, according to embodiments of the present disclosure. Rotation of the dispenser roll 114 while the dispenser roll 114 is dispensing an uncut portion of the thin film 102, to be positioned above the carrier 204, is shown. Rotation of the take-up roll 112, to take up a second portion 108 (see Figure 1 ) of the thin film 102 after a first portion of the thin film 102 has been cut away, is also shown.

[0034] Figure 4A is a top schematic view 400 of the film loading station 110 of Figures 3A-3B while thin film is being chucked to a carrier, according to embodiments of the present disclosure. At this time during the operation of the film loading station 110, the base stage 310 is raised (not visible in Figure 4A, see Figure 4B).

[0035] Figure 4B is a side schematic view 450 of the film loading station 110 shown in Figure 4A, according to embodiments of the present disclosure. The base stage 310 has been raised at this time during operation of the film loading station 110, raising the carrier 204 and causing the carrier 204 to contact the thin film 102. In some embodiments, tension in the thin film 102 may increase due to the upward movement of the carrier 204. At this time during the operation of the film loading station 110, one or more charging devices 460, which may include probes, charge the one or more supporters 220 of the carrier 204. When charged, the supporters 220 act to electrostatically chuck the thin film 102 to the carrier 204. [0036] Figure 5A is a top schematic view 500 of the film loading station 110 of Figures 4A-4B while thin film is being cut, according to embodiments of the present disclosure. At this time during the operation of the film loading station 110, a cutter (not visible in Figure 5A, see Figure 5B) cuts the first portion 106 of the thin film 102 away from the second portion 108 of the thin film 102.

[0037] Figure 5B is a side schematic view 550 of the film loading station 110 shown in Figure 5A, according to embodiments of the present disclosure. The base stage 310 remains raised at this time during operation of the film loading station 110. At this time during operation of the film loading station 110, one or more cutters 560 cut the first portion 106 of the thin film 102 away from the second portion 108 of the thin film 102. The one or more cutters 560 may be a laser cutter in some embodiments of the present disclosure.

[0038] Figure 6A is a top schematic view 600 of the film loading station 110 of Figures 5A-5B after the base stage is lowered, according to embodiments of the present disclosure. At this time during the operation of the film loading station 110, the base stage 310 is lowered (not visible in Figure 6A, see Figure 6B).

[0039] Figure 6B is a side schematic view 650 of the film loading station 110 shown in Figure 6A, according to embodiments of the present disclosure. At this time during the operation of the film loading station 110, the base stage 310 is lowered. The first portion 106 of the thin film 102 is electrostatically chucked to the carrier 204 by the supporters 220.

[0040] Figure 7A is a top schematic view 700 of the film loading station 110 of Figures 6A-6B after the carrier 204 is removed, according to embodiments of the present disclosure. At this time during the operation of the film loading station 110, the carrier 204 has been removed from the film loading station 110, e.g., for processing in the process chamber 160 (see Figure 1 ).

[0041] Figure 7B is a side schematic view 750 of the film loading station 110 shown in Figure 7A, according to embodiments of the present disclosure. As described above, at this time during the operation of the film loading station 110, the carrier 204 (not shown, see Figures 3A though 6B) has been removed from the film loading station 110. After the carrier 204 has been removed from the film loading station, as shown in Figures 7A and 7B, a new carrier 204 (or the same carrier 204) may be placed on the base stage 310, as illustrated in Figures 3A and 3B. Additionally, the take-up roll 112 and the dispenser roll 114 may be rotated to cause a new portion of the thin film 102 to be positioned above the carrier 204, as illustrated in Figures 3A and 3B.

[0042] Figures 8A, 8B, and 8C are a schematic top view 800 and schematic sectional views 850 and 870 of a carrier assembly 804, according to embodiments of the present disclosure. The carrier assembly 804 may be an example of the carrier 104, shown in Figure 1. The carrier assembly 804 includes a rigid substrate 810 and a mask 830 that may be removable attached to the rigid substrate 810. In some embodiments, the rigid substrate 810 may comprise glass, ceramic, carbon composite, Invar, and/or titanium. In embodiments, the mask 830 may comprise the same material as the rigid substrate 810. In some embodiments, the mask 830 has beams 832a, 832b and open areas 834a, 834b. Portions of the rigid substrate 810 are visible in Figure 8A via the open areas 834a, 834b. In some embodiments, a rigid substrate 810 and a mask 830 made of titanium may expand a small amount when exposed to higher temperatures (e.g., 80 to 100°C) in a process chamber (e.g., process chamber 160, shown in Figure 1 ), and the expansion of the rigid substrate 810 and the mask 830 may place the first portion 106 (see Figure 1 ) of the thin film 102 (see Figure 1 ) under additional tension, which may improve the yield of the processes performed on the first portion 106 of the thin film 102 in the process chamber.

[0043] As illustrated in Figure 8B, the mask 830 may be removably attached to the rigid substrate 810 by one or more magnets 852a, 852b and 854a, 854b. The magnets 852a, 852b and 854a, 854b may act to removably attach the mask 830 to the rigid substrate 810. Additionally or alternatively, one or more of the magnets 852a, 852b and 854a, 854b may be metallic pads that may be attracted to corresponding magnets 852a, 852b and 854a, 854b in the mask 830 or the rigid substrate 810. [0044] While Figure 8B illustrates the mask 830 being removably attached to the rigid substrate 810 by magnets 852a, 852b and 854a, 854b, the present disclosure is not limited to such embodiments, and the mask 830 may be removably attached to the rigid substrate 810 by clamps, clips, or other means.

[0045] A process for operating a film loading station 110 (see Figure 1 ) to load a first portion 106 (see Figure 1) of a thin film 102 (see Figure 1 ) onto a carrier assembly 804 (see Figures 8A-8C) will now be described with reference to Figures 9A-9B through 13A-13B.

[0046] Figure 9A is a top schematic view 900 of a film loading station 110 before a thin film is chucked to a carrier, according to embodiments of the present disclosure. As illustrated, a thin film 102 is supported by a take-up roll 112 and a dispenser roll 114. A rigid substrate 810 is supported between the take-up roll 112 and the dispenser roll 114 by a base stage 310.

[0047] Figure 9B is a side schematic view 950 of the film loading station 110 shown in Figure 9A, according to embodiments of the present disclosure. Rotation of the dispenser roll 114 while the dispenser roll 114 is dispensing an uncut portion of the thin film 102, to be positioned above the rigid substrate 810, is shown. Rotation of the take-up roll 112, to take up a second portion 108 (see Figure 1) of the thin film 102 after a first portion of the thin film 102 has been cut away, is also shown. As illustrated, a mask handling tool 952 supports the mask 830 above the thin film 102.

[0048] Figure 10A is a top schematic view 1000 of the film loading station 110 of Figures 9A-9B while thin film is being chucked to a carrier, according to embodiments of the present disclosure. At this time during the operation of the film loading station 110, the base stage 310 is raised (not visible in Figure 10A, see Figure 10B), and the mask handling tool 952 (not visible in Figure 10A, see Figure 9B) has lowered the mask 830 onto the film 102, such that the mask 830 clamps a first portion 106 of the thin film 102 between the mask 830 and the rigid substrate 810 (not visible in Figure 10A, see Figure 10B). [0049] Figure 10B is a side schematic view 1050 of the film loading station 110 shown in Figure 10A, according to embodiments of the present disclosure. The base stage 310 has been raised at this time during operation of the film loading station 110, raising the rigid substrate 810 and causing the rigid substrate 810 to contact the thin film 102. In some embodiments, tension in the thin film 102 may increase due to the upward movement of the rigid substrate 810. Also at this time during the operation of the film loading station 110, and as described above, the mask handling tool 952 (not visible in Figure 10B, see Figure 9B) has lowered the mask 830 onto the film 102, such that the mask 830 clamps a first portion 106 of the thin film 102 between the mask 830 and the rigid substrate 810.

[0050] Figure 11A is a top schematic view 1100 of the film loading station 110 of Figures 10A-10B while thin film is being cut, according to embodiments of the present disclosure. At this time during the operation of the film loading station 110, a cutter (not visible in Figure 11A, see Figure 11 B) cuts the first portion 106 of the thin film 102 away from the second portion 108 of the thin film 102.

[0051] Figure 11 B is a side schematic view 1150 of the film loading station 110 shown in Figure 11 A, according to embodiments of the present disclosure. The base stage 910 remains raised at this time during operation of the film loading station 110. At this time during operation of the film loading station 110, one or more cutters 1160 cut the first portion 106 of the thin film 102 away from the second portion 108 of the thin film 102. The one or more cutters 1160 may include one or more laser cutters in some embodiments of the present disclosure.

[0052] Figure 12A is a top schematic view 1200 of the film loading station 110 of Figures 11A-11 B after the base stage is lowered, according to embodiments of the present disclosure. At this time during the operation of the film loading station 110, the base stage 910 is lowered (not visible in Figure 12A, see Figure 12B).

[0053] Figure 12B is a side schematic view 1250 of the film loading station 110 shown in Figure 12A, according to embodiments of the present disclosure. At this time during the operation of the film loading station 110, the base stage 910 is lowered. The first portion 106 of the thin film 102 is chucked to the carrier assembly 804 by being clamped between the mask 830 and the rigid substrate 810.

[0054] Figure 13A is a top schematic view 1300 of the film loading station 110 of Figures 12A-12B after the carrier assembly 804 is removed, according to embodiments of the present disclosure. At this time during the operation of the film loading station 110, the carrier assembly 804 (not shown, see Figures 9A though 12B) has been removed from the film loading station 110, e.g., for processing in the process chamber 160 (see Figure 1 ).

[0055] Figure 13B is a side schematic view 1350 of the film loading station 110 shown in Figure 13A, according to embodiments of the present disclosure. As described above, at this time during the operation of the film loading station 110, the carrier assembly 804 (not shown, see Figures 9A though 12B) has been removed from the film loading station 110. After the carrier assembly 804 has been removed from the film loading station, as shown in Figures 13A and 13B, a new rigid substrate 810 (or the same rigid substrate 810) may be placed on the base stage 910, as illustrated in Figures 9A and 9B. Additionally, a new mask 830 (or the same mask 830) may be positioned above the thin film 102 by the mask handling tool 952, as shown in Figure 9B. Also, the take-up roll 112 and the dispenser roll 114 may be rotated to cause a new portion of the thin film 102 to be positioned above the rigid substrate 810, as illustrated in Figures 9A and 9B.

[0056] Figure 14 is a flow diagram of a method 1400 for processing a thin film, such as the thin film 102, as described herein.

[0057] Operation 1402 includes disposing a first carrier on a base stage. For example, carrier 204 may be disposed on base stage 310 by carrier handling robot 132.

[0058] Operation 1404 includes disposing a first portion of the thin film above the first carrier. Continuing the example, take-up roll 112 may rotate to take up thin film 102 while dispenser roll 114 rotates to dispense the thin film 102 and dispose a first portion 106 of the thin film 102 above the carrier 204. [0059] Operation 1406 includes raising the base stage such that the first carrier contacts the thin film. Continuing the example, the base stage 310 is raised such that the carrier 204 contacts the thin film 102.

[0060] Operation 1408 includes chucking the first portion of the thin film to the first carrier. Continuing the example, supporters 220 of the carrier 204 may be electrically charged, such that the thin film 102 is electrostatically chucked to the first carrier 204.

[0061] Operation 1410 includes cutting the first portion of the thin film away from a second portion of the thin film. Continuing the example, one or more cutters 560 cut the first portion 106 of the thin film 102 away from a second portion 108 of the thin film 102.

[0062] Optional operation 1412 includes lowering the base stage. Continuing the example, the base stage 310, which supports the carrier 204 having the first portion 106 of the thin film 102 chucked to the carrier 204, is lowered.

[0063] Optional operation 1414 includes removing the first carrier, with the first portion of the thin film, from the base stage. Continuing the example, the carrier 204 having the first portion 106 of the thin film 102 chucked to the carrier 204 is removed, e.g., by the first carrier handling robot 132, from the film loading station 110.

[0064] Optional operation 1416 includes rotating a take-up roll such that the second portion of the thin film is wrapped around the take-up roll and a third portion of the thin film is disposed above the base stage. Continuing the example, the takeup roll 112 is rotated such that the second portion 108 of the thin film 102 is wrapped around the take-up roll 112 and a third portion of the thin film 102 is disposed above the base stage 310.

[0065] Optional operation 1418 includes placing the first carrier and the first portion of the thin film into a process chamber. Continuing the example, the carrier 204 and the first portion 106 of the thin film 102, which is chucked to the carrier 204, are placed into a process chamber 160. [0066] Optional operation 1420 includes performing a vapor deposition process on the first portion of the thin film in the process chamber. Continuing the example, a chemical vapor deposition process is performed on the first portion 106 of the thin film 102 in the process chamber 160.

[0067] In aspects of the present disclosure, raising the base stage as in operation 1406 includes placing the thin film under tension.

[0068] In aspects of the present disclosure, method 1400 may further include dechucking the first portion of the thin film from the first carrier; vacuum chucking the first portion of the thin film to a second carrier; and removing the first portion of the thin film from the first carrier.

[0069] In aspects of the present disclosure, method 1400 may further include disposing the first carrier on the base stage after removing the first portion of the thin film from the first carrier.

[0070] In aspects of the present disclosure, dechucking the first portion of the thin film may include electrically discharging one or more supporters on the first carrier, wherein the one or more supporters are operable to electrostatically dechuck the first portion of the thin film from the first carrier when the one or more supporters are electrically discharged.

[0071] In aspects of the present disclosure, chucking the first portion of the thin film to the first carrier comprises electrically charging one or more supporters on the first carrier, wherein the one or more supporters are operable to electrostatically chuck the first portion of the thin film to the first carrier when the one or more supporters are electrically charged.

[0072] In aspects of the present disclosure, chucking the first portion of the thin film to the first carrier comprises clamping the first portion of the thin film between the first carrier and a mask.

[0073] In aspects of the present disclosure, method 1400 may further include lowering the mask onto the first portion of the thin film. [0074] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

What is claimed is:

1 . A method for processing a thin film, comprising: disposing a first carrier on a base stage; disposing a first portion of the thin film above the first carrier; raising the base stage such that the first carrier contacts the thin film; chucking the first portion of the thin film to the first carrier; and cutting the first portion of the thin film away from a second portion of the thin film.

2. The method of claim 1 , wherein raising the base stage comprises placing the thin film under tension.

3. The method of claim 1 , further comprising: lowering the base stage; and removing the first carrier, with the first portion of the thin film, from the base stage.

4. The method of claim 3, further comprising rotating a take-up roll to wrap the second portion of the thin film around the take-up roll and dispose a third portion of the thin film above the base stage.

5. The method of claim 3, further comprising: placing the first carrier and the first portion of the thin film into a process chamber; and performing a vapor deposition process on the first portion of the thin film in the process chamber.

6. The method of claim 3, further comprising: dechucking the first portion of the thin film from the first carrier; vacuum chucking the first portion of the thin film to a second carrier; and removing the first portion of the thin film from the first carrier.

7. The method of claim 6, further comprising disposing the first carrier on the base stage after removing the first portion of the thin film from the first carrier.

8. The method of claim 6, wherein dechucking the first portion of the thin film comprises electrically discharging one or more supporters on the first carrier.

9. The method of claim 1 , wherein chucking the first portion of the thin film to the first carrier comprises electrically charging one or more supporters on the first carrier.

10. The method of claim 1 , wherein chucking the first portion of the thin film to the first carrier comprises clamping the first portion of the thin film between the first carrier and a mask.

11 . The method of claim 10, further comprising lowering the mask onto the first portion of the thin film.

12. A system for processing a thin film, comprising: a first roll operable to dispense the thin film; a second roll operable to take up the thin film; a base stage, disposed between the first roll and the second roll configured to support a first carrier and operable to raise the first carrier to contact a first portion of the thin film; at least one of: a probe operable to electrically charge one or more supporters on the first carrier to electrostatically chuck the first portion of the thin film to the first carrier; or a mask handling tool operable to place a mask on the first portion of the thin film to clamp the first portion of the thin film between the first carrier and the mask; and a cutter operable to cut the first portion of the thin film away from a second portion of the thin film.

13. The system of claim 12, wherein the base stage is further operable to cause the first carrier to place the thin film under tension when the first carrier contacts the first portion of the thin film.

14. The system of claim 12, further comprising: a vapor deposition chamber; and a carrier handling robot operable to place the first carrier with the first portion of the thin film in the vapor deposition chamber.

15. The system of claim 14, comprising the probe and further comprising: an additional probe operable to electrically discharge the one or more supporters on the first carrier; and a second carrier operable to: vacuum chuck the first portion of the thin film; and remove the first portion of the thin film from the first carrier.

16. The system of claim 15, wherein the carrier handling robot is further operable to place the first carrier on the base stage after the first portion of the thin film is removed from the first carrier.

17. The system of claim 14, comprising the mask handling tool and further comprising a second carrier operable to: vacuum chuck the first portion of the thin film; and remove the first portion of the thin film from the first carrier.

18. The system of claim 17, wherein the carrier handling robot is further operable to place the first carrier on the base stage after the first portion of the thin film is removed from the first carrier.

19. A carrier for processing a thin film, comprising: a rigid substrate; and one or more supporters on the rigid substrate and operable to electrostatically chuck a first portion of the thin film to the carrier.

20. The carrier of claim 19, wherein the rigid substrate comprises at least one of glass, ceramic, carbon composite, INVAR, or titanium.