[go: up one dir, main page]

Ng, 2005 - Google Patents

Measurement and modeling of fluid pressures in chemical mechanical polishing

Ng, 2005

View PDF
Document ID
7631600618553400505
Author
Ng S
Publication year

External Links

Snippet

A theory of the sub-ambient fluid pressure phenomenon observed during the wet sliding of a disk on a polymeric pad is presented. Two-dimensional fluid pressure mapping using membrane pressure sensors reveals a large, asymmetrical sub-ambient pressure region …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices

Similar Documents

Publication Publication Date Title
Fu et al. A plasticity-based model of material removal in chemical-mechanical polishing (CMP)
US6458013B1 (en) Method of chemical mechanical polishing
Liang et al. Wear phenomena in chemical mechanical polishing
Evans et al. Material removal mechanisms in lapping and polishing
Seok et al. Multiscale material removal modeling of chemical mechanical polishing
Suratwala et al. Microscopic removal function and the relationship between slurry particle size distribution and workpiece roughness during pad polishing
Oh et al. An integrated material removal model for silicon dioxide layers in chemical mechanical polishing processes
Moon Mechanical aspects of the material removal mechanism in chemical mechanical polishing (CMP)
Saka et al. Nano-scale scratching in chemical–mechanical polishing
Che et al. A scratch intersection model of material removal during chemical mechanical planarization (CMP)
Wei et al. Analyses and experimental confirmation of removal performance of silicon oxide film in the chemical–mechanical polishing (CMP) process with pattern geometry of concentric groove pads
Pal et al. Material removal characteristics of full aperture optical polishing process
Kenchappa et al. Soft chemical mechanical polishing pad for oxide CMP applications
Xu et al. Progress in material removal mechanisms of surface polishing with ultra precision
Jiang et al. A chemical mechanical polishing model based on the viscous flow of the amorphous layer
US6947862B2 (en) Method for simulating slurry flow for a grooved polishing pad
Ng Measurement and modeling of fluid pressures in chemical mechanical polishing
Shan et al. Mechanical interactions and their effects on chemical mechanical polishing
Cook CMP consumables II: pad
Lu et al. The effect of wafer shape on slurry film thickness and friction coefficients in chemical mechanical planarization
Lin et al. Analysis of the tribological mechanisms arising in the chemical mechanical polishing of copper-film wafers
Shan Mechanical interactions at the interface of chemical mechanical polishing
Chang et al. Contact mechanics of superfinishing
Mahajan Fundamental studies on silicon dioxide chemical mechanical polishing
Muldowney et al. Characterization of CMP pad surface texture and pad-wafer contact