CN104183560B - Capacitive fingerprint sensor package structure and the method for encapsulation - Google Patents
Capacitive fingerprint sensor package structure and the method for encapsulation Download PDFInfo
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- CN104183560B CN104183560B CN201410424303.6A CN201410424303A CN104183560B CN 104183560 B CN104183560 B CN 104183560B CN 201410424303 A CN201410424303 A CN 201410424303A CN 104183560 B CN104183560 B CN 104183560B
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- 238000005538 encapsulation Methods 0.000 title abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 45
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000011241 protective layer Substances 0.000 claims description 45
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- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
Abstract
The present invention provides a kind of capacitive fingerprint sensor package structure and the method for encapsulation, and capacitive fingerprint sensor package structure includes：The chip of individual packages；Fingerprint sensing element, is arranged on above the chip and is electrically connected with the chip；Substrate, is arranged on the beneath chips, and the substrate is electrically connected with the fingerprint sensing element by tin ball, and the substrate is electrically connected by tin ball and the fingerprint sensing element with the chip.According to the capacitive fingerprint sensor package structure of the present invention and the method for encapsulation, by the way that fingerprint sensing element and chip are separated, then it is electrically connected, so reduces the surface area of whole fingerprint sensor package structure.
Description
Technical field
The present invention relates to bio-identification module packaging technology, more particularly to a kind of capacitive fingerprint sensor package structure
And the method for encapsulation.
Background technology
Fingerprint identification device has been widely used for various terminal equipment, such as mobile terminal, banking system, attendance checking system
Etc..
Fingerprint identification device of the prior art includes fingerprint recognition sensing chip, control chip and substrate, wherein, refer to
Line recognizes that sensing chip and control chip are produced on same substrate, this clearly increases the area of substrate, and then adds
The whole surface area of fingerprint identification device.Downsizing so to terminal device is very unfavorable.
The content of the invention
The present invention provides a kind of capacitive fingerprint sensor package structure and the method for encapsulation, to solve in the prior art
Fingerprint identification device causes the problem of surface area is larger because substrate area is larger.
One side of the invention provides a kind of capacitive fingerprint sensor package structure, including：
The chip of individual packages；
Fingerprint sensing element, is arranged on above the chip and is electrically connected with the chip；
Substrate, is arranged on the beneath chips, the substrate is electrically connected with the fingerprint sensing element by tin ball, and institute
Substrate is stated to electrically connect with the chip by tin ball and the fingerprint sensing element.
Another aspect of the invention provides a kind of method of capacitive fingerprint sensor package, including：
By the chip of individual packages and the welding of fingerprint sensing element by weld tabs, make the chip and the fingerprint sense
Answer electrical connection between element；
Substrate and the fingerprint sensing element are connected by soldered ball, so that the substrate and fingerprint sensing element electricity
Connection, wherein, chip is located between the fingerprint sensing element and the substrate, and the substrate passes through tin ball and the fingerprint sense
Element is answered to be electrically connected with the chip.
As shown from the above technical solution, the present invention is provided capacitive fingerprint sensor package structure and the side of encapsulation
Method, by the way that fingerprint sensing element and chip are separated, then is electrically connected, so reduces whole fingerprint sensor package structure
Surface area, and then beneficial to terminal device miniaturization.
Brief description of the drawings
Figure 1A is the schematic diagram of the capacitive fingerprint sensor package structure according to one embodiment of the invention；
Figure 1B be fingerprint sensor package structure in fingerprint sensing element concrete structure schematic diagram；
The schematic diagram of Fig. 2 capacitive fingerprint sensor package structures according to another embodiment of the present invention；
Fig. 3 is according to the schematic diagram of the capacitive fingerprint sensor package structure of further embodiment of this invention；
The schematic diagram of the capacitive fingerprint sensor package structures of Fig. 4 according to yet another embodiment of the invention；
The schematic diagram of Fig. 5 capacitive fingerprint sensor package structures according to another embodiment of the present invention；
Fig. 6 is according to the schematic diagram of the capacitive fingerprint sensor package structure of further embodiment of this invention；
The schematic diagram of the capacitive fingerprint sensor package structures of Fig. 7 according to yet another embodiment of the invention；
The schematic diagram of Fig. 8 capacitive fingerprint sensor package structures according to another embodiment of the present invention
Fig. 9 is according to the schematic diagram of the capacitive fingerprint sensor package structure of further embodiment of this invention；
The schematic diagram of the capacitive fingerprint sensor package structures of Figure 10 according to yet another embodiment of the invention；
The schematic diagram of Figure 11 capacitive fingerprint sensor package structures according to another embodiment of the present invention；
The schematic flow sheet of the method for the capacitive fingerprint sensor packages of Figure 12 according to yet another embodiment of the invention.
Embodiment
The present embodiment provides a kind of capacitive fingerprint sensor package structure, the capacitive fingerprint sensor package knot
Structure can be specifically arranged in fingerprint identification device.The fingerprint identification device is used for the fingerprint for recognizing user.
As shown in Figure 1A, it is the schematic diagram of capacitive fingerprint sensor package structure according to the present embodiment.The electric capacity
The fingerprint sensor package structure 200 of formula includes chip 201, fingerprint sensing element 202 and the substrate 203 of individual packages.
Wherein, fingerprint sensing element 202 is arranged on the top of chip 201 and electrically connected with chip 201, specifically can be by chip
201 are electrically connected with fingerprint sensing element 202 using upside-down mounting mode；Substrate 203 is arranged on the lower section of chip 201, substrate 203 with
Fingerprint sensing element 202 is electrically connected by tin ball 204, and substrate 203 passes through tin ball 204 and fingerprint sensing element 202 and chip
201 electrical connections.Wherein, fingerprint sensing element 202 is the fingerprint induction zone for realizing fingerprint recognition, and chip 201 is logic IC
(Integrated Circuit, integrated circuit), i.e., the fingerprint signal collected to fingerprint sensing element 202 is carried out at calculating
Reason.As shown in Figure 1B, it is 202 concrete structure schematic diagrams of wherein fingerprint sensing element.Wherein, finger is formed with substrate 2021
Line sensing element circuit 2022, is also formed with sensing element route protection film layer 2023 on substrate 2021, the sensing element line
The covering fingerprint sensing element of road protection film layer 2023 circuit 2022, for protecting fingerprint sensing element circuit 2022, to avoid brokenly
It is bad.In the present embodiment, chip 201 is not electrically connected directly with substrate 203, but passes through tin ball 204 and fingerprint sensing element
202 electrically connect setting indirectly with chip 201.The main material of the tin ball 204 of the present embodiment include main material include tin, lead,
Silver, copper etc..
Alternatively, the length of the chip 201 is less than the length of fingerprint sensing element 202, and then can reduce and use chip
201, further, save the cost of whole capacitive fingerprint sensor package structure 200.
At least one projection 210 is formed with the chip 201 of the present embodiment, chip 210 passes through the projection 210 and fingerprint sense
Element 202 is answered to electrically connect, the projection 210 can be specifically by falling between scolding tin, i.e. chip 201 and fingerprint sensing element 202
Cored blade technolgy (Flip Chip Package) is electrically connected.In addition, also being wrapped between chip 201 and fingerprint sensing element 202
Underfilling (Underfill) 211 is included, the underfilling 211 is used to bond chip 210 and fingerprint sensing element 202.The bottom
Layer filler 211 can be specifically epoxy resin (Epoxy), and the machinery that the bottom filling 211 can effectively improve projection 210 is strong
Degree, so as to improve the life-span of whole capacitive fingerprint sensor package structure 200.
Alternatively, the capacitive fingerprint sensor package structure 200 of the present embodiment also includes capacitance resistance 220, the electricity
Hold resistance 220 to be arranged on substrate 203, the resistance capacitance 220 can play a part of voltage stabilizing, filtering.The substrate 203 specifically may be used
With including the FPC formed from below to up (Flexible Printed Circuit, FPC) 221 and PCB (Printed
Circuit Board, printed circuit board) 222, i.e. PCB222 formation is in FPC221 top.Specifically, the PCB222 with
FPC221 can be connected by tin cream 223, i.e., the tin cream 223 is formed between FPC221 and PCB222.Specifically, on FPC221
Including connector (Connector) 260, for connecting peripheral circuit.The connector 260 can be arranged on according to actual needs
Any one on FPC221, only shows a kind of situation in Fig. 2.
Alternatively, EMC layers of (Epoxy Molding Compound, heat are also filled between chip 201 and substrate 203
Thermosetting resin) 241, the difference for the thermal coefficient of expansion that the EMC layers 241 are used between compensation chips 201 and substrate 203 prevents wet
Gas is destroyed, and can protect chip 201.Projection 210 is dispersed in EMC layers 241.The surface area of the EMC layers 241 can be more than
The surface area of fingerprint sensing element 202.
Alternatively, as shown in Figure 1A, the capacitive fingerprint sensor package structure 200 of the present embodiment also includes frame
(Bezel) 240, the frame 240 is arranged on substrate 203, and the frame 240 is set around chip 201 and fingerprint sensing element 202
Put, specifically, the frame 240 can be arranged on substrate 203, that is, is arranged on PCB222.Alternatively, as shown in Fig. 2 the side
The bottom of frame 240 can also contact FPC221, i.e., the frame 240 passes through PCB222 and tin cream 223.The frame 240 can be to electricity
The fingerprint sensor package structure 200 of appearance formula plays decoration function, and the sense of touch of user can also be made more preferable.The material of the frame 240
Material can be plastics.
Alternatively, as shown in Figure 1A, the capacitive fingerprint sensor package structure 200 can also include color film layer
205 and protective layer 206, the color film layer 205 is arranged at the top of fingerprint sensing element 202, and protective layer 206 is arranged at color film
The top of layer 205.Wherein, the coupling of protective layer 206 is set on frame 240, the protective layer 206 specifically can by llowing group of materials or
One or more of its equivalent is made：Ceramics, DLC (Diamond-like carbon, DLC), glass, reinforcing glass
Glass passes through chemically treated other kinds of glass, sapphire, by the chemically treated change with its at least some of feature
Compound, or glass anti-crushing substitute, comprising polymethyl methacrylate (Polymethyl Methacrylate, PMMA),
Polyethylene terephthalate (Polyethylene Terephthalate, PET), can also be the ink after solidification
Coating.The color film layer 205 can be the ink being printed on protective layer 206, or by being sprayed on protective layer 206
Ink.The ink has certain color, and color film layer 205 can be made to be translucent or opaque, so, the fingerprint of lower section
The structures such as sensing element 202 will not be seen by a user.Protective layer 206 can further protect color film layer 205, make its avoid by
The nail of user or other sharppointed article frictions and damage, equally, protective layer 206 can also play a part of protect chip 201.
Wherein, the thickness of color film layer 205 is 5 microns to 30 microns, and the thickness of protective layer 206 is micro- for 10 microns to 30
Rice.Alternatively, the color film layer 205 and the thickness sum of protective layer 206 can be less than or equal to 100 microns, specifically, can be with
Less than or equal to 50 microns.
Mobile terminal and tablet personal computer device usually using high glaze, high transmittance substrate as product cover plate, this
A little substrates are usually glass, sapphire, transparent plastic panel or other any with high-gloss surface, the material of high light transmittance
Panel.In order to which above-mentioned capacitive fingerprint sensor package structure is fitted into mobile terminal or tablet personal computer, protective layer 206
There can be high-gloss surface, with the ID (Industrlal Design, industrial design) of matching product design effect；Certainly have
When according to its surface of design requirement can also be matte effect.The vertical view face of the protective layer 206 can be any shape, for example, justify
Shape, ball shape and other button-shapes.The surface of protective layer 206 can be smooth, or depression, for example meet user's hand
The depression of finger, so can be that the finger of user is positioned well, to recognize the fingerprint in user's finger, or raised
's.The situation of the surfacing of protective layer 206 is only shown in following figure.It is micro- that the flatness of the protective layer 206 is less than or equal to 10
Rice.
Figure 1A-Figure 11 is the various combinations for the putting position of capacitance resistance and the shape of frame.Wherein, each fingerprint
The concrete structure of sensing element 202 is as shown in Figure 1B.
Alternatively, as shown in Figure 1A, capacitance resistance 220 can be arranged on PCB222 and close proximity to chip 201.Electric capacity
It is nearer that resistance 220 and fingerprint sensing element 202 or chip 201 are leaned on, and its voltage stabilizing, filter effect are better, the image effect collected
Fruit is better.In Figure 1A, frame 240 is arranged on PCB222, and height of the height higher than protective layer 206 of frame 240, can be made
It is placed on well on protective layer 206 with the finger for quoting family.
Alternatively, as shown in Fig. 2 being the structural representation of capacitive fingerprint sensor package structure 300.Capacitance resistance
220 can be arranged on PCB222 and be wrapped up by EMC layers 241, i.e., capacitance resistance 220 can be arranged in frame 240, with chip
201 lean on it is very near, the size that this is accomplished by capacitance resistance 220 is sufficiently small, for example with 0201 package dimension.0201 encapsulation
Size is specially a length of 0.60 ± 0.05mm of capacitance resistance 220, a width of 0.30 ± 0.05mm, a height of 0.23 ± 0.05mm, when
So can also be according to actual needs using 0402 package dimension etc..Capacitance resistance 220 is set including in EMC layers 241, making
Capacitance resistance 220 is obtained very close to chip 201, thus it is very good for the transmission of signal.In Fig. 2, frame 240 is arranged on
On FPC221.The height of frame 240 in Fig. 2 is higher than the height of protective layer 206, can make to put well with the finger for quoting family
On protective layer 206.In the Fig. 2, the surface area of EMC layers 241 can be bigger than fingerprint sensing element 202, illustrates from Fig. 2 section
It can be seen from the figure that, EMC layers 241 are longer than the length of fingerprint sensing element 202, certainly, and ECM layers 241 can also sense with fingerprint
The length of element 202 is consistent, as shown in figure 1, will not be repeated here.
Alternatively, as shown in figure 3, being the structural representation of capacitive fingerprint sensor package structure 400.In Fig. 3
FPC221 is longer than PCB222, and capacitance resistance 220 is arranged on FPC221.Because in actual assembled, the only part of frame 240
Size is exposed, is limited the size in the range of frame 240 so generally requiring, and FPC221 is located at its outside frame scope
He is hidden in below the panel of terminal device or casing part, and user does not see, it is possible to using relatively slightly larger encapsulation
Electric capacity, for example with the capacitance resistance of 0402 or 0603 grade package dimension.The volume of capacitance resistance 220 is bigger, and production cost is got over
It is low, therefore using the larger capacitance resistance 220 of volume, so can further reduce whole capacitive fingerprint sensor package
The production cost of structure 200.The height of frame 240 in Fig. 3 is higher than the height of protective layer 206, can make with the hand for quoting family
Finger is placed on protective layer 206 well, and the frame 240 is arranged on FPC221.
Alternatively, as shown in figure 4, being the structural representation of capacitive fingerprint sensor package structure 500.Capacitance resistance
220 can be arranged on PCB222 and close proximity to chip 201.It is nearer that capacitance resistance 220 and fingerprint sensing element 202 are leaned on,
Its electric signal transmission between fingerprint sensing element 202 is better.In Fig. 4, the height of frame 240 and the height of protective layer 206
It is identical, and the frame 240 is arranged on PCB222.
Alternatively, as shown in figure 5, being the structural representation of capacitive fingerprint sensor package structure 600.Capacitance resistance
220 can be arranged on PCB222 and be wrapped up by EMC layers 241.The size that this is accomplished by capacitance resistance 220 is sufficiently small, for example, adopt
0201 package dimension is used, 0201 package dimension is specially a length of 0.60 ± 0.05mm of capacitance resistance 220, a width of 0.30 ±
0.05mm, a height of 0.23 ± 0.05mm, certainly can also be according to actual needs using 0402 package dimension etc..By capacitance resistance
220 set be included in EMC layers 241 so that capacitance resistance 220 very close to chip 201, therefore for signal transmission very
It is good.The height of frame 240 in Fig. 5 is identical with the height of protective layer 206, and the frame 240 is arranged on FPC221.The Fig. 5
In, the surface area of EMC layers 241 can be bigger than fingerprint sensing element 202, as can be seen that EMC layers from Fig. 5 diagrammatic cross-section
241 is longer than the length of fingerprint sensing element 202, certainly, and ECM layers 241 can also be consistent with the length of fingerprint sensing element 202,
As shown in figure 1, will not be repeated here.
Alternatively, as shown in fig. 6, being the structural representation of capacitive fingerprint sensor package structure 700.FPC221 length
In PCB222, and capacitance resistance 220 is arranged on FPC221.Because in actual assembled, only outside the size of the part of frame 240
Dew, is limited the size in the range of frame 240 so generally requiring, and FPC221 is located at the other parts outside frame scope
It is hidden in below the panel of terminal device or casing, user does not see, it is possible to using the electric capacity of relatively slightly larger encapsulation, example
Such as use the capacitance resistance of 0402 or 0603 package dimension.The volume of capacitance resistance 220 is bigger, and production cost is lower, therefore
Using the capacitance resistance 220 that volume is larger, it so can further reduce whole capacitive fingerprint sensor package structure 200
Production cost.The height of frame 240 in Fig. 6 is identical with the height of protective layer 206, and the frame 240 is arranged on FPC221
On.
Alternatively, as shown in fig. 7, the structure of the capacitive fingerprint sensor package structure 800 not include frame is shown
It is intended to.Wherein, capacitance resistance 220 can be arranged on PCB222 and close proximity to chip 201.Capacitance resistance 220 and fingerprint sense
That answers that element 202 leans on is nearer, and its electric signal transmission between fingerprint sensing element 202 is better.
Alternatively, as shown in figure 8, the structure of the capacitive fingerprint sensor package structure 900 not include frame is shown
It is intended to.Wherein, capacitance resistance 220 can be arranged on PCB222 and be wrapped up by EMC layers 241.This is accomplished by capacitance resistance 220
Size is sufficiently small, for example with 0201 package dimension, 0201 package dimension be specially capacitance resistance 220 a length of 0.60 ±
0.05mm, a width of 0.30 ± 0.05mm, a height of 0.23 ± 0.05mm, certainly can also be according to actual needs using 0402 encapsulation chi
It is very little etc..Capacitance resistance 220 is set including in EMC layers 241 so that capacitance resistance 220 is very close to chip 201, therefore
Transmission for signal is very good.
Alternatively, as shown in figure 9, the structure of the capacitive fingerprint sensor package structure 1000 not include frame is shown
It is intended to.FPC221 is longer than PCB222, and capacitance resistance 220 is arranged on FPC221.Because in actual assembled, only frame 240
Partial size is exposed, is limited the size in the range of frame 240 so generally requiring, and FPC221 is located at frame scope
Outer other parts are hidden in below the panel of terminal device or casing, and user does not see, it is possible to using relatively slightly larger
The electric capacity of encapsulation, for example with the capacitance resistance of 0402 or 0603 grade package dimension.The volume of capacitance resistance 220 is bigger, production
Cost is lower, therefore using the larger capacitance resistance 220 of volume, so can further reduce whole capacitive fingerprint sensing
The production cost of device encapsulating structure 200.
Alternatively, as shown in Figure 10, it is the deformation of frame 240.The top of frame 240 can be to be skewed, i.e. frame 240
Inclined one side with protective layer 206 in obtuse angle, and the projection of frame 240 on a substrate 103 and protective layer 206 upper surface in base
Projection on plate 103 is not completely overlapping, i.e. the upper surface of the inclined one side not contact protection layer 206 of frame 240.The frame 240
Shape can with alternate figures 1A into Fig. 9 any frame 240, will not be repeated here.The shape of frame 240 in Figure 10 can be more
Good guiding user's finger makes the experience of user more preferable on protective layer 206.
Alternatively, as shown in figure 11, it is the deformation of frame 240.The top of frame 240 can be to be skewed, i.e. frame 240
The upper surface of inclined one side and protective layer 206 in obtuse angle, and the projection of frame 240 on a substrate 103 with protective layer 206 in base
Projection on plate 103 has the upper surface of the inclined one side contact protection layer 206 of overlapping part, i.e. frame 240.In 12 from figure
As can be seen that frame 240 blocks protective layer 206 so that the capacitive fingerprint sensor package structure 200 is more preferably firm, no
Can be because external forces scatter easily.The shape of the frame 240 can with alternate figures 1A into Fig. 9 any frame 240, herein not
Repeat again.The shape of frame 240 in Figure 11 can preferably guide user's finger to protective layer 206, make the experience of user
More preferably.
Certainly, the shape of frame 240 can also be other various, will not be repeated here.
According to the capacitive fingerprint sensor package structure 200 of the present embodiment, by by fingerprint sensing element 202 and core
Piece 201 is separated, then is electrically connected, and is so reduced the surface area of whole capacitive fingerprint sensor package structure 200, is entered
And beneficial to the miniaturization of terminal device.The surface refers to the surface seen when capacitive fingerprint encapsulating structure 200 is overlooked
Product.It is envisioned that to being very likely to reduce the volume of whole terminal device.
The fingerprint identification device of above-mentioned capacitive fingerprint sensor package structure is included, passes through fingerprint sensing element 202
The fingerprint characteristic of user's finger is obtained with chip 201.Fingerprint identification device is divided into push type and slidingtype, and push type requirement is used
When finger is pressed the protective layer 206 on the surface of fingerprint sensing element 202 by person, these fingerprint sensing elements 202 are intercepted simultaneously
The image of whole fingerprint.Slidingtype requires that finger is longitudinally slipped over fingerprint sensing element 202 by user, and fingerprint sensing element
202 then sequentially access the fragment of fingerprint image, and the fragment of these fingerprint images can be used for producing the model of fingerprint.For example work as hand
Refer to along the protective layer 206 above the fingerprint sensing element it is swiped through when, the concave point (paddy) and salient point (ridge) of finger sensing, from
And obtain the relevant information of fingerprint.
As shown in figure 12, be above-mentioned capacitive fingerprint sensor package method schematic flow sheet.This is capacitive
The method of fingerprint sensor package includes：
Step 301, the chip of individual packages and the welding of fingerprint sensing element are made into chip and fingerprint sense by weld tabs
Answer electrical connection between element.
Specifically, it is to be carried out by the way of flip-chip (Flip Chip) between the chip and fingerprint sensing element
Electrical connection.
Step 302, substrate and fingerprint sensing element are connected by soldered ball, so that substrate and fingerprint sensing element are electrically connected
Connect.
Wherein, chip is located between fingerprint sensing element and substrate, and substrate passes through tin ball and fingerprint sensing element and chip
Electrical connection.
In the present embodiment, the side of chip towards substrate is provided with circuit.Specifically, there is no the side of circuit in chip
Pre-position, carries out process of tin using long gold process formation projection, and on projection, recycles flip-chip, will
Flip-chip realizes electrical connection on the fingerprint sensing element made.Next, bottom filling filling process is carried out,
Chip and fingerprint sensing element is set firmly to connect.
Next, the chip glued and fingerprint sensing element are connected on substrate by tin ball bonding, then to substrate
EMC materials are filled between chip, EMC layers are formed.
After step 302, the method for the capacitive fingerprint sensor package structure of the present embodiment making also includes：
In fingerprint sensing element color film layer is formed away from the side of chip；
Protective layer is formed in color film layer.
The formation of color film layer and protective layer can be after frame formation.
Alternatively, color film layer and the thickness sum of protective layer are less than or equal to 100 microns, more specifically, can be with small
In or equal to 50 microns.
Alternatively, the thickness of color film layer is specifically as follows 10 microns to 30 microns, alternatively, and the thickness of protective layer is specific
It can be 10 microns to 30 microns.
Alternatively, it can also form one layer of bed material coating to increase color film layer and fingerprint sensing element below color film layer
Between adhesive force.The bed material coating can be formed after step 302 and before color film layer is formed.If there is side
Frame, then form frame on substrate again after protective layer is formed.
Protective layer can specifically be made up of one or more of llowing group of materials or its equivalent：Ceramics, DLC
(Diamond-like carbon, DLC), glass, strengthened glass pass through chemically treated glass, sapphire, process
The chemically treated compound with its at least some of feature, or glass anti-crushing substitute, include poly-methyl methacrylate
Ester (Polymethyl Methacrylate, PMMA), polyethylene terephthalate (Polyethylene
Terephthalate, PET), it can also be the ink coating after solidification.
The method of the capacitive fingerprint sensor package structure of making of the present embodiment, by by fingerprint sensing element and core
Piece is separated, then is electrically connected, and so reduces the surface area of whole fingerprint sensor package structure, and then beneficial to terminal device
Miniaturization.The surface refers to the surface area seen when capacitive fingerprint encapsulating structure is overlooked.It is envisioned that to,
It is very likely to reduce the volume of whole terminal device.
One of ordinary skill in the art will appreciate that：Realizing all or part of step of above method embodiment can pass through
Programmed instruction related hardware is completed, and foregoing program can be stored in a computer read/write memory medium, the program
Upon execution, the step of including above method embodiment is performed；And foregoing storage medium includes：ROM, RAM, magnetic disc or light
Disk etc. is various can be with the medium of store program codes.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that：It still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic；
And these modifications or replacement, the essence of appropriate technical solution is departed from the scope of various embodiments of the present invention technical scheme.
Claims (6)
1. a kind of capacitive fingerprint sensor package structure, it is characterised in that including：
The chip of individual packages；
Fingerprint sensing element, is arranged on above the chip and is electrically connected with the chip；
Substrate, is arranged on the beneath chips, the substrate is electrically connected with the fingerprint sensing element by tin ball, and the base
Plate is electrically connected by tin ball and the fingerprint sensing element with the chip；
The capacitive fingerprint sensor package structure also includes：Capacitance resistance, the capacitance resistance is arranged on the substrate
On；
The substrate includes the FPC FPC and printing board PCB formed from below to up；
The capacitive fingerprint sensor package structure also includes thermosetting resin EMC, the EMC be filled in the chip with
Between the substrate；
The capacitance resistance is set on the pcb, and the capacitance resistance is by described EMC layers parcel；
Or the FPC is longer than the PCB, and the capacitance resistance is arranged on FPC；
The capacitive fingerprint sensor package structure also includes：Frame, the frame is set on the substrate, and described
Frame surrounds the chip and the fingerprint sensing element；
The capacitive fingerprint sensor package structure also includes：Color film layer, is arranged on above the fingerprint sensing element；
Protective layer, is arranged on above the color film layer；
Wherein, the frame is higher than the protective layer, and the top of the frame is skewed, and inclined one side of the frame connects
Touch the upper surface of the protective layer.
2. capacitive fingerprint sensor package structure according to claim 1, it is characterised in that the chip with it is described
Fingerprint sensing element is electrically connected with using flip-chip.
3. capacitive fingerprint sensor package structure according to claim 1, it is characterised in that the color film layer
Thickness is 5 microns to 30 microns.
4. the capacitive fingerprint sensor package structure according to claim 1 or 3, it is characterised in that the protective layer
Thickness be 10 microns to 30 microns.
5. capacitive fingerprint sensor package structure according to claim 3, it is characterised in that the color film layer and institute
The thickness sum for stating protective layer is less than or equal to 50 microns.
6. capacitive fingerprint sensor package structure according to claim 3, it is characterised in that the protective layer it is smooth
Degree is less than or equal to 10 microns.
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| CN201410424303.6A CN104183560B (en) | 2014-08-26 | 2014-08-26 | Capacitive fingerprint sensor package structure and the method for encapsulation |
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| CN201410424303.6A CN104183560B (en) | 2014-08-26 | 2014-08-26 | Capacitive fingerprint sensor package structure and the method for encapsulation |
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| CN104183560B true CN104183560B (en) | 2017-09-22 |
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Families Citing this family (11)
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| CN104681533A (en) * | 2014-12-31 | 2015-06-03 | 华天科技（西安）有限公司 | Substrate groove-based chip integrated fingerprint identification sensor and manufacturing method thereof |
| CN104484660A (en) * | 2014-12-31 | 2015-04-01 | 华天科技（西安）有限公司 | Chip-integrated fingerprint identification sensor and manufacturing method thereof |
| CN104637892B (en) * | 2015-01-27 | 2017-11-24 | 华进半导体封装先导技术研发中心有限公司 | The encapsulating structure and its method for packing of fingerprint recognition module |
| CN104766830B (en) * | 2015-04-02 | 2018-07-06 | 南昌欧菲生物识别技术有限公司 | A kind of fingerprint sensor package structure, packaging method and electronic equipment |
| KR20160143071A (en) * | 2015-06-04 | 2016-12-14 | 앰코 테크놀로지 코리아 주식회사 | Package of finger print sensor |
| CN104966700B (en) * | 2015-06-04 | 2019-02-12 | 南昌欧菲生物识别技术有限公司 | A chip module cover plate, a chip module packaging structure and an electronic device |
| CN106682564A (en) * | 2015-11-09 | 2017-05-17 | 康达生命科学有限公司 | Capacitive fingerprint sensor and packaging method thereof |
| US10256173B2 (en) * | 2016-02-22 | 2019-04-09 | Advanced Semiconductor Engineering, Inc. | Semiconductor device and method for manufacturing the same |
| EP3217316A1 (en) * | 2016-03-11 | 2017-09-13 | Nxp B.V. | Fingerprint sensing system and method |
| CN110692135B (en) * | 2019-06-14 | 2021-03-19 | 深圳市汇顶科技股份有限公司 | Chip package structure and electronic equipment |
| CN111985391B (en) * | 2020-08-18 | 2023-11-28 | Oppo（重庆）智能科技有限公司 | Method and device for detecting protective film, mobile terminal and storage medium |
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Effective date of registration: 20181009 Address after: 330000 room 1408, red Gucheng tower, 545 Exhibition Road, Nanchang, Jiangxi. Patentee after: Nanchang Institute of virtual reality Limited by Share Ltd Address before: 330100 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Co-patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Co-patentee before: Shenzhen OFilm Tech Co.,Ltd. Co-patentee before: Suzhou OFilm Tech. Co.,Ltd. |