CN101657938B - 磁场耦合型天线、磁场耦合型天线模块及磁场耦合型天线装置、及这些的制造方法 - Google Patents
磁场耦合型天线、磁场耦合型天线模块及磁场耦合型天线装置、及这些的制造方法 Download PDFInfo
- Publication number
- CN101657938B CN101657938B CN200880011674.4A CN200880011674A CN101657938B CN 101657938 B CN101657938 B CN 101657938B CN 200880011674 A CN200880011674 A CN 200880011674A CN 101657938 B CN101657938 B CN 101657938B
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- Prior art keywords
- insulating barrier
- magnetic core
- field coupling
- coupling type
- magnetic field
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
- H01Q7/08—Ferrite rod or like elongated core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Details Of Aerials (AREA)
- Near-Field Transmission Systems (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Soft Magnetic Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007105513 | 2007-04-13 | ||
| JP105513/2007 | 2007-04-13 | ||
| PCT/JP2008/057078 WO2008133018A1 (fr) | 2007-04-13 | 2008-04-10 | Antenne de type à couplage de champ magnétique, module d'antenne de type à couplage de champ magnétique, dispositif d'antenne de type à couplage de champ magnétique et leurs procédés de fabrication |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101657938A CN101657938A (zh) | 2010-02-24 |
| CN101657938B true CN101657938B (zh) | 2014-05-14 |
Family
ID=39925477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880011674.4A Expired - Fee Related CN101657938B (zh) | 2007-04-13 | 2008-04-10 | 磁场耦合型天线、磁场耦合型天线模块及磁场耦合型天线装置、及这些的制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP5170087B2 (fr) |
| CN (1) | CN101657938B (fr) |
| GB (2) | GB2485318B (fr) |
| WO (1) | WO2008133018A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110011705A (zh) * | 2014-12-19 | 2019-07-12 | 株式会社村田制作所 | 无线ic器件 |
Families Citing this family (99)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7519328B2 (en) | 2006-01-19 | 2009-04-14 | Murata Manufacturing Co., Ltd. | Wireless IC device and component for wireless IC device |
| US9064198B2 (en) | 2006-04-26 | 2015-06-23 | Murata Manufacturing Co., Ltd. | Electromagnetic-coupling-module-attached article |
| JP4281850B2 (ja) | 2006-06-30 | 2009-06-17 | 株式会社村田製作所 | 光ディスク |
| DE112007002024B4 (de) | 2006-09-26 | 2010-06-10 | Murata Mfg. Co., Ltd., Nagaokakyo-shi | Induktiv gekoppeltes Modul und Element mit induktiv gekoppeltem Modul |
| US8235299B2 (en) | 2007-07-04 | 2012-08-07 | Murata Manufacturing Co., Ltd. | Wireless IC device and component for wireless IC device |
| ATE540377T1 (de) | 2007-04-26 | 2012-01-15 | Murata Manufacturing Co | Drahtlose ic-vorrichtung |
| JP4666102B2 (ja) | 2007-05-11 | 2011-04-06 | 株式会社村田製作所 | 無線icデバイス |
| JP4466795B2 (ja) | 2007-07-09 | 2010-05-26 | 株式会社村田製作所 | 無線icデバイス |
| CN101578616A (zh) | 2007-07-17 | 2009-11-11 | 株式会社村田制作所 | 无线ic器件及电子设备 |
| EP2568419B1 (fr) | 2007-07-18 | 2015-02-25 | Murata Manufacturing Co., Ltd. | Dispositif avec circuit RFID |
| JP5267463B2 (ja) | 2008-03-03 | 2013-08-21 | 株式会社村田製作所 | 無線icデバイス及び無線通信システム |
| WO2009142114A1 (fr) | 2008-05-21 | 2009-11-26 | 株式会社村田製作所 | Dispositif ci sans fil |
| WO2009145007A1 (fr) | 2008-05-26 | 2009-12-03 | 株式会社村田製作所 | Système de dispositif à ci sans fil et procédé d'authentification de dispositif à ci sans fil |
| EP2320519B1 (fr) | 2008-08-19 | 2017-04-12 | Murata Manufacturing Co., Ltd. | Dispositif à circuit intégré sans fil et procédé de fabrication de celui-ci |
| DE112009002384B4 (de) | 2008-11-17 | 2021-05-06 | Murata Manufacturing Co., Ltd. | Antenne und Drahtlose-IC-Bauelement |
| JP4752909B2 (ja) * | 2008-12-24 | 2011-08-17 | 株式会社村田製作所 | 磁性体アンテナ及びアンテナ装置 |
| JP5041075B2 (ja) | 2009-01-09 | 2012-10-03 | 株式会社村田製作所 | 無線icデバイスおよび無線icモジュール |
| JP5267578B2 (ja) | 2009-01-30 | 2013-08-21 | 株式会社村田製作所 | アンテナ及び無線icデバイス |
| JP4987893B2 (ja) * | 2009-02-27 | 2012-07-25 | 東光株式会社 | 高周波結合器およびそれを用いた非接触伝送通信システム |
| JP2010245371A (ja) * | 2009-04-08 | 2010-10-28 | Elpida Memory Inc | 半導体装置および半導体装置の製造方法 |
| WO2010119854A1 (fr) | 2009-04-14 | 2010-10-21 | 株式会社村田製作所 | Composant pour dispositif de ci sans fil et dispositif de ci sans fil |
| JP4687832B2 (ja) | 2009-04-21 | 2011-05-25 | 株式会社村田製作所 | アンテナ装置 |
| WO2010140429A1 (fr) | 2009-06-03 | 2010-12-09 | 株式会社村田製作所 | Dispositif de circuit intégré sans fil et son procédé de production |
| WO2010146944A1 (fr) | 2009-06-19 | 2010-12-23 | 株式会社村田製作所 | Dispositif sans fil à circuits intégrés et procédé de couplage d'un circuit d'alimentation électrique et de plaques rayonnantes |
| CN102474009B (zh) | 2009-07-03 | 2015-01-07 | 株式会社村田制作所 | 天线及天线模块 |
| JP4715954B2 (ja) * | 2009-08-28 | 2011-07-06 | パナソニック株式会社 | アンテナ装置 |
| WO2011037234A1 (fr) | 2009-09-28 | 2011-03-31 | 株式会社村田製作所 | Dispositif sans fil à circuit intégré et procédé de détection de conditions environnementales l'utilisant |
| WO2011040393A1 (fr) | 2009-09-30 | 2011-04-07 | 株式会社村田製作所 | Substrat de circuit et son procédé de fabrication |
| JP5304580B2 (ja) | 2009-10-02 | 2013-10-02 | 株式会社村田製作所 | 無線icデバイス |
| JP5522177B2 (ja) | 2009-10-16 | 2014-06-18 | 株式会社村田製作所 | アンテナ及び無線icデバイス |
| JP5418600B2 (ja) | 2009-10-27 | 2014-02-19 | 株式会社村田製作所 | 送受信装置及び無線タグ読み取り装置 |
| WO2011055703A1 (fr) | 2009-11-04 | 2011-05-12 | 株式会社村田製作所 | Terminal de communication et système de traitement de l'information |
| WO2011055701A1 (fr) | 2009-11-04 | 2011-05-12 | 株式会社村田製作所 | Terminal de communication et système de traitement de l'information |
| EP2498207B1 (fr) | 2009-11-04 | 2014-12-31 | Murata Manufacturing Co., Ltd. | Étiquette à circuit radio intégré, lecteur/enregistreur, et système de traitement d'information |
| CN102576929B (zh) | 2009-11-20 | 2015-01-28 | 株式会社村田制作所 | 天线装置以及移动通信终端 |
| WO2011077877A1 (fr) | 2009-12-24 | 2011-06-30 | 株式会社村田製作所 | Antenne et terminal portable |
| JP5569011B2 (ja) * | 2010-01-29 | 2014-08-13 | 大日本印刷株式会社 | アンテナ部品 |
| WO2011108340A1 (fr) | 2010-03-03 | 2011-09-09 | 株式会社村田製作所 | Module de communication sans fil et dispositif de communication sans fil |
| WO2011108341A1 (fr) | 2010-03-03 | 2011-09-09 | 株式会社村田製作所 | Dispositif de radiocommunication et terminal de radiocommunication |
| JP5477459B2 (ja) | 2010-03-12 | 2014-04-23 | 株式会社村田製作所 | 無線通信デバイス及び金属製物品 |
| GB2491447B (en) | 2010-03-24 | 2014-10-22 | Murata Manufacturing Co | RFID system |
| JP5630499B2 (ja) | 2010-03-31 | 2014-11-26 | 株式会社村田製作所 | アンテナ装置及び無線通信デバイス |
| WO2012005278A1 (fr) | 2010-07-08 | 2012-01-12 | 株式会社村田製作所 | Antenne et dispositif d'identification par radiofréquence (rfid) |
| GB2495418B (en) | 2010-07-28 | 2017-05-24 | Murata Manufacturing Co | Antenna apparatus and communication terminal instrument |
| WO2012020748A1 (fr) | 2010-08-10 | 2012-02-16 | 株式会社村田製作所 | Carte de circuit imprimé et système de communication sans fil |
| CN101976762A (zh) * | 2010-09-19 | 2011-02-16 | 北京握奇数据系统有限公司 | 双通道线圈天线及具有该双通道线圈天线的装置 |
| WO2012043432A1 (fr) | 2010-09-30 | 2012-04-05 | 株式会社村田製作所 | Dispositif à circuit intégré sans fil |
| CN105226382B (zh) | 2010-10-12 | 2019-06-11 | 株式会社村田制作所 | 天线装置及终端装置 |
| WO2012053412A1 (fr) | 2010-10-21 | 2012-04-26 | 株式会社村田製作所 | Dispositif terminal de communication |
| JP5716891B2 (ja) * | 2010-11-10 | 2015-05-13 | 横浜ゴム株式会社 | 情報取得装置 |
| CN105048058B (zh) | 2011-01-05 | 2017-10-27 | 株式会社村田制作所 | 无线通信器件 |
| JP5304956B2 (ja) | 2011-01-14 | 2013-10-02 | 株式会社村田製作所 | Rfidチップパッケージ及びrfidタグ |
| CN103119786B (zh) | 2011-02-28 | 2015-07-22 | 株式会社村田制作所 | 无线通信器件 |
| WO2012121185A1 (fr) | 2011-03-08 | 2012-09-13 | 株式会社村田製作所 | Dispositif d'antenne et appareil terminal de communication |
| KR101317226B1 (ko) | 2011-04-05 | 2013-10-15 | 가부시키가이샤 무라타 세이사쿠쇼 | 무선 통신 디바이스 |
| WO2012141070A1 (fr) | 2011-04-13 | 2012-10-18 | 株式会社村田製作所 | Dispositif à circuit intégré sans fil et terminal de communication sans fil |
| WO2012157596A1 (fr) | 2011-05-16 | 2012-11-22 | 株式会社村田製作所 | Dispositif à ic sans fil |
| CN103370834B (zh) | 2011-07-14 | 2016-04-13 | 株式会社村田制作所 | 无线通信器件 |
| JP5333707B2 (ja) | 2011-07-15 | 2013-11-06 | 株式会社村田製作所 | 無線通信デバイス |
| WO2013011865A1 (fr) | 2011-07-19 | 2013-01-24 | 株式会社村田製作所 | Module d'antenne, dispositif d'antenne, étiquette rfid et dispositif terminal de communication |
| JP5418737B2 (ja) | 2011-09-09 | 2014-02-19 | 株式会社村田製作所 | アンテナ装置および無線デバイス |
| CN102354813A (zh) * | 2011-09-23 | 2012-02-15 | 深圳市江波龙电子有限公司 | 一种通信天线及其制造方法、应用终端 |
| WO2013080991A1 (fr) | 2011-12-01 | 2013-06-06 | 株式会社村田製作所 | Dispositif ci sans fil et son procédé de fabrication |
| KR20130105938A (ko) | 2012-01-30 | 2013-09-26 | 가부시키가이샤 무라타 세이사쿠쇼 | 무선 ic 디바이스 |
| WO2013125610A1 (fr) | 2012-02-24 | 2013-08-29 | 株式会社村田製作所 | Dispositif d'antenne et dispositif de communication sans fil |
| JP5787032B2 (ja) | 2012-03-29 | 2015-09-30 | 株式会社村田製作所 | 磁界プローブ |
| WO2013153697A1 (fr) | 2012-04-13 | 2013-10-17 | 株式会社村田製作所 | Procédé d'inspection d'étiquette d'identification par radiofréquence (rfid) et dispositif d'inspection |
| JP6062691B2 (ja) * | 2012-04-25 | 2017-01-18 | Necトーキン株式会社 | シート状インダクタ、積層基板内蔵型インダクタ及びそれらの製造方法 |
| JP5505571B2 (ja) * | 2012-04-27 | 2014-05-28 | 株式会社村田製作所 | コイルアンテナおよび通信端末装置 |
| CN106601421A (zh) * | 2012-05-09 | 2017-04-26 | 株式会社村田制作所 | 线圈天线元件以及天线模块 |
| JP6089446B2 (ja) * | 2012-05-22 | 2017-03-08 | 株式会社村田製作所 | アンテナ装置および通信端末装置 |
| WO2014024762A1 (fr) * | 2012-08-09 | 2014-02-13 | 株式会社村田製作所 | Dispositif d'antenne et dispositif de communication sans fil |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2008133018A1 (ja) | 2010-07-22 |
| JP2013078144A (ja) | 2013-04-25 |
| GB2485318A (en) | 2012-05-09 |
| GB201202765D0 (en) | 2012-04-04 |
| JP5573937B2 (ja) | 2014-08-20 |
| CN101657938A (zh) | 2010-02-24 |
| GB2485318B (en) | 2012-10-10 |
| GB2461443B (en) | 2012-06-06 |
| GB2461443A (en) | 2010-01-06 |
| JP5170087B2 (ja) | 2013-03-27 |
| GB0917865D0 (en) | 2009-11-25 |
| WO2008133018A1 (fr) | 2008-11-06 |
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