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CN118398520A - Semiconductor manufacturing apparatus, coating apparatus, and method for manufacturing semiconductor device - Google Patents

Semiconductor manufacturing apparatus, coating apparatus, and method for manufacturing semiconductor device Download PDF

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Publication number
CN118398520A
CN118398520A CN202410097490.5A CN202410097490A CN118398520A CN 118398520 A CN118398520 A CN 118398520A CN 202410097490 A CN202410097490 A CN 202410097490A CN 118398520 A CN118398520 A CN 118398520A
Authority
CN
China
Prior art keywords
paste
stage
syringe
substrate
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202410097490.5A
Other languages
Chinese (zh)
Inventor
横森刚
高柳健一
小桥英晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fasford Technology Co Ltd
Original Assignee
Fasford Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fasford Technology Co Ltd filed Critical Fasford Technology Co Ltd
Publication of CN118398520A publication Critical patent/CN118398520A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Die Bonding (AREA)

Abstract

The invention provides a semiconductor manufacturing apparatus, a coating apparatus and a manufacturing method of a semiconductor device, and relates to a technology capable of reducing deviation of at least one of a coating position and a coating amount of paste. The semiconductor manufacturing apparatus includes: a syringe having a nozzle at a front end thereof, for storing a paste; a first stage; a second stage for supporting the paste-coated substrate; an imaging device for imaging the paste applied to the first stage; and a control device configured to adjust a coating position and a coating amount of the replaced syringe based on a result of identifying the first paste applied to the first stage by the syringe before the replacement and a result of identifying the second paste applied to the first stage by the syringe after the replacement.

Description

Semiconductor manufacturing apparatus, coating apparatus, and method for manufacturing semiconductor device
Technical Field
The present invention relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a die mounter in which a resin paste is used as a bonding material.
Background
As one of the steps of manufacturing a semiconductor device, there is a case where bare chips separated from a wafer are picked up, and the picked up bare chips are attached to a substrate coated with a resin paste by a syringe. Here, the resin paste is a liquid binder, and is, for example, a silver paste such as silver epoxy resin or silver acrylic. Hereinafter, the resin paste will be simply referred to as paste.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2020-4812
Disclosure of Invention
When the syringe is replaced, the application position or the application amount of the paste applied by the syringe after replacement may be changed with respect to the paste applied by the syringe before replacement.
The present invention provides a technology capable of reducing deviation of at least one of a paste application position and an application amount. Other objects and novel features will become apparent from the description and drawings of the present specification.
A brief description of a typical embodiment of the present invention follows.
That is, the semiconductor manufacturing apparatus includes: a syringe having a nozzle at a front end thereof, for storing a paste; a first stage; a second stage for supporting the paste-coated substrate; an imaging device for imaging the paste applied to the first stage; and a control device configured to adjust a coating position and a coating amount of the replaced syringe based on a result of identifying the first paste applied to the first stage by the syringe before the replacement and a result of identifying the second paste applied to the first stage by the syringe after the replacement.
Effects of the invention
According to the present invention, it is possible to reduce the deviation of at least one of the application position and the application amount of the paste.
Drawings
Fig. 1 is a plan view schematically showing a die mounter in the embodiment.
Fig. 2 is a diagram illustrating a schematic configuration when viewed from the arrow a direction in fig. 1.
Fig. 3 is a side view schematically showing the pre-processing section shown in fig. 1.
Fig. 4 is a block diagram showing a schematic configuration of a control system of the chip mounter shown in fig. 1.
Fig. 5 is a flowchart showing a method of manufacturing a semiconductor device using the die bonder shown in fig. 1.
Fig. 6 is a block diagram showing a configuration example of the preprocessing section.
Fig. 7 is a plan view showing the proofing stage coated with paste before replacement of the syringe.
Fig. 8 is a plan view showing the proofing stage coated with paste after replacement of the syringe.
Fig. 9 is a flowchart showing a method of adjusting the coating position or the coating amount.
Fig. 10 is a side view showing the structure of the pre-processing portion in the first modification.
Fig. 11 is a plan view showing a proofing stage according to a second modification.
Description of the reference numerals
1. Chip mounter (semiconductor manufacturing apparatus)
80 Control unit (control device)
91-Syringe
92- & Gtnozzle
94, Pre-processing camera (shooting device)
96, Pre-processing stage (second stage)
100. Sample stage (first stage)
Detailed Description
Hereinafter, embodiments and modifications will be described with reference to the drawings. However, in the following description, the same reference numerals are given to the same components, and overlapping description is omitted. In order to make the description more clear, the drawings may schematically show the width, thickness, shape, etc. of each part as compared with the actual form, but in principle, the drawings are examples, and do not limit the explanation of the present invention.
A structure of a chip mounter, which is one embodiment of a semiconductor manufacturing apparatus, will be described with reference to fig. 1 to 3. Fig. 1 is a schematic plan view showing a configuration example of a die mounter in the embodiment. Fig. 2 is a diagram illustrating a schematic configuration when viewed from the arrow a direction in fig. 1. Fig. 3 is a side view schematically showing the pre-processing section shown in fig. 1.
The chip mounter 1 generally includes a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a pre-processing unit 90, a mounting unit 40, a conveying unit 50, a substrate supply unit 60, a substrate carry-out unit 70, and a control unit (control device, controller) 80. The Y direction is the front-back direction of the chip mounter 1, the X direction is the left-right direction, and the Z direction is the up-down direction. The wafer supply unit 10 is disposed on the front side of the die mounter 1, and the mounting unit 40 is disposed on the rear side.
The wafer supply section 10 has a wafer cassette lifter 11, a wafer holding stage 12, a peeling unit 13, and a wafer recognition camera 14.
The wafer cassette lifter 11 moves up and down a wafer cassette (not shown) holding a plurality of wafer rings WR to a wafer transfer height. Alignment of the wafer ring WR supplied from the wafer cassette lifter 11 is performed by a wafer correction groove, not shown. The wafer ring WR is taken out from the wafer cassette by a wafer extractor not shown and supplied to the wafer holding stage 12, or taken out from the wafer holding stage 12 and accommodated in the wafer cassette.
A wafer W, which is divided into a plurality of bare chips D, is bonded (attached) on the dicing tape DT. The dicing tape DT is held to the wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the die D is a semiconductor die or a glass die.
The wafer holding stage 12 moves in the XY directions by an XY table and a driving unit, not shown, and moves the bare chip D to be picked up to the position of the peeling unit 13. The wafer holder 12 rotates the wafer ring WR in the XY plane by a driving unit not shown. The peeling means 13 is moved in the up-down direction by a driving section not shown. The peeling unit 13 peels the bare chip D from the dicing tape DT.
The wafer recognition camera 14 grasps the pickup position of the bare chip D picked up from the wafer W and performs surface inspection of the bare chip D.
The pickup section 20 has a pickup head 21 and a Y drive section 23. The pickup head 21 is provided with a collet 22 for sucking and holding the bare chip D peeled off at the tip. The pickup head 21 picks up the bare chip D from the wafer supply section 10 and places it on the intermediate stage 31. The Y drive section 23 moves the pickup head 21 in the Y axis direction. The pickup unit 20 includes driving units (not shown) for moving the pickup head 21 in the X direction while lifting and rotating the pickup head.
The intermediate stage section 30 includes an intermediate stage 31 on which the bare chip D is mounted, and a stage recognition camera 34 for recognizing the bare chip D on the intermediate stage 31. The intermediate stage 31 has suction holes for sucking the mounted bare chips D. The mounted bare chip D is temporarily held on the intermediate stage 31.
The preprocessing section 90 includes an injector 91, a driving section 93, a preprocessing camera 94 as an imaging device, a preprocessing stage 96 as a second stage, and a proofing stage 100 as a first stage. The syringe 91 has a nozzle 92 at a lower front end. The syringe 91 applies paste to the substrate S transferred to the pre-processing stage 96 by the transfer unit 50. The driving unit 93 moves the syringe 91 in the X direction, the Y direction, and the up and down direction. The substrate S is, for example, a lead frame formed of a wiring substrate or a metal sheet, a glass substrate, or the like.
The pre-processing camera 94 grasps the position of the paste applied to the substrate S by the syringe 91, and the like. The pre-processing stage 96 is raised when paste is applied to the substrate S, and supports the substrate S from below. The pre-processing stage 96 has suction holes (not shown) for vacuum suction of the substrate S, and can fix the substrate S. The pre-processing camera 94 photographs paste applied to a predetermined area of the proofing stage 100.
The proofing stage 100 is disposed so as to sandwich one of the pair of conveyance paths 52 on the Y-direction side with respect to the pre-processing stage 96. The proofing stage 100 is provided within the movement range of the syringe 91 and the pre-processing camera 94. Here, the syringe 91 and the pre-processing camera 94 move in the Y direction. Details of the proofing stage 100 will be described later.
The mounting section 40 has a mounting head 41, a Y driving section 43, a substrate recognition camera 44, and a mounting table 46. The mounting head 41 is provided with a collet 42 for sucking and holding the bare chip D at the tip. The Y driving unit 43 moves the mounting head 41 in the Y axis direction. The board recognition camera 44 photographs a position recognition mark (not shown) of the package region P of the board S, and recognizes the mounting position. Here, a plurality of product regions (hereinafter referred to as package regions P) that eventually become one package are formed on the substrate S. The position identification mark is provided for each package region P. The mounting table 46 is raised when the bare chip D is mounted on the substrate S, and supports the substrate S from below. The mounting table 46 has a suction port (not shown) for vacuum-sucking the substrate S, and can fix the substrate S. The mounting table 46 has a heating portion (not shown) for heating the substrate S. The mounting unit 40 includes driving units (not shown) for moving the mounting head 41 in the X direction and lifting and rotating the mounting head.
With this configuration, the mounting head 41 corrects the pickup position and posture based on the pickup data of the stage recognition camera 34, and picks up the bare chip D from the intermediate stage 31. The mounting head 41 mounts (mounts and bonds) the bare chip D on the paste-coated package region P of the transported substrate S based on the imaging data of the substrate recognition camera 44.
The conveying section 50 includes a conveying claw 51 for holding and conveying the substrate S, and a pair of conveying paths 52 for moving the substrate S. The substrate S is moved in the X direction by driving a nut (not shown) provided in the conveyance claw 51 of the conveyance path 52 by a ball screw (not shown) provided along the conveyance path 52. With this configuration, the substrate S is moved from the substrate supply unit 60 to the mounting position along the conveyance path 52, and after mounting, is moved to the substrate carry-out unit 70, and the substrate S is delivered to the substrate carry-out unit 70.
The substrate supply unit 60 takes out the substrate S stored in and carried in the carrier jig from the carrier jig and supplies the substrate S to the carrier unit 50. The substrate carrying-out section 70 stores the substrate S carried by the carrying section 50 in the carrying jig.
The control system of the chip mounter 1 will be described with reference to fig. 4. Fig. 4 is a block diagram showing a schematic configuration of a control system of the chip mounter shown in fig. 1.
The control system 8 includes a control unit 80, a driving unit 86, a signal unit 87, and an optical system 88. The control unit 80 generally includes a control and arithmetic device 81 mainly composed of a CPU (Central Processing Unit ), a storage device 82, an input/output device 83, a bus 84, and a power supply unit 85. The storage 82 has a primary storage 82a and a secondary storage 82b. The main memory 82a is constituted by a RAM (Random Access Memory ) storing a processing program or the like. The auxiliary storage 82b is configured by an HDD (HARD DISK DRIVE ) or an SSD (Solid STATE DRIVE, solid state disk) that stores control data, image data, and the like necessary for control.
The input/output device 83 has a monitor 83a for displaying device status, information, and the like of the chip mounter 1, a touch panel 83b for inputting an instruction from an operator, a mouse 83c for operating the monitor 83a, and an image pickup device 83d for picking up image data from the optical system 88. The input-output device 83 further has a motor control device 83e, an I/O signal control device 83f, and a focus control device 83g. The motor control device 83e controls the driving section 86 such as the ZY drive shaft of the XY stage of the wafer supply section 10 and the mounting head stage of the mounting section 40. The I/O signal control device 83f receives a signal from the signal section 87, and controls the signal section 87. The signal section 87 includes various sensors, switches for controlling the brightness of the lighting device, etc., a knob, etc. The control and arithmetic device 81 takes in necessary data via the bus 84 and calculates the data to control the pickup head 21 and the like, and sends information to the monitor 83a and the like.
The control and arithmetic device 81 stores the image data captured by the optical system 88 in the storage device 82 via the image capturing device 83 d. The optical system 88 includes the wafer recognition camera 14, the stage recognition camera 34, the substrate recognition camera 44, and the pre-process camera 94. The camera used in the optical system 88 digitizes the light intensity and color. The control and arithmetic device 81 performs positioning of the bare chip D and the substrate S, inspection of the paste application pattern, and surface inspection of the bare chip D and the substrate S by software programmed based on the stored image data. The control and arithmetic device 81 moves the driving unit 86 by the motor control device 83e based on the calculated positions of the bare chip D and the substrate S by software. By this process, the control and arithmetic device 81 positions the die D on the wafer W, and the die D is mounted on the package region P of the substrate S by operating the wafer supply unit 10, the pickup unit 20, and the driving unit of the mounting unit 40.
A mounting process (a method of manufacturing a semiconductor device) which is one of the steps of manufacturing a semiconductor device using the chip mounter 1 will be described with reference to fig. 5. Fig. 5 is a flowchart showing a method of manufacturing a semiconductor device using the die bonder shown in fig. 1. In the following description, the operations of the respective parts constituting the chip mounter 1 are controlled by the control unit 80.
(Wafer carrying-in step (step S1))
The wafer ring WR is supplied to the wafer cassette of the wafer cassette lifter 11. The supplied wafer ring WR is supplied to the wafer holding stage 12.
(Substrate carrying-in step (step S2))
The carrier tool storing the substrate S is supplied to the substrate supply unit 60. The substrate S is taken out from the conveyance jig at the substrate supply unit 60, and the substrate S is fixed to the conveyance claw 51.
(Pickup step (step S3))
After the step S1, the wafer holding stage 12 is moved so that the desired bare chip D can be picked up from the dicing tape DT. The bare chip D is photographed by the wafer recognition camera 14, and positioning and surface inspection of the bare chip D are performed based on image data obtained by the photographing. By performing image processing on the image data, the offset amount (X, Y, θ direction) of the die D on the wafer holding stage 12 from the die position reference point of the die mounter is calculated and positioned. The die position reference point is set and held in advance by setting a predetermined position of the wafer holding table 12 as an initial setting of the apparatus. The surface inspection of the bare chip D is performed by performing image processing on the image data.
The positioned bare chip D is peeled from the dicing tape DT by the peeling unit 13 and the pickup head 21. The bare chip D peeled from the dicing tape DT is sucked and held by the collet 22 provided on the pickup head 21, and is transported to the intermediate stage 31 to be placed thereon.
The bare chip D on the intermediate stage 31 is photographed by the stage recognition camera 34, and positioning and surface inspection of the bare chip D are performed based on image data obtained by photographing. By performing image processing on the image data, the offset amount (X, Y, θ direction) of the die D on the intermediate stage 31 from the die position reference point of the die mounter 1 is calculated and positioned. The reference point of the die position is set and held in advance by setting a predetermined position of the intermediate stage 31 as an initial setting of the device. The surface inspection of the bare chip D is performed by performing image processing on the image data.
The pickup head 21 that conveys the bare chip D to the intermediate stage 31 is returned to the wafer supply section 10. Following the above-described steps, the next die D is peeled from the dicing tape DT, and thereafter the die D are peeled from the dicing tape DT one by one following the same steps.
(Pretreatment step (step S4))
After step S2, the substrate S is transported to the pre-processing stage 96 by the transport unit 50. The surface of the substrate S before coating is photographed by the pre-processing camera 94, and the surface to which the paste should be applied is confirmed based on the image data obtained by photographing. If there is no problem on the surface to be coated, the position of the substrate S supported by the pre-processing stage 96 to be coated with the paste is checked and positioned. The positioning is performed by pattern matching or the like in the same manner as the mounting portion 40.
The paste is ejected from the nozzle 92 at the tip of the syringe 91 and applied to the substrate S in accordance with the trajectory of the nozzle 92 set in advance.
The applied paste is photographed by a pre-processing camera 94. Whether the paste is properly applied or not is confirmed based on the image obtained by photographing, and inspection (appearance inspection) of the applied paste is performed. That is, in the appearance inspection, it is confirmed whether or not the applied paste is applied in a predetermined shape and in a predetermined amount to a predetermined position of the substrate S. The inspection content is, for example, the presence or absence of paste, application area, application shape (shortage, excess), and the like. The inspection may be performed by a method of comparing the pixels after separating the regions of the paste by binarization, a method of comparing the scores obtained by pattern matching, or the like.
(Mounting Process (Process S5))
If there is no problem in coating, the substrate S is transported to the mounting table 46 by the transport unit 50. The substrate S placed on the mounting table 46 is photographed by the substrate recognition camera 44, and image data is acquired by the photographing. By performing image processing on the image data, the offset amount (X, Y, θ direction) of the substrate S from the substrate position reference point of the chip mounter is calculated. The predetermined position of the mounting portion 40 is set as the initial setting of the device and held in advance with respect to the board position reference point.
The suction position of the mounting head 41 is corrected based on the offset amount of the die D on the intermediate stage 31 calculated in step S3, and the die D is sucked by the collet 42. The die D is mounted on a predetermined portion of the substrate S supported on the mounting table 46 by the mounting head 41 that suctions the die D from the intermediate stage 31. The bare chip D mounted on the substrate S is photographed by the substrate recognition camera 44, and inspection of whether the bare chip D is mounted to a desired position or not is performed based on image data obtained by photographing.
The mounting head 41, which mounts the bare chip D to the substrate S, is returned to the intermediate stage 31. Following the steps described above, the next bare chip D is picked up from the intermediate stage 31 and mounted to the substrate S. This step is repeated to attach the bare chip D to all the package regions P of the substrate S.
(Substrate carrying-out Process (Process S6))
The substrate S on which the bare chip D is mounted is conveyed to the substrate carrying-out section 70. The substrate S is taken out from the transfer claw 51 in the substrate carrying-out section 70 and stored in the transfer jig. The carrier jig storing the substrate S is carried out from the die mounter 1.
As described above, the bare chip D is mounted on the substrate S and carried out from the die mounter 1. Then, for example, the carrier jig storing the substrate S on which the bare chip D is mounted is carried to a wire bonding step, and the electrodes of the bare chip D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is carried to an injection molding process, and the bare chip D and the Au wire are sealed with an injection molding resin (not shown), whereby the semiconductor package is completed.
The application of the paste in the pre-processing section will be described with reference to fig. 6. Fig. 6 is a block diagram showing a configuration example of the preprocessing section.
The pre-processing section 90 includes a syringe 91, a driving section 93, a pre-processing camera 94, a syringe holder 95, a pre-processing stage 96, a dispenser 97, and a pipe 98 for supplying air pressure.
When the paste stored in the syringe 91 is applied to the substrate S, the control unit 80 supplies pressurized gas such as air from the air-pulse type dispenser 97 for a fixed time from the upper portion of the syringe 91, and ejects a predetermined amount of paste. The control unit 80 makes the injector 91 scan (draw) in two dimensions (normally, from the center to the center) in the XY plane with the nozzle 92 being brought close to the substrate.
The dispenser 97 includes a compressed air supply port 97a connected to a positive pressure source, a vacuum exhaust port 97b connected to a negative pressure source, an exhaust port 97c for exhausting compressed air supplied to the syringe, and an air control output port 97d.
The operation of the dispenser 97 is described. The compressed air introduced from the compressed air supply port 97a is regulated to an appropriate pressure by a discharge regulator (not shown) and is sent out from the air control output port 97d via a valve unit (not shown). Inside the air control outlet 97d, a pressure sensor 97e for monitoring output is provided. The compressed air supplied to the syringe 91 is forcibly discharged from the exhaust port 97c via a valve unit (not shown). In addition, in order to avoid dripping due to the weight of the paste when not ejecting, it is necessary to supply a weak vacuum. The vacuum is discharged from the vacuum exhaust port 97b by bringing the compressed air from the compressed air supply port 97a to an appropriate pressure (negative pressure) via a vacuum regulator (not shown). The negative pressure is controlled by a valve unit (not shown) and is connected to the air control outlet 97 d. The discharge pressure can be measured from a pressure signal (PRS) output from the dispenser 97. The discharge time can be measured by measuring a Discharge Signal (DSC) output from the dispenser 97.
The paste ejection process is described. The paste is contained in the syringe 91. First, in response to an instruction from the control unit 80, the driving unit 93 lowers the syringe holder 95, thereby lowering the tip of the nozzle 92 from a relatively high position to a position at a predetermined height (nozzle height (Hn)) from the upper surface of the substrate S at the ejection start time. The nozzle height (Hn) is, for example, 100 to 200 μm. When compressed air is supplied from the dispenser 97 through the pipe 98 in accordance with an instruction from the control unit 80, the air pressure in the syringe 91 increases rapidly and ejection starts gradually. In synchronization therewith, the drawing action starts. Specifically, the driving unit 93 moves the syringe holder 95 in response to an instruction from the control unit 80, and thereby the nozzle 92 horizontally moves in two dimensions. The nozzle 92 is normally returned to the initial position and the drawing operation is ended. In synchronization with this, when the supply of the compressed air from the dispenser 97 is stopped in accordance with the instruction of the control unit 80, the air pressure in the syringe 91 rapidly decreases, and the ejection gradually decreases to stop. Almost simultaneously with the stop, the driving section 93 lifts the nozzle 92 according to the instruction of the control section 80.
Next, the proofing stage 100 will be described with reference to fig. 7. Fig. 7 is a plan view showing a proofing stage to which paste is applied before replacement of a syringe.
As shown in fig. 7, the proofing stage 100 has a coating region 101 and a proofing region 102. The application area 101 is an area to apply paste when the syringe 91 is replaced together with the nozzle 92 or when only the syringe 91 is replaced.
In addition, when the remaining amount of paste in the syringe 91 is small, the syringe 91 is replaced in advance so that the paste is not interrupted in the middle of the next application operation. In addition, there are cases where the syringe 91 is replaced according to the kind of bare chip.
The proofing region 102 is a region in which the paste is proofing when the coating is not performed for a predetermined time or longer. When the coating is not performed for a predetermined time or longer, the coating amount at the start of the coating becomes unstable due to the influence of thixotropic properties (thixotropy). Therefore, for example, a preliminary operation of patterning the paste is performed before the application to the first sealing region P of the substrate S. The three squares shown in the proofing area 102 are proofing pastes Ps. The syringe 91, the pre-processing camera 94, the pre-processing stage 96, and the proofing stage 100 constitute a coating apparatus.
Next, the adjustment of the coating position and the coating amount using the proofing stage 100 will be described with reference to fig. 7 to 9. Fig. 8 is a plan view showing the proofing stage coated with paste after replacement of the syringe. Fig. 9 is a flowchart showing a method of adjusting the coating position or the coating amount.
(Step S11)
As shown in fig. 7, when the syringe 91 is replaced, the control unit 80 applies paste to the application region 101 of the proofing stage 100 through the syringe 91 and the nozzle 92. Here, the pattern of the applied paste is the same as the pattern of the encapsulation region P applied to the substrate S.
(Step S12)
Then, the control section 80 photographs the applied paste Pb by the pre-processing camera 94. The control unit 80 acquires and recognizes (measures) the captured image (reference image) and stores (records) the measurement result in the storage device 82.
The stored measurement results are the X coordinate (application position X) and Y coordinate (application position Y) of the application position (center of gravity position of area) of the paste Pb, and the area (application area) of the paste Pb. At least one of the application position of the paste Pb and the area of the paste Pb may be measured, and only one of the application position of the paste Pb and the measurement result of the area of the paste Pb may be stored.
The measurement result is calculated by the control unit 80 by performing image processing on the acquired reference image. The application position (Cb) of the paste Pb is the center of gravity position of the pixel, and the application area (CAb) of the paste Pb is the number of pixels.
(Step S13)
Next, the operator replaces the syringe 91. In addition, the operator removes the paste applied on the application region 101 of the proofing stage 100.
(Step S14)
As shown in fig. 8, after the syringe 91 is replaced, the control unit 80 applies paste to the application region 101 of the proofing stage 100. Here, the pattern of the applied paste is the same as the pattern applied to the application region 101 of the proofing stage 100 before the syringe 91 is replaced.
(Step S15)
Then, the control unit 80 photographs the applied paste Pa by the pre-processing camera 94. The control unit 80 acquires and recognizes (measures) the captured image (target image) and stores (records) the measurement result in the storage device 82.
The stored measurement results are the X coordinate (application position X) and Y coordinate (application position Y) of the application position (center of gravity position of area) of the paste Pa, and the area (application area) of the paste Pa. At least one of the application position of the paste Pa and the area of the paste Pa is checked, and only one of the application position of the paste Pa and the area of the paste Pa may be stored as a result of measuring the same.
The measurement result is calculated by the control unit 80 by performing image processing on the acquired target image. The application position (Ca) of the paste Pa is the center of gravity position of the pixel, and the application area (CAa) of the paste Pa is the number of pixels.
(Step S16)
The control unit 80 corrects the positions of the syringe 91 and the nozzle 92 after replacement based on the application position (Cb) of the paste Pb measured in step S12 and the application position (Ca) of the paste Pa measured in step S15. In addition, step S16 is not performed without adjusting the coating position.
(Step S17)
The control unit 80 corrects at least one of the discharge pressure and discharge time of the dispenser 97 based on the paste Pb application area (CAb) measured in step S12 and the paste Pa application area (CAa) measured in step S15. In addition, step S17 is not performed without adjusting the coating amount.
According to the embodiment, at least one of the following effects is obtained.
(A) Since the paste applied on the proofing stage 100 can be recognized by the preprocessing camera 94 and the application position and the application amount can be calculated, the application position and the application amount can be adjusted.
(B) Since the application position and the application amount of the paste can be adjusted by the patterning stage 100, the production parts can be saved as compared with the case where the paste is applied to the production parts such as the substrate S and the application position is adjusted.
(C) Since the application position and the application amount of the paste can be adjusted by the proofing stage 100, the influence of the variation in the production parts can be eliminated.
(D) Since the coating position and the coating amount can be adjusted using image recognition, the influence of the operation deviation of each operator is eliminated. Thus, the product reject ratio can be reduced.
< Modification >
In the following, several representative modifications of the embodiment are exemplified. In the following description of the modification, the same reference numerals as those of the above-described embodiment are used for the portions having the same structures and functions as those of the above-described embodiment. The description of the above-described embodiment can be appropriately referred to in the range where the above-described descriptions are not technically contradictory. In addition, some of the above embodiments and all or some of the modifications can be applied in a suitable combination within a range that is not technically contradictory.
(First modification)
The pre-processing portion in the first modification will be described with reference to fig. 10. Fig. 10 is a side view showing the structure of the pre-processing portion in the first modification.
The proofing stage 100 in the first modification example is made of a material transparent to visible light, such as glass. The lower-view camera (imaging device) 104 in the first modification is disposed below the proofing stage 100. The control unit 80 applies paste on the proofing stage 100 by using the syringe 91. Then, the control unit 80 photographs the paste applied to the proofing stage 100 from the back side (lower side) of the proofing stage 100, and confirms the application position and application area of the paste. Since the imaging surface of the paste is flat, the shape of the paste can be recognized more accurately.
(Second modification)
A proofing stage in the second modification will be described with reference to fig. 11. Fig. 11 is a plan view showing a proofing stage according to a second modification.
The proofing stage 100 in the second modification is movable, for example, in the X direction. In this way, a plurality of coating regions 101 can be provided on the proofing stage 100, and the coating range of the paste can be widened.
The invention made by the present inventors has been specifically described above based on the embodiments and the modifications, but the invention is not limited to the embodiments and the modifications, and various modifications are naturally possible.
For example, in the embodiment, the example of photographing the paste applied to the proofing stage 100 by the pre-processing camera 94 has been described, but the paste may be photographed by a camera different from the pre-processing camera 94.
In the embodiment, the paste is applied to the substrate S, but the paste may be applied to the mounted bare chip.
In the embodiment, an example was described in which the intermediate stage section 30 is provided between the wafer supply section 10 and the mounting section 40, the bare chip D picked up from the wafer supply section 10 is mounted on the intermediate stage 31 by the pickup head 21, the bare chip D is picked up again from the intermediate stage 31 by the mounting head 41, and the bare chip D is mounted on the conveyed substrate S. The die D picked up from the wafer supply section 10 may be mounted on the substrate S by the mounting head 41.

Claims (11)

1. A semiconductor manufacturing apparatus includes:
a syringe having a nozzle at a tip end for storing a paste;
a first stage for applying paste from the syringe;
a second stage for supporting a substrate coated with a paste by the syringe;
A photographing device that recognizes the paste applied on the first stage; and
And a control device configured to adjust a coating position and a coating amount of the replaced syringe based on a result of identifying the first paste applied to the first stage by the syringe before the replacement and a result of identifying the second paste applied to the first stage by the syringe after the replacement.
2. The semiconductor manufacturing apparatus according to claim 1, wherein,
The control device is configured to control the operation of the vehicle,
Shooting the first paste by the shooting device, recording a first coating position and a first coating area calculated from the shot image in a storage device,
Shooting the second paste by the shooting device, recording a second coating position and a second coating area calculated from the shot image in the storage device,
Correcting the position of the replaced syringe based on the first application position and the second application position, and correcting the ejection rate of the replaced syringe based on the first application area and the second application area.
3. The semiconductor manufacturing apparatus according to claim 1, wherein,
The control device is configured to apply the first paste and the second paste to a predetermined region of the first stage.
4. The semiconductor manufacturing apparatus according to claim 2, wherein,
Further comprises a driving part for moving the syringe,
The control device is configured to adjust the application position by moving the syringe by the driving unit based on the first application position and the second application position.
5. The semiconductor manufacturing apparatus according to claim 2, wherein,
Further comprising a dispenser for supplying pressurized gas to the syringe,
The control device is configured to adjust the coating amount by changing the pressure of the dispenser based on the first coating area and the second coating area.
6. The semiconductor manufacturing apparatus according to claim 1, wherein,
The first stage is formed by a component transparent under visible light,
The paste is coated on the upper surface of the first stage,
The photographing device is disposed below the first stage.
7. The semiconductor manufacturing apparatus according to claim 1, wherein,
The first stage is configured to be movable.
8. The semiconductor manufacturing apparatus according to claim 1, wherein,
The control device is configured to take an image of the substrate and the paste applied to the substrate by the imaging device.
9. The semiconductor manufacturing apparatus according to claim 1, wherein,
The mounting head is further provided with a mounting head for mounting the bare chip on the substrate coated with the paste.
10. A coating device is provided with:
A syringe having a nozzle at a front end thereof, for storing a paste;
a first stage;
a second stage for supporting the paste-coated substrate;
An imaging device for imaging the paste applied to the first stage; and
And a control device configured to adjust a coating position and a coating amount of the replaced syringe based on a result of identifying the first paste applied to the first stage by the syringe before the replacement and a result of identifying the second paste applied to the first stage by the syringe after the replacement.
11. A method of manufacturing a semiconductor device, comprising:
A step of loading a substrate into a semiconductor manufacturing apparatus, wherein the semiconductor manufacturing apparatus comprises: a syringe having a nozzle at a front end and storing a paste; a first stage; a second stage for supporting the paste-coated substrate; an imaging device for imaging the paste applied to the first stage; and a control device configured to adjust a coating position and a coating amount of the replaced syringe based on a result of recognition of the first paste applied to the first stage by the syringe before the replacement and a result of recognition of the second paste applied to the first stage by the syringe after the replacement; and
And applying a paste to the substrate supported by the second stage.
CN202410097490.5A 2023-01-26 2024-01-24 Semiconductor manufacturing apparatus, coating apparatus, and method for manufacturing semiconductor device Pending CN118398520A (en)

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Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04199778A (en) * 1990-11-29 1992-07-20 Sanyo Electric Co Ltd Coating apparatus
JP2006007013A (en) * 2004-06-22 2006-01-12 Shibaura Mechatronics Corp Paste application method and apparatus
JP2007250617A (en) 2006-03-14 2007-09-27 Matsushita Electric Ind Co Ltd Bonding apparatus and bonding method
KR101641115B1 (en) 2008-02-22 2016-07-20 무사시 엔지니어링 가부시키가이샤 Ejection amount correction method and coating apparatus
JP2010051876A (en) * 2008-08-27 2010-03-11 Nec Corp Method for detecting center position of coating liquid drop and device for applying liquid material
JP2010119954A (en) 2008-11-19 2010-06-03 Hitachi High-Technologies Corp Functional liquid application apparatus, and apparatus and method for exchanging functional liquid supply head
JP5630050B2 (en) 2010-03-26 2014-11-26 パナソニック株式会社 Paste applicator
JP5382005B2 (en) 2011-01-06 2014-01-08 パナソニック株式会社 Paste application method
JP6982731B2 (en) 2018-01-31 2021-12-17 パナソニックＩｐマネジメント株式会社 Paste application device and paste application method
JP7161870B2 (en) 2018-06-27 2022-10-27 ファスフォードテクノロジ株式会社 Die bonder and semiconductor device manufacturing method
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