CN118604044A - A method and system for testing the performance of thermal conductivity and heat dissipation structure of computer circuits - Google Patents
A method and system for testing the performance of thermal conductivity and heat dissipation structure of computer circuits Download PDFInfo
- Publication number
- CN118604044A CN118604044A CN202410361075.6A CN202410361075A CN118604044A CN 118604044 A CN118604044 A CN 118604044A CN 202410361075 A CN202410361075 A CN 202410361075A CN 118604044 A CN118604044 A CN 118604044A
- Authority
- CN
- China
- Prior art keywords
- temperature
- heat dissipation
- temperature sensor
- time period
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 173
- 238000012360 testing method Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000011056 performance test Methods 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 12
- 238000013461 design Methods 0.000 claims description 9
- 230000032683 aging Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000007599 discharging Methods 0.000 description 3
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 2
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明提供一种计算机电路的导热散热结构性能测试方法和系统，涉及测试技术领域。所述方法包括：在导热散热结构的风路中设置多个温度传感器；控制计算机电路按照最大功率运行并采集第一温度数据；启动散热扇，运行第二预设时间段并采集第二温度数据，进而确定温度控制性能评分；检测风速数据，进而确定散热性能评分；控制计算机电路停止运行，保持散热扇运行第三时间段并采集第三温度数据，进而确定散热速度评分；根据温度控制性能评分、散热性能评分和散热速度评分，确定性能测试评分。根据本发明，可基于三个方面的评分全面掌握导热散热结构的性能，有助于控制计算机的集成电路的温度，提升计算机的性能，降低计算机的电子器件的老化速度。
The present invention provides a method and system for testing the performance of a heat-conducting and heat-dissipating structure of a computer circuit, and relates to the field of testing technology. The method comprises: setting a plurality of temperature sensors in the air path of the heat-conducting and heat-dissipating structure; controlling the computer circuit to operate at maximum power and collecting first temperature data; starting the heat dissipation fan, operating the second preset time period and collecting second temperature data, and then determining the temperature control performance score; detecting wind speed data, and then determining the heat dissipation performance score; controlling the computer circuit to stop operating, keeping the heat dissipation fan operating for a third time period and collecting third temperature data, and then determining the heat dissipation speed score; determining the performance test score according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score. According to the present invention, the performance of the heat-conducting and heat-dissipating structure can be fully grasped based on the scores of the three aspects, which is helpful to control the temperature of the computer's integrated circuit, improve the computer's performance, and reduce the aging speed of the computer's electronic components.
Description
技术领域Technical Field
本发明涉及测试技术领域，尤其涉及一种计算机电路的导热散热结构性能测试方法和系统。The present invention relates to the field of testing technology, and in particular to a method and system for testing the performance of a heat conduction and heat dissipation structure of a computer circuit.
背景技术Background Art
在相关技术中，通常通过直接测量计算机机箱内温度，或者计算级的集成电路中能够产生热量的电子器件的温度的方式，确定导热散热结构的性能是否达标，但该种测试方式精确性较差，难以准确且全面地了解导热散热结构的性能。In the related art, whether the performance of the thermal conductive heat dissipation structure meets the standard is usually determined by directly measuring the temperature inside the computer case or the temperature of the electronic devices that can generate heat in the computing-level integrated circuit. However, this test method has poor accuracy and it is difficult to accurately and comprehensively understand the performance of the thermal conductive heat dissipation structure.
公开于本申请背景技术部分的信息仅仅旨在加深对本申请的一般背景技术的理解，而不应当被视为承认或以任何形式暗示该信息构成已为本领域技术人员所公知的现有技术。The information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or any form of implication that the information constitutes the prior art already known to those skilled in the art.
发明内容Summary of the invention
本发明提供一种计算机电路的导热散热结构性能测试方法和系统，能够解决相关技术中测试导热散热结构的性能时精确性较差的技术问题。The present invention provides a method and system for testing the performance of a heat-conducting and heat-dissipating structure of a computer circuit, which can solve the technical problem of poor accuracy in testing the performance of a heat-conducting and heat-dissipating structure in the related art.
根据本发明的第一方面，提供一种计算机电路的导热散热结构性能测试方法,包括：According to a first aspect of the present invention, a method for testing the performance of a thermal conductive heat dissipation structure of a computer circuit is provided, comprising:
在导热散热结构的风路中设置多个温度传感器，其中，每个温度传感器具有序号；A plurality of temperature sensors are arranged in the air path of the heat-conducting and heat-dissipating structure, wherein each temperature sensor has a serial number;
控制计算机电路按照最大功率运行第一预设时间段，并在第一预设时间段内的每个时刻，获取每个温度传感器检测到的第一温度数据；Controlling the computer circuit to operate at maximum power for a first preset time period, and obtaining first temperature data detected by each temperature sensor at each moment in the first preset time period;
保持所述计算机电路按照最大功率运行的状态，并启动导热散热结构的散热扇，使所述散热扇按照最大功率运行第二预设时间段，并在所述第二预设时间段内的每个时刻，获取每个温度传感器检测到的第二温度数据；Maintaining the state where the computer circuit operates at maximum power, and starting the heat dissipation fan of the heat conduction and heat dissipation structure, so that the heat dissipation fan operates at maximum power for a second preset time period, and obtaining second temperature data detected by each temperature sensor at each moment in the second preset time period;
根据所述第一温度数据、所述第二温度数据，以及温度传感器的序号，确定温度控制性能评分；Determine a temperature control performance score according to the first temperature data, the second temperature data, and a serial number of the temperature sensor;
在所述第二预设时间段中，检测风路出口处的风速数据，其中，所述风路出口处设置有温度传感器；In the second preset time period, wind speed data at an air path outlet is detected, wherein a temperature sensor is provided at the air path outlet;
根据所述风路的设计参数、所述风速数据和所述风路出口处的温度传感器检测到的第二温度数据，确定散热性能评分；Determining a heat dissipation performance score according to the design parameters of the air duct, the wind speed data, and second temperature data detected by a temperature sensor at an outlet of the air duct;
控制所述计算机电路停止运行，并保持所述散热扇按照最大功率运行第三时间段，并在第三时间段内的每个时刻，获取每个温度传感器检测到的第三温度数据；Control the computer circuit to stop running, and keep the cooling fan running at maximum power for a third time period, and obtain third temperature data detected by each temperature sensor at each moment in the third time period;
根据所述第三温度数据，确定散热速度评分；Determining a heat dissipation speed score according to the third temperature data;
根据所述温度控制性能评分、所述散热性能评分和所述散热速度评分，确定导热散热结构的性能测试评分。A performance test score of the thermally conductive heat dissipation structure is determined according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score.
根据本发明的第二方面，提供一种计算机电路的导热散热结构性能测试系统，包括：According to a second aspect of the present invention, there is provided a thermal conductivity and heat dissipation structure performance testing system for a computer circuit, comprising:
设置模块，用于在导热散热结构的风路中设置多个温度传感器，其中，每个温度传感器具有序号；A setting module, used to set a plurality of temperature sensors in the air path of the heat conduction and heat dissipation structure, wherein each temperature sensor has a serial number;
第一检测模块，用于控制计算机电路按照最大功率运行第一预设时间段，并在第一预设时间段内的每个时刻，获取每个温度传感器检测到的第一温度数据；A first detection module, used to control the computer circuit to operate at maximum power for a first preset time period, and to obtain first temperature data detected by each temperature sensor at each moment in the first preset time period;
第二检测模块，用于保持所述计算机电路按照最大功率运行的状态，并启动导热散热结构的散热扇，使所述散热扇按照最大功率运行第二预设时间段，并在所述第二预设时间段内的每个时刻，获取每个温度传感器检测到的第二温度数据；a second detection module, configured to maintain the computer circuit in a state of operating at maximum power, and start a heat dissipation fan of the heat conduction and heat dissipation structure, so that the heat dissipation fan operates at maximum power for a second preset time period, and obtain second temperature data detected by each temperature sensor at each moment in the second preset time period;
温度控制性能评分模块，用于根据所述第一温度数据、所述第二温度数据，以及温度传感器的序号，确定温度控制性能评分；a temperature control performance scoring module, configured to determine a temperature control performance score according to the first temperature data, the second temperature data, and a sequence number of a temperature sensor;
风速模块，用于在所述第二预设时间段中，检测风路出口处的风速数据，其中，所述风路出口处设置有温度传感器；A wind speed module, used for detecting wind speed data at an air path outlet in the second preset time period, wherein a temperature sensor is provided at the air path outlet;
散热性能评分模块，用于根据所述风路的设计参数、所述风速数据和所述风路出口处的温度传感器检测到的第二温度数据，确定散热性能评分；a heat dissipation performance scoring module, configured to determine a heat dissipation performance score according to the design parameters of the air duct, the wind speed data, and second temperature data detected by a temperature sensor at an outlet of the air duct;
第三检测模块，用于控制所述计算机电路停止运行，并保持所述散热扇按照最大功率运行第三时间段，并在第三时间段内的每个时刻，获取每个温度传感器检测到的第三温度数据；a third detection module, used for controlling the computer circuit to stop running, and keeping the cooling fan running at maximum power for a third time period, and obtaining third temperature data detected by each temperature sensor at each moment in the third time period;
散热速度评分模块，用于根据所述第三温度数据，确定散热速度评分；A heat dissipation speed scoring module, used to determine a heat dissipation speed score according to the third temperature data;
性能测试评分模块，用于根据所述温度控制性能评分、所述散热性能评分和所述散热速度评分，确定导热散热结构的性能测试评分。The performance test scoring module is used to determine the performance test score of the thermal conductive heat dissipation structure according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score.
技术效果：根据本发明，可在导热散热结构的风路中设置多个温度传感器，从而准确且全面地检测导热散热结构中各个位置的温度数据，提升检测的准确性和全面性，且可基于不同工况下的温度数据以及其他相关数据分别确定温度控制性能评分、散热性能评分和散热速度评分，从而可基于三个方面的评分全面掌握导热散热结构的性能，有助于控制计算机的集成电路的温度，提升计算机的性能，降低计算机的电子器件的老化速度。在确定温度控制性能评分时，可通过功率比来确定目标温度传感器所在位置处的温度变化趋势的相对变化的权值，并通过非目标温度传感器与最接近的目标温度传感器之间的序号差异来确定非目标温度传感器所在位置处的温度变化趋势的相对变化的权值，从而使得温度控制性能评分能够准确反映各个位置的温度控制的重要性，并且，可使与目标温度传感器相关的项的权重大于与非目标温度传感器相关的项的权重，从而可准确反映导热散热结构对于风路中的各个位置的温度控制能力。在确定散热性能评分时，可确定第二预设时间段内散热扇排出机箱的总热量，以及各个电子器件在第二时间段内的总耗电量，并将二者之比作为散热性能评分，从而准确且客观地描述电子器件发热的热量中，被排出机箱的热量的占比，可准确反映导热散热结构的散热性能。在确定散热速度评分时，可通过温度传感器检测到的第三温度数据的下降速率，和第一温度数据的上升速率之比来确定散热速度的快慢，并通过预设权重来表示不同位置处的散热速度的重要性，从而使散热速度评分能够客观且准确地表达导热散热结构的散热性能。Technical effect: According to the present invention, multiple temperature sensors can be set in the air path of the heat-conducting heat dissipation structure, so as to accurately and comprehensively detect the temperature data of each position in the heat-conducting heat dissipation structure, improve the accuracy and comprehensiveness of the detection, and can respectively determine the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score based on the temperature data under different working conditions and other related data, so that the performance of the heat-conducting heat dissipation structure can be fully grasped based on the scores of the three aspects, which is helpful to control the temperature of the computer's integrated circuit, improve the performance of the computer, and reduce the aging speed of the computer's electronic devices. When determining the temperature control performance score, the weight of the relative change of the temperature change trend at the location of the target temperature sensor can be determined by the power ratio, and the weight of the relative change of the temperature change trend at the location of the non-target temperature sensor can be determined by the difference in the serial number between the non-target temperature sensor and the closest target temperature sensor, so that the temperature control performance score can accurately reflect the importance of temperature control at each position, and the weight of the item related to the target temperature sensor can be made greater than the weight of the item related to the non-target temperature sensor, so that the temperature control ability of the heat-conducting heat dissipation structure for each position in the air path can be accurately reflected. When determining the heat dissipation performance score, the total heat discharged from the chassis by the cooling fan in the second preset time period and the total power consumption of each electronic device in the second time period can be determined, and the ratio of the two can be used as the heat dissipation performance score, thereby accurately and objectively describing the proportion of heat generated by the electronic device that is discharged from the chassis, which can accurately reflect the heat dissipation performance of the thermal conductive heat dissipation structure. When determining the heat dissipation speed score, the speed of the heat dissipation can be determined by the ratio of the decrease rate of the third temperature data detected by the temperature sensor to the increase rate of the first temperature data, and the importance of the heat dissipation speed at different positions can be expressed by preset weights, so that the heat dissipation speed score can objectively and accurately express the heat dissipation performance of the thermal conductive heat dissipation structure.
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，而非限制本发明。根据下面参考附图对示例性实施例的详细说明，本发明的其它特征及方面将更清楚。It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and not limiting of the present invention. Other features and aspects of the present invention will become more apparent from the following detailed description of exemplary embodiments with reference to the accompanying drawings.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的实施例，In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other embodiments can be obtained based on these drawings without creative work.
图1示例性地示出根据本发明实施例的计算机电路的导热散热结构性能测试方法的流程示意图；FIG1 exemplarily shows a flow chart of a method for testing the performance of a heat conduction and heat dissipation structure of a computer circuit according to an embodiment of the present invention;
图2示例性地示出根据本发明实施例的计算机电路的导热散热结构性能测试系统的框图。FIG. 2 exemplarily shows a block diagram of a thermal conductive and heat dissipation structure performance testing system for a computer circuit according to an embodiment of the present invention.
具体实施方式DETAILED DESCRIPTION
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
下面以具体地实施例对本发明的技术方案进行详细说明。下面这几个具体的实施例可以相互结合，对于相同或相似的概念或过程可能在某些实施例不再赘述。The technical solution of the present invention is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.
图1示例性地示出根据本发明实施例的计算机电路的导热散热结构性能测试方法的流程示意图，所述方法包括：FIG1 exemplarily shows a flow chart of a method for testing the performance of a heat conduction and heat dissipation structure of a computer circuit according to an embodiment of the present invention, the method comprising:
步骤S101，在导热散热结构的风路中设置多个温度传感器，其中，每个温度传感器具有序号；Step S101, setting a plurality of temperature sensors in the air path of the heat conduction and heat dissipation structure, wherein each temperature sensor has a serial number;
步骤S102，控制计算机电路按照最大功率运行第一预设时间段，并在第一预设时间段内的每个时刻，获取每个温度传感器检测到的第一温度数据；Step S102, controlling the computer circuit to operate at maximum power for a first preset time period, and obtaining first temperature data detected by each temperature sensor at each moment in the first preset time period;
步骤S103，保持所述计算机电路按照最大功率运行的状态，并启动导热散热结构的散热扇，使所述散热扇按照最大功率运行第二预设时间段，并在所述第二预设时间段内的每个时刻，获取每个温度传感器检测到的第二温度数据；Step S103, maintaining the state where the computer circuit operates at maximum power, and starting the heat dissipation fan of the heat conduction and heat dissipation structure, so that the heat dissipation fan operates at maximum power for a second preset time period, and obtaining second temperature data detected by each temperature sensor at each moment in the second preset time period;
步骤S104，根据所述第一温度数据、所述第二温度数据，以及温度传感器的序号，确定温度控制性能评分；Step S104, determining a temperature control performance score according to the first temperature data, the second temperature data, and the serial number of the temperature sensor;
步骤S105，在所述第二预设时间段中，检测风路出口处的风速数据，其中，所述风路出口处设置有温度传感器；Step S105, in the second preset time period, detecting wind speed data at the wind path outlet, wherein a temperature sensor is provided at the wind path outlet;
步骤S106，根据所述风路的设计参数、所述风速数据和所述风路出口处的温度传感器检测到的第二温度数据，确定散热性能评分；Step S106, determining a heat dissipation performance score according to the design parameters of the air duct, the wind speed data, and second temperature data detected by a temperature sensor at an outlet of the air duct;
步骤S107，控制所述计算机电路停止运行，并保持所述散热扇按照最大功率运行第三时间段，并在第三时间段内的每个时刻，获取每个温度传感器检测到的第三温度数据；Step S107, controlling the computer circuit to stop running, and keeping the cooling fan running at maximum power for a third time period, and acquiring third temperature data detected by each temperature sensor at each moment in the third time period;
步骤S108，根据所述第三温度数据，确定散热速度评分；Step S108, determining a heat dissipation speed score according to the third temperature data;
步骤S109，根据所述温度控制性能评分、所述散热性能评分和所述散热速度评分，确定导热散热结构的性能测试评分。Step S109, determining a performance test score of the thermal conductive heat dissipation structure according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score.
根据本发明的实施例的计算机电路的导热散热结构性能测试方法，可在导热散热结构的风路中设置多个温度传感器，从而准确且全面地检测导热散热结构中各个位置的温度数据，提升检测的准确性和全面性，且可基于不同工况下的温度数据以及其他相关数据分别确定温度控制性能评分、散热性能评分和散热速度评分，从而可基于三个方面的评分全面掌握导热散热结构的性能，有助于控制计算机的集成电路的温度，提升计算机的性能，降低计算机的电子器件的老化速度。According to the thermal conductive heat dissipation structure performance testing method of a computer circuit according to an embodiment of the present invention, multiple temperature sensors can be set in the air path of the thermal conductive heat dissipation structure to accurately and comprehensively detect the temperature data of various positions in the thermal conductive heat dissipation structure, thereby improving the accuracy and comprehensiveness of the detection, and can respectively determine the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score based on the temperature data under different working conditions and other related data, so that the performance of the thermal conductive heat dissipation structure can be fully understood based on the scores of the three aspects, which helps to control the temperature of the computer's integrated circuit, improve the performance of the computer, and reduce the aging rate of the computer's electronic components.
根据本发明的一个实施例，在步骤S101中，计算机电路中的导热散热结构通常可包括导体材料构成的风路，例如，铜制管道，导热散热结构还可包括散热扇，散热扇可设置在风路的尽头，通过散热扇的旋转，使得风路内的空气流动，从而将电子器件散入风路中的热量排出计算机的机箱。能够产生热量的电子器件可于风路的多个位置相邻设置，便于将产生的热量散入风路，并通过风路排出机箱，减少热量在机箱内的积累，减少机箱内温度过高，导致电路性能下降甚至损坏电路的可能性。可在风路的多个位置设置温度传感器，从而检测风路中多个位置处的温度数据，所述多个位置可包括与所述电子器件相邻的位置，风路出口的位置等。According to one embodiment of the present invention, in step S101, the heat conduction and heat dissipation structure in the computer circuit may generally include an air path made of a conductive material, such as a copper pipe. The heat conduction and heat dissipation structure may also include a heat dissipation fan, which may be arranged at the end of the air path. The rotation of the heat dissipation fan allows the air in the air path to flow, thereby discharging the heat dissipated by the electronic device into the air path out of the computer chassis. Electronic devices capable of generating heat may be arranged adjacent to multiple positions in the air path, so as to facilitate dissipating the generated heat into the air path and discharging it out of the chassis through the air path, thereby reducing the accumulation of heat in the chassis, and reducing the possibility of excessive temperature in the chassis, resulting in reduced circuit performance or even damage to the circuit. Temperature sensors may be arranged at multiple positions in the air path to detect temperature data at multiple positions in the air path, and the multiple positions may include positions adjacent to the electronic device, positions of the air path outlet, etc.
根据本发明的一个实施例，在步骤S102中，在对导热散热结构的性能进行测试时，可首先控制计算机电路按照最大功率运行第一预设时间段，例如，1分钟，3分钟，5分钟等，本发明对第一预设时间段的时长不做限制。使得计算机电路中的多个电子器件充分发热，并可在第一预设时间段内的多个时刻获取第一温度数据，通过第一温度数据可确定风路的各个位置处的实时温度和升温速度。每个时刻之间的时间间隔可以是1秒，3秒，5秒等，本发明对时刻之间的时间间隔不做限制。According to one embodiment of the present invention, in step S102, when testing the performance of the heat-conducting and heat-dissipating structure, the computer circuit can be first controlled to run at maximum power for a first preset time period, for example, 1 minute, 3 minutes, 5 minutes, etc. The present invention does not limit the length of the first preset time period. Multiple electronic devices in the computer circuit are fully heated, and first temperature data can be obtained at multiple moments in the first preset time period. The real-time temperature and heating rate at each position of the air path can be determined through the first temperature data. The time interval between each moment can be 1 second, 3 seconds, 5 seconds, etc. The present invention does not limit the time interval between moments.
根据本发明的一个实施例，在步骤S103中，在第一时间段之后，可保持计算机电路的运行功率，并启动散热扇，开始向机箱外排出热量。进一步地，可在开启散热扇后的第二预设时间段内的多个时刻检测每个温度传感器的第二温度数据，从而可确定风路的各个位置处的实时温度和降温速度，便于后续确定导热散热结构对于温度控制的性能。According to an embodiment of the present invention, in step S103, after the first time period, the operating power of the computer circuit can be maintained, and the heat dissipation fan can be started to start discharging heat outside the chassis. Further, the second temperature data of each temperature sensor can be detected at multiple times within the second preset time period after the heat dissipation fan is turned on, so that the real-time temperature and cooling speed at each position of the air path can be determined, which is convenient for subsequent determination of the performance of the heat conduction and heat dissipation structure for temperature control.
根据本发明的一个实施例，在步骤S104中，可基于以上获得的第一温度数据和第二温度数据，以及各个温度传感器的序号确定温度控制性能评分，该评分可用于描述导热散热结构对于温度的控制能力。According to one embodiment of the present invention, in step S104, a temperature control performance score can be determined based on the first temperature data and the second temperature data obtained above, and the serial number of each temperature sensor, and the score can be used to describe the temperature control capability of the thermal conductive heat dissipation structure.
根据本发明的一个实施例，步骤S104可包括：对每个温度传感器检测到的第一温度数据与第一预设时间段内的时刻进行拟合，获得每个温度传感器的第一温度函数；对每个温度传感器检测到的第二温度数据与第二预设时间段内的时刻进行拟合，获得每个温度传感器的第二温度函数；根据温度传感器的序号，在多个温度传感器中，筛选出与能够产生热量的电子器件相邻设置的目标温度传感器；根据所述第一温度函数、所述第二温度函数、所述目标温度传感器的序号，确定温度控制性能评分。According to one embodiment of the present invention, step S104 may include: fitting the first temperature data detected by each temperature sensor with the moment within a first preset time period to obtain a first temperature function of each temperature sensor; fitting the second temperature data detected by each temperature sensor with the moment within a second preset time period to obtain a second temperature function of each temperature sensor; according to the serial number of the temperature sensor, screening out a target temperature sensor that is arranged adjacent to an electronic device that can generate heat from a plurality of temperature sensors; and determining a temperature control performance score according to the first temperature function, the second temperature function, and the serial number of the target temperature sensor.
根据本发明的一个实施例，第一温度函数可用于描述各个温度传感器检测到的第一温度数据在第一预设时间段内的变化趋势，第二温度函数可用于描述各个温度传感器检测到的第二温度数据在第二预设时间段内的变化趋势，如果导热散热结构对于温度的控制能力较强，则第二温度数据的变化趋势与第一温度数据的变化趋势则会出现较大差异，例如，第一温度数据的变化趋势为温度迅速升高，而第二温度数据的变化趋势为遏制温度升高的势头，甚至使温度下降。与电子器件相邻设置的温度传感器可作为目标温度传感器，由于目标温度传感器检测到的温度数据可直接反应电子器件的实时温度以及电子器件的温度变化趋势，因此可对目标温度传感器检测到的温度数据进行重点监测。According to one embodiment of the present invention, the first temperature function can be used to describe the change trend of the first temperature data detected by each temperature sensor within the first preset time period, and the second temperature function can be used to describe the change trend of the second temperature data detected by each temperature sensor within the second preset time period. If the heat-conducting and heat-dissipating structure has a strong control ability over the temperature, the change trend of the second temperature data will be greatly different from the change trend of the first temperature data. For example, the change trend of the first temperature data is a rapid increase in temperature, while the change trend of the second temperature data is to curb the momentum of temperature increase or even reduce the temperature. The temperature sensor arranged adjacent to the electronic device can be used as a target temperature sensor. Since the temperature data detected by the target temperature sensor can directly reflect the real-time temperature of the electronic device and the temperature change trend of the electronic device, the temperature data detected by the target temperature sensor can be monitored intensively.
根据本发明的一个实施例，根据所述第一温度函数、所述第二温度函数、所述目标温度传感器的序号，确定温度控制性能评分，包括：确定每个温度传感器的第一温度函数的第一温度导函数；将第一预设时间段内的时刻代入所述第一温度导函数，获得各个时刻的第一温度变化率；根据各个时刻的第一温度变化率，确定每个温度传感器检测到的第一温度数据的第一平均变化率；确定每个温度传感器的第二温度函数的第二温度导函数；将第二预设时间段内的时刻代入所述第二温度导函数，获得各个时刻的第二温度变化率；根据各个时刻的第二温度变化率，确定每个温度传感器检测到的第二温度数据的第二平均变化率；确定能够产生热量的电子器件的最大运行功率；根据公式(1)确定温度控制性能评分Tc,According to one embodiment of the present invention, a temperature control performance score is determined according to the first temperature function, the second temperature function, and the serial number of the target temperature sensor, including: determining a first temperature derivative of the first temperature function of each temperature sensor; substituting the time in a first preset time period into the first temperature derivative to obtain a first temperature change rate at each time; determining a first average change rate of the first temperature data detected by each temperature sensor according to the first temperature change rate at each time; determining a second temperature derivative of the second temperature function of each temperature sensor; substituting the time in a second preset time period into the second temperature derivative to obtain a second temperature change rate at each time; determining a second average change rate of the second temperature data detected by each temperature sensor according to the second temperature change rate at each time; determining a maximum operating power of an electronic device capable of generating heat; and determining a temperature control performance score Tc according to formula (1).
其中，Ri,1为第i个目标温度传感器对应的第一平均变化率，Ri,2为第i个目标温度传感器对应的第二平均变化率，Pi为与第i个目标温度传感器相邻设置的能够产生热量的电子器件的最大运行功率，m为目标温度传感器的数量，Rj,1为温度传感器中，除目标温度传感器之外的第j个非目标温度传感器对应的第一平均变化率，Rj,2为第j个非目标温度传感器对应的第二平均变化率，Oj,U为第j个非目标温度传感器的序号，Oi,T为第i个目标温度传感器的序号，min为取最小值函数，n为非目标温度传感器的数量，i≤m，j≤n，且i、j、m和n均为正整数，α1和α2为预设权重，且α1>α2。Wherein, R i,1 is the first average change rate corresponding to the i-th target temperature sensor, R i,2 is the second average change rate corresponding to the i-th target temperature sensor, P i is the maximum operating power of the electronic device capable of generating heat and arranged adjacent to the i-th target temperature sensor, m is the number of target temperature sensors, R j,1 is the first average change rate corresponding to the j-th non-target temperature sensor other than the target temperature sensor among the temperature sensors, R j,2 is the second average change rate corresponding to the j-th non-target temperature sensor, O j,U is the serial number of the j-th non-target temperature sensor, O i,T is the serial number of the i-th target temperature sensor, min is the minimum value function, n is the number of non-target temperature sensors, i≤m, j≤n, and i, j, m and n are all positive integers, α 1 and α 2 are preset weights, and α 1 >α 2 .
根据本发明的一个实施例，第一平均变化率可用于描述第一预设时间段内的升温趋势，第二平均变化率可用于描述在开启散热扇后的温度变化趋势，例如，温度可能转而下降，或者升温速度减缓等。因此，在公式(1)中，|Ri,1-Ri,2|可表示第i个目标温度传感器所在位置处的温度变化趋势的改变情况，则为第i个目标温度传感器所在位置处的温度变化趋势的相对变化，相对变化的值越大，则散热扇开启后，导热散热结构对于温度的控制性能越强。目标温度传感器对应的相对变化的权值为即，与第i个目标温度传感器相邻设置的电子器件的功率，与各个电子器件的总功率之比，该权值越大，则表示与第i个目标温度传感器相邻设置的电子器件的功率越大，对其进行温度控制的重要性越高。可利用该权值对上述相对变化进行加权求和。According to an embodiment of the present invention, the first average change rate can be used to describe the temperature increase trend within the first preset time period, and the second average change rate can be used to describe the temperature change trend after the cooling fan is turned on, for example, the temperature may turn to drop, or the temperature increase rate may slow down. Therefore, in formula (1), |R i,1 -R i,2 | can represent the change of the temperature change trend at the location of the i-th target temperature sensor, is the relative change of the temperature change trend at the location of the i-th target temperature sensor. The larger the relative change value, the stronger the temperature control performance of the heat conduction and heat dissipation structure after the cooling fan is turned on. The weight of the relative change corresponding to the target temperature sensor is That is, the ratio of the power of the electronic device adjacent to the i-th target temperature sensor to the total power of all electronic devices. The larger the weight, the greater the power of the electronic device adjacent to the i-th target temperature sensor, and the higher the importance of temperature control. The weight can be used to perform weighted summation on the above relative changes.
根据本发明的一个实施例，类似的，为第j个非目标温度传感器所在位置处的温度变化趋势的相对变化，其权值为min|Oj,U-Oi,T|为第j个非目标温度传感器与最接近的目标温度传感器之间的序号差异，由于温度传感器按照序号依次设置，因此，序号差异也可以表示第j个非目标温度传感器与最接近的目标温度传感器之间的距离，非目标温度传感器与最接近的目标温度传感器的距离越近，受到目标温度传感器附近的电子器件的散热的影响越大，则对其进行温度控制的重要性越高。可利用该权值对上述相对变化进行加权平均。According to one embodiment of the present invention, similarly, is the relative change of the temperature change trend at the location of the jth non-target temperature sensor, and its weight is min|O j,U -O i,T | is the serial number difference between the jth non-target temperature sensor and the closest target temperature sensor. Since the temperature sensors are arranged in sequence according to the serial numbers, the serial number difference can also represent the distance between the jth non-target temperature sensor and the closest target temperature sensor. The closer the distance between the non-target temperature sensor and the closest target temperature sensor is, the greater the influence of the heat dissipation of the electronic devices near the target temperature sensor is, and the higher the importance of temperature control is. The weight value can be used to perform weighted average on the above relative changes.
根据本发明的一个实施例，可通过预设权重对上述两项进行加权求和，获得温度控制性能评分。且α1>α2，即，与目标温度传感器相关的项的权重大于与非目标温度传感器相关的项的权重，使得温度控制性能评分能够准确反映导热散热结构对于风路中的各个位置(包括设置电子器件的位置与其他位置)的温度控制能力。According to an embodiment of the present invention, the temperature control performance score can be obtained by weighted summing the above two items with preset weights. And α 1 >α 2 , that is, the weight of the item related to the target temperature sensor is greater than the weight of the item related to the non-target temperature sensor, so that the temperature control performance score can accurately reflect the temperature control capability of the heat conduction and heat dissipation structure for each position in the air path (including the position where the electronic device is set and other positions).
通过这种方式，可通过功率比来确定目标温度传感器所在位置处的温度变化趋势的相对变化的权值，并通过非目标温度传感器与最接近的目标温度传感器之间的序号差异来确定非目标温度传感器所在位置处的温度变化趋势的相对变化的权值，从而使得温度控制性能评分能够准确反映各个位置的温度控制的重要性，并且，可使与目标温度传感器相关的项的权重大于与非目标温度传感器相关的项的权重，从而可准确反映导热散热结构对于风路中的各个位置的温度控制能力。In this way, the weight of the relative change of the temperature change trend at the location of the target temperature sensor can be determined by the power ratio, and the weight of the relative change of the temperature change trend at the location of the non-target temperature sensor can be determined by the difference in serial numbers between the non-target temperature sensor and the closest target temperature sensor, so that the temperature control performance score can accurately reflect the importance of temperature control at each location, and the weight of the item related to the target temperature sensor can be made greater than the weight of the item related to the non-target temperature sensor, so as to accurately reflect the temperature control capability of the thermal conductive heat dissipation structure for each location in the air path.
根据本发明的一个实施例，在步骤S105中，在第二预设时间段中，可检测风路出口处的风速数据，从而可确定散热扇的风量，以及由计算机机箱内转移至机箱外的热量。According to an embodiment of the present invention, in step S105, during the second preset time period, the wind speed data at the air outlet can be detected to determine the air volume of the cooling fan and the heat transferred from the computer case to the outside of the case.
根据本发明的一个实施例，步骤S106可包括：根据所述风路的设计参数，确定所述风路出口处的风路截面积；将所述风速数据和所述第二预设时间段内的时刻进行拟合，获得风速函数；确定能够产生热量的电子器件的最大运行功率；根据所述风路截面积、所述风速函数、所述最大运行功率和风路出口处的温度传感器对应的第二温度函数，确定散热性能评分。According to one embodiment of the present invention, step S106 may include: determining the cross-sectional area of the wind path at the wind path outlet according to the design parameters of the wind path; fitting the wind speed data and the moments within the second preset time period to obtain a wind speed function; determining the maximum operating power of the electronic device that can generate heat; and determining a heat dissipation performance score according to the cross-sectional area of the wind path, the wind speed function, the maximum operating power and the second temperature function corresponding to the temperature sensor at the wind path outlet.
根据本发明的一个实施例，根据所述风路截面积、所述风速函数、所述最大运行功率和风路出口处的温度传感器对应的第二温度函数，确定散热性能评分，包括：根据公式(2)确定散热性能评分Rp,According to an embodiment of the present invention, determining the heat dissipation performance score according to the wind path cross-sectional area, the wind speed function, the maximum operating power and a second temperature function corresponding to the temperature sensor at the wind path outlet includes: determining the heat dissipation performance score Rp according to formula (2):
其中，ρ为空气密度，ca为空气比热容，S为所述风路截面积，v(t)为所述风速函数，T2,out(t)为所述风路出口处的温度传感器对应的第二温度函数，Tr为室温，t2,1为第二预设时间段内的第1个时刻，t2,N为第二预设时间段内的最后一个时刻，Pi为与第i个目标温度传感器相邻设置的能够产生热量的电子器件的最大运行功率，m为目标温度传感器的数量，i≤m，且i和m均为正整数。Among them, ρ is air density, c a is air specific heat capacity, S is the cross-sectional area of the wind path, v(t) is the wind speed function, T 2,out (t) is the second temperature function corresponding to the temperature sensor at the wind path outlet, Tr is room temperature, t 2,1 is the first moment in the second preset time period, t 2,N is the last moment in the second preset time period, Pi is the maximum operating power of the electronic device capable of generating heat and arranged adjacent to the i-th target temperature sensor, m is the number of target temperature sensors, i≤m, and i and m are both positive integers.
根据本发明的一个实施例，在公式(2)中，ρSv(t)为单位时间内散热扇排出机箱的空气的质量，该质量与空气的比热容，以及第二温度函数和室温之间的温差的乘积，为单位时间内散热扇排出机箱的热量，对该单位时间内排出机箱的热量进行积分，可获得第二预设时间段内散热扇排出机箱的总热量。公式(2)的分母即为各个电子器件在第二时间段内的总耗电量，总耗电量中一定比例的能量用来发热，因此，可用总耗电量反映各个电子器件在第二时间段内的发热的热量。公式(2)可反映散热扇排出机箱的总热量与各个电子器件的总耗电量之比，可作为散热性能评分，散热性能评分越高，则表示电子器件发热的热量中，被排出机箱的热量的占比越高，散热性能越好。According to one embodiment of the present invention, in formula (2), ρSv(t) is the mass of air discharged from the chassis by the cooling fan per unit time. The product of the mass, the specific heat capacity of the air, and the temperature difference between the second temperature function and the room temperature is the heat discharged from the chassis by the cooling fan per unit time. The heat discharged from the chassis per unit time is integrated to obtain the total heat discharged from the chassis by the cooling fan in the second preset time period. The denominator of formula (2) is the total power consumption of each electronic device in the second time period. A certain proportion of the total power consumption is used for heat generation. Therefore, the total power consumption can be used to reflect the heat generated by each electronic device in the second time period. Formula (2) can reflect the ratio of the total heat discharged from the chassis by the cooling fan to the total power consumption of each electronic device, which can be used as a heat dissipation performance score. The higher the heat dissipation performance score, the higher the proportion of the heat discharged from the chassis in the heat generated by the electronic device, and the better the heat dissipation performance.
通过这种方式，可确定第二预设时间段内散热扇排出机箱的总热量，以及各个电子器件在第二时间段内的总耗电量，并将二者之比作为散热性能评分，从而准确且客观地描述电子器件发热的热量中，被排出机箱的热量的占比，可准确反映导热散热结构的散热性能。In this way, the total heat discharged from the chassis by the cooling fan during the second preset time period and the total power consumption of each electronic component during the second time period can be determined, and the ratio of the two can be used as the heat dissipation performance score, thereby accurately and objectively describing the proportion of heat generated by the electronic components that is discharged from the chassis, and accurately reflecting the heat dissipation performance of the thermal conductive heat dissipation structure.
根据本发明的一个实施例，在步骤S107中，计算机电路停止运行，但散热扇继续运行，并在第三时间段内的多个时刻检测第三温度数据，从而确定计算机电路不再产生新的热量后，导热散热结构对剩余的热量的散热速度。According to one embodiment of the present invention, in step S107, the computer circuit stops running, but the cooling fan continues to run and detects third temperature data at multiple times within a third time period, so as to determine the heat dissipation speed of the thermal conductive heat dissipation structure for the remaining heat after the computer circuit no longer generates new heat.
根据本发明的一个实施例，步骤S108可包括：对每个温度传感器检测到的第三温度数据与第三预设时间段内的时刻进行拟合，获得每个温度传感器的第三温度函数；确定每个温度传感器的第三温度函数的第三温度导函数；将第三预设时间段内的时刻代入所述第三温度导函数，获得各个时刻的第三温度变化率；根据各个时刻的第三温度变化率，确定每个温度传感器检测到的第三温度数据的第三平均变化率；根据所述第三平均变化率和所述第一平均变化率，确定散热速度评分。According to one embodiment of the present invention, step S108 may include: fitting the third temperature data detected by each temperature sensor with the moments within a third preset time period to obtain a third temperature function of each temperature sensor; determining a third temperature derivative of the third temperature function of each temperature sensor; substituting the moments within the third preset time period into the third temperature derivative to obtain a third temperature change rate at each moment; determining a third average change rate of the third temperature data detected by each temperature sensor based on the third temperature change rate at each moment; and determining a heat dissipation speed score based on the third average change rate and the first average change rate.
根据本发明的一个实施例，第三平均变化率可表示计算机电路不再产生热量后，导热散热结构在继续散热的过程中引起的温度下降速率。根据所述第三平均变化率和所述第一平均变化率，确定散热速度评分，包括：根据公式(3)确定散热速度评分Rs，According to an embodiment of the present invention, the third average change rate may represent the temperature drop rate caused by the heat conduction and heat dissipation structure in the process of continuing to dissipate heat after the computer circuit no longer generates heat. Determining the heat dissipation speed score according to the third average change rate and the first average change rate includes: determining the heat dissipation speed score Rs according to formula (3),
其中，Ri,3为第i个目标温度传感器对应的第三平均变化率，Rj,3为第j个非目标温度传感器对应的第三平均变化率。Wherein, R i,3 is the third average change rate corresponding to the i-th target temperature sensor, and R j,3 is the third average change rate corresponding to the j-th non-target temperature sensor.
根据本发明的一个实施例，在公式(3)中，表示第i个目标温度传感器检测到的第三温度数据的下降速率，和第一温度数据的上升速率之比，该比值越大，则可表示导热散热结构的散热速度越快，如果该值大于1，则表示导热散热结构的散热速度快于电子器件的产生热量的速度。类似的，表示第j个非目标温度传感器检测到的第三温度数据的下降速率，和第一温度数据的上升速率之比。并且，仍然可通过以上预设权重α1和α2对上述比值的平均值进行加权求和，获得散热速度评分，从而使散热速度评分可表示对不同位置处的散热速度的重要性。According to one embodiment of the present invention, in formula (3), It represents the ratio of the decreasing rate of the third temperature data detected by the i-th target temperature sensor to the increasing rate of the first temperature data. The larger the ratio is, the faster the heat dissipation speed of the heat conduction heat dissipation structure is. If the value is greater than 1, it means that the heat dissipation speed of the heat conduction heat dissipation structure is faster than the speed at which the electronic device generates heat. Similarly, It represents the ratio of the decreasing rate of the third temperature data detected by the jth non-target temperature sensor to the increasing rate of the first temperature data. In addition, the average values of the above ratios can still be weighted and summed by the above preset weights α1 and α2 to obtain the heat dissipation speed score, so that the heat dissipation speed score can represent the importance of the heat dissipation speed at different positions.
通过这种方式，可通过温度传感器检测到的第三温度数据的下降速率，和第一温度数据的上升速率之比来确定散热速度的快慢，并通过预设权重来表示不同位置处的散热速度的重要性，从而使散热速度评分能够客观且准确地表达导热散热结构的散热性能。In this way, the speed of heat dissipation can be determined by the ratio of the decrease rate of the third temperature data detected by the temperature sensor to the increase rate of the first temperature data, and the importance of the heat dissipation speed at different positions can be represented by preset weights, so that the heat dissipation speed score can objectively and accurately express the heat dissipation performance of the thermal conductive heat dissipation structure.
根据本发明的一个实施例，在步骤S109中，可将温度控制性能评分、散热性能评分和散热速度评分进行加权求和，获得导热散热结构的性能测试评分，从而可通过多个方面准确且全面地测评导热散热结构的导热散热性能。According to one embodiment of the present invention, in step S109, the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score may be weightedly summed to obtain a performance test score of the thermally conductive heat dissipation structure, thereby accurately and comprehensively evaluating the thermally conductive heat dissipation performance of the thermally conductive heat dissipation structure from multiple aspects.
根据本发明的实施例的计算机电路的导热散热结构性能测试方法，可在导热散热结构的风路中设置多个温度传感器，从而准确且全面地检测导热散热结构中各个位置的温度数据，提升检测的准确性和全面性，且可基于不同工况下的温度数据以及其他相关数据分别确定温度控制性能评分、散热性能评分和散热速度评分，从而可基于三个方面的评分全面掌握导热散热结构的性能，有助于控制计算机的集成电路的温度，提升计算机的性能，降低计算机的电子器件的老化速度。在确定温度控制性能评分时，可通过功率比来确定目标温度传感器所在位置处的温度变化趋势的相对变化的权值，并通过非目标温度传感器与最接近的目标温度传感器之间的序号差异来确定非目标温度传感器所在位置处的温度变化趋势的相对变化的权值，从而使得温度控制性能评分能够准确反映各个位置的温度控制的重要性，并且，可使与目标温度传感器相关的项的权重大于与非目标温度传感器相关的项的权重，从而可准确反映导热散热结构对于风路中的各个位置的温度控制能力。在确定散热性能评分时，可确定第二预设时间段内散热扇排出机箱的总热量，以及各个电子器件在第二时间段内的总耗电量，并将二者之比作为散热性能评分，从而准确且客观地描述电子器件发热的热量中，被排出机箱的热量的占比，可准确反映导热散热结构的散热性能。在确定散热速度评分时，可通过温度传感器检测到的第三温度数据的下降速率，和第一温度数据的上升速率之比来确定散热速度的快慢，并通过预设权重来表示不同位置处的散热速度的重要性，从而使散热速度评分能够客观且准确地表达导热散热结构的散热性能。According to the performance test method of the heat conduction and heat dissipation structure of the computer circuit of the embodiment of the present invention, multiple temperature sensors can be set in the air path of the heat conduction and heat dissipation structure, so as to accurately and comprehensively detect the temperature data of each position in the heat conduction and heat dissipation structure, improve the accuracy and comprehensiveness of the detection, and can respectively determine the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score based on the temperature data under different working conditions and other related data, so as to comprehensively grasp the performance of the heat conduction and heat dissipation structure based on the scores of the three aspects, which is helpful to control the temperature of the integrated circuit of the computer, improve the performance of the computer, and reduce the aging speed of the electronic components of the computer. When determining the temperature control performance score, the weight of the relative change of the temperature change trend at the location of the target temperature sensor can be determined by the power ratio, and the weight of the relative change of the temperature change trend at the location of the non-target temperature sensor can be determined by the difference in the serial number between the non-target temperature sensor and the closest target temperature sensor, so that the temperature control performance score can accurately reflect the importance of temperature control at each position, and the weight of the item related to the target temperature sensor can be made greater than the weight of the item related to the non-target temperature sensor, so as to accurately reflect the temperature control ability of the heat conduction and heat dissipation structure for each position in the air path. When determining the heat dissipation performance score, the total heat discharged from the chassis by the cooling fan in the second preset time period and the total power consumption of each electronic device in the second time period can be determined, and the ratio of the two can be used as the heat dissipation performance score, thereby accurately and objectively describing the proportion of heat generated by the electronic device that is discharged from the chassis, which can accurately reflect the heat dissipation performance of the thermal conductive heat dissipation structure. When determining the heat dissipation speed score, the speed of the heat dissipation can be determined by the ratio of the decrease rate of the third temperature data detected by the temperature sensor to the increase rate of the first temperature data, and the importance of the heat dissipation speed at different positions can be expressed by preset weights, so that the heat dissipation speed score can objectively and accurately express the heat dissipation performance of the thermal conductive heat dissipation structure.
图2示例性地示出根据本发明实施例的计算机电路的导热散热结构性能测试系统的框图，所述系统包括：FIG. 2 exemplarily shows a block diagram of a thermal conductivity and heat dissipation structure performance testing system for a computer circuit according to an embodiment of the present invention, the system comprising:
设置模块，用于在导热散热结构的风路中设置多个温度传感器，其中，每个温度传感器具有序号；A setting module, used to set a plurality of temperature sensors in the air path of the heat conduction and heat dissipation structure, wherein each temperature sensor has a serial number;
第一检测模块，用于控制计算机电路按照最大功率运行第一预设时间段，并在第一预设时间段内的每个时刻，获取每个温度传感器检测到的第一温度数据；A first detection module, used to control the computer circuit to operate at maximum power for a first preset time period, and to obtain first temperature data detected by each temperature sensor at each moment in the first preset time period;
第二检测模块，用于保持所述计算机电路按照最大功率运行的状态，并启动导热散热结构的散热扇，使所述散热扇按照最大功率运行第二预设时间段，并在所述第二预设时间段内的每个时刻，获取每个温度传感器检测到的第二温度数据；a second detection module, used to keep the computer circuit running at maximum power, and start the heat dissipation fan of the heat conduction and heat dissipation structure, so that the heat dissipation fan runs at maximum power for a second preset time period, and obtain second temperature data detected by each temperature sensor at each moment in the second preset time period;
温度控制性能评分模块，用于根据所述第一温度数据、所述第二温度数据，以及温度传感器的序号，确定温度控制性能评分；a temperature control performance scoring module, configured to determine a temperature control performance score according to the first temperature data, the second temperature data, and a sequence number of a temperature sensor;
风速模块，用于在所述第二预设时间段中，检测风路出口处的风速数据，其中，所述风路出口处设置有温度传感器；A wind speed module, used for detecting wind speed data at an air path outlet in the second preset time period, wherein a temperature sensor is provided at the air path outlet;
散热性能评分模块，用于根据所述风路的设计参数、所述风速数据和所述风路出口处的温度传感器检测到的第二温度数据，确定散热性能评分；a heat dissipation performance scoring module, configured to determine a heat dissipation performance score according to the design parameters of the air duct, the wind speed data, and second temperature data detected by a temperature sensor at an outlet of the air duct;
第三检测模块，用于控制所述计算机电路停止运行，并保持所述散热扇按照最大功率运行第三时间段，并在第三时间段内的每个时刻，获取每个温度传感器检测到的第三温度数据；a third detection module, used for controlling the computer circuit to stop running, and keeping the cooling fan running at maximum power for a third time period, and obtaining third temperature data detected by each temperature sensor at each moment in the third time period;
散热速度评分模块，用于根据所述第三温度数据，确定散热速度评分；A heat dissipation speed scoring module, used to determine a heat dissipation speed score according to the third temperature data;
性能测试评分模块，用于根据所述温度控制性能评分、所述散热性能评分和所述散热速度评分，确定导热散热结构的性能测试评分。The performance test scoring module is used to determine the performance test score of the thermal conductive heat dissipation structure according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score.
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410361075.6A CN118604044B (en) | 2024-03-27 | 2024-03-27 | A method and system for testing the performance of thermal conductivity and heat dissipation structure of computer circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410361075.6A CN118604044B (en) | 2024-03-27 | 2024-03-27 | A method and system for testing the performance of thermal conductivity and heat dissipation structure of computer circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118604044A true CN118604044A (en) | 2024-09-06 |
| CN118604044B CN118604044B (en) | 2025-03-04 |
Family
ID=92550586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410361075.6A Active CN118604044B (en) | 2024-03-27 | 2024-03-27 | A method and system for testing the performance of thermal conductivity and heat dissipation structure of computer circuits |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118604044B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119335368A (en) * | 2024-12-20 | 2025-01-21 | 国鲸科技(广东横琴粤澳深度合作区)有限公司 | Chip heat dissipation analysis device for circuit substrate |
| CN119572586A (en) * | 2024-12-31 | 2025-03-07 | 北京恒京盛石油装备有限公司 | A horizontal heat dissipation system for a fracturing vehicle |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6203191B1 (en) * | 1998-10-28 | 2001-03-20 | Speculative Incorporated | Method of junction temperature determination and control utilizing heat flow |
| US20090052496A1 (en) * | 2007-08-21 | 2009-02-26 | Fujitsu Limited | Temperature testing apparatus and temperature testing method |
| US20150361864A1 (en) * | 2014-04-21 | 2015-12-17 | Clemson University | Control of radiator cooling fans |
| US20180017275A1 (en) * | 2016-07-15 | 2018-01-18 | Schneider Electric Buildings, Llc | Methods and system for obtaining and using wind condition data |
| CN109211963A (en) * | 2017-06-30 | 2019-01-15 | 上海新微技术研发中心有限公司 | System and method for detecting thermal resistance of heat-conducting material |
| CN113640341A (en) * | 2021-07-27 | 2021-11-12 | 广东芯聚能半导体有限公司 | Device coupling thermal resistance measuring method and device and storage medium |
| CN113933346A (en) * | 2021-11-11 | 2022-01-14 | 张家港市恒强冷却设备有限公司 | Method for contrast test of cooling effect of cooling pipes made of different materials of motor air cooler |
| US20230010864A1 (en) * | 2021-07-07 | 2023-01-12 | Yazaki Corporation | Power supply control apparatus and temperature control method |
| CN116629120A (en) * | 2023-05-23 | 2023-08-22 | 南京大全变压器有限公司 | A heat dissipation evaluation method and system for a dry-type power transformer |
| CN117500227A (en) * | 2023-10-26 | 2024-02-02 | 苏州元脑智能科技有限公司 | Heat dissipation control method and device, electronic equipment and storage medium |
-
2024
- 2024-03-27 CN CN202410361075.6A patent/CN118604044B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6203191B1 (en) * | 1998-10-28 | 2001-03-20 | Speculative Incorporated | Method of junction temperature determination and control utilizing heat flow |
| US20090052496A1 (en) * | 2007-08-21 | 2009-02-26 | Fujitsu Limited | Temperature testing apparatus and temperature testing method |
| US20150361864A1 (en) * | 2014-04-21 | 2015-12-17 | Clemson University | Control of radiator cooling fans |
| US20180017275A1 (en) * | 2016-07-15 | 2018-01-18 | Schneider Electric Buildings, Llc | Methods and system for obtaining and using wind condition data |
| CN109211963A (en) * | 2017-06-30 | 2019-01-15 | 上海新微技术研发中心有限公司 | System and method for detecting thermal resistance of heat-conducting material |
| US20230010864A1 (en) * | 2021-07-07 | 2023-01-12 | Yazaki Corporation | Power supply control apparatus and temperature control method |
| CN113640341A (en) * | 2021-07-27 | 2021-11-12 | 广东芯聚能半导体有限公司 | Device coupling thermal resistance measuring method and device and storage medium |
| CN113933346A (en) * | 2021-11-11 | 2022-01-14 | 张家港市恒强冷却设备有限公司 | Method for contrast test of cooling effect of cooling pipes made of different materials of motor air cooler |
| CN116629120A (en) * | 2023-05-23 | 2023-08-22 | 南京大全变压器有限公司 | A heat dissipation evaluation method and system for a dry-type power transformer |
| CN117500227A (en) * | 2023-10-26 | 2024-02-02 | 苏州元脑智能科技有限公司 | Heat dissipation control method and device, electronic equipment and storage medium |
Non-Patent Citations (2)
| Title |
|---|
| ESPINOZA, K等: "An Auto-Tuning PI Control System for an Open-Circuit Low-Speed Wind Tunnel Designed for Greenhouse Technology", SENSORS, vol. 15, no. 8, 31 August 2015 (2015-08-31), pages 19723 - 19749 * |
| 刘显茜等: "双层布置锂离子电池组散热性能分析", 陕西理工大学学报, vol. 35, no. 05, 20 October 2019 (2019-10-20), pages 21 - 26 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119335368A (en) * | 2024-12-20 | 2025-01-21 | 国鲸科技(广东横琴粤澳深度合作区)有限公司 | Chip heat dissipation analysis device for circuit substrate |
| CN119572586A (en) * | 2024-12-31 | 2025-03-07 | 北京恒京盛石油装备有限公司 | A horizontal heat dissipation system for a fracturing vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118604044B (en) | 2025-03-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN118604044A (en) | A method and system for testing the performance of thermal conductivity and heat dissipation structure of computer circuits | |
| US8985847B2 (en) | Thermal resistance-based monitoring of cooling of an electronic component | |
| TWI360739B (en) | Pressure sensing device for electronic device and | |
| CN102724846B (en) | Cooling control method and controller for heat sink | |
| TW567408B (en) | Apparatus and method for controlling power and clock speed of electronic system | |
| CN100541392C (en) | Temperature detection system and method | |
| TW201223423A (en) | Heat dissipating device and method thereof | |
| CN108691797B (en) | A kind of radiator fan speed-regulating control device and method | |
| CN107145431A (en) | The method and server of server B MC systems air channel abnormal monitoring alarm | |
| US20180252593A1 (en) | Thermal testing system | |
| US9482632B2 (en) | Abnormality detection device | |
| CN116878693B (en) | Mining electromechanical equipment monitoring and management method and system | |
| Lin et al. | Experimental study of the heat sink assembly with oblique straight fins | |
| CN118464238B (en) | A switch cabinet monitoring device and monitoring method | |
| CN110212218A (en) | A kind of detection method and system of fuel cell triple valve | |
| TWI323838B (en) | Mthod for contrlling the rotational speed of a cooling fan in an electronic system and electronic system utilizing the same | |
| WO2022052583A1 (en) | Heat dissipation control method, apparatus and device | |
| CN110567739A (en) | Method and device for rapid detection of heat dissipation state of radiator | |
| CN112114600A (en) | Cabinet equipment and temperature control method thereof | |
| CN100563411C (en) | Heat exchange device and heat exchange control method for data processing components in communication equipment | |
| TWI297429B (en) | System and method for controlling heat dissipation | |
| CN118885031A (en) | Electric drive coolant temperature control method and device | |
| JPH02310613A (en) | Computer cooling device and computer cooling method | |
| CN115047953B (en) | A server cooling method, system, device and medium | |
| CN111751697A (en) | A method and device for detecting thermal resistance of a crimp IGBT |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |