CN110021571B - Radiator based on jet flow micro-channel - Google Patents
Radiator based on jet flow micro-channel Download PDFInfo
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- CN110021571B CN110021571B CN201910328666.2A CN201910328666A CN110021571B CN 110021571 B CN110021571 B CN 110021571B CN 201910328666 A CN201910328666 A CN 201910328666A CN 110021571 B CN110021571 B CN 110021571B
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- water outlet
- channel
- water inlet
- pipe
- jet flow
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 64
- 238000001816 cooling Methods 0.000 claims abstract description 33
- 238000009834 vaporization Methods 0.000 claims abstract description 28
- 230000008016 vaporization Effects 0.000 claims abstract description 28
- 239000003507 refrigerant Substances 0.000 claims abstract description 23
- 238000005192 partition Methods 0.000 claims description 16
- 238000012546 transfer Methods 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- -1 freon Substances 0.000 claims description 3
- 239000002086 nanomaterial Substances 0.000 claims description 3
- 239000000725 suspension Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 2
- 238000005728 strengthening Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 210000001503 joint Anatomy 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat sink based on fluidic microchannels. Relates to a radiator. The radiator based on the jet micro-channel is exquisite in structure, convenient to use, convenient to process and good in radiating effect, and can be widely applied to various electronic and electrical chip devices. The piezoelectric pump is fixedly connected to the side wall of the body, the water inlet pipe and the water outlet pipe are respectively communicated with two sides of the piezoelectric pump, and the water inlet pipe and the water outlet pipe are both communicated with the body; the body is hollow form and this internal baffle and communicating pipe of being equipped with, through the baffle will the hollow part of body is separated for cooling chamber and vaporization chamber, the cooling chamber is located the top of vaporization chamber, and is used for the holding refrigerant, communicating pipe wears to establish the baffle, the end opening of communicating pipe is located the top of vaporization chamber, and the top mouth of communicating pipe is located the upper portion of cooling chamber. The invention has the advantage of strengthening the cooling effect on the high-heat-density chip.
Description
Technical Field
The invention relates to a radiator, in particular to a radiator based on a jet micro-channel.
Background
At present, with the rapid development of industries such as ultra-large scale integrated circuits, high-density heating electronic and electrical equipment and the like, the heat dissipation requirement is higher and higher, and the heat-transfer section bar heat radiator cannot timely solve the requirement of high heat flow density, has the characteristics of low heat conduction coefficient, slow heat conduction and the like, so that the heat radiator with high efficiency is required to improve the working efficiency.
To this, the people has provided the little radiator that leads to of efflux that has efficient heat-conduction ability, however, current microchannel makes and the efflux mode is comparatively complicated, adopt photoetching in the aspect of making, laser, modes such as chemical attack, processing cost and processing equipment all have higher cost, adopt the water pump in the aspect of the efflux, the cooler, water pipe etc. lead to the system comparatively complicated, can't obtain effective application at the electronic electric chip of miniaturized high heat density, how fully combine microchannel and fluidic advantage, satisfy the miniaturization when reduce cost, the heat dissipation demand of the electronic electric chip of high heat flux density ization, become the difficult problem that this field needs to solve and attack urgently.
Disclosure of Invention
Aiming at the problems, the invention provides the radiator based on the jet micro-channel, which has the advantages of exquisite structure, convenience in use and processing, good radiating effect and wide application in various electronic and electrical chip devices.
The technical scheme of the invention is as follows: the piezoelectric pump is fixedly connected to the side wall of the body, the water inlet pipe and the water outlet pipe are respectively communicated with two sides of the piezoelectric pump, and the water inlet pipe and the water outlet pipe are both communicated with the body;
the body is hollow, a partition plate and a communicating pipe are arranged in the body, the hollow part of the body is divided into a cooling cavity and a vaporization cavity by the partition plate, the cooling cavity is positioned above the vaporization cavity and used for containing a refrigerant, the communicating pipe penetrates through the partition plate, a bottom opening of the communicating pipe is positioned at the top of the vaporization cavity, and a top opening of the communicating pipe is positioned at the upper part of the cooling cavity;
the jet flow groove is formed in the center of the bottom surface of the partition plate, a jet flow cover plate is fixedly connected to a notch of the jet flow groove, a plurality of jet holes are formed in the jet flow cover plate, a water inlet channel is further formed in the partition plate, one end of the water inlet channel is in butt joint with a water inlet pipe, the other end of the water inlet channel is communicated with the jet flow groove, a water outlet groove and a water outlet channel are formed in one side of the top surface of the partition plate, and one end of the water outlet channel is in butt joint with a water outlet pipe, and the other end of the water outlet channel is communicated with the water outlet groove.
The top surface of the body is fixedly connected with a plurality of radiating fins, and the top surfaces of the radiating fins are fixedly connected with a fan.
The refrigerant is absolute ethyl alcohol, freon, water or suspension containing high-thermal-conductivity nano materials.
All fixedly connected with a plurality of heat transfer fins on the bottom surface in cooling chamber and vaporization chamber, the heat transfer fin is slice, awl post, cylinder, cuboid, tetrahedron or zigzag, and a plurality of the heat transfer fin can cross arrangement or array arrangement.
The jet flow (namely, the refrigerant enters the vaporization cavity in a jet mode) and the micro-channel (comprising a water outlet channel, a water outlet pipe, a water inlet pipe and a water inlet channel) are combined; on one hand, the high-speed jet flow mode is adopted to take away the heat with high heat flow density and high heating rate of the chip through the high-speed flow of the coolant medium, so that the temperature of the chip is quickly reduced; on the other hand, the micro-channel structure design is adopted inside, the heat exchange capacity of the refrigerant medium and the heat dissipation fins is improved, the temperature of the chip can be distributed uniformly to the maximum, the heat dissipation efficiency is improved, meanwhile, the vaporization cavity, the cooling cavity and the refrigerant jet flow channel are separated, the mutual interference is reduced, and the local 'dry burning' phenomenon is avoided. The piezoelectric pump and the radiator are designed in a combined mode, the complexity of a system is reduced, the piezoelectric pump and the radiator are combined into a whole, the operation cost and the processing cost of the whole radiator are improved, and the application of a miniaturized jet flow micro-channel radiator is achieved.
Aiming at the characteristics of concentrated heat flux density, large heat productivity, high heating rate and the like of the conventional chip, the invention combines the advantages of high jet flow cooling rate, high micro-channel cooling efficiency and the like to strengthen the cooling effect on the chip with high heat density.
Drawings
The structure of the scheme in figure 1 is schematically shown,
figure 2 is a top view of figure 1,
figure 3 is a perspective view one of figure 1,
FIG. 4 is a second perspective view of FIG. 1;
figure 5 is a partial cross-sectional view taken along line a-a of figure 1,
figure 6 is a partial cross-sectional view taken along line B-C of figure 1,
figure 7 is a partial cross-sectional view taken along line C-C of figure 1,
figure 8 is a partial cross-sectional view taken along line D-D of figure 1,
FIG. 9 is a partial cross-sectional view taken along line E-E of FIG. 1;
in the figure, the body 1 is a partition board, 111 is a jet groove, 112 is a jet hole, 113 is a water inlet channel, 114 is a water outlet channel, 115 is a water outlet channel, 12 is a communicating pipe, 13 is a cooling cavity, 14 is a vaporization cavity, 10 is a heat exchange fin, 2 is a water inlet pipe, 3 is a water outlet pipe, and 4 is a heat dissipation fin.
Detailed Description
As shown in fig. 1-9, the present invention includes a body 1, a water inlet pipe 2, a water outlet pipe 3, and a piezoelectric pump (which is fixed on the side wall of the body and is located between the water inlet pipe and the water outlet pipe, and is not drawn for clarity in the figures, so that the piezoelectric pump that can be understood and duplicated by those skilled in the art is not drawn), the piezoelectric pump is fixedly connected to the side wall of the body 1, the water inlet pipe 2 and the water outlet pipe 3 are respectively communicated with two sides of the piezoelectric pump, and both are communicated with the body 1;
the body 1 is hollow, a partition plate 11 and a communicating pipe 12 are arranged in the body 1, the hollow part of the body 1 is divided into a cooling cavity 13 and a vaporization cavity 14 through the partition plate 11, the cooling cavity 13 is positioned above the vaporization cavity 14 and used for containing a refrigerant, the communicating pipe 12 penetrates through the partition plate 11, the bottom opening of the communicating pipe 12 is positioned at the top of the vaporization cavity 14, and the top opening of the communicating pipe 12 is positioned at the upper part of the cooling cavity 13;
shooting groove 111 has been seted up at the center of the bottom surface of baffle 11, shooting groove 111's notch fixedly connected with efflux apron, a plurality of jet orifices 112 have been seted up on the efflux apron, inhalant canal 113 has still been seted up in the baffle 11, inhalant canal 113's one end and inlet tube 2 butt joint and other end intercommunication shooting groove 111, go out basin 114 and exhalant canal 115 have been seted up to one side of the top surface of baffle 11, exhalant canal 115's one end and 3 butt joints of outlet pipe, and other end intercommunication goes out basin 114. Thus, the refrigerant stored in the cooling cavity can flow into the piezoelectric pump from the water outlet groove, the water outlet channel and the water outlet pipe, and quickly enters the incidence groove from the water inlet pipe and the water inlet channel under the action of the piezoelectric pump, so as to finally enter the vaporization cavity in a spraying mode; and the refrigerant in the vaporization cavity is vaporized after heat exchange is finished and enters the cooling cavity from the communicating pipe for condensation.
When the piezoelectric pump is actually used, the bottom surface of the body can be arranged on the chip, and the piezoelectric pump is electrified when the chip is electrified to work; thus, the refrigerant sprayed into the vaporization cavity under the action of the piezoelectric pump can rapidly exchange heat with the bottom of the vaporization cavity (the bottom surface of the body is in contact with the chip, so that the heat exchange with the chip is completed in the process), and a large amount of heat is taken away after vaporization; afterwards, the vaporized refrigerant enters the cooling cavity from the communicating pipe and exchanges heat with the outside of the body in the cooling cavity, so that the refrigerant is finally condensed and stored in the cooling cavity to form circulation and guarantee continuous heat dissipation.
The jet flow (namely, the refrigerant enters the vaporization cavity in a jet mode) and the micro-channel (comprising a water outlet channel, a water outlet pipe, a water inlet pipe and a water inlet channel) are combined; on one hand, the high-speed jet flow mode is adopted to take away the heat with high heat flow density and high heating rate of the chip through the high-speed flow of the coolant medium, so that the temperature of the chip is quickly reduced; on the other hand, the micro-channel structure design is adopted inside, the heat exchange capacity of the refrigerant medium and the heat dissipation fins is improved, the temperature of the chip can be distributed uniformly to the maximum, the heat dissipation efficiency is improved, meanwhile, the vaporization cavity, the cooling cavity and the refrigerant jet flow channel are separated, the mutual interference is reduced, and the local 'dry burning' phenomenon is avoided. The piezoelectric pump and the radiator are designed in a combined mode, the complexity of a system is reduced, the piezoelectric pump and the radiator are combined into a whole, the operation cost and the processing cost of the whole radiator are improved, and the application of a miniaturized jet flow micro-channel radiator is achieved.
Aiming at the characteristics of concentrated heat flux density, large heat productivity, high heating rate and the like of the conventional chip, the invention combines the advantages of high jet flow cooling rate, high micro-channel cooling efficiency and the like to strengthen the cooling effect on the chip with high heat density.
A plurality of heat dissipation fins 4 are fixedly connected to the top surface of the body 1, and a fan is fixedly connected to the top surface of the heat dissipation fins (for clarity, the fan that can be understood and duplicated by those skilled in the art is not depicted). Therefore, the cooling cavity has better heat exchange efficiency with the outside, and the refrigerant has higher condensation speed after being vaporized.
The refrigerant is absolute ethyl alcohol, freon, water or suspension containing high-thermal-conductivity nano materials.
The bottom surfaces of the cooling cavity 13 and the vaporization cavity 14 are fixedly connected with a plurality of heat exchange fins 10 which are in a sheet shape, a conical column shape, a cylindrical shape, a cuboid shape, a tetrahedron shape or a sawtooth shape, and the heat exchange fins can be arranged in a cross mode or an array mode. Thereby showing the heat exchange efficiency who has promoted refrigerant and vaporization chamber bottom, perhaps say so with the chip, further promoted the radiating efficiency to the chip promptly.
Claims (1)
1. A radiator based on a jet flow micro-channel is characterized by comprising a body, a water inlet pipe, a water outlet pipe and a piezoelectric pump, wherein the piezoelectric pump is fixedly connected to the side wall of the body; the body is hollow, a partition plate and a communicating pipe are arranged in the body, the hollow part of the body is divided into a cooling cavity and a vaporization cavity by the partition plate, the cooling cavity is positioned above the vaporization cavity and used for containing a refrigerant, the communicating pipe penetrates through the partition plate, a bottom opening of the communicating pipe is positioned at the top of the vaporization cavity, and a top opening of the communicating pipe is positioned at the upper part of the cooling cavity; the center of the bottom surface of the partition board is provided with a jet flow groove, a notch of the jet flow groove is fixedly connected with a jet flow cover plate, the jet flow cover plate is provided with a plurality of jet holes, the partition board is also provided with a water inlet channel, one end of the water inlet channel is butted with a water inlet pipe, the other end of the water inlet channel is communicated with the jet flow groove, one side of the top surface of the partition board is provided with a water outlet groove and a water outlet channel, one end of the water outlet channel is butted with a water outlet pipe, and the other end of the water outlet channel is communicated with the water outlet groove; the refrigerant stored in the cooling cavity can flow into the piezoelectric pump from the water outlet groove, the water outlet channel and the water outlet pipe, and quickly enters the incidence groove from the water inlet pipe and the water inlet channel under the action of the piezoelectric pump, so that the refrigerant finally enters the vaporization cavity in a spraying mode; the refrigerant in the vaporization cavity is vaporized after heat exchange is finished and enters the cooling cavity from the communicating pipe for condensation; the top surface of the body is fixedly connected with a plurality of radiating fins, and the top surfaces of the radiating fins are fixedly connected with a fan; the refrigerant is absolute ethyl alcohol, freon, water or suspension containing high-thermal-conductivity nano materials; all fixedly connected with a plurality of heat transfer fins on the bottom surface in cooling chamber and vaporization chamber, the heat transfer fin is slice, awl post, cylinder, cuboid, tetrahedron or zigzag, and a plurality of the heat transfer fin can cross arrangement or array arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910328666.2A CN110021571B (en) | 2019-04-23 | 2019-04-23 | Radiator based on jet flow micro-channel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910328666.2A CN110021571B (en) | 2019-04-23 | 2019-04-23 | Radiator based on jet flow micro-channel |
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| Publication Number | Publication Date |
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| CN110021571A CN110021571A (en) | 2019-07-16 |
| CN110021571B true CN110021571B (en) | 2022-04-29 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111863748B (en) * | 2020-08-17 | 2022-02-15 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Integrated micro cooler and cooling system |
| CN118549794B (en) * | 2024-06-18 | 2025-01-17 | 苏州京工半导体科技有限公司 | Jet flow micro-channel testing device for high-power consumption chip |
| CN118870645B (en) * | 2024-09-27 | 2024-12-24 | 苏州元脑智能科技有限公司 | A heat dissipation device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2894209Y (en) * | 2006-04-19 | 2007-04-25 | 哈尔滨工程大学 | Microjet matrix impingement radiator |
| CN105208837A (en) * | 2015-10-29 | 2015-12-30 | 中国电子科技集团公司第二十研究所 | Staggered micro-channel heat sinking device based on sealed micro jet |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5263536A (en) * | 1991-07-19 | 1993-11-23 | Thermo Electron Technologies Corp. | Miniature heat exchanger |
| CN101645430B (en) * | 2009-09-03 | 2011-07-27 | 浙江大学 | Chip cooling device |
| CN102271485B (en) * | 2011-05-12 | 2015-09-23 | 南京理工大学 | Array jetting, boiling cooling exchange method based on combination under high heat flux condition |
| CN103096687A (en) * | 2011-11-07 | 2013-05-08 | 微邦科技股份有限公司 | Gas-liquid circulation heat dissipation device |
| US9320171B2 (en) * | 2014-06-05 | 2016-04-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Two-phase cooling systems, power electronics modules, and methods for extending maximum heat flux |
| CN107329546A (en) * | 2017-07-13 | 2017-11-07 | 电子科技大学 | The experimental system and method for a kind of heat abstractor, cooling system and heat abstractor |
| CN108167792A (en) * | 2017-12-27 | 2018-06-15 | 常州大学 | A kind of closed micro jet flow fine channel LED cooling devices |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2894209Y (en) * | 2006-04-19 | 2007-04-25 | 哈尔滨工程大学 | Microjet matrix impingement radiator |
| CN105208837A (en) * | 2015-10-29 | 2015-12-30 | 中国电子科技集团公司第二十研究所 | Staggered micro-channel heat sinking device based on sealed micro jet |
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Address after: No.96 Anlin Road, Yangzhou City, Jiangsu Province 225006 Applicant after: Yangzhou Wanfang Technology Co.,Ltd. Address before: No.96 Anlin Road, Yangzhou City, Jiangsu Province 225006 Applicant before: YANGZHOU WANFANG ELECTRONIC TECHNOLOGY LLC |
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