CN110085973A - Antenna packages structure and packaging method - Google Patents

Abstract

The present invention provides an antenna packaging structure and packaging method, the structure comprising: a rewiring layer; a metal feeder post formed on the second surface of the rewiring layer; a first packaging layer covering the metal feeder post; a first antenna metal layer Connected with the metal feeder post; protective adhesive layer, covering the first antenna metal layer; second packaging layer; second antenna metal layer; at least one antenna circuit chip, electrically bonded to the first surface of the rewiring layer ; The third encapsulation layer at least surrounds the peripheral side of the antenna circuit chip; the metal bump realizes the electrical extraction of the rewiring layer. The present invention can integrate all active components or passive components in one packaging structure through different rewiring layer wiring arrangements, and can effectively reduce the packaging size. The structure of the invention is a vertically arranged structure, which can effectively shorten the conduction path between components, has better electrical and antenna performance, and has lower power consumption at the same time.

Description

Antenna packaging structure and packaging method

technical field

The invention belongs to the field of packaging and the field of communication equipment, and in particular relates to an antenna packaging structure and a packaging method.

Background technique

Due to the progress of science and technology, various high-tech electronic products have been developed to facilitate people's life, including various electronic devices, such as notebook computers, mobile phones, tablet computers (PADs), and the like.

With the popularization of these high-tech electronic products and the increase of people's demand, in addition to the substantial increase of various functions and applications configured in these high-tech products, especially in order to meet people's mobile needs, the function of wireless communication has been added. Therefore, people can use these high-tech electronic products at any place or at any time through these high-tech electronic devices with wireless communication functions. Thereby greatly increasing the flexibility and convenience of the use of these high-tech electronic products, therefore, people no longer have to be confined to a fixed area, breaking the boundaries of the scope of use, making the application of these electronic products really convenient people's lives.

In the application of the antenna, such as the application of the mobile phone terminal, the transmission and reception signals of the antenna need to be combined with multiple functional chip modules. The known method is to directly make the antenna on the surface of the circuit board (PCB). This approach will cause the antenna to occupy additional circuit board area, and, due to the long transmission signal line, poor performance, high power consumption, and large package volume, especially the traditional PCB package has too much loss under 5G millimeter wave transmission.

SUMMARY OF THE INVENTION

In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an antenna packaging structure and packaging method, which are used to solve the problems of large antenna packaging volume and large signal transmission loss in the prior art.

In order to achieve the above object and other related objects, the present invention provides an antenna package structure, the package structure includes: a rewiring layer, the rewiring layer includes a first surface and an opposite second surface; a metal feeder post formed on The second surface of the rewiring layer; the first encapsulation layer, covering the metal feeder post, and its top surface exposes the metal feeder post; the first antenna metal layer, formed on the first encapsulation layer , the antenna metal layer is connected to the metal feeder post; the protective adhesive layer is covered on the first antenna metal layer; the second packaging layer is covered on the protective adhesive layer; the second antenna metal layer , formed on the second packaging layer; at least one antenna circuit chip, electrically bonded to the first surface of the rewiring layer; a third packaging layer, at least surrounding the peripheral side of the antenna circuit chip, the There are openings in the third package layer and the rewiring layer; metal bumps are formed in the openings and electrically connected with the rewiring layer, so as to realize the electrical extraction of the rewiring layer.

Optionally, the material of the protective adhesion layer includes polyimide.

Optionally, the connection between the metal feeder post and the rewiring layer has a lower metal layer, the material of the metal feeder post includes one of Au, Ag, Cu, and Al, and the material of the lower metal layer Including a stack of Ni layer and Au layer.

Optionally, the materials of the first encapsulation layer, the second encapsulation layer and the third encapsulation layer include one of silica gel and epoxy resin.

Optionally, there are multiple antenna circuit chips, and the antenna circuit chip includes one of an active component and a passive component, wherein the active component includes one of a power management circuit, a transmitting circuit, and a receiving circuit, The passive component includes one of resistors, capacitors and inductors.

Optionally, a sealing protection layer is further filled between the antenna circuit chip and the rewiring layer.

The present invention also provides an antenna packaging method, the packaging method comprising the steps of: 1) providing a support base, forming a separation layer on the support base; 2) forming a rewiring layer on the separation layer, the The rewiring layer includes a first surface connected to the separation layer and an opposite second surface; 3) forming a metal feeder column on the second surface of the rewiring layer; 4) encapsulating the metal feeder with the first packaging layer Feeder post, thinning the first packaging layer, so that the top surface of the metal feeder post is exposed on the first packaging layer; 5) forming a first antenna metal layer on the first packaging layer, the first An antenna metal layer is connected to the metal feeder post; 6) forming a protective adhesive layer covering the first antenna metal layer; 7) forming a second encapsulation layer on the protective adhesive layer; 8) forming a second encapsulation layer on the Forming a second antenna metal layer on the second encapsulation layer; 9) peeling off the rewiring layer and the supporting substrate based on the separation layer, exposing the first surface of the rewiring layer; 10) providing an antenna circuit chip, and The antenna circuit chip is electrically bonded to the first surface of the rewiring layer; 11) the antenna circuit chip is packaged with a third packaging layer; 12) formed in the third packaging layer and the rewiring layer A hole is formed in the hole to form a metal bump to realize the electrical extraction of the rewiring layer.

Optionally, the supporting base includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate.

Optionally, the separation layer includes a light-to-heat conversion layer, step 9) irradiating the light-to-heat conversion layer with laser light, so that the light-to-heat conversion layer is separated from the rewiring layer and the support substrate, and then peeled off The redistribution layer and the support substrate.

Optionally, step 2) making the rewiring layer includes steps: 2-1) forming a first dielectric layer on the surface of the separation layer; 2-2) forming a seed on the surface of the first dielectric layer by sputtering layer, forming a first metal layer on the seed layer, and etching the first metal layer and the seed layer to form a patterned first metal wiring layer; 2-3) on the patterned Form a second dielectric layer on the surface of the first metal wiring layer, and etch the second dielectric layer to form a second dielectric layer with a patterned through hole; 2-4) fill the conductive plug in the patterned through hole , and then using a sputtering process to form a second metal layer on the surface of the second dielectric layer, and etching the metal layer to form a patterned second metal wiring layer.

Optionally, a step is further included: repeating steps 2-3) to 2-4) to form a rewiring layer with a multi-layer stacked structure.

Optionally, the material of the protective adhesion layer includes polyimide.

Optionally, forming a metal feeder post on the second surface of the rewiring layer includes the steps of: forming a lower metal layer on the rewiring layer; Metal feeder posts are formed on the layer.

Optionally, the lower metal layer includes a laminate composed of a Ni layer and an Au layer.

Optionally, step 10) further includes the step of filling a sealing protection layer between the antenna circuit chip and the rewiring layer.

Optionally, the material of the metal feeder column includes one of Au, Ag, Cu, and Al.

Optionally, the method for forming the first encapsulation layer, the second encapsulation layer and the third encapsulation layer includes one of compression molding, transfer molding, liquid seal molding, vacuum lamination and spin coating, and the first The materials of the first encapsulation layer, the second encapsulation layer and the third encapsulation layer include one of silica gel and epoxy resin.

Optionally, there are multiple antenna circuit chips, and the antenna circuit chip includes one of an active component and a passive component, wherein the active component includes one of a power management circuit, a transmitting circuit, and a receiving circuit, The passive component includes one of resistors, capacitors and inductors.

As mentioned above, the antenna packaging structure and packaging method of the present invention have the following beneficial effects:

The present invention can integrate all active components or passive components in one packaging structure through different rewiring layer wiring arrangements, and can effectively reduce the package size.

The structure of the antenna circuit chip, the rewiring layer, and the antenna metal of the present invention is arranged in a vertical arrangement structure, which can effectively shorten the conduction path between components, have better electrical performance and antenna performance, and have lower power consumption at the same time.

In the present invention, a protective adhesive layer is set between adjacent two-layer antenna structures, on the one hand, it can protect the antenna metal, on the other hand, it can improve the adhesion performance between adjacent two-layer antenna structures, and improve the mechanical structure of the antenna. strength.

The invention uses a fan-out packaging method to package the antenna structure, which can effectively reduce the package volume, so that the antenna package structure has higher integration and better packaging performance, and has broad application prospects in the field of semiconductor packaging.

Description of drawings

1 to 19 are schematic structural diagrams of each step of the antenna packaging method of the present invention, wherein FIG. 19 is a schematic structural diagram of the antenna packaging structure of the present invention.

Component designation description

101 Support base

102 separation layer

201 The first medium layer

202 First metal wiring layer

203 Second dielectric layer

204 Second metal wiring layer

301 lower metal layer

302 metal feeder post

303 First encapsulation layer

304 First antenna metal layer

305 protective adhesive layer

306 Second encapsulation layer

307 Second antenna metal layer

401 antenna circuit chip

402 sealing protection layer

403 third encapsulation layer

404 opening

501 metal bump

Detailed ways

Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

For example, when describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the general scale, and the schematic diagram is only an example, which should not limit the protection scope of the present invention. In addition, the three-dimensional space dimensions of length, width and depth should be included in actual production.

For the convenience of description, spatial relation terms such as "below", "below", "below", "below", "above", "on" etc. may be used herein to describe an element or element shown in the drawings. The relationship of a feature to other components or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

In the context of this application, structures described as having a first feature "on top of" a second feature may include embodiments where the first and second features are formed in direct contact, as well as additional features formed between the first and second features. Embodiments between the second feature such that the first and second features may not be in direct contact.

It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of the present invention, so that only the components related to the present invention are shown in the diagrams rather than the number, shape and Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual implementation, and the component layout type may also be more complicated.

As shown in Figures 1 to 19, this embodiment provides a packaging method for an antenna, and the packaging method includes the following steps:

As shown in FIG. 1 , step 1) is firstly performed to provide a support base 101 , and a separation layer 102 is formed on the support base 101 .

As an example, the supporting base 101 includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate. In this embodiment, the support base 101 is selected as a glass substrate, the cost of the glass substrate is low, the separation layer 102 is easy to be formed on the surface of the glass substrate, and the difficulty of the subsequent peeling process can be reduced.

As an example, the separation layer 102 includes a light-to-heat conversion layer (LTHC), which is formed on the support substrate 101 by a spin-coating process, and then cured and shaped by a curing process. The performance of the light-to-heat conversion layer (LTHC) is stable, and the surface is relatively smooth, which is beneficial to the fabrication of the subsequent rewiring layer, and in the subsequent stripping process, the difficulty of stripping is relatively low.

As shown in Figures 2 to 5, then step 2) is performed to form a rewiring layer on the separation layer 102, the rewiring layer includes a first surface connected to the separation layer 102 and an opposite second surface .

Step 2) making described rewiring layer comprises steps:

As shown in Figure 2, step 2-1) is carried out, a first dielectric layer 201 is formed on the surface of the separation layer 102 by using a chemical vapor deposition process or a physical vapor deposition process, and the material of the first dielectric layer 201 includes epoxy resin , silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, one or more combinations of fluorine-containing glass.

For example, the material of the first dielectric layer 201 is selected as PI (polyimide), so as to further reduce the difficulty and cost of the process.

As shown in Figure 3, step 2-2) is carried out, a seed layer is formed on the surface of the first dielectric layer 201 by a sputtering process, a first metal layer is formed on the seed layer, and the first metal layer is formed And the seed layer is etched to form a patterned first metal wiring layer 202 . The material of the seed layer includes a stack of titanium layer and copper layer. The material of the first metal wiring layer 202 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium.

As shown in FIG. 4, step 2-3) is carried out, a second dielectric layer 203 is formed on the surface of the patterned first metal wiring layer 202 by using a chemical vapor deposition process or a physical vapor deposition process, and the second dielectric layer 203 is formed on the surface of the second dielectric layer Layer 203 is etched to form a second dielectric layer 203 with patterned through holes. The material of the second dielectric layer 203 includes one or a combination of two or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass.

For example, the material of the second dielectric layer 203 is selected as PI (polyimide), so as to further reduce the difficulty and cost of the process.

As shown in FIG. 4, perform step 2-4), fill the conductive plug in the patterned through hole, and then use a sputtering process to form a second metal layer on the surface of the second dielectric layer 203, and the metal layer is etched to form a patterned second metal wiring layer 204 . The material of the second metal wiring layer 204 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium.

Next, as shown in FIG. 5 , the above steps 2-3) to 2-4) can be repeated to form a rewiring layer with a multi-layer stacked structure, so as to realize different wiring functions.

As shown in FIGS. 6 to 7 , proceed to step 3) to form a patterned lower metal layer 301 on the second surface of the rewiring layer, and use a wire bonding process or an electroplating process or an electroless plating process to form a patterned lower metal layer 301 on the lower surface A metal feeder post 302 is formed on the metal layer 301 , the metal feeder post 302 is electrically connected to the redistribution layer, and the metal feeder post 302 is approximately perpendicular to the surface of the redistribution layer.

The lower metal layer 301 includes a stack of Ni layer and Au layer. In this embodiment, a metal feeder post 302 is formed on the lower metal layer 301 by wire bonding, and the material of the metal feeder post 302 includes one of Au, Ag, Cu, and Al. The lower metal layer 301 can effectively strengthen the bonding strength between the metal feeder post 302 and the rewiring layer, and reduce contact resistance.

As shown in FIGS. 8 to 9 , proceed to step 4), encapsulate the metal feeder post 302 with the first encapsulation layer 303, and thin the first encapsulation layer 303 so that the top surface of the metal feeder post 302 is exposed. on the first encapsulation layer 303 .

As an example, the method of encapsulating the metal feeder column 302 with the first encapsulation layer 303 includes one of compression molding, transfer molding, liquid seal molding, vacuum lamination, and spin coating. The first encapsulation layer 303 Materials include one of silicone and epoxy.

As shown in FIG. 10 , proceed to step 5) to form a first antenna metal layer 304 on the surface of the first packaging layer 303 , and the first antenna metal layer 304 is connected to the metal feeder post 302 .

The material of the first antenna metal layer 304 may be copper or the like.

As shown in FIG. 11 , step 6) is followed to form a protective adhesive layer 305 covering the first antenna metal layer 304 .

For example, the material of the protective adhesive layer 305 includes polyimide. Since the adjacent two-layer antenna structures are separated by a layer of antenna metal layer, the adhesion strength between the two-layer antenna structures is easily reduced, resulting in displacement or rupture. In the present invention, a protective adhesive layer 305 is provided between adjacent two-layer antenna structures. On the one hand, it can protect the antenna metal, and on the other hand, it can improve the adhesion performance between adjacent two-layer antenna structures, and improve the mechanical strength of the antenna. Structural strength.

As shown in FIG. 12 , step 7) is then performed to form a second encapsulation layer 306 on the protective adhesive layer 305 .

As an example, the method of forming the second encapsulation layer 306 includes one of compression molding, transfer molding, liquid seal molding, vacuum lamination and spin coating, and the material of the second encapsulation layer 306 includes silica gel and ring One of the oxygen resins.

As shown in FIG. 13 , proceed to step 8) to form a second antenna metal layer 307 on the second encapsulation layer 306 .

The material of the second antenna metal layer 307 can be copper, etc., and the second antenna metal layer 307 can be electrically connected with the first antenna metal layer 304 or the rewiring layer.

The present invention can obtain a multi-layer antenna structure layer. The multi-layer antenna structure has a certain loss, but can effectively shorten the conduction path between components, has better electrical performance and antenna performance, and has lower power consumption at the same time.

As shown in FIG. 14 , step 9) is performed next, and the rewiring layer and the supporting substrate 101 are peeled off based on the separation layer 102 to expose the first surface of the rewiring layer.

Specifically, the separation layer 102 includes a light-to-heat conversion layer, where laser light is used to irradiate the light-to-heat conversion layer to separate the light-to-heat conversion layer from the rewiring layer and the support substrate 101, and then peel off The redistribution layer and the supporting substrate 101 .

As shown in FIG. 15 , proceed to step 10), provide an antenna circuit chip 401, and bond the antenna circuit chip 401 to the first surface of the rewiring layer so that the antenna circuit chip 401 passes through the rewiring layer. And the metal feeder post 302 is electrically connected to the first antenna metal layer 304 . For example, the antenna circuit chip 401 may be bonded to the first surface of the rewiring layer through a soldering process or a ball planting process.

For example, there are multiple antenna circuit chips 401, and the antenna circuit chip 401 includes one or both of active components and passive components, wherein the active component includes one of a power management circuit, a transmitting circuit, and a receiving circuit. The passive component includes one of resistors, capacitors and inductors. The present invention can integrate all active components or passive components in one packaging structure through different rewiring layer wiring arrangements, and can effectively reduce the package size.

In this embodiment, there is a gap between the antenna circuit chip 401 and the rewiring layer, and this embodiment also includes the step of filling a sealing protection layer 402 between the antenna circuit chip 401 and the rewiring layer , as shown in Figure 16. The dense protective layer can improve the structural strength between the antenna circuit chip 401 and the rewiring layer, and avoid damage to the antenna circuit chip 401 due to extrusion or the like.

As shown in FIG. 17 , proceed to step 11) to package the antenna circuit chip 401 with the third packaging layer 403 . In order to further protect the antenna circuit chip 401 .

For example, the method of forming the third packaging layer 403 includes one of compression molding, transfer molding, liquid seal molding, vacuum lamination and spin coating, and the material of the third packaging layer 403 includes silica gel and epoxy A type of resin.

As shown in FIGS. 18-19 , then step 12) is performed to form openings 404 in the third packaging layer 403 and the rewiring layer, and form metal bumps 501 in the openings 404 to realize Electrical extraction of the rewiring layer. The metal bump 501 may be one of tin solder, silver solder and gold-tin alloy solder.

As shown in FIG. 19 , this embodiment also provides an antenna packaging structure, which can be applied to electronic devices such as 5G networks. The packaging structure includes: a rewiring layer, and the rewiring layer includes The first surface and the opposite second surface; the metal feeder column 302 is formed on the second surface of the rewiring layer; the first encapsulation layer 303 covers the metal feeder column 302, and its top surface exposes the Metal feeder post 302; the first antenna metal layer 304 is formed on the first packaging layer, and the antenna metal layer is connected to the metal feeder post 302; a protective adhesive layer 305 is covered on the first antenna metal layer layer 304; second encapsulation layer 306, covering on the protective adhesive layer 305; second antenna metal layer 307, formed on the second encapsulation layer 306; at least one antenna circuit chip 401, electrically bonded to The first surface of the rewiring layer; the third encapsulation layer 403, at least surrounding the peripheral side of the antenna circuit chip 401, the third encapsulation layer 403 and the rewiring layer have openings 404; metal bumps Block 501 is formed in the opening 404 and electrically connected to the rewiring layer, so as to realize the electrical extraction of the rewiring layer.

The material of the protective adhesive layer 305 includes polyimide. In the present invention, a protective adhesive layer 305 is provided between adjacent two-layer antenna structures. On the one hand, it can protect the antenna metal, and on the other hand, it can improve the adhesion performance between adjacent two-layer antenna structures, and improve the mechanical strength of the antenna. Structural strength.

The connection between the metal feeder post 302 and the rewiring layer has a lower metal layer 301, the material of the metal feeder post 302 includes one of Au, Ag, Cu, and Al, and the material of the lower metal layer 301 Including a stack of Ni layer and Au layer. The lower metal layer 301 can effectively strengthen the bonding strength between the metal feeder post 302 and the rewiring layer, and reduce contact resistance.

The materials of the first encapsulation layer 303 , the second encapsulation layer 306 and the third encapsulation layer 403 include one of silica gel and epoxy resin.

There are multiple antenna circuit chips 401, and the antenna circuit chip 401 includes one of an active component and a passive component, wherein the active component includes one of a power management circuit, a transmitting circuit, and a receiving circuit. Passive components include one of resistors, capacitors and inductors. A sealing protection layer 402 is also filled between the antenna circuit chip 401 and the rewiring layer.

As mentioned above, the antenna packaging structure and packaging method of the present invention have the following beneficial effects:

The present invention can integrate all active components or passive components in one packaging structure through different rewiring layer wiring arrangements, and can effectively reduce the package size.

The antenna circuit chip 401, rewiring layer, and antenna metal of the present invention are arranged in a vertical arrangement structure, which can effectively shorten the conduction path between components, have better electrical and antenna performance, and have lower power consumption.

In the present invention, a protective adhesive layer 305 is provided between adjacent two-layer antenna structures. On the one hand, it can protect the antenna metal, and on the other hand, it can improve the adhesion performance between adjacent two-layer antenna structures, and improve the mechanical strength of the antenna. Structural strength.

The invention uses a fan-out packaging method to package the antenna structure, which can effectively reduce the package volume, so that the antenna package structure has higher integration and better packaging performance, and has wide application prospects in the field of semiconductor packaging.

Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial application value.

The above-mentioned embodiments merely illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can make modifications or changes to the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed in the present invention should still be covered by the claims of the present invention.

Claims (18)

1. An antenna package structure, characterized in that the package structure comprises: a rewiring layer comprising a first side and an opposite second side; a metal feeder column formed on the second surface of the redistribution layer; The first encapsulation layer covers the metal feeder column, and its top surface exposes the metal feeder column; a first antenna metal layer formed on the first encapsulation layer, and the antenna metal layer is connected to the metal feeder post; a protective adhesive layer covering the first antenna metal layer; a second encapsulation layer covering the protective adhesive layer; a second antenna metal layer formed on the second encapsulation layer; at least one antenna circuit chip electrically bonded to the first side of the redistribution layer; The third encapsulation layer surrounds at least the peripheral side of the antenna circuit chip, and the third encapsulation layer and the rewiring layer have openings; The metal bump is formed in the opening and is electrically connected with the rewiring layer, so as to realize the electrical extraction of the rewiring layer. 2. The antenna package structure according to claim 1, wherein the material of the protective adhesive layer comprises polyimide. 3. The antenna packaging structure according to claim 1, characterized in that: the connecting portion of the metal feeder post and the rewiring layer has a lower metal layer, and the material of the metal feeder post includes Au, Ag, Cu, One of Al, the material of the lower metal layer includes a laminate composed of a Ni layer and an Au layer. 4. The antenna packaging structure according to claim 1, wherein the material of the first packaging layer, the second packaging layer and the third packaging layer comprises one of silica gel and epoxy resin. 5. The antenna packaging structure of claim 1, wherein there are multiple antenna circuit chips, and the antenna circuit chip includes one of an active component and a passive component, wherein the active component includes a power management One of a circuit, a transmitting circuit, and a receiving circuit, and the passive component includes one of a resistor, a capacitor, and an inductor. 6 . The antenna package structure according to claim 1 , wherein a sealing protection layer is filled between the antenna circuit chip and the rewiring layer. 7. An antenna packaging method, characterized in that the packaging method comprises the steps of: 1) providing a support base on which a separation layer is formed; 2) forming a rewiring layer on the separation layer, the rewiring layer including a first surface connected to the separation layer and an opposite second surface; 3) forming a metal feeder post on the second surface of the redistribution layer; 4) encapsulating the metal feeder post with a first encapsulation layer, and thinning the first encapsulation layer so that the top surface of the metal feeder post is exposed to the first encapsulation layer; 5) forming a first antenna metal layer on the first packaging layer, the first antenna metal layer is connected to the metal feeder post; 6) forming a protective adhesive layer covering the first antenna metal layer; 7) forming a second encapsulation layer on the protective adhesive layer; 8) forming a second antenna metal layer on the second encapsulation layer; 9) peeling off the rewiring layer and the supporting substrate based on the separation layer, exposing the first surface of the rewiring layer; 10) providing an antenna circuit chip, electrically bonding the antenna circuit chip to the first surface of the rewiring layer; 11) Encapsulating the antenna circuit chip with a third encapsulation layer; 12) Forming holes in the third encapsulation layer and the rewiring layer, and forming metal bumps in the openings, so as to realize electrical extraction of the rewiring layer. 8 . The antenna packaging method according to claim 7 , wherein the supporting substrate comprises one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate. 9. The packaging method of the antenna according to claim 7, characterized in that: the separation layer includes a light-to-heat conversion layer, and step 9) irradiates the light-to-heat conversion layer with laser light, so that the light-to-heat conversion layer and the light-to-heat conversion layer The redistribution layer and the support substrate are separated, and then the redistribution layer and the support substrate are peeled off. 10. The packaging method of the antenna according to claim 7, characterized in that: step 2) making the rewiring layer comprises the steps of: 2-1) forming a first dielectric layer on the surface of the separation layer; 2-2) Forming a seed layer on the surface of the first dielectric layer by sputtering, forming a first metal layer on the seed layer, and etching the first metal layer and the seed layer to form a pattern The first metal wiring layer of the layer; 2-3) forming a second dielectric layer on the surface of the patterned first metal wiring layer, and etching the second dielectric layer to form a second dielectric layer with patterned through holes; 2-4) filling conductive plugs in the patterned through holes, then forming a second metal layer on the surface of the second dielectric layer by sputtering, and etching the metal layer to form a patterned second metal layer. metal wiring layer. 11 . The antenna packaging method according to claim 10 , further comprising the step of: repeating steps 2-3) to 2-4) to form a rewiring layer with a multilayer stack structure. 12 . The antenna packaging method according to claim 7 , wherein the protective adhesive layer is made of polyimide. 13 . 13. The antenna packaging method according to claim 7, wherein forming a metal feeder post on the second surface of the rewiring layer comprises the steps of: forming a lower metal layer on the redistribution layer; A metal feeder post is formed on the lower metal layer by using a wire bonding process, an electroplating process or an electroless plating process. 14 . The antenna packaging method according to claim 13 , wherein the lower metal layer comprises a laminate composed of a Ni layer and an Au layer. 15 . 15 . The antenna packaging method according to claim 7 , wherein step 10) further comprises a step of filling a sealing protection layer between the antenna circuit chip and the rewiring layer. 16 . 16. The antenna packaging method according to claim 7, wherein the material of the metal feeder post includes one of Au, Ag, Cu and Al. 17. The antenna packaging method according to claim 7, characterized in that: the method of forming the first packaging layer, the second packaging layer and the third packaging layer includes compression molding, transfer molding, liquid seal molding, One of vacuum lamination and spin coating, the materials of the first encapsulation layer, the second encapsulation layer and the third encapsulation layer include one of silica gel and epoxy resin. 18. The antenna packaging method according to claim 7, wherein there are multiple antenna circuit chips, and the antenna circuit chip includes one of an active component and a passive component, wherein the active component includes One of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.