CN111031461B

CN111031461B - A dustproof structure for MEMS devices and a MEMS microphone packaging structure

Info

Publication number: CN111031461B
Application number: CN201911415114.1A
Authority: CN
Inventors: 林育菁; 宫岛博志; 佐野豊
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2025-03-11
Anticipated expiration: 2039-12-31
Also published as: CN111031461A; WO2021135119A1

Abstract

The invention discloses a dustproof structure for an MEMS device and an MEMS microphone packaging structure, wherein the dustproof structure comprises a grid film, a first carrier and a second carrier, the first carrier is provided with a first through opening, and the second carrier is provided with a second through opening; the first carrier and the second carrier are respectively arranged on two sides of the grid film, the grid film is arranged between the first opening and the second opening, and the first carrier and/or the second carrier are/is configured to be fixed on the MEMS device. The first carrier and the second carrier of the invention have good supporting and protecting effects on the grid film, can avoid the direct contact damage of the grid film, and the first opening and the second opening are opposite to the through holes on the grid film, thereby providing a smooth passage for air and facilitating the transmission of sound.

Description

Dustproof structure for MEMS device and MEMS microphone packaging structure

Technical Field

The invention belongs to the technical field of acousto-electric conversion, and particularly relates to a dustproof structure for an MEMS device and an MEMS microphone packaging structure.

Background

With the rapid development of electroacoustic technology, various electroacoustic products are layered endlessly. Microphones are one of the most important devices in electroacoustic products as a transducer for converting sound into an electrical signal. Microphones are now widely used in many different types of electronic products such as cell phones, tablet computers, notebook computers, VR devices, AR devices, smart watches, and smart wear. In recent years, as for a microphone package structure, the design of the structure thereof has become an important point and a hot spot for the study of those skilled in the art.

The conventional microphone package structure generally includes a housing having a housing chamber in which components such as a chip module (e.g., a MEMS chip and an ASIC chip) are housed and fixed, and a sound pickup hole is provided in the housing. However, in long-term application, it is found that external dust, impurities and other particles and foreign matters are easily introduced into the accommodating cavity of the microphone through the pick-up hole, and the external particles and the foreign matters can cause certain damage to components such as a chip assembly in the accommodating cavity, so that the acoustic performance and the service life of the microphone can be influenced.

In view of the above-mentioned problems, the solution adopted at present is to provide a corresponding isolation assembly on the pick-up hole of the microphone package structure for blocking the entry of external particles, foreign matters, etc. The existing isolation assembly comprises a supporting part and an isolation net cloth. When the isolation assembly is used, the isolation assembly is mounted on the sound pickup hole. However, the existing isolation assembly is easy to damage due to the fact that the isolation mesh cloth is directly exposed and the strength of the isolation mesh cloth is low, and therefore sounding quality of the microphone is affected.

Disclosure of Invention

An object of the present invention is to provide a dust-proof structure for a MEMS device and a MEMS microphone package structure.

According to a first aspect of the present invention, there is provided a dust-proof structure for a MEMS device, comprising:

a mesh membrane configured to be permeable to sound;

A first carrier having a first opening therethrough and a second carrier having a second opening therethrough;

The first carrier and the second carrier are respectively arranged at two sides of the grid film, and the grid film is spaced between the first opening and the second opening;

the first carrier and/or the second carrier are configured for being fixed on a MEMS device.

Optionally, the grid film includes an isolation net and a fixing portion, the fixing portion is connected around the isolation net, the fixing portion is fixedly connected with the first carrier and the second carrier, and the isolation net is spaced between the first opening and the second opening.

Optionally, the thickness of the mesh film ranges from 0.3 micrometers to 0.7 micrometers.

Optionally, the first carrier and/or the second carrier has a thickness in the range of 25 micrometers to 55 micrometers.

Optionally, the first carrier and the second carrier have the same structural dimensions.

Optionally, the first carrier and the second carrier are the same material.

Optionally, the grid film is a multilayer structure, the grid film at least comprises an upper grid film and a lower grid film, the first carrier is fixedly connected with the upper grid film, and the second carrier is fixedly connected with the lower grid film.

Optionally, the upper grid film and the lower grid film are bonded to form a fixed connection.

Optionally, the materials of the first carrier and the second carrier are photoetching materials, the photoetching materials for forming the first carrier and the second carrier are formed on two sides of the grid film in advance, and the first carrier and the second carrier are formed through a photoetching process.

According to a second aspect of the present invention, there is provided a MEMS microphone package structure comprising:

the shell is provided with a containing cavity, and is provided with an acoustic hole which communicates the inside and the outside of the shell;

a microphone device fixedly disposed within the housing;

The dustproof structure is characterized in that at least a first carrier of the dustproof structure is fixedly connected with the shell;

The mesh membrane encloses the acoustic holes and/or the mesh membrane is spaced between the acoustic holes and the microphone device.

Compared with the prior art, the invention has the technical effects that:

The invention discloses a dustproof structure for an MEMS device, which comprises a grid film, a first carrier and a second carrier, wherein the first carrier is provided with a through first opening, the second carrier is provided with a through second opening, the first carrier and the second carrier are respectively arranged at two sides of the grid film, and the arrangement of the first carrier and the second carrier has good supporting and protecting effects on the grid film.

Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

FIG. 1 is a schematic view of a dust-proof structure for a MEMS device according to the present invention;

FIG. 2 is a schematic diagram of a grid film structure of a dust-proof structure for MEMS devices according to the present invention;

FIG. 3 is a schematic cross-sectional view of a dust-proof structure for a MEMS device according to the present invention;

FIG. 4 is a schematic diagram of a photolithography stage structure for a dust-proof structure of a MEMS device according to the present invention;

FIG. 5 is a schematic diagram of a photolithography stage structure for a dust-proof structure of a MEMS device according to the present invention;

FIG. 6 is a schematic diagram of a photolithography stage structure for a dust-proof structure of a MEMS device according to the present invention;

FIG. 7 is a schematic view of another dust-proof structure for MEMS devices according to the present invention;

FIG. 8 is a schematic diagram of a MEMS microphone package structure according to the present invention;

fig. 9 is a schematic structural diagram of another MEMS microphone package structure according to the present invention.

Wherein, the dustproof structure comprises a 100-dustproof structure, a 1-grid film, a 101-isolation net, a 102-fixing part, a 103-upper grid film, a 104-lower grid film, a 2-first carrier, a 3-second carrier, a 4-first opening, a 5-second opening, a 6-shell, a 7-sound hole, an 8-microphone device, a 9-first supporting part, a 10-second supporting part, a 11-protective layer, a 12-first bonding layer and a 13-substrate.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.

The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.

It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

Referring to fig. 1 and 3, the present invention discloses a dust-proof structure 100 for a MEMS device, comprising:

The first carrier 2 is provided with a first opening 4 which penetrates through, and the second carrier 3 is provided with a second opening 5 which penetrates through, the first carrier 2 and the second carrier 3 are respectively arranged at two sides of the grid film 1, and the grid film 1 is arranged between the first opening 4 and the second opening 5;

the first carrier 2 and/or the second carrier 3 are configured for being fixed on a MEMS device.

The grid membrane 1 is provided with a plurality of through holes which can allow air to pass through, so that sound is conveniently transmitted, the first carrier 2 and the second carrier 3 are respectively arranged on two sides of the grid membrane 1, can well support and protect the grid membrane 1, can avoid direct contact damage of the grid membrane 1, and the first opening 4 and the second opening 5 are opposite to the through holes on the grid membrane 1, so that a smooth channel is provided for the air, and the sound is conveniently transmitted.

Alternatively, referring to fig. 1 and 2, the mesh film 1 includes an isolation mesh 101 and a fixing portion 102, the fixing portion 102 is connected around the isolation mesh 101, the fixing portion 102 is fixedly connected with the first carrier 2 and the second carrier 3, and the isolation mesh 101 is spaced between the first opening 4 and the second opening 5.

Since the isolation net 101 of the grid film 1 is provided with a plurality of through holes, the strength of the isolation net 101 is low, the structural strength of the grid film 1 can be increased by the dense fixing portions 102 around the isolation net 101, and the fixing portions 102 are fixedly connected with the first carrier 2 and the second carrier 3, so that the structural stability of the dustproof structure 100 is ensured.

Optionally, the thickness of the mesh film 1 ranges from 0.3 micrometers to 0.7 micrometers. Since the grid film 1 is used on the MEMS device, there is a high requirement on the size thereof, and the thickness of the grid film 1 should be in a low range to achieve a good dust-proof effect. However, if the mesh film 1 is too thin, the strength is too low, which is liable to cause breakage, but if the mesh film 1 is too thick, the size and weight of the dust-proof structure 100 are increased on the one hand, and the passage of air is inconvenient on the other hand, which makes sound transmission difficult.

Optionally, the thickness of the first carrier 2 and/or the second carrier 3 ranges from 25 micrometers to 55 micrometers. In order to provide good support protection for the grid film 1, it is necessary that the first carrier 2 and the second carrier 3 have a certain thickness, but the thickness should not be too high, and if the thickness of the first carrier 2 and the second carrier 3 is too large, the size and weight of the dust-proof structure 100 are increased, which is not suitable for the application in MEMS devices.

Optionally, the first carrier 2 and the second carrier 3 have the same structural dimensions. The first carrier 2 and the second carrier 3 have the same structural dimensions, which are convenient for rapid manufacturing and assembly, and improve the efficiency of manufacturing and assembly, and on the other hand, the applicability of the dustproof structure 100 is improved, so that the dustproof structure can be flexibly used in the forward and backward directions.

Optionally, the first carrier 2 and the second carrier 3 are of the same material. The same material for the first carrier 2 and the second carrier 3 can facilitate rapid manufacturing and assembly, improve efficiency of manufacturing and assembly, and improve applicability of the dust-proof structure 100.

Alternatively, referring to fig. 7, the mesh film 1 is a multi-layer structure, the mesh film 1 includes at least an upper layer mesh film 103 and a lower layer mesh film 104, the first carrier 2 is fixedly connected with the upper layer mesh film 103, and the second carrier 3 is fixedly connected with the lower layer mesh film 104. Of course, the multi-layer structure of the mesh film 1 may be a combination of three, four or more layers, as long as the dimensional quality and the dust-proof effect can be achieved.

On the one hand, as more through holes are formed in the grid film 1, the structural strength of the grid film 1 is weaker, so that the structural strength and the service life of the grid film 1 can be improved by adopting a mode of compounding the upper grid film 103 and the lower grid film 104, on the other hand, the materials and the through holes of the upper grid film 103 and the lower grid film 104 can be the same or different in size, and when the materials and the through holes of the upper grid film 103 and the lower grid film 104 are different in size, the filtering effect on dust and other impurities of different types and sizes can be achieved, and the applicability of the dustproof structure 100 is improved.

Optionally, the upper mesh film 103 and the lower mesh film 104 are bonded to form a fixed connection. Specifically, the upper layer mesh film 103 and the lower layer mesh film 104 are bonded by the first adhesive layer 12, and the bonding can be double-sided adhesive bonding or glue bonding, so that the bonding connection mode is flexible and convenient to operate, high in connection strength and good in effect.

Optionally, the materials of the first carrier 2 and the second carrier 3 are photo-etching materials, the photo-etching materials for forming the first carrier 2 and the second carrier 3 are formed on two sides of the grid film 1 in advance, and the first carrier 2 and the second carrier 3 are formed through a photo-etching process.

In particular, referring to fig. 4, 5 and 6, the photolithography process includes the steps of:

A support part is arranged on the second carrier 3;

disposing the first carrier 2 opposite the lithographic apparatus;

A mask is arranged on one side, close to the lithography equipment, of the first carrier 2, and a through hole is arranged on the mask at a position opposite to the first opening 4;

The photoetching equipment performs photoetching on the first carrier 2 to obtain the first carrier 2 with the first opening 4;

removing the mask and providing a protective layer 11 on the side of the first carrier 2 close to the lithographic apparatus;

disposing the second carrier 3 opposite the lithographic apparatus;

a mask is arranged on one side, close to the lithography equipment, of the second carrier 3, and a through hole is arranged on the mask at a position opposite to the second opening 5;

The photoetching equipment performs photoetching on the second carrier 3 to obtain the second carrier 3 with the second opening 5;

The mask and protective layer 11 are removed to yield the dust-proof structure 100.

The support may include a first support 9 and a second support 10, and in particular, the first support 9 may be an organic layer directly connected to the second carrier 3, and the second support 10 may be a silicon wafer layer connected to the first support 9.

The MEMS device may be a MEMS microphone, a MEMS sensor, a MEMS chip, a MEMS switch, etc.

Referring to fig. 8 and 9, the present invention also discloses a MEMS microphone package structure, comprising:

a housing 6 provided with a receiving cavity, wherein an acoustic hole 7 is arranged on the housing 6, and the acoustic hole 7 communicates the inside and the outside of the housing 6;

a microphone device 8, said microphone device 8 being fixedly arranged within said housing 6;

The dustproof structure 100, at least the first carrier 2 of the dustproof structure 100 is fixedly connected with the housing 6;

the mesh membrane 1 encloses the sound holes 7 and/or the mesh membrane 1 is spaced between the sound holes 7 and the microphone device 8.

The first carrier 2 of the dust-proof structure 100 may be fixedly connected to the housing 6, or the first carrier 2 and the second carrier 3 may be fixedly connected to the housing 6 in order to enhance the connection stability of the dust-proof structure 100, or the dust-proof structure 100 may be disposed outside the housing 6 opposite to the sound hole 7, inside the housing 6 opposite to the sound hole 7, or further directly around the microphone devices 8 in the housing 6, or directly around a plurality of the microphone devices 8, or only around important microphone devices 8 such as chips. It is also possible to use the dust-proof structure 100 around the microphone device 8 to perform a double protection function with the dust-proof structure 100 at the sound hole 7.

Specifically, the housing 6 includes a substrate 13, the acoustic hole 7 is disposed on the substrate 13, the dustproof structure 100 seals the acoustic hole 7, the microphone device 8 includes a MEMS chip, the dustproof structure 100 is spaced between the acoustic hole 7 and the MEMS chip, and the dustproof structure 100 and the MEMS chip may or may not be directly connected to form a spacing support structure as shown in fig. 8.

While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A dustproof structure for a MEMS device, comprising:

a mesh membrane configured to be sound-permeable;

A first carrier and a second carrier, the first carrier having a first through opening, and the second carrier having a second through opening;

The first carrier and the second carrier are respectively arranged on both sides of the grid membrane, and the grid membrane is spaced between the first opening and the second opening;

The first carrier and/or the second carrier are configured to be fixed on the MEMS device;

The grid membrane comprises an isolation net and a fixing portion, wherein the fixing portion is connected around the isolation net, the fixing portion is fixedly connected to the first carrier and the second carrier, and the isolation net is spaced between the first opening and the second opening;

The isolation net is provided with a plurality of through holes;

The grid membrane is a multi-layer structure, and the grid membrane at least includes an upper grid membrane and a lower grid membrane. The first carrier is fixedly connected to the upper grid membrane, and the second carrier is fixedly connected to the lower grid membrane.

2. The dustproof structure according to claim 1 is characterized in that the thickness of the grid film ranges from 0.3 microns to 0.7 microns.

3 . The dustproof structure according to claim 1 , wherein a thickness of the first carrier and/or the second carrier is in a range of 25 μm to 55 μm.

4 . The dustproof structure according to claim 1 , wherein the first carrier and the second carrier have the same structural size.

The dustproof structure according to claim 1 , wherein the first carrier and the second carrier are made of the same material.

6 . The dustproof structure according to claim 1 , wherein the upper mesh film and the lower mesh film are bonded to form a fixed connection.

7. The dustproof structure according to any one of claims 1-5 is characterized in that the materials of the first carrier and the second carrier are photolithography materials, and the photolithography materials used to constitute the first carrier and the second carrier are pre-formed on both sides of the grid film, and the first carrier and the second carrier are formed through a photolithography process.

8. A MEMS microphone packaging structure, characterized by comprising:

A shell having a receiving cavity, wherein the shell is provided with a sound hole, and the sound hole connects the inside and the outside of the shell;

A microphone device, wherein the microphone device is fixedly disposed in the housing;

The dustproof structure according to any one of claims 1 to 7, wherein at least the first carrier is fixedly connected to the housing;

The mesh membrane closes the sound hole; and/or the mesh membrane is spaced between the sound hole and the microphone device.