CN111131985B

CN111131985B - Dust-proof structure, microphone packaging structure, and electronic device

Info

Publication number: CN111131985B
Application number: CN201911423067.5A
Authority: CN
Inventors: 游振江; 畠山庸平; 林育菁
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2025-04-22
Anticipated expiration: 2039-12-31
Also published as: WO2021135120A1; CN111131985A

Abstract

The present invention discloses a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure includes a carrier and a mesh portion; the mesh portion includes a filter and a fixing portion arranged around the filter; the carrier is a hollow structure, and a pore structure extending along the thickness direction of the carrier is arranged on the carrier; the mesh portion is arranged at one end of the carrier and covers the hollow structure, the filter is opposite to the hollow structure, and the fixing portion is connected to the carrier. One technical effect of the present invention is that the filter on the mesh portion can maintain a flat state, and the mesh portion can effectively block external particles and foreign matter from entering the interior of the microphone packaging structure.

Description

Dustproof structure, microphone packaging structure and electronic equipment

Technical Field

The invention relates to the technical field of electroacoustic conversion, in particular to a dustproof structure, a microphone packaging structure and electronic equipment.

Background

With the rapid development of electroacoustic technology, various electroacoustic products are layered endlessly. Microphones are one of the most important devices in electroacoustic products as a transducer for converting sound into an electrical signal. Nowadays, microphones have been widely used in many different types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smart watches, and smart wear. In recent years, as for a microphone package structure, the design of the structure thereof has become an important point and a hot spot for the study of those skilled in the art.

The conventional microphone package structure generally includes a housing having a housing chamber in which components such as a chip module (e.g., a MEMS chip and an ASIC chip) are housed and fixed, and a sound pickup hole is provided in the housing. However, in long-term application, it is found that external dust, impurities and other particles and foreign matters are easily introduced into the accommodating cavity of the microphone through the pick-up hole, and the external particles and the foreign matters can cause certain damage to components such as a chip assembly in the accommodating cavity, so that the acoustic performance and the service life of the microphone can be influenced.

In view of the above-mentioned problems, the solution adopted at present is to provide an isolation assembly on the pick-up hole of the microphone package structure to block the entry of external particles, foreign matters, etc. The conventional spacer assembly, as shown in fig. 1 and 2, includes a support portion 101 and a spacer mesh 102. When the isolation assembly is used, the isolation assembly is mounted on the sound pickup hole. However, in the conventional spacer assembly, due to the difference in size, material, structure and the like between the support portion 101 and the spacer mesh 102, a certain internal stress difference is likely to be generated at the connection position of the support portion 101 and the spacer mesh 102, which may cause the mesh film 103 on the spacer mesh 102 to be wrinkled or wrinkled, and the mesh film 103 may not be ensured to be in a flat state, which may cause the quality of the product to be degraded, and even may affect the airflow at the mesh film 103.

Disclosure of Invention

An object of the present invention is to provide a dustproof structure, a microphone package structure and a new technical solution of an electronic device.

According to a first aspect of the present invention, there is provided a dust-proof structure comprising a carrier and a mesh portion;

The grid part comprises a filter screen and a fixing part arranged around the filter screen;

The carrier is of a hollow structure, and a pore canal structure extending along the thickness direction of the carrier is arranged on the carrier;

The grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with the carrier.

Optionally, the channel structure comprises a plurality of first channels distributed over an edge portion of the carrier.

Optionally, the first duct is a through hole or a blind hole.

Optionally, the first channels extend in the thickness direction of the carrier and onto the fixing portions of the mesh portion.

Optionally, the section of the first pore canal is circular, and the aperture of the first pore canal is 5-300 μm.

Optionally, the cell structure further comprises a plurality of second cells, the plurality of second cells being disposed adjacent to the hollow structure, the plurality of second cells being disposed around an edge of the hollow structure.

Optionally, the second duct is a through hole or a blind hole.

Optionally, the second channels extend in the thickness direction of the carrier and onto the fixing portions of the mesh portion.

Optionally, the section of the second pore canal is in a strip shape or an arc shape;

the width of the second pore canal is 25-50 mu m, and the length of the second pore canal is 300-600 mu m.

According to a second aspect of the present invention, a microphone package is provided. The microphone packaging structure comprises a shell with a containing cavity, wherein a pickup hole is formed in the shell and used for communicating the inside and the outside of the shell;

the microphone device is fixedly arranged in the accommodating cavity;

the dust-proof structure of any one of the above is further included, and the dust-proof structure is arranged on the pick-up hole.

Optionally, the dust-proof structure is located outside the housing.

Optionally, the housing includes a substrate and a packaging cover, and the substrate and the packaging cover enclose the accommodating cavity;

The dustproof structure is accommodated in the accommodating cavity;

the microphone device includes a MEMS chip and a signal amplifier.

Optionally, the pickup hole is located on the encapsulation lid, dustproof construction with encapsulation lid fixed connection.

Optionally, the pick-up hole is located on the packaging cover, and the dustproof structure is fixedly connected to the substrate to cover the MEMS chip.

Optionally, the pick-up hole is located on the base plate, and the dustproof structure is fixedly arranged at a position corresponding to the pick-up hole on the base plate.

Optionally, the pick-up hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate corresponding to the position of the pick-up hole, and the MEMS chip is arranged on the dustproof structure.

According to a third aspect of the present invention, an electronic device is provided. The electronic device comprises a microphone package as claimed in any one of the above.

According to the dustproof structure provided by the embodiment of the invention, the pore canal is specially designed on the carrier, when the grid part is fixed on the carrier, the deformation of the carrier can be absorbed, and the stress difference is relieved, so that the filter screen on the grid part can be kept in a flat state, and the phenomenon of wrinkling or wrinkling on the filter screen is avoided. The dustproof structure provided by the embodiment of the invention can effectively protect the pickup hole of the microphone packaging structure, and the grid part can prevent external particles and foreign matters from entering the microphone packaging structure, so that all components in the microphone can be effectively protected, and the influence on the acoustic performance and the service life of the microphone is avoided. The technical task to be achieved or the technical problem to be solved by the present invention is never thought or expected by the person skilled in the art, so the present invention is a new technical solution.

Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a side view of a prior art isolation assembly.

Fig. 2 is a side view of a dust-proof structure provided in accordance with one embodiment of the present invention.

Fig. 3 is a schematic structural view of a carrier provided according to an embodiment of the present invention.

Fig. 4 is a schematic structural view of a carrier according to another embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a microphone package structure according to a first embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a microphone package structure according to a second embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a microphone package structure according to a third embodiment of the present invention.

Fig. 8 is a schematic structural diagram of a microphone package structure according to a fourth embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a microphone package structure according to a fifth embodiment of the present invention.

Reference numerals illustrate:

101-supporting parts, 102-isolating mesh cloth and 103-mesh membrane;

1-carrier, 11-pore structure, 111-first pore, 112-second pore, 2-grid part, 12-hollow structure, 13-edge part, 21-filter screen, 22-fixed part, 3-shell, 31-package cover, 32-substrate, 4-pick-up hole, 5-MEMS chip, 6-signal amplifier.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.

The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.

It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

According to one embodiment of the present invention, a dust-proof structure is provided. The dustproof structure can be applied to a microphone packaging structure, for example. The dustproof structure can effectively prevent external particles and foreign matters from entering the microphone packaging structure through the pickup hole on the microphone packaging structure, so that components in the microphone can be effectively protected, and the acoustic performance and the service life of the microphone are prevented from being influenced.

The following further describes the specific structure of the dust-proof structure provided in the embodiment of the present invention. The dustproof structure provided by the embodiment of the invention, as shown in fig. 2, comprises a carrier 1 and a grid part 2. The mesh part 2 includes a filter screen 21 and a fixing part 22 provided around the filter screen 21. The carrier 1 is of a hollow structure, and the carrier 1 is provided with a pore canal structure 11 extending along the thickness direction of the carrier 1. The mesh part 2 is disposed at one end of the carrier 1 and covers the hollow structure 12, the filter mesh 21 is opposite to the hollow structure 12, and the fixing part 22 is connected to the carrier 1.

The dustproof structure provided by the embodiment of the invention improves the structure of the carrier 1. Specifically, on the edge portion 13 of the carrier 1, a tunnel structure 11 capable of absorbing deformation of the carrier 1, relieving stress differences is provided. When the grid part 2 is fixedly connected with the carrier 1, the pore canal structure 11 on the carrier 1 can keep the filter screen 21 on the grid part 2 in a flat state, and the phenomenon of generating wrinkles or wrinkles on the filter screen 21 is avoided.

The dustproof structure provided by the embodiment of the invention can effectively protect the microphone packaging structure. The filter screen 21 is arranged on the grid part 2, the filter screen 2 can enable airflow to pass through, and the filter screen 21 can also effectively prevent external particles and foreign matters (such as dust and impurities) from entering the microphone packaging structure, so that various components in the microphone packaging structure can be effectively protected, and the acoustic performance and the service life of the microphone can be prevented from being influenced. In addition, since the filter screen 21 on the mesh portion 2 can be in a flat state, it is also advantageous for air to smoothly flow there without adversely affecting the movement of the air flow.

In the present invention, as shown in fig. 2, the mesh part 2 includes a filter 21 and a fixing part 22 provided around the filter 21. Wherein the fixing portion 22 may be used to connect the mesh portion 2 with the carrier 1 so that the mesh portion 2 can be covered on the carrier 1. When the fixing portion 22 of the mesh portion 2 is connected to the carrier 1, the fixing portion 22 is actually connected to the edge portion 13 of the carrier 1. Specifically, the fixing portion 22 of the mesh portion 2 and the edge portion 13 of the carrier 1 may be connected together by, for example, adhesive bonding, or may be connected together by, for example, fastening or welding, which may be flexibly selected by those skilled in the art according to specific needs, and the present invention is not limited thereto.

The filter screen 21 may be, for example, a mesh fabric made of a metal material with a mesh aperture not greater than 10 μm, so that the air flow can smoothly pass through, and meanwhile, particles such as dust and impurities outside can be effectively prevented from entering. The filter screen made of metal has the characteristic of good durability, does not need to be replaced frequently, and has longer service life. Of course, the filter 21 may also be a mesh with other pore sizes and other materials. The shape of the mesh of the filter 21 may be, for example, circular, square, triangular, or the like. Those skilled in the art can flexibly adjust the device according to specific needs, and the device is not limited thereto.

In the mesh portion 2, the filter 21 itself may have a regular shape such as a circular shape, a square shape, or an elliptical shape, for example, and the filter 21 may have other irregular shapes. Those skilled in the art can flexibly adjust the device according to actual needs, and the invention is not limited thereto.

In the present invention, the channel structure 11 is provided on the edge portion 13 of the carrier 1, wherein the channel structure 11 has various forms.

In one example of the present invention, as shown in fig. 3, the channel structure 11 includes a plurality of first channels 111, and the plurality of first channels 111 are distributed on the edge portion 13 of the carrier 1. Preferably, the plurality of first portholes 111 are evenly distributed over the edge portion 13 of the carrier 1 for better absorption of planar deformations of the carrier 1.

The first duct 111 may be, for example, a through hole penetrating the entire carrier 1. Of course, the first duct 111 may also be a blind hole formed in the carrier 1. In addition, the first duct 111 may extend out of the carrier 1 in the thickness direction of the carrier 1 and extend to the fixing portion 22 of the mesh portion 2. Those skilled in the art can flexibly select the specific case, and the method is not limited thereto.

As shown in fig. 3, the first porthole 111 may, for example, have a circular cross-section. At this time, the pore diameter of the first pore passage 111 may range from 5 μm to 300 μm. It should be noted that the cross section of the first duct 111 is not limited to a circle, but may be square, oval, triangle, trapezoid, etc., and those skilled in the art can flexibly adjust the cross section according to the specific situation, which is not limited.

In another example of the present invention, as shown in fig. 4, the cell structure 11 includes a plurality of first cells 111 and a plurality of second cells 112, and the first cells 111 are different from the second cells 112 in shape and structure. The first portholes 111 may for example have a circular cross-section, in which case the first portholes 111 have a pore size in the range of 5 μm to 300 μm. The cross-section of the second channel 112 may be, for example, elongated or curved, where the width of the second channel ranges from 25 μm to 50 μm and the length of the second channel ranges from 300 μm to 600 μm. As shown in fig. 4, the plurality of second cells 112 are all close to the hollow structure 12 of the carrier 1, and the plurality of second cells 112 are disposed around the edge of the hollow structure 12, so that the hollow structure 12 and the plurality of second cells 112 form a concentric annular structure. At this time, a plurality of first cells 111 are arranged at the portion where the second cells 112 are not provided on the edge portion 13 of the carrier 1. Wherein the first plurality of channels 111 are preferably uniformly distributed. In this example, two types of cells are provided on the carrier 1, and in particular, a plurality of second cells 112 are provided in close proximity to the outer edge of the hollow structure 12 of the carrier 1 to form a concentric annular structure with the hollow structure 12, which can better absorb the planar deformation of the carrier 1. Thus, when the mesh part 2 is fixedly connected with the carrier 1, deformation at the connection position of the mesh part 2 and the carrier can be avoided, so that the flatness of the filter screen 21 on the mesh part 2 is influenced, and the filter screen 21 can be kept in a flat state without generating wrinkles thereon.

The first duct 111 may be, for example, a through hole penetrating the entire carrier 1. Of course, the first duct 111 may also be a blind hole formed in the carrier 1. Likewise, the second portholes 112 may for example be through holes extending through the entire carrier 1. Of course, the second duct 111 may also be a blind hole formed in the carrier 1.

In addition, when the duct structure 11 includes the first duct 111 and the second duct 112, the first duct 111 and the second duct 112 may be through holes or blind holes. Alternatively, the first hole 111 may be a through hole, and the second hole 112 may be a blind hole. Alternatively, the first hole 111 is a blind hole, and the second hole 112 is a through hole. Those skilled in the art can flexibly adjust the device according to the specific situation, and the device is not limited. In addition, some of the first holes 111 may be through holes, and another part may be blind holes. Likewise, some of the second channels 112 may be through holes, and another part may be blind holes.

When the fixing portion 22 of the mesh portion 2 is connected to the carrier 1, for example, bonding, welding, fastening, or the like may be used, and those skilled in the art can flexibly adjust the fixing portion according to specific needs, which is not limited thereto.

In the present invention, the thickness of the mesh portion 2 may be, for example, 0.5 μm. The height of the carrier 1 may be, for example, 40 μm. This size is suitable for most microphone packages. Of course, the person skilled in the art can also suitably adjust the dimensions thereof according to the specific assembly requirements, without limitation.

According to another embodiment of the present invention, there is also provided a microphone package. The microphone packaging structure can be applied to various types of electronic products such as mobile phones, notebook computers, ipad, VR equipment, intelligent wearable equipment and the like, and is widely applied. The microphone packaging structure provided by the embodiment of the invention can effectively avoid the phenomenon that components such as an internal chip component are damaged due to the influence of external dust, impurities and other particles, can prolong the service life of the microphone, and can also keep excellent acoustic performance of the microphone.

The following further describes a specific structure of the microphone package structure provided in the embodiment of the present invention.

As shown in fig. 5 to 9, the microphone package structure provided by the embodiment of the invention includes a housing 3 having a receiving cavity, and a sound pickup hole 4 is provided on the housing 3. The sound pickup hole 4 is used to communicate the inside and the outside of the housing 3. A microphone device is accommodated and fixed in the accommodating cavity of the housing 3. The microphone packaging structure provided by the invention further comprises the dustproof structure, and the dustproof structure is fixedly arranged on the pickup hole 4. The dustproof structure can effectively protect components and parts inside the microphone packaging structure.

In the present invention, the sound pickup hole 4 may have a circular shape, a square shape, a triangular shape, an elliptical shape, or the like. The sound pickup holes 4 may be provided in one or more as needed. The specific setting position of the pick-up hole 4 can also be flexibly adjusted according to the specific situation of the microphone packaging structure, which is not limited by the invention.

In an alternative example of the invention, the dust-proof structure may be located outside the housing 3, as shown in fig. 5. That is, the sound pickup hole 4 is shielded from the outside. In this example, the dust-proof structure is mounted outside the microphone package structure to cover the sound pick-up hole 4, and does not occupy the space inside the microphone package structure. When the dustproof structure is installed, the position of the dustproof structure can be reasonably installed according to the position of the pickup hole 4, so that the dustproof structure can be aligned with the pickup hole 4, and external particles and foreign matters can be prevented from being introduced into the microphone packaging structure through the pickup hole 4.

Of course, the present invention is not limited to the dust-proof structure being provided outside the housing 3, and the dust-proof structure may be provided in the accommodation chamber of the housing 3. The setting position of the dustproof structure can be flexibly adjusted according to specific needs by a person skilled in the art.

The microphone packaging structure of the invention has the structure that the shell 3 comprises a base plate 32 and a packaging cover 31, and the base plate 32 and the packaging cover 31 together enclose the accommodating cavity. The dust-proof structure is accommodated in the accommodating cavity of the housing 3. The microphone device comprises a MEMS chip 5 and a signal amplifier 6.

In an alternative example of the present invention, as shown in fig. 6, the pick-up hole 4 is located on the package cover 31, and the dust-proof structure is fixedly connected to the package cover 32. The position of dustproof construction corresponds to pickup hole 4, can avoid external particulate matter, foreign matter to introduce into microphone packaging structure inside through pickup hole 4.

In an alternative example of the present invention, as shown in fig. 7, the pick-up hole 4 is located on the package cover 31, and the dust-proof structure is fixedly connected to the substrate 32 at a position corresponding to the pick-up hole 4, and at the same time, the dust-proof structure covers the MEMS chip 5, so that the chip in the microphone package structure can be effectively protected.

In the present invention, the sound collection hole 4 is not limited to the package cover 31 provided in the case 3, and may be provided in the substrate 32. For example, as shown in fig. 8, the sound collection hole 4 is located on the base plate 32, and the dust-proof structure is fixedly provided on the base plate 32 at a position corresponding to the sound collection hole 4. As another example, as shown in fig. 9, the sound collection hole 4 is located on the substrate 32, the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collection hole 4, and the MEMS chip 5 is provided on the dust-proof structure. When the sound pickup hole 4 is formed in the substrate 32, a person skilled in the art can adjust the mounting position of the dust-proof structure according to the specific situation, so long as the dust-proof structure can prevent external particles and foreign matters from entering or protect the internal chip.

Wherein the package cover 31 has a dish-like structure as a whole, and has an open end. The material of the package cover 31 may be, for example, a metal material, a plastic material, or a PCB board. The package cover 31 may have a cylindrical shape, a rectangular parallelepiped shape, or the like, for example. Those skilled in the art can flexibly adjust the device according to actual needs, and the device is not limited.

The substrate 32 may be a circuit board well known in the art, for example, a PCB board, etc., which is not limited thereto. The package cover 31 and the substrate 32 may be fixed together by adhesive bonding or solder bonding, for example, and may be flexibly selected by those skilled in the art as needed, which is not limited.

In the microphone package structure provided by the invention, a microphone device is fixedly accommodated in an accommodating cavity of a housing 3. In particular, as shown in fig. 5-9, the microphone device may comprise, for example, a MEMS chip 5 and a signal amplifier 6.

Wherein the MEMS chip 5 comprises a substrate and an induction film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, or the like. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the housing cavity, the MEMS chip 5 may be mounted on the substrate 32. Of course, the MEMS chip 5 may also be mounted on the package cover 31, for example, a special adhesive may be used to adhere the MEMS chip 5 to the package cover 31. The MEMS chip 5 may also be turned on by a circuit pattern in the substrate 32 in a flip-chip manner, which is well known to those skilled in the art, and the present invention will not be described in detail herein.

The signal amplifier 6 may be mounted on the package cover 31, or may be mounted on the substrate 32. The signal amplifier 6 may be an ASIC chip, for example. The ASIC chip is connected to the MEMS chip 5. The electrical signal output from the MEMS chip 5 can be transmitted to the ASIC chip, and processed and output by the ASIC chip. The MEMS chip 5 and the ASIC chip 6 may be electrically connected by a metal wire (bonding wire) so as to achieve mutual conduction between the two.

In addition, the MEMS chip 5 and/or the signal amplifier 6 may be buried in the substrate 32 or semi-buried in the substrate 32. For example, conductors are provided within the substrate 32, and pads are provided on the substrate 32. The conductors are, for example, metallized vias disposed within the substrate 32. The pads are electrically connected to the MEMS chip 5 and the signal amplifier 6 via conductors. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 contributes to the miniaturization of the microphone.

When the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, at least one metal layer is required to be provided above and below the MEMS chip 5 and the signal amplifier 6, respectively. The metal layer is grounded as a shield. A plurality of metal conductors are arranged in the area around the MEMS chip 5 and the signal amplifier 6 for constituting a shielding structure together with the above-mentioned metal layers. The MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, so that the surface of the signal amplifier 6 is not required to be coated with protective glue, thus simplifying the process and improving the optical noise resistance of the product.

On the other hand, the invention also provides electronic equipment. The electronic device comprises the microphone packaging structure.

The electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, an intelligent wearable device, etc., which is not limited in the present invention.

While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A dustproof structure, characterized in that: it includes a carrier and a mesh part;

The mesh portion includes a filter screen and a fixing portion arranged around the filter screen;

The carrier is a hollow structure, and a pore structure extending along the thickness direction of the carrier is provided on the carrier;

The mesh part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected to the carrier;

The pore structure comprises a plurality of first pores, the plurality of first pores are evenly distributed on the edge of the carrier, and the cross section of the first pore is circular;

The channel structure further includes a plurality of second channels, the plurality of second channels are close to the hollow structure, the plurality of second channels are arranged around the edge of the hollow structure, and the cross section of the second channels is arc-shaped.

2 . The dustproof structure according to claim 1 , wherein the first hole is a through hole or a blind hole.

3 . The dustproof structure according to claim 1 , wherein the first hole extends along the thickness direction of the carrier and extends to the fixing portion of the mesh portion.

4. The dustproof structure according to any one of claims 1, characterized in that the pore size of the first channel is 5-300 μm.

5 . The dustproof structure according to claim 1 , wherein the second hole is a through hole or a blind hole.

6 . The dustproof structure according to claim 1 , wherein the second hole extends along the thickness direction of the carrier and to the fixing portion of the mesh portion.

7. The dustproof structure according to any one of claims 1, characterized in that the width of the second channel is 25-50 μm, and the length of the second channel is 300-600 μm.

8. A microphone packaging structure, characterized in that: it comprises a housing having a receiving cavity, a sound pickup hole is arranged on the housing, and the sound pickup hole is used to connect the inside and the outside of the housing;

Also included is a microphone device, which is fixedly disposed in the accommodating cavity;

It also includes a dustproof structure as described in any one of claims 1 to 7, wherein the dustproof structure is arranged on the sound pickup hole.

9 . The microphone packaging structure according to claim 8 , wherein the dustproof structure is located outside the housing.

10. The microphone packaging structure according to claim 8, wherein the housing comprises a substrate and a packaging cover, and the substrate and the packaging cover enclose the accommodating cavity;

The dustproof structure is accommodated in the accommodating cavity;

The microphone device includes a MEMS chip and a signal amplifier.

11 . The microphone packaging structure according to claim 10 , wherein the sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the packaging cover.

12 . The microphone packaging structure according to claim 10 , wherein the sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the substrate to cover the MEMS chip.

13 . The microphone packaging structure according to claim 10 , wherein the sound pickup hole is located on the substrate, and the dustproof structure is fixedly provided on the substrate at a position corresponding to the sound pickup hole.

14. The microphone packaging structure according to claim 10 is characterized in that: the sound pickup hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole, and the MEMS chip is arranged on the dustproof structure.

15. An electronic device, characterized in that it comprises the microphone packaging structure as described in any one of claims 8 to 14.