CN113141702A - Insulating sheet, printed circuit board comprising insulating sheet, semiconductor device and embedded component - Google Patents
Insulating sheet, printed circuit board comprising insulating sheet, semiconductor device and embedded component Download PDFInfo
- Publication number
- CN113141702A CN113141702A CN202010055623.4A CN202010055623A CN113141702A CN 113141702 A CN113141702 A CN 113141702A CN 202010055623 A CN202010055623 A CN 202010055623A CN 113141702 A CN113141702 A CN 113141702A
- Authority
- CN
- China
- Prior art keywords
- layer
- insulating sheet
- insulating
- resin layer
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides an insulating sheet, a printed circuit board comprising the insulating sheet, a semiconductor device and an embedded component, which comprise a protective layer, an insulating resin layer and a supporting layer which are arranged in sequence; wherein the first adhesive force of the protective layer and the insulating resin layer is 0.1-0.4N/mm; and the second bonding force of the supporting layer and the insulating resin layer is 0.2-0.8N/mm, the second bonding force is greater than the first bonding force, and the difference between the second bonding force and the first bonding force is not less than 0.1N/mm. The invention can well protect the middle insulating resin layer by selecting the specific protective layer and the specific supporting layer, and can not influence the application effect of the insulating resin layer when the finally obtained insulating resin layer is separated from the outer layer.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and relates to an insulating sheet, a printed circuit board comprising the insulating sheet, a semiconductor device and an embedded component.
Background
At present, the methods for manufacturing the circuit of the Printed Circuit Board (PCB) mainly include the traditional subtractive method, MSAP and SAP. Subtractive processes are still the major method of making circuits in the present PCB industry, starting with a copper clad laminate, where the circuit is desired, by applying a resist, and then etching away the unwanted copper foil and resist to form the circuit pattern. The line width and the line spacing of the current PCB manufacturing process by the subtractive method can reach 30 mu m \30 mu m. However, the development of the electronic industry is very rapid, and electronic products are more and more miniaturized and multifunctional, so that the wiring of the PCB design is thinner and thinner, the used insulating substrate is thinner and thinner, and the size of the via hole is smaller and smaller. The MSAP process (modified semi-additive process) uses special carrier copper foil to achieve lower line width and line spacing, and the minimum line width and line spacing can be 20 μm/20 μm using this technique.
CN104113994A discloses a method for manufacturing a printed circuit board by using a new and improved semi-additive method, comprising the following steps: a) preparing a dielectric layer, laminating a copper foil with the roughness of the rough surface less than 4 mu m on the dielectric layer to form a copper foil conducting layer, and forming a composite structure substrate; b) reducing the thickness of the copper foil conducting layer to 0.2-5 μm; c) manufacturing through holes or blind holes on the dielectric layer and the copper foil conducting layer; d) conducting treatment is carried out on the copper foil conducting layer and the wall of the blind hole or the through hole to form a seed layer; e) pasting a photosensitive film on the surface of a substrate, and forming an electroplating barrier layer on the substrate through pattern transfer; f) electroplating the substrate; g) forming a metal protective layer on the surface of the circuit pattern by using a chemical plating or electroplating method; h) removing the electroplating barrier layer; i) removing the exposed seed layer and the copper foil conducting layer by adopting a flash etching method, and reserving a circuit pattern formed by electroplating; j) removing the metal protection layer; K) repeating the steps a) to j) on the circuit board to manufacture the multilayer circuit board, wherein the minimum line width and line distance of the patent application can be 20 mu m/20 mu m, but the medium layer is not described too much.
As electronic products are further produced in a higher density direction, the design requirements are further increased, i.e. a multilayer circuit board with line width and line spacing smaller than 20 μm \20 μm is required, and a more demanding SAP (semi-additive process) process must be used. The insulating layer adopted by the process is different from a bonding sheet formed by semi-curing a traditional glass fiber cloth pre-impregnated resin composition, and is an insulating resin sheet produced in a roll-to-roll mode of a protective layer/resin composition/a supporting layer. The protective layer of the insulating resin sheet is mainly used for protecting the insulating resin layer from pollution and preventing the insulating resin layer from sticking together; the support layer is a carrier layer made of insulating resin sheet and plays a role of support. When the multilayer circuit board is manufactured, the protective layer and the supporting layer are required to be peeled off, and because the protective layer and the supporting layer are peeled off step by step, various problems such as difficult peeling, peeling of two layers together, peeling of a part of insulating resin layers, poor appearance of insulating layers and the like are easy to occur in the actual operation process, so that the actual application is influenced. Meanwhile, in order to achieve further thinning of the printed wiring board, it is desired that an inner layer substrate, an insulating layer, and the like used for the printed wiring board be thinned and that embedding of components be facilitated.
Accordingly, it is desirable to provide an insulating resin sheet that can be applied to the SAP process.
Disclosure of Invention
The invention aims to provide an insulating sheet, a printed circuit board comprising the insulating sheet, a semiconductor device and an embedded component. According to the invention, through selecting the specific protective layer and the specific supporting layer, the finally obtained insulating resin layer can be separated from the outer layer, and the application effect of the insulating resin layer is not influenced.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides an insulating sheet, comprising a protective layer, an insulating resin layer and a supporting layer, which are sequentially disposed;
wherein the first adhesive force of the protective layer and the insulating resin layer is 0.1-0.4N/mm; and the second bonding force of the supporting layer and the insulating resin layer is 0.2-0.8N/mm, the second bonding force is greater than the first bonding force, and the difference between the second bonding force and the first bonding force is not less than 0.1N/mm.
When the insulating sheet provided by the invention is applied, the second adhesive force is greater than the first adhesive force, so that the insulating resin layer can not be damaged when the protective layer is firstly stripped; meanwhile, the invention limits the bonding force between the protective layer and the supporting layer and the insulating resin layer respectively, and can ensure that the middle insulating resin layer is not damaged when the two outer layers are removed respectively.
If the first adhesive force is too small, the function of protecting the insulating resin layer cannot be achieved, if the first adhesive force is too large, on one hand, the protective layer is not easy to peel off, and on the other hand, if the first adhesive force is larger than the second adhesive force, when the protective layer is peeled off, the appearance of the insulating resin layer can be influenced, even part of the insulating resin layer is peeled off, and finally, the insulating resin layer cannot be molded; and if the separation of part of the insulating resin layer from the support layer is caused, impurities are easily introduced between the support layer and the insulating resin layer, and the support layer and the insulating resin layer are easily wrinkled in the subsequent pressing process, so that the lamination quality is affected. Similar problems can also occur if the second adhesive layer is too large or too small.
The 0.1-0.4N/mm may be 0.12N/mm, 0.15N/mm, 0.18N/mm, 0.2N/mm, 0.22N/mm, 0.25N/mm, 0.29N/mm, 0.3N/mm, 0.32N/mm, 0.35N/mm, 0.38N/mm, etc.
The 0.2-0.8N/mm may be 0.25N/mm, 0.3N/mm, 0.35N/mm, 0.4N/mm, 0.45N/mm, 0.5N/mm, 0.55N/mm, 0.6N/mm, 0.65N/mm, 0.7N/mm, 0.75N/mm, etc.
Preferably, the difference between the second adhesion and the first adhesion is above 0.2N/mm, such as 0.22N/mm, 0.24N/mm, 0.28N/mm, 0.3N/mm, 0.4N/mm, etc.
Preferably, the support layer is selected from a layer of plastic material.
Preferably, the plastic material is selected from any one of or a combination of at least two of polyester, polycarbonate, polyacrylic, cyclic polyolefin, triacetyl cellulose, polyether sulfide, polyether ketone, or polyimide.
Preferably, the polyester is selected from polyethylene terephthalate and/or polyethylene naphthalate.
Preferably, the polyacrylic is selected from polymethyl methacrylate.
Examples of the support include a film made of a plastic material, a metal foil, and a release paper, and preferably a film made of a plastic material or a metal foil.
When a film formed by a plastic material is selected as a support, the film is selected from any one of polyester, polycarbonate, polyacrylic acid, cyclic polyolefin, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone or polyimide; the polyester is selected from polyethylene terephthalate (PET), polyethylene naphthalate (PEN); the acrylic is polymethyl methacrylate (PMMA). When a metal foil is used as the support, for example, copper foil, aluminum foil, and the like are exemplified, and copper foil is preferable.
The thickness of the support is 5 to 70 μm, for example, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, etc., preferably 10 to 60 μm, and more preferably 10 to 50 μm.
As commercially available products of the support, polyethylene terephthalate (PET) can be selected from SK-1, AL-5, etc. manufactured by Linderaceae, Lumiror R56, Lumiror T60, Lumiror T6AM, Lumiror R80, etc. manufactured by Toray, G2LA, etc.; polyethylene naphthalate (PEN) may be selected from テ Tokyo ネヅクス Q83; the polyimide film (PI film) was selected from ュ - ピレックス -S manufactured by Udo Kyowa Kagaku K.K.; アビ -force ル AH and アビ -force ル NPI manufactured by Kaneka.
Preferably, the protective layer is selected from any one of polyethylene, polypropylene or polyethylene terephthalate or a combination of at least two of them.
In the invention, the protective layer is used for preventing the surface of the insulating resin layer from being adhered and avoiding the surface of the resin composition layer from being physically damaged; and also for preventing adhesion of foreign matters such as dust. The present inventors have found that by controlling the adhesion of the protective layer to the insulating resin layer within a suitable range, the appearance can be improved, and the yield, the operating efficiency and the lamination quality can be improved.
As the protective layer, a film formed of a plastic material can be preferably used. Examples of the plastic material include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); acrylic such as Polycarbonate (PC) and polymethyl methacrylate (PMMA), cyclic polyolefin, diacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, and polyimide.
Preferably, in a preferred embodiment, the protective layer comprises any one of polyethylene, polypropylene and polyethylene terephthalate or a combination of at least two thereof.
Preferably, the thickness of the protective layer is preferably 5 to 75 μm, such as 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, and the like, more preferably 10 to 50 μm, even more preferably 10 to 40 μm, and most preferably 10 to 30 μm. When a protective layer with a release layer is used, the thickness of the protective layer with a release layer is preferably within the above range as a whole.
As commercially available products of the protective layer, there may be mentioned those selected from: a polypropylene film "アルファン MA-430" or "アルファン MA-411" manufactured by Wangzi エフテックス (Ltd.).
Preferably, the thickness of the insulating resin layer is 10 to 500. mu.m, such as 50. mu.m, 80. mu.m, 100. mu.m, 150. mu.m, 200. mu.m, 250. mu.m, 300. mu.m, 350. mu.m, 400. mu.m, 450. mu.m, etc., more preferably 20 to 50. mu.m, such as 25. mu.m, 30. mu.m, 35. mu.m, 40. mu.m, 45. mu.m, etc., or 100 to 300. mu.m, such as 150. mu.m, 200. mu.m, 250. mu.m, etc.
The thickness of the insulating resin layer is generally 20-50 μm when applied to fine lines, and 100-300 μm when applied to embedded components.
The resin composition used for the insulating resin layer of the present invention is a resin composition commonly used in the art in the prior art.
Preferably, the constituent material of the insulating resin layer includes a resin composition.
Preferably, the inorganic filler is contained in an amount of 30 to 80 wt%, for example, 40 wt%, 50 wt%, 60 wt%, 70 wt%, based on 100 wt% of nonvolatile components in the resin composition.
The preparation method of the insulating sheet is common, and the exemplary simple description is as follows: and (3) uniformly mixing the resin composition glue solution, coating the resin composition glue solution on the support layer by using a coating device, heating and drying the resin composition glue solution, removing the solvent, and then laminating the surface without the support body with the protective layer to obtain the insulating sheet.
In a second aspect, the present invention provides a method of using the insulating sheet according to the first aspect, the method comprising the steps of:
(1) removing the first outer layer of the insulating sheet, then attaching the insulating resin layer to the layer to be attached, and attaching the insulating sheet to two sides of the layer to be attached respectively to obtain the composite board;
(2) and after the obtained composite board is pretreated, removing the second outer layer of the insulating sheet, and then carrying out post-treatment.
In a third aspect, the present invention provides a printed circuit board comprising an insulating layer obtained from the insulating sheet of the first aspect.
In the practical application process, the protective layer and the support layer included in the insulation sheet need to be removed.
Illustratively, the present invention explains a method for using an insulating sheet of the present invention, by taking as an example a method for manufacturing a printed circuit board using the insulating sheet according to the first aspect, the method comprising the steps of:
(1) removing the protective layer of the insulating sheet, then attaching the insulating resin layer to the core plate, and respectively attaching the insulating sheets to two sides of the core plate to obtain the composite plate;
(2) and after the obtained composite board is pretreated, removing the supporting layer of the insulating sheet, and then curing, preparing a through hole, removing glue, plating copper and preparing a circuit to obtain the printed circuit board.
Specifically, the method comprises the following steps: peeling off the protective layer of the insulating sheet of the first aspect; under the vacuum condition, adhering insulating sheets on the two sides of the core plate, and adhering the core plate and the insulating resin layer; preheating at 70-130 deg.C for 30 s to 10 min; stripping the supporting layer, and performing post-curing in an oven; manufacturing a through hole; removing glue from the through hole, and chemically plating copper on the surface of the insulating resin layer and the through hole; then electroplating copper on the required circuit area to obtain the multilayer circuit board.
The processes of manufacturing the through hole, removing the glue and the like in the invention are not limited, and are common process means in the prior art.
In a fourth aspect, the present invention provides a semiconductor device comprising the printed circuit board of the second aspect.
The semiconductor device of the present invention can be prepared by mounting a component (semiconductor chip) on the conductive position of the printed circuit board. The "conducting position" refers to a position in the printed circuit board for conducting electrical signals, and the position may be on the surface or an embedded position (in this case, a component). The semiconductor chip is not particularly limited as long as it is an electric circuit element made of a semiconductor.
The method of mounting the semiconductor chip in the production of the semiconductor device of the present invention is not particularly limited as long as the semiconductor chip effectively functions, and specific examples thereof include a wire bonding mounting method, a flip chip mounting method, a mounting method using a Bump-less Build-Up Layer (BBUL), a mounting method using an Anisotropic Conductive Film (ACF), a mounting method using a non-conductive film (NCF), and the like.
In a fifth aspect, the present invention provides an embedded component, which includes an insulating layer obtained from the insulating sheet of the first aspect.
When the insulating resin layer is used for preparing the embedded component, the thickness of the required insulating resin layer is thicker and is 100-300 mu m.
Compared with the prior art, the invention has the following beneficial effects:
when the insulating sheet provided by the invention is applied, the second adhesive force is greater than the first adhesive force, so that the insulating resin layer can not be damaged when the protective layer is firstly stripped; meanwhile, the invention limits the bonding force between the protective layer and the supporting layer and the insulating resin layer respectively, and can ensure that the middle insulating resin layer is not damaged when the two outer layers are removed respectively.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
The materials and the reference information of the examples and comparative examples are as follows:
| material | Manufacturer brand |
| PET film (Release force 0.4N/mm) | Lin De Ke SK-1 |
| PET film (Release force 0.6N/mm) | Dongli corporation Lumiror T60 |
| PET film (Release force 0.8N/mm) | Dongli corporation Lumiror R80 |
| Polyethylene film (HDPE, 0.2N/mm release force) | Medium petro-chemical MH702 |
| Polyethylene film (HDPE, 0.1N/mm release force) | Medium petrochemical MH602 |
| Polyethylene film (HDPE, 0.05N/mm release force) | Meditanized MH502 |
| PEN film (Release force 0.4N/mm) | Emperor Q83 |
| Epoxy resin | New day iron TX-1467 |
| Phenolic resin | Hansen PHL6635 |
| Phenoxy resin | Hansen EPONOL 53-BH-35 |
| Block copolymer | Keteng 1652 |
| Spherical silica | Birapy DQ1028L |
| 2E4MZ (curing accelerators) | Formation of four countries |
| Core-shell rubber (CSR) | KANECA MX-227 |
| Polyether sulfone | Suwei VERADEL 3000RP |
Example 1
An insulating sheet is prepared by the following steps:
(1) preparation of epoxy resin glue solution:
100 parts of epoxy resin is taken as matrix resin, 30 parts of phenolic resin and 1 part of 2E4MZ, 40 parts of phenoxy resin and 40 parts of block copolymer are taken as toughening agents, 120 parts of spherical silica is taken as filler, and a mixed solvent of butanone and propylene glycol methyl ether (1:1) is utilized to prepare epoxy resin glue solution with the solid content of 50%.
(2) Preparing an insulating sheet:
and (2) coating the epoxy resin glue solution on the surface of a support layer PET film (with the release force of 0.8N/mm) by a coating device, wherein the thickness of the coating is 50 mu m, drying in a 160 ℃ oven for 3 minutes, removing the organic solvent, laminating the surface of the resin layer without the support layer and a protective layer (PET with the release force of 0.4N/mm) into a coil in a rolling manner, wherein the laminating temperature is 100 ℃, the pressure is 2MPa, and finally, cutting into sheets to obtain the insulating sheet.
Example 2
An insulating sheet is prepared by the following steps:
(1) preparation of epoxy resin glue solution:
100 parts of epoxy resin is taken as matrix resin, 30 parts of phenolic resin and 1 part of 2E4MZ, 25 parts of core-shell rubber and 45 parts of block copolymer are taken as toughening agents, 200 parts of spherical silicon dioxide is taken as filler, and a mixed solvent of butanone and propylene glycol methyl ether (1:1) is utilized to prepare epoxy resin glue solution with the solid content of 50%.
(2) Preparing an insulating sheet:
coating the epoxy resin glue solution on the surface of a high-density PET (polyethylene) film (with the release force of 0.4N/mm) of a support layer by a coating device, wherein the thickness of the coating is 40 mu m, drying the coating in a drying oven at the temperature of 30 ℃ for 5 minutes, removing the organic solvent, then laminating the surface of the resin layer without the support layer and a protective layer (polyethylene HDPE with the release force of 0.1N/mm) into a coil in a rolling mode, wherein the laminating temperature is 100 ℃, the pressure is 2MPa, and finally, cutting the resin layer into sheets to obtain the insulating sheet.
Example 3
An insulating sheet is prepared by the following steps:
(1) preparation of epoxy resin glue solution:
100 parts of epoxy resin is taken as matrix resin, 30 parts of phenolic resin and 1 part of 2E4MZ, 20 parts of core-shell rubber and 50 parts of block copolymer are taken as toughening agents, 100 parts of spherical silicon dioxide is taken as filler, and a mixed solvent of butanone and propylene glycol methyl ether (1:1) is utilized to prepare epoxy resin glue solution with the solid content of 50%.
(2) Preparing an insulating sheet:
coating the epoxy resin glue solution on the surface of a high-density PEN film (with the release force of 0.4N/mm) of a support layer by a coating device, wherein the thickness of the coating is 200 mu m, drying the coating in an oven at 150 ℃ for 7 minutes, removing the organic solvent, then laminating the surface of the resin layer without the support layer and a protective layer (polyethylene HDPE with the release force of 0.2N/mm) into a coil in a rolling mode, and finally cutting the laminated resin layer into sheets to obtain the insulating sheet, wherein the laminating temperature is 100 ℃ and the pressure is 2 MPa.
Example 4
An insulating sheet is prepared by the following steps:
(1) preparation of epoxy resin glue solution:
100 parts of epoxy resin is taken as matrix resin, 3 parts of dicyandiamide and 1 part of 2E4MZ, 20 parts of core-shell rubber and 50 parts of polyether sulfone are taken as toughening agents, 100 parts of spherical silicon dioxide is taken as filler, and a mixed solvent of DMF and butanone (1:1) is utilized to prepare epoxy resin glue solution with solid content of 50%.
(2) Preparing an insulating sheet:
coating the epoxy resin glue solution on the surface of a support layer high-density PEN film (with the release force of 0.2N/mm) by a coating device, wherein the thickness of the coating is 150 mu m, drying in an oven at 155 ℃ for 8 minutes, removing the organic solvent, then laminating the surface of the resin layer without the support layer and a protective layer (polyethylene HDPE with the release force of 0.1N/mm) into a coil in a rolling mode, and finally cutting into sheets to obtain the insulating sheet, wherein the laminating temperature is 100 ℃ and the pressure is 2 MPa.
Comparative example 1
The only difference from example 1 was that in this comparative example, the support layer was replaced with a PET film (release force 0.4N/mm).
Comparative example 2
The only difference from example 4 was that in this comparative example, the support layer was replaced with a high density PEN film (0.9N/mm release force).
Comparative example 3
The only difference from example 3 is that in this comparative example the protective layer was replaced with polyethylene HDPE with a release force of 0.05N/mm.
Comparative example 4
The only difference from example 1 was that in this comparative example, the protective layer was replaced with a PET film (release force 0.6N/mm).
Comparative example 5
The only difference from example 4 was that in this comparative example, the protective layer was replaced with a PET film (release force 0.4N/mm).
Performance testing
The performance tests were performed on the insulating sheets provided in examples 1 to 4 and comparative examples 1 to 5, by the following methods:
(1) adhesion of insulating resin layer and outer layer:
a sample having a size of 75mm × 25mm was prepared with a cutter, using an anti-peeling tester having a resolution of not less than 0.02N: adhering the cut test sample strips to a circular fixture of an anti-stripping instrument by using a double-sided adhesive tape, stripping an outer layer material at a stretching speed of 50mm/min in a 90-degree mode along the length direction, reading a stable test result as L, and dividing the stable test result by the L by 25 to obtain the bonding force of the outer layer of the sample, wherein the unit is N/mm;
(2) peel-off resist and support layer experiments:
among them, evaluation of class A: resin peeling during protective layer separation;
evaluation of type B: when the protective layer is separated, whether the supporting layer is separated from the resin layer or not is judged;
evaluation of class C: and resin peeling off when the support layer is separated.
Evaluation of class D: the ease of peeling the protective layer (in which peeling operation is easy and effective protection of the resin layer is good, handling at peeling requires careful and uniform force and the protective resin layer is general, and failure in effective protection of the resin layer, or generation of other layers after peeling is poor in the ease of delamination or peeling).
The test results are shown in table 1:
TABLE 1
According to the embodiment and the performance test of the invention, the insulating sheet provided by the invention can not cause the supporting layer or the protective layer to be incapable of supporting or protecting due to too small adhesive force in the storage process, and on the other hand, the operation is simple and rapid in the application process, and the situations of incapability of peeling, peeling of the insulating resin layer, advanced separation of the resin layer and the outer layer and the like due to too large or too small adhesive force can be avoided.
As is clear from comparison of examples 1 to 3 with example 4, the difference between the first adhesion and the second adhesion is 0.2N/mm or more, which is a good effect. As can be seen from the comparison between example 1 and comparative example 1, the difference between the first adhesion force and the second adhesion force of the present invention cannot be less than 0.1N/mm, otherwise, when the first outer layer is peeled off, a glue dropping phenomenon may occur or the support layer may be separated from the resin layer in advance, thereby affecting the application of the insulation sheet, the glue dropping easily contaminates the PCB circuit layer manufacture, and also affects the PCB glue filling effect. As can be seen from the comparison between example 4 and comparative example 2, when the second adhesion force is too high, glue is likely to fall off when the supporting layer is peeled off, so that the application of the insulating sheet is affected, and the glue falls off to easily contaminate the PCB circuit layer manufacture, which also affects the PCB glue filling effect. As is clear from comparison between example 2 and comparative example 3, if the first adhesive force is too small, the resin layer is likely to be partially separated during winding and is likely to be contaminated with dust or the like, and thus the resin layer cannot be well protected. As is clear from the comparison between example 1 and comparative example 4, when the first adhesive force is too high, the resin layer is likely to be partially peeled off or the resin layer is likely to be partially separated from the support in the process of peeling the protective film.
As can be seen from the comparison between the above examples and comparative examples, the magnitude of the first adhesive force and the second adhesive force and the first adhesive force and the second adhesive force are all required to be within the range defined by the present invention to obtain the technical effects of the present invention.
The application of the insulating sheet provided by the invention is exemplified as follows:
application example 1
A printed circuit board is prepared by the following steps:
(1) pretreatment of the inner layer circuit substrate:
and performing DESMEAR and brown oxidation treatment on the PCB with the inner layer circuit to obtain the rough surface of the PCB surface.
(2) Manufacturing an outer layer PCB by using an insulating sheet:
a. pre-pressing: the protective layer of the insulating sheet (provided in example 1) was removed by tearing, the insulating resin layer exposed and the inner layer PCB pretreated in (1) above were laminated, and then lamination was performed by applying heat and pressure under a vacuum of 10kgf/cm in a vacuum laminator2The temperature was 140 ℃ and the time was 3 minutes.
b. Post-curing: and removing the supporting layer of the insulating sheet from the pre-pressed laminated board, and then putting the laminated board into an oven for curing at the temperature of 190 ℃ for 60 minutes.
c. Manufacturing a fine line by an SAP process: and drilling, DESMEAR and copper deposition electroplating are carried out on the post-cured laminated board, so that a fine line with the line width and the line distance of 15/15 mu m can be manufactured.
Application example 2
An embedded component is prepared by the following steps:
(1) pretreatment of the inner layer circuit substrate:
and (4) locally hollowing the PCB with the inner layer circuit and then embedding the components.
(2) Manufacturing an outer layer PCB by using an insulating sheet:
a. pre-pressing: the first outer layer of the insulating sheet (provided in example 4) was torn off to expose the insulating resin layer and laminated with the inner layer PCB pretreated in (1) above, and then laminated by applying heat and pressure under a vacuum pressure of 10kgf/cm in a vacuum laminator2The temperature was 150 ℃ and the time was 2 minutes.
b. Post-curing: and removing the second outer layer of the pre-pressed laminated board, covering a layer of 12-micron copper foil on the surface of the insulating resin layer, putting the laminated board into a traditional PCB laminating machine, and curing for 60 minutes at 190 ℃.
c. Manufacturing an outer circuit of the PCB: and (3) drilling the laminated board, performing DESMEAR and copper deposition electroplating and other traditional methods to manufacture the PCB.
The specific operations of the general conventional preparation method in the application example of the present invention are not described in detail.
The applicant states that the present invention is described by the above embodiments of the insulating sheet, the printed circuit board, the semiconductor device and the embedded component of the present invention, but the present invention is not limited to the above detailed method, that is, it does not mean that the present invention is implemented only by relying on the above detailed method. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. An insulating sheet is characterized by comprising a protective layer, an insulating resin layer and a supporting layer which are sequentially arranged;
wherein the first adhesive force of the protective layer and the insulating resin layer is 0.1-0.4N/mm; and the second bonding force of the supporting layer and the insulating resin layer is 0.2-0.8N/mm, the second bonding force is greater than the first bonding force, and the difference between the second bonding force and the first bonding force is not less than 0.1N/mm.
2. The insulating sheet according to claim 1, wherein the second adhesion force differs from the first adhesion force by not less than 0.2N/mm.
3. Insulating sheet according to claim 1 or 2, characterized in that the supporting layer is selected from a layer of plastic material;
preferably, the plastic material is selected from any one or a combination of at least two of polyester, polycarbonate, polyacrylic, cyclic polyolefin, triacetyl cellulose, polyether sulfide, polyether ketone or polyimide;
preferably, the polyester is selected from polyethylene terephthalate and/or polyethylene naphthalate;
preferably, the polyacrylic is selected from polymethyl methacrylate.
4. An insulating sheet according to any of claims 1-3, characterized in that the protective layer is selected from any one of polyethylene, polypropylene or polyethylene terephthalate or a combination of at least two thereof.
5. Insulating sheet according to any one of claims 1 to 4, characterised in that the thickness of the supporting layer is 10-50 μm;
preferably, the thickness of the protective layer is 10-30 μm;
preferably, the thickness of the insulating resin layer is 10 to 500 μm; further preferably 20 to 50 μm or 100-300 μm.
6. The insulating sheet according to any one of claims 1 to 5, wherein a constituent raw material of the insulating resin layer comprises a resin composition;
preferably, the content of the inorganic filler is 30 to 80% by weight based on 100% by weight of nonvolatile components in the resin composition.
7. Use of an insulating sheet according to any of claims 1 to 6, characterized in that it comprises the following steps:
(1) removing the protective layer of the insulating sheet, then attaching the insulating resin layer to the layer to be attached, and attaching the insulating sheet to one side or two sides of the layer to be attached respectively to obtain the composite board;
(2) and after the obtained composite board is pretreated, removing the supporting layer of the insulating sheet, and then carrying out post-treatment.
8. A printed circuit board comprising an insulating layer obtained from the insulating sheet according to any one of claims 1 to 6.
9. A semiconductor device characterized by comprising the printed circuit board according to claim 8.
10. An embedded component, comprising an insulating layer obtained from the insulating sheet according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010055623.4A CN113141702A (en) | 2020-01-17 | 2020-01-17 | Insulating sheet, printed circuit board comprising insulating sheet, semiconductor device and embedded component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010055623.4A CN113141702A (en) | 2020-01-17 | 2020-01-17 | Insulating sheet, printed circuit board comprising insulating sheet, semiconductor device and embedded component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113141702A true CN113141702A (en) | 2021-07-20 |
Family
ID=76808639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010055623.4A Pending CN113141702A (en) | 2020-01-17 | 2020-01-17 | Insulating sheet, printed circuit board comprising insulating sheet, semiconductor device and embedded component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113141702A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101437914A (en) * | 2006-05-09 | 2009-05-20 | 日立化成工业株式会社 | Adhesive sheet, circuit member connection structure using the same, and semiconductor device |
| CN101637070A (en) * | 2007-03-29 | 2010-01-27 | 住友电木株式会社 | Base-equipped insulating sheet, multi-layer printed circuit board, semiconductor device, and multi-layer printed circuit board manufacturing method |
| CN101977765A (en) * | 2008-03-25 | 2011-02-16 | 味之素株式会社 | Insulating resin sheet and method for producing multilayer printed wiring board using same |
| CN103650649A (en) * | 2011-07-07 | 2014-03-19 | 日立化成株式会社 | Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board |
| CN103857268A (en) * | 2012-11-28 | 2014-06-11 | 大自达电线股份有限公司 | Shield film, shield printed wiring board and method of manufacturing shield printed wiring board |
| CN104685018A (en) * | 2012-08-02 | 2015-06-03 | Lg化学株式会社 | Adhesive film and method of encapsulating organic electronic device using same |
| US20150296632A1 (en) * | 2014-04-11 | 2015-10-15 | Panasonic Intellectual Property Management Co., Ltd. | Metal-foil-attached adhesive sheet, metal-foil-attached laminated board, metal-foil-attached multi-layer board, and method of manufacturing circuit board |
| CN110684477A (en) * | 2019-10-10 | 2020-01-14 | 中国科学院深圳先进技术研究院 | A kind of composite structure insulating film and preparation method thereof |
-
2020
- 2020-01-17 CN CN202010055623.4A patent/CN113141702A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101437914A (en) * | 2006-05-09 | 2009-05-20 | 日立化成工业株式会社 | Adhesive sheet, circuit member connection structure using the same, and semiconductor device |
| CN101637070A (en) * | 2007-03-29 | 2010-01-27 | 住友电木株式会社 | Base-equipped insulating sheet, multi-layer printed circuit board, semiconductor device, and multi-layer printed circuit board manufacturing method |
| CN101977765A (en) * | 2008-03-25 | 2011-02-16 | 味之素株式会社 | Insulating resin sheet and method for producing multilayer printed wiring board using same |
| CN103650649A (en) * | 2011-07-07 | 2014-03-19 | 日立化成株式会社 | Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board |
| CN104685018A (en) * | 2012-08-02 | 2015-06-03 | Lg化学株式会社 | Adhesive film and method of encapsulating organic electronic device using same |
| CN103857268A (en) * | 2012-11-28 | 2014-06-11 | 大自达电线股份有限公司 | Shield film, shield printed wiring board and method of manufacturing shield printed wiring board |
| US20150296632A1 (en) * | 2014-04-11 | 2015-10-15 | Panasonic Intellectual Property Management Co., Ltd. | Metal-foil-attached adhesive sheet, metal-foil-attached laminated board, metal-foil-attached multi-layer board, and method of manufacturing circuit board |
| CN110684477A (en) * | 2019-10-10 | 2020-01-14 | 中国科学院深圳先进技术研究院 | A kind of composite structure insulating film and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8356405B2 (en) | Method of manufacturing printed circuit board | |
| KR101077340B1 (en) | A carrier member for manufacturing a substrate and a method of manufacturing a substrate using the same | |
| US8435376B2 (en) | Carrier for manufacturing substrate and method of manufacturing substrate using the same | |
| US20140124475A1 (en) | Method of manufacturing printed circuit board | |
| TW200410621A (en) | Flexible rigid printed circuit board and method of fabricating the board | |
| TW201406237A (en) | Integrated circuit substrate and method for manufacturing same | |
| US20140102767A1 (en) | Multi-layer type printed circuit board and method of manufacturing the same | |
| JP5883542B2 (en) | Copper-clad laminate with protective layer and multilayer printed wiring board | |
| US20110139858A1 (en) | Carrier for manufacturing substrate and method of manufacturing substrate using the same | |
| KR101125356B1 (en) | The printed circuit board and the method for manufacturing the same | |
| CN101296562A (en) | Copper foil substrate and method for manufacturing flexible printed circuit board by using same | |
| CN102340933B (en) | How to make a circuit board | |
| CN105409334B (en) | Method for forming laminated structure with plated through holes using removable cover layer | |
| JP3944921B2 (en) | Manufacturing method of multilayer wiring board | |
| CN108369832B (en) | Method of manufacturing a printed circuit board | |
| JP5095117B2 (en) | Multilayer circuit board having cable portion and method for manufacturing the same | |
| CN113141702A (en) | Insulating sheet, printed circuit board comprising insulating sheet, semiconductor device and embedded component | |
| CN113973420A (en) | Rigid-flex board and manufacturing method thereof | |
| KR101167422B1 (en) | Carrier member and method of manufacturing PCB using the same | |
| CN113136145B (en) | Insulating resin sheet, use method thereof, printed circuit board comprising insulating resin sheet and application | |
| JP3698863B2 (en) | Bonding material for single-sided metal-clad laminate production | |
| WO2012099430A2 (en) | Copper clad film for manufacturing a copper clad laminate having a carrier layer made of an aluminum material and copper clad laminate comprising same | |
| KR101109336B1 (en) | Carrier for manufacturing printed circuit board and manufacturing method of printed circuit board using same | |
| KR101156776B1 (en) | A method of manufacturing a printed circuit board | |
| JP7265560B2 (en) | LAMINATED PRODUCT, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |